Abstract: Word lines intersect bit lines at a plurality of cross points where a plurality of single memory transistor synapse cells are located. Each cell includes a memory transistor; a pulse shaping unit coupled to a given one of a plurality of signal lines and a gate of the memory transistor; a logic gate having inputs coupled to a corresponding one of the word lines and a corresponding one of the bit lines, and an output coupled to the pulse shaping unit; and a pass gate arrangement. The latter is coupled to the memory transistor, the corresponding one of the word lines, the corresponding one of the bit lines, and the output of the logic gate. Pulses are applied to the gate of the memory transistor for weight adjustment during update and to interconnect the memory transistor to the corresponding one of the bit lines during inference.

Abstract: Methods for programming or reading a memory cell are disclosed. The methods include following operations. A read voltage at a first read voltage level is applied to read a memory cell for detecting a resistance level of the memory cell. The read voltage at a second read voltage level, different from the first read voltage level, is applied to read the memory cell for determining a waveform type has been utilized to program the memory cell. The resistance level and the waveform type are combined to recognize data bits stored in the memory cell.

Abstract: An exemplary semiconductor incorporates phase change material MoxW1-xTe2 that may be the semiconducting channel or may be part of a control terminal/gate of the semiconductor. The phase change material selectably being in one of metal and insulator phases depending on whether a voltage field greater than a predetermined phase change field is present at the phase change material. The properties of the semiconductor are varied depending on the phase of the phase change material.

Abstract: Some embodiments include an integrated assembly having a conductive line supported by a deck and extending along a longitudinal direction. The conductive line is configured to carry an electrical signal. A connection region is along the conductive line. The conductive line splits amongst multiple components as it passes through the connection region. The components are spread-apart from one another along a lateral direction which is orthogonal to the longitudinal direction. An opening extends vertically through the deck and through the connection region. The opening breaks one of the components of the conductive line to leave another of the components to carry the electrical signal across the connection region.

Abstract: A memory device may include a memory cell array including a plurality of memory cells and a compensation resistor electrically connected to the memory cell array. The compensation resistor may generate a cell current compensating for a voltage drop generated in a parasitic resistor of a signal line connected to at least one memory cell of the plurality of memory cells. The compensation circuit may control a magnitude of resistance of a compensation resistor upon receiving an address corresponding to the memory cell. The compensation circuit may increase a magnitude of the cell current based on adjusting the magnitude of resistance of the compensation resistor to be substantially equal to a resistance value of the parasitic resistor.

Abstract: A method of forming a self-aligned phase change memory element is provided. A bottom electrode is formed on a landing pad of a phase change memory element. A layer of dielectric material over the bottom electrode and a via etched through the dielectric material to expose the bottom electrode. The via is lined with a GST phase change layer that is etched back from the top surface of the dielectric layer. The via is then filled with a nitride fill, at least of portion of which is etched back from the top surface of the dielectric layer. A top electrode metal is then deposited at the top of the via, wherein the top electrode material is coupled to the phase change material and nitride fill material.

Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.

Abstract: Techniques are provided for programming a self-selecting memory cell that stores a first logic state. To program the memory cell, a pulse having a first polarity may be applied to the cell, which may result in the memory cell having a reduced threshold voltage. During a duration in which the threshold voltage of the memory cell may be reduced (e.g., during a selection time), a second pulse having a second polarity (e.g., a different polarity) may be applied to the memory cell. Applying the second pulse to the memory cell may result in the memory cell storing a second logic state different than the first logic state.

Abstract: Memory devices and manufacturing methods thereof are presented. A memory device a substrate and a memory cell having at least one selector and a storage element. The selector includes a well of a first polarity type disposed in the substrate, a region of a second polarity type disposed over the well and in the substrate, and first and second regions of the first polarity type disposed adjacent to the region of the second polarity type. The storage element includes a programmable resistive layer disposed on the region of the second polarity type and an electrode disposed over the programmable resistive layer.

Abstract: In an example, a plurality of signal pulses is applied across a plurality of memory cells concurrently until each respective memory cell reaches a desired state. Each respective memory cell is commonly coupled to a first signal line and is coupled to a different respective second signal line. Each signal pulse causes each respective memory cell to move toward the desired state by causing each respective memory cell to snap back. Current to a respective second signal line is turned off in response to each time the respective memory cell coupled thereto snaps back.

Abstract: Some embodiments include apparatuses and methods having a memory cell, first and second conductive lines configured to access the memory cell, and a switch configured to apply a signal to one of the first and second conductive lines. In at least one of such embodiments, the switch can include a phase change material. Other embodiments including additional apparatuses and methods are described.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a plurality of first lines; a plurality of second lines; a plurality of memory cells disposed in respective intersection regions between the first lines and the second lines and coupled between the first lines and the second lines, the plurality of memory cells having a first turn-on voltage; and a test circuit block suitable for applying a stress pulse having a voltage level equal to or higher than the first turn-on voltage to one or more first lines selected from the first lines in a test mode.

Abstract: A semiconductor memory device may include banks. A sensor is disposed adjacent to the banks and configured to sense a temperature. An address buffer is configured to receive an address from an external device. A first demultiplexer is configured to transfer a row address in the address to one of the banks. A second demultiplexer is configured to transfer a column address in the address to one of the banks. A command buffer is configured to receive a command from the external device. A control logic block is configured to control the first and second demultiplexers and the banks in accordance with the command and bank information in the address. A data buffer is configured to exchange data signals between the banks and the external device. The control logic block may be further configured to transfer information on the temperature to the external device.

Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.

Abstract: A memory device includes a memory array, write drivers and a controller. The memory array includes a plurality of memory units respectively arranged in a plurality of bit lines. The write drivers generate a plurality of write bit signals respectively inputted to the bit lines. The controller provides a voltage mode control signal and a current mode control signal. The controller is electrically coupled to the write drivers. Each of the write drivers generates a respective write bit signal of each of the write drivers according to the voltage mode control signal and the current mode control signal. When each of the memory units is in a set state, the controller outputs the voltage mode control signal and the current mode control signal to the write drivers. When each of the memory units is in a reset state, the controller outputs the voltage mode control signal to the write drivers.

Abstract: A memory device includes: a memory cell array, multiple bit lines, a compensation circuit, a holding circuit, and a control logic circuit. The memory cell array includes multiple memory cells. Each of the bit lines is connected to at least one of the memory cells. Among the bit lines, a predetermined voltage is applied to selected bit lines connected to selected memory cells. The compensation circuit includes a sampling circuit that generates a sampling value by sensing a leakage current applied to non-selected memory cells from among the plurality of memory cells. The holding circuit compensates for a voltage applied to the selected bit lines, based on the sampling value. The control logic circuit outputs a sampling-enable signal that controls enabling of the sampling circuit and a holding-enable signal that controls enabling of the holding circuit.

Abstract: Structures and methods for a multi-bit phase change memory are disclosed herein. A method includes establishing a write-reference voltage that incrementally ramps over a write period. The increments of the write-reference voltage correspond to discrete resistance states of a storage cell of the multi-bit phase change memory.

Abstract: A method for programming a phase change memory cell placed in an initial crystalline state, the memory cell being called of taking a plurality of resistance values belonging to a range of values called “programming window”, the method including parameterizing a lower limit of the programming window by applying to the memory cell a single gradual writing voltage pulse or a first series of identical gradual writing voltage pulses; progressively adjusting the resistance value of the memory cell by the following operations: a gradual erasing operation during which a series of identical gradual erasing voltage pulses is applied to the memory cell; a gradual writing operation during which a second series of identical gradual writing voltage pulses is applied to the memory cell; the gradual writing and gradual erasing voltage pulses have a width less than 50 ns.

Abstract: A method of switching a phase-change device (Device), including changing phase of the Device from a semiconducting 2H phase to a new 2Hd phase with a higher conductivity, the Device having an active material with a thickness including a phase transition material to thereby transition the Device from a high resistive state (HRS) to a low resistive state (LRS) by application of a set voltage and further to return the Device from the LRS back to the HRS by application of a reset voltage.

Abstract: Methods, systems, and devices for enabling fast pulse operation are described. A threshold voltage of a selection component and a requisite duration for a voltage applied to a selection component to reach a threshold voltage in response to a voltage generated by an external source may be determined. The threshold voltage may correspond to a voltage at which the selection component is configured to release electric charge. A voltage may then be generated and applied to an access line that is in electronic communication with the selection component and a memory cell for at least the requisite duration. Electric charge may be stored at the selection component during the requisite duration and transferred to memory cell after the requisite duration.

Abstract: Some embodiments include memory arrays. The memory arrays can have global bitlines extending along a first horizontal direction, vertical local bitlines extending perpendicularly from the global bitlines, and wordlines extending along a second horizontal direction which is perpendicular to the first horizontal direction. The global bitlines may be subdivided into a first series at a first elevational level, and a second series at a second elevational level which is different from the first elevational level. The global bitlines of the first series can alternate with the global bitlines of the second series. There can be memory cell material directly between the wordlines and the vertical local bitlines. The memory cell material may form a plurality of memory cells uniquely addressed by wordline/global bitline combinations. Some embodiments include cross-point memory cell units that have areas of about 2 F2.

Abstract: A rapid testing read out integrated circuit (ROIC) includes phase-change material (PCM) radio frequency (RF) switches residing on an application specific integrated circuit (ASIC). Each PCM RF switch includes a PCM and a heating element transverse to the PCM. The ASIC is configured to provide amorphizing and crystallizing electrical pulses to a selected PCM RF switch. The ASIC is also configured to generate data for determining and characterizing OFF state conductivity skew and ON state conductivity skew of the PCM in the selected PCM RF switch after the ASIC performs a plurality of OFF/ON cycles. In one implementation, a testing method using the ASIC is disclosed.

Abstract: Techniques regarding FET 1T2R unit cells are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a first resistive random-access memory unit operably coupled to a field-effect transistor by a first extrinsic semiconductor layer. The system can also comprise a second resistive random-access memory unit operably coupled to the field-effect transistor by a second extrinsic semiconductor layer.

Abstract: A phase change memory array may include at least one cell used to determine whether the array has been altered by thermal exposure over time. The cell may be the same or different from the other cells. In some embodiments, the cell is only read in response to an event. If in response to that reading, it is determined that the cell has changed state or resistance, it may deduce whether the change is a result of thermal exposure. Corrective measures may then be taken.

Abstract: A memory device can include: a memory array with memory cells arranged as data lines; an interface that receives a read command requesting bytes of data in a consecutively addressed order from an address of a starting byte; a first buffer that stores a first data line from the memory array that includes the starting byte; a second buffer that stores a second data line from the memory array, which is consecutively addressed with respect to the first data line; output circuitry configured to access data from the buffers, and to sequentially output each byte from the starting byte through a highest addressed byte of the first data line, and each byte from a lowest addressed byte of the second data line until the requested data bytes has been output; and a data strobe driver that clocks each byte of data output by a data strobe on the interface.

Abstract: A memory device includes: a memory cell array including a plurality of memory cells, wherein each of the plurality of memory cells includes a switching element, and a data storage element connected to the switching element, wherein the data storage element includes a phase change material; and a memory controller configured to perform a control operation with respect to a first memory cell of the plurality of memory cells by inputting an operating current to the first memory cell, and inputting a compensation current flowing from the data storage element to the switching element in the first memory cell before or after inputting the operating current to the first memory cell.

Abstract: Electrical contacts may be formed by forming dielectric liners along sidewalls of a dielectric structure, forming sacrificial liners over and transverse to the dielectric liners along sidewalls of a sacrificial structure, selectively removing portions of the dielectric liners at intersections of the dielectric liners and sacrificial liners to form pores, and at least partially filling the pores with a conductive material. Nano-scale pores may be formed by similar methods. Bottom electrodes may be formed and electrical contacts may be structurally and electrically coupled to the bottom electrodes to form memory devices. Nano-scale electrical contacts may have a rectangular cross-section of a first width and a second width, each width less than about 20 nm. Memory devices may include bottom electrodes, electrical contacts having a cross-sectional area less than about 150 nm2 over and electrically coupled to the bottom electrodes, and a cell material over the electrical contacts.

Abstract: Methods, systems, and devices for a tapered cell profile and fabrication are described. A memory storage component may contain multiple chalcogenide materials and may include a tapered profile. For example, a first chalcogenide material may be coupled with a second chalcogenide material. Each of the chalcogenide materials may be further coupled with a conductive material (e.g., an electrode). Through an etching process, the chalcogenide materials may tapered (e.g., step tapered). A pulse may be applied to the tapered chalcogenide materials resulting in a memory storage component that includes a mixture of the chalcogenide materials.

Abstract: A memory device includes a memory array, a bit line driving circuit, a word line driving circuit, a read/write circuit, a controller, and a reference driving circuit. The memory array includes several memory units. The bit line driving circuit is configured to interpret a memory bit address and to drive a bit line. The word line driving circuit is configured to interpret a memory word address and to drive a word line. The read/write circuit is configured to read, set, or reset the memory units. The controller is configured to switch the memory array to work in a single memory unit mode or a dual memory unit mode. The reference driving circuit is configured to drive a reference line, wherein the reference line comprises several reference units, and the reference line and the reference units are located in the memory array.

Abstract: Techniques for void reduction in phase change memory (PCM) devices are provided. In one embodiment, the system is provided that comprises a PCM device comprising a first electrode and a second electrode. The system can further comprise a first connector coupled to the first electrode and that applies a negative voltage to the first electrode, and a second connector coupled to the second electrode and that applies a ground voltage to the second electrode, wherein applying the negative voltage to the first electrode and applying the ground voltage to the second electrode comprises negatively biasing the PCM device. The system can further comprise the first connector applying the positive voltage to the first electrode, and the second connector applying a ground voltage to the second electrode, wherein applying the positive voltage to the first electrode and applying the ground voltage to the second electrode comprises positively biasing the PCM device.

Abstract: A sensing-amplifier device includes a first input terminal, a second input terminal, a reference unit, and a sense amplifier. The reference unit is configured to provide a reference signal. The switching unit is selectively coupled to the first input terminal, the second input terminal, and a reference unit. The sense amplifier includes two terminals. The two terminals of the sense amplifier are coupled to the first input terminal and the second input terminal respectively by switching of the switching unit so as to operate in a twin memory unit mode, or one terminal of the sense amplifier is coupled to the first input terminal or the second input terminal and the other terminal of the sense amplifier is coupled to the reference unit by switching of the switching unit so as to operate in a single memory unit mode.

Abstract: Provided is an initialization control unit that causes a resistance value of a variable resistive element in an access restriction region to be changed to an initial value larger than a predetermined value. The resistance value is changed in a read only mode among the read only mode in which writing to the access restriction region is prohibited and a writable mode in which the writing to the access restriction region is permitted. The access restriction region is in a memory cell array in which the variable resistive elements are arranged, and the initialization control unit transitions to the writable mode. In addition, a write control unit causes a resistance value of an element corresponding to write data among the variable resistive elements in the access restriction region to be changed to a value smaller than the initial value in the writable mode, and transitions to the read only mode.

Abstract: Example implementations relate to memory read requests. For example, an implementation may include tracking progress of an iterative write sequence to write data to a memory element of a memory module. A received read request is detected to be addressed to a memory bank that includes the memory element undergoing the iterative write sequence. Based on the tracked progress, a time is determined to interrupt the iterative write sequence with insertion of the read request. The time aligns between operations of the iterative write sequence and data is returned within a predetermined read latency.

Abstract: A microelectronic memory having metallization layers formed on a back side of a substrate, wherein the metallization layers on back side may be used for the formation of source lines and word lines. Such a configuration may allow for a reduction in bit cell area, a higher memory array density, and lower source line and word line resistances. Furthermore, such a configuration may also provide the flexibility to independently optimize interconnect performance for logic and memory circuits.

Abstract: Methods, systems, and devices related to techniques to access a self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more time durations during which a fixed level of voltage or current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Abstract: Some embodiments include memory arrays. The memory arrays can have global bitlines extending along a first horizontal direction, vertical local bitlines extending perpendicularly from the global bitlines, and wordlines extending along a second horizontal direction which is perpendicular to the first horizontal direction. The global bitlines may be subdivided into a first series at a first elevational level, and a second series at a second elevational level which is different from the first elevational level. The global bitlines of the first series can alternate with the global bitlines of the second series. There can be memory cell material directly between the wordlines and the vertical local bitlines. The memory cell material may form a plurality of memory cells uniquely addressed by wordline/global bitline combinations. Some embodiments include cross-point memory cell units that have areas of about 2F2.

Abstract: A volatile memory device includes a refresh controller configured to control a hidden refresh operation performed on a first portion of memory cells while a valid operation is performed on a second portion of the memory cells. The volatile memory device is configured to perform a regular refresh operation in response to receiving a refresh command. The refresh controller is configured to generate refresh information using a performance indicator of the hidden refresh operation during a first part of a reference time. The volatile memory device is configured to perform a desired number of the regular refresh operation during a remaining part of the reference time based on the refresh information. The desired number of the regular refresh operation is an integer based on a difference between a target number of refresh operations during the reference time and a count value of the hidden refresh operation during the reference time.

Abstract: A memory system includes a memory controller; and a memory device including a memory cell array, which includes a plurality of bit lines and a plurality of blocks. Each block includes a plurality of word lines, and each word line includes a plurality of phase-change random access memory (PRAM) cells connected, respectively, to the plurality of bit lines. The memory controller is configured to buffer write requests each including write data and is configured to perform a write operation that includes a reset phase and a subsequent set phase. The reset phase includes erasing the PRAM cells included in first word lines from among the plurality of word lines included in a selected block, from among the plurality of blocks, and the set phase includes, after the reset phase, writing the write data from the buffered write requests to the PRAM cells of the first word lines.

Abstract: Provided is a method of operating a resistive memory device including a memory cell array. The method includes the resistive memory device performing a first write operation in response to an active command and a write command and performing a second write operation in response to a write active command and the write command. The first write operation includes a read data evaluation operation for latching data read from the memory cell array in response to the active command. The second write operation excludes the read data evaluation operation.

Abstract: A method of operating a phase change memory device includes flowing a write current of a first polarity through a phase change memory element of a selected phase change memory cell, and flowing a read current of a second polarity opposite to the first polarity through the phase change memory element of the selected phase change memory cell. A first junction between the phase change memory element and a first electrode and a second junction between the phase change memory element and a second electrode exhibit asymmetric thermoelectric heat generation during the step of flowing the write current.

Abstract: Resistive memory cell structures and methods are described herein. One or more memory cell structures comprise a first resistive memory cell comprising a first resistance variable material and a second resistive memory cell comprising a second resistance variable material that is different than the first resistance variable material.

Abstract: A memory cell can include a chalcogenide material having a narrowed end. A conductive material can be positioned at the narrowed end of the chalcogenide material. A dielectric barrier layer can be disposed between the conductive material and the narrowed end of the chalcogenide material. A dielectric spacer material can be positioned along a narrowed segment of the chalcogenide material.

Abstract: According to an embodiment, a semiconductor memory device comprises first wiring lines, second wiring lines, and first variable resistance elements. The first wiring lines are arranged in a first direction and have as their longitudinal direction a second direction intersecting the first direction. The second wiring lines are arranged in the second direction and have the first direction as their longitudinal direction. The first variable resistance elements are respectively provided at intersections of the first wiring lines and the second wiring lines. In addition, this semiconductor memory device comprises a first contact extending in a third direction that intersects the first direction and second direction and having one end thereof connected to the second wiring line. The other end and a surface intersecting the first direction of this first contact are covered by a first conductive layer.

Abstract: Some embodiments include memory arrays. The memory arrays can have global bitlines extending along a first horizontal direction, vertical local bitlines extending perpendicularly from the global bitlines, and wordlines extending along a second horizontal direction which is perpendicular to the first horizontal direction. The global bitlines may be subdivided into a first series at a first elevational level, and a second series at a second elevational level which is different from the first elevational level. The global bitlines of the first series can alternate with the global bitlines of the second series. There can be memory cell material directly between the wordlines and the vertical local bitlines. The memory cell material may form a plurality of memory cells uniquely addressed by wordline/global bitline combinations. Some embodiments include cross-point memory cell units that have areas of about 2F2.

Abstract: Some embodiments include an integrated assembly having a conductive line supported by a deck and extending along a longitudinal direction. The conductive line is configured to carry an electrical signal. A connection region is along the conductive line. The conductive line splits amongst multiple components as it passes through the connection region. The components are spread-apart from one another along a lateral direction which is orthogonal to the longitudinal direction. An opening extends vertically through the deck and through the connection region. The opening breaks one of the components of the conductive line to leave another of the components to carry the electrical signal across the connection region.

Abstract: A semiconductor system may be provided. The semiconductor system may include a phase changeable memory device. The phase changeable memory device may include a phase changeable memory cell array, the phase changeable memory cell array may include a plurality of word lines, a plurality of bit lines overlapped with the word lines and phase changeable memory cells respectively connected to overlapping points between the word lines and the bit lines, and the phase changeable memory cell may include a phase changeable material. The semiconductor system may include a controller. The controller may be configured to provide the phase changeable memory device with a command and an address for controlling the phase changeable memory device.

Abstract: The present disclosure provides a control circuit of a memory array. The control circuit includes a first switch and a set termination circuit. The first switch is connected between a first voltage source and a data line of a resistive memory cell of the memory array. The set termination circuit has a first terminal connected to a control terminal of the first switch and a second terminal connected to the data line of the resistive memory cell of the memory array. When a data line voltage of the data line decreases to be lower than a first voltage in a first duration of the resistive memory cell performing a set operation, the set termination circuit turns off the first switch to terminate the set operation by stopping providing the first voltage of the first voltage source to the data line.

Abstract: A nonvolatile memory cell includes a first voltage supply node, a second voltage supply node, an output node, a resistive random access memory device having a first electrode and a second electrode, the first electrode connected to the first voltage supply node, at least one p-channel transistor connected between the second electrode of the resistive random access memory device and the output node, at least one n-channel transistor connected between the output node and the second voltage supply node, and an inverter connected between the output node and a gate of the at least one n-channel transistor.

Abstract: Disclosed herein is a memory cell including a memory element and a selector device. The memory cell may be programmed with a programming pulse having a first polarity and read with a read pulse having a second polarity. The memory cell may be programmed with a programming pulse having first and second portions. The first and second portions may have different magnitudes and polarities. The memory cell may exhibit reduced voltage drift and/or threshold voltage distribution. Described herein is a memory cell that acts as both a memory element and a selector device. The memory cell may be programmed with a programming pulse having first and second portions. The first and second portions may have different magnitudes and polarities.

Abstract: A memory device includes a plurality of memory regions including memory cells coupled between a plurality of word lines and a plurality of bit lines, an address decoder suitable for decoding an address to generate a plurality of selection signals corresponding to the bit lines, and outputting the selection signals to a plurality of signal lines, and a plurality of selection circuits corresponding to the memory regions, respectively, and suitable for selecting the bit lines in response to the selection signals received through the signal lines, wherein at least one of the selection circuits is coupled to the signal lines in an arrangement different from remaining selection circuits.