Abstract: A semiconductor memory may include: a first variable resistance element including a first terminal and a second terminal; a second variable resistance element including a first terminal, a second terminal, and a third terminal; a first transistor configured to control an electrical connection between a first conductive line and the first terminal of the first variable resistance element; a second transistor configured to control an electrical connection between the first conductive line and the first terminal of the second variable resistance element; a connection layer structured to electrically connect the second terminal of the first variable resistance element to the second and third terminals of the second variable resistance element; and a third conductive line is electrically connected to the connection layer.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a magnetization fixed layer having a fixed direction of magnetization, and an intermediate layer disposed therebetween, which intermediate layer contains a nonmagnetic material. The magnetization fixed layer has at least two ferromagnetic layers having a direction of magnetization tilted from a direction perpendicular to a film surface, which are laminated and magnetically coupled interposing a coupling layer therebetween. This configuration may effectively prevent divergence of magnetization reversal time due to directions of magnetization of the storage layer and the magnetization fixed layer being substantially parallel or antiparallel, reduce write errors, and enable writing operation in a short time.

Abstract: Memory structures including an MTJ-containing pillar that is void of re-sputtered bottom electrode metal particles is provided by first forming the MTJ-containing pillar on a sacrificial material-containing structure, and thereafter replacing the sacrificial material-containing structure with at least a replacement bottom electrode structure. In some embodiments, the sacrificial material-containing structure is replaced with both a bottom electrode diffusion barrier liner and a replacement bottom electrode structure.

Abstract: Improved differential programming of multiple two-terminal memory cells that define an identifier bit is provided. Differential programming can apply a program cycle to multiple memory cells concurrently, detect a program event for one (or a first group) of the memory cells and disconnect all of the memory cells from a program supply voltage in response to detecting the program event. Moreover, disconnecting the memory cells can be accomplished prior to a duration of the program cycle, serving to mitigate an invalid data result for the identifier bit, as well as reduce power consumption associated with the differential programming. Circuits providing intrinsic suppression of a non-programmed memory cell(s) defining an identifier bit in response to programming of another memory cell (or group of cells) defining the identifier bit are included. Differential programming can reduce power consumption and mitigate or avoid invalid data results for an identifier bit.

Abstract: Provided herein is a cell of a magnetic random access memory (MRAM) circuit. The cell includes a horizontal outer perimeter and an access transistor including a first terminal, a second terminal, and a gate terminal. The cell includes a magnetic tunnel junction (MTJ) structure located in the horizontal outer perimeter and above the bottom electrode. The MTJ structure being centered within the horizontal outer perimeter. The cell includes a bottom electrode located entirely within the horizontal outer perimeter. The bottom electrode comprising a shape enabling the MTJ structure to be centered within the horizontal outer perimeter.

Abstract: An integrated chip has a memory cell that includes a magnetic tunnel junction (MTJ) device and an access selector apparatus. The MTJ device includes a free layer and a pinned layer. The access selector apparatus includes a first metal structure and a second metal structure separated by one or more non-metallic layers. The first metal structure includes a polarized magnetic layer. The polarized magnetic layer produces a magnetic field that extends through the free layer, tilting its magnetic field and thereby substantially reducing a switching time for the MTJ device. The access selector apparatus may be a bipolar selector. The polarized magnetic layer may be incorporated into an electrode of the bipolar selector. Both the access selector apparatus and the MTJ device may be formed by a stack of material layers. The resulting memory cell may be compact and have good write speed.

Abstract: A memory device includes a plurality of sense amplifiers, a plurality of memory cells, a plurality of data lines, a plurality of reference cells, and a connection line. The memory cells are coupled to a plurality of first inputs of the plurality of sense amplifiers respectively. The data lines are coupled to a plurality of second inputs of the plurality of sense amplifiers respectively. The reference cells are arranged in a plurality of columns respectively and coupled to the plurality of data line respectively. Each of the plurality of reference cells includes a plurality of resistive elements. The connection line is coupled to the plurality of data lines. In a read mode, one of the sense amplifiers is configured to access the plurality of resistive elements arranged in at least one of the plurality of columns.

Abstract: The disclosed technology relates to a logic device based on spin waves. In one aspect, the logic device includes a spin wave generator, a waveguide, at least two phase shifters, and an output port. The spin wave generator is connected with the waveguide and is configured to emit a spin wave in the waveguide. The at least two phase shifters are connected with the waveguide at separate positions such that, when a spin wave is emitted by the spin wave generator, it passes via the phase shifters. The at least two phase shifters are configured to change a phase of the passing spin wave. The output port is connected with the wave guide such that the at least two phase shifters are present between the spin wave generator and the output port.

Abstract: A semiconductor device includes a substrate, a first MTJ structure, a second MTJ structure, an interconnection structure including a first metal interconnection and a second metal interconnection disposed on and contacting the first metal interconnection, a fifth metal interconnection, and a sixth metal interconnection. The first MTJ structure, the second MTJ structure, and the interconnection structure are disposed on the substrate. The interconnection structure is located between the first MTJ structure and the second MTJ structure in a first horizontal direction. The fifth metal interconnection and the sixth metal interconnection are disposed under and contact the first MTJ structure and the second MTJ structure, respectively. The fifth metal interconnection includes a barrier layer and a metal layer disposed on the barrier layer. A length of the first MTJ structure in the first horizontal direction is greater than a length of the metal layer in the first horizontal direction.

Abstract: Disclosed is a memory device including a magnetic storage element. The memory device includes a memory cell array, a voltage generator, and a write driver. The memory cell array includes a first region and a second region. The memory device is configured to store a value of a first read current determined based on a value of a reference resistance for distinguishing a parallel state and an anti-parallel state of a programmed memory cell. The sensing circuit is configured to generate the first read current based on the value of the first read current and to perform a read operation on the first region based on the first read current.

Abstract: A device structure includes at least one selector device. Each selector device includes a vertical stack including, from bottom to top, a bottom electrode, a metal oxide semiconductor channel layer, and a top electrode and located over a substrate, a gate dielectric layer contacting sidewalls of the bottom electrode, the metal oxide semiconductor channel layer, and the top electrode, and a gate electrode formed within the gate dielectric layer and having a top surface that is coplanar with a top surface of the top electrode. Each top electrode or each bottom electrode of the at least one selector device may be contacted by a respective nonvolatile memory element to provide a one-selector one-resistor memory cell.

Abstract: According to one embodiment, a magnetic memory device including a stacked structure including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer, and containing magnesium (Mg) and oxygen (O). The nonmagnetic layer further contains a first additive element and a second additive element, the first additive element is at least one element selected from sulfur (S), gallium (Ga), aluminum (Al), titanium (Ti), vanadium (V), hydrogen (H), fluorine (F), manganese (Mn), lithium (Li), nitrogen (N) and magnesium (Mg), and the second additive element is lithium (Li).

Abstract: Some embodiments relate to a probabilistic random number generator. The probabilistic random number generator includes a memory cell comprising a magnetic tunnel junction (MTJ), and an access transistor coupled to the MTJ of the memory cell. A variable current source is coupled to the access transistor and is configured to provide a plurality of predetermined current pulse shapes, respectively, to the MTJ to generate a bit stream that includes a plurality of probabilistic random bits, respectively, from the MTJ. The predetermined current pulse shapes have different current amplitudes and/or pulse widths corresponding to different switching probabilities for the MTJ.

Abstract: An apparatus is provided which comprises: a stack comprising a magnetic insulating material (MI such as EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, or graphene), wherein the magnetic insulating material has a first magnetization; a magnet with a second magnetization, wherein the magnet is adjacent to the TMD of the stack; and an interconnect comprising a spin orbit material, wherein the interconnect is adjacent to the magnet.

Abstract: A processing apparatus includes a bit-cell array including at least one bit-cell line including a plurality of bit-cells electrically connected to each other in series, wherein each of the plurality of bit-cells includes: a first magnetic resistor that is configured to store a first resistance value based on a movement of a location of a magnetic domain-wall; a second magnetic resistor that is configured to store a second resistance value, wherein the second resistance value is equal to or less than the first resistance value; a first switching element configured to switch an electrical signal applied to the first magnetic resistor; and a second switching element configured to switch an electrical signal applied to the second magnetic resistor.

Abstract: The present disclosure relates to a magnon spin valve device, a magnon sensor, a magnon field effect transistor, a magnon tunnel junction and a magnon memory. A magnon spin valve device may comprise a first ferromagnetic insulation layer, a non-magnetic conductive layer disposed on the first ferromagnetic insulation layer, and a second ferromagnetic insulation layer disposed on the non-magnetic conductive layer.

Abstract: A domain wall moving type magnetic recording element includes: a domain wall moving layer in which first layers containing a rare earth metal and second layers containing a transition metal are alternately stacked in a first direction; and a first electrode and a second electrode which face the domain wall moving layer and are arranged to be away from each other. The domain wall moving layer has SOT suppression parts which are positioned in one of interfaces between the first layers and the second layers and contain a non-magnetic metal. The SOT suppression parts are locally distributed at the interface.

Abstract: A layout method includes: forming a layout structure of a memory array having first and second rows, each including a plurality of storage cells, wherein at least one of the storage cells includes a fuse; disposing a word line between the first and second rows; disposing a plurality of control electrodes across the word line for connecting the storage cells of the first row and the storage cells of the second row respectively; disposing a first cut layer on a first control electrode of the control electrodes located on a first side of the word line; and disposing a second cut layer on a second control electrode of the control electrodes located on a second side of the word line; wherein the first side of the word line is opposite to the second side of the word line.

Abstract: A semiconductor device includes a substrate, a first magnetic tunnel junction (MTJ) structure, a second MTJ structure, and an interconnection structure. The first MTJ structure, the second MTJ structure, and the interconnection structure are disposed on the substrate. The interconnection structure is located between the first MTJ structure and the second MTJ structure in a first horizontal direction, and the interconnection structure includes a first metal interconnection and a second metal interconnection. The second metal interconnection is disposed on and contacts the first metal interconnection.

Abstract: This magnetic recording head includes a main magnetic pole, a write shield, and an element. The element has a first portion, a second portion, and a non-magnetic conductive layer disposed therebetween. The element has a first current path connecting the main magnetic pole and the non-magnetic conductive layer to each other, and a second current path connecting the write shield and the non-magnetic conductive layer to each other.

Abstract: A semiconductor device includes a substrate, a first magnetic tunnel junction (MTJ) structure, a second MTJ structure, and an interconnection structure. The first MTJ structure, the second MTJ structure, and the interconnection structure are disposed on the substrate. The interconnection structure is located between the first MTJ structure and the second MTJ structure in a first horizontal direction, and the interconnection structure includes a first metal interconnection and a second metal interconnection. The second metal interconnection is disposed on and contacts the first metal interconnection. A material composition of the second metal interconnection is different from a material composition of the first metal interconnection.

Abstract: A memory device includes programmable memory cells and a programming circuit for programming a selected memory cell to a target logic state by applying one or more programming current pulses. A temperature sensor operates to sense a temperature of the memory device. A reading circuit reads a current logic state of the selected memory cell after a predetermined programming current pulse of the programming current pulses. The reading circuit includes a sensing circuit that senses a current logic state of the selected memory cell according to a comparison between a reading electric current depending on the current logic state of the selected memory cell and a reference current. An adjusting circuit adjusts one or the other of the reading electric current and the reference electric current to be provided to the sensing circuit according to the temperature of the memory device.

Abstract: This disclosure relates to selectively performing a read with increased accuracy, such as a self-reference read, from a memory. In one aspect, data is read from memory cells, such as magnetoresistive random access memory (MRAM) cells, of a memory array. In response to detecting a condition associated with reading from the memory cells, a self-reference read can be performed from at least one of the memory cells. For instance, the condition can indicate that data read from the memory cells is uncorrectable via decoding of error correction codes (ECC). Selectively performing self-reference reads can reduce power consumption and/or latency associated with reading from the memory compared to always performing self-reference reads.

Abstract: Disclosed herein are related to a memory device including a set of memory cells and a memory controller. In one aspect, each of the set of memory cells includes a select transistor and a storage element connected in series between a corresponding bit line and a corresponding source line. In one aspect, the memory controller is configured to apply a first write voltage to a bit line coupled to a selected memory cell, apply a second write voltage to a word line coupled to a gate electrode of a select transistor of the selected memory cell during a first time period, and apply a third write voltage to a source line coupled to the selected memory cell. The second write voltage may be between the first write voltage and the third write voltage.

Abstract: The present disclosure is drawn to, among other things, a method of managing a magnetoresistive memory (MRAM) device. In some aspects, the method includes receiving a configuration bit from a write mode configuration register. In response to determining the configuration bit is a first value, the MRAM device is operated in a NOR emulation mode. In response to determining the configuration bit is a second value, the MRAM device is operated in a persistent memory mode.

Abstract: A semiconductor device and a method of operating the same are provided. The semiconductor device includes a transistor and a fuse structure electrically connected to the transistor. The fuse structure includes a first fuse element, a second fuse element, and a fuse medium. The second fuse element at least partially overlaps the first fuse element. The fuse medium connects the first fuse element and the second fuse element. The fuse medium includes an electrically conductive material.

Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.

Abstract: Various means for improvement in signal-to-noise ratio (SNR) for a magnetic field sensor are disclosed for low power and high resolution magnetic sensing. The improvements may be done by reducing parasitic effects, increasing sense element packing density, interleaving a Z-axis layout to reduce a subtractive effect, and optimizing an alignment between a Z-axis sense element and a flux guide, etc.

Abstract: A 1S-1T ferroelectric memory cell is provided that include a transistor and a two-terminal selector device. The transistor exhibits a low conductive state and a high conductive state (channel resistance), depending on drive voltage. The two-terminal selector device exhibits one of an ON-state and an OFF-state depending upon whether the transistor is in its low conductive state or its high conductive state. The transistor may be, for instance, a ferroelectric gate vertical transistor. Modulation of a polarization state of ferroelectric material of the vertical transistor may be utilized to switch the state of the selector device. The memory cell may thus selectively be operated in one of an ON-state and an OFF-state depending upon whether the selector device is in its ON-state or OFF-state.

Abstract: A memory device that includes a first magnetic insulating tunnel barrier reference layer present on a first non-magnetic metal electrode, and a free magnetic metal layer present on the first magnetic insulating tunnel barrier reference layer. A second magnetic insulating tunnel barrier reference layer may be present on the free magnetic metal layer, and a second non-magnetic metal electrode may be present on the second magnetic insulating tunnel barrier. The first and second magnetic insulating tunnel barrier reference layers are arranged so that their magnetizations are aligned to be anti-parallel.

Abstract: A method includes forming a cell layer including first and second cells, each of which is configured to perform a circuit function; forming a first metal layer above the cell layer and including a first conductive feature and a second conductive feature extending along a first direction, in which the first conductive feature extends from the first cell into the second cell, and in which a shortest distance between a center line of the first conductive feature and a center line of the second conductive feature along a second direction is less than a width of the first conductive feature, and the second direction is perpendicular to the first direction; forming a first conductive via interconnecting the cell layer and the conductive feature.

Abstract: The present disclosure includes apparatuses, methods, and systems for charge separation for memory sensing. An embodiment includes applying a sensing voltage to a memory cell, and determining a data state of the memory cell based, at least in part, on a comparison of an amount of charge discharged by the memory cell while the sensing voltage is being applied to the memory cell before a particular reference time and an amount of charge discharged by the memory cell while the sensing voltage is being applied to the memory cell after the particular reference time.

Abstract: The invention relates to hard magnets that include an intermetallic compound having the general composition XaX?bYcZd where X and X? independently from one another are representative of a 3d transition metal with unpaired electrons; Y is a 4d or 5d transition metal of groups 5, 8, 9, or 10 Z is a main group element of groups 13, 14 or 15; a and d independently from one another represent a number between 0.1 and 2.0; and b and c independently from one another represent a number between 0.0 and 2.0; such that a+b+c+d is between 3.0 and 4.0.

Abstract: A magnetoresistance effect element includes a first ferromagnetic layer, a second ferromagnetic layer, a first non-magnetic layer; and a second non-magnetic layer, wherein, the first ferromagnetic layer and the second ferromagnetic layer are formed so that at least one of them includes a Heusler alloy layer, the first non-magnetic layer is provided between the first ferromagnetic layer and the second ferromagnetic layer, the second non-magnetic layer is in contact with any surface of the Heusler alloy layer and has a discontinuous portion with respect to a lamination surface, and the second non-magnetic layer is made of a material different from that of the first non-magnetic layer and is a (001)-oriented oxide containing Mg.

Abstract: A spin-orbit-torque magnetization rotational element includes: a spin-orbit torque wiring layer which extends in an X direction; and a first ferromagnetic layer which is laminated on the spin-orbit torque wiring layer, wherein the first ferromagnetic layer has shape anisotropy and has a major axis in a Y direction orthogonal to the X direction on a plane in which the spin-orbit torque wiring layer extends, and wherein the easy axis of magnetization of the first ferromagnetic layer is inclined with respect to the X direction and the Y direction orthogonal to the X direction on a plane in which the spin-orbit torque wiring layer extends.

Abstract: A magnetic element is provided. The magnetic element includes a free magnetization layer having a surface area that is approximately 1,600 nm2 or less, the free magnetization layer including a magnetization state that is configured to be changed; an insulation layer coupled to the free magnetization layer, the insulation layer including a non-magnetic material; and a magnetization fixing layer coupled to the insulation layer opposite the free magnetization layer, the magnetization fixing layer including a fixed magnetization so as to be capable of serving as a reference of the free magnetization layer.

Abstract: Aspects of the present disclosure are directed to magnetic tunnel junction (MTJ) structures comprising multiple MTJ bits connected in series. For example, a magnetic tunnel junction (MTJ) stack according to the present disclosure may include at least a first MTJ bit and a second MTJ bit stacked above the first MTJ bit, and a resistance state of the MTJ stack may be read by passing a single read current through both the first MTJ bit and the second MTJ bit.

Abstract: A magnetic storage device includes a magnetoresistive effect element. The magnetoresistive effect element includes a first ferromagnetic layer; a second ferromagnetic layer; a non-magnetic layer between the first ferromagnetic layer and the second ferromagnetic layer; and a first layer provided at a side of the first ferromagnetic layer opposite to a side of the first ferromagnetic layer at which the non-magnetic layer is provided. The first layer includes a rare-earth element and the first layer has a region including boron (B) at a proportion higher than a proportion of boron (B) in the first ferromagnetic layer.

Abstract: Provided herein may be a semiconductor device. The semiconductor device may include a stack including word lines, a bit line penetrating the stack, a global bit line disposed above the stack, global word lines disposed above the stack, a common select line disposed above the stack, a first contact plug coupling the global bit line and the bit line to each other and penetrating the common select line, and second contact plugs coupling the global word lines and the word lines to each other respectively and penetrating the common select line.

Abstract: Embodiments of the present invention disclose an MRAM cell layout for 32 nm, 45 nm, and 65 nm CMOS process technology.

Abstract: According to one embodiment, a magnetic memory device includes a stacked structure including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer, and containing magnesium (Mg) and oxygen (O). The nonmagnetic layer further contains an additive element selected from fluorine (F), sulfur (S), hydrogen (H) and lithium (Li).

Abstract: To provide a control circuit capable of not only suppressing an increase in power consumption with a simple configuration but also preventing erroneous writing and destruction of a memory element. Provided is a control circuit that outputs a signal for discharging charges accumulated in a source line and a bit line according to activation of a word line, and outputs a signal for making the source line and the bit line be in a floating state by a start of writing or reading, with respect to a memory cell including the source line, the bit line, a transistor that is provided between the source line and the bit line, and switches on and off by a potential of the word line, and a memory element connected to the transistor in series.

Abstract: A system includes a multiturn counter that can store a magnetic state associated with a number of accumulated turns of a magnetic field. The multiturn counter includes a plurality of magnetoresistive elements electrically coupled in series with each other. A matrix of electrical connections is arranged to connect magnetoresistive elements of the plurality of magnetoresistive elements to other magnetoresistive elements of the plurality of magnetoresistive elements.

Abstract: A magnetic memory element having a magnetic free layer and a magnetic reference layer with a non-magnetic barrier layer between the magnetic reference layer and the magnetic free layer. A spin current layer (which may be a precessional spin current layer) is located adjacent to the magnetic free layer and is separated from the magnetic free layer by a non-magnetic coupling layer. A material layer adjacent to and in contact with the spin current layer, has a material composition and thickness that are chosen to provide a desired effective magnetization in the spin current layer. The material layer, which may be a capping layer or a seed layer, can be constructed of a material other than tantalum which may include one or more of Zr, Mo, Ru, Rh, Pd, Hf, W, Ir, Pt and/or alloys and/or nitrides of these elements.

Abstract: A magnetic memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack includes a reference layer, a tunnel barrier layer, a free layer, and a magnetoelectric multiferroic layer including at least one crystalline grain. The magnetization of the magnetoelectric multiferroic layer may be axial, canted, or in-plane. For axial or canted magnetization of the magnetoelectric multiferroic layer, a deterministic switching of the free layer may be achieved through coupling with the axial component of magnetization of the magnetoelectric multiferroic layer. Alternatively, the in-plane magnetization of the magnetoelectric multiferroic layer may be employed to induce precession of the magnetization angle of the free layer.

Abstract: Disclosed is a method for generating, from a first electric current having a first frequency, a plurality of second currents each having a second respective frequency component, the method including the following steps: supplying a frequency distributor including a first set of pillars including a layer made from a first magnetic material and having a resonance frequency; exciting each pillar of the first set with an electromagnetic field having the first frequency, the ratio between twice the resonance frequency of each pillar of the first set and the first frequency being equal, to within ten percent, to a first natural integer; and generating, by each pillar of the first set, a second frequency component in the second respective current.

Abstract: A hall bar device for a memory or logic application can include a gate electrode, a boron-doped chromia layer on the gate electrode; and a hall bar structure with four legs on the boron-doped chromia layer. For a memory application, the hall bar device can be written to by applying a pulse voltage across the gate electrode and one leg of the hall bar structure in the absence of an applied magnetic field; and can be read from by measuring a voltage across the one leg of the hall bar structure and its opposite leg.

Abstract: A method is presented for preventing excessive cap dielectric loss in memory areas and logic areas of a device. The method includes forming a first conductive line with top via and a conductive pad over a dielectric layer, wherein the conductive pad includes a microstud, depositing a dielectric cap in direct contact with the first conductive line and the conductive pad, and constructing a top electrode, a magnetic tunnel junction (MTJ) stack, and a bottom electrode in vertical alignment with the microstud of the conductive pad.

Abstract: Magnetic memory devices and methods are provided. In one aspect, a memory device may comprise a control circuitry and at least one array of memory structures. Each memory structure may comprise a metal layer and a first magnetic tunnel junction (MTJ) disposed on the metal layer. The metal layer may include a first region and a second region. Electrical resistivity of at least a first part of the first region is different from electrical resistivity of the second region. The first magnetic tunnel junction (MTJ) may comprise a first free layer adjacent to the metal layer, a first barrier layer adjacent to the first free layer, and a first reference layer adjacent to the first barrier layer. The first free layer is in contact with the first region of the metal layer.