Abstract: A flash memory device includes a plurality of memory blocks. A selected memory block among the plurality of memory blocks includes 2n pages of data. The selected memory block includes different types of memory cells capable of storing different numbers of bits.

Abstract: Systems and methods to manage memory on a dual in-line memory module (DIMM) are provided. A particular method may include receiving at a flash application-specific integrated circuit (ASIC) a request from a processor to access data stored in a flash memory of a DIMM. The data may be transferred from the flash memory to a switch of the DIMM. The data may be routed to a dynamic random-access memory (DRAM) of the DIMM. The data may be stored in the DRAM and may be provided from the DRAM to the processor.

Abstract: Memory devices, methods, and sample and hold circuits are disclosed, including a memory device that includes a sample and hold circuit coupled to a bit line. One such sample and hold circuit includes a read circuit, a verify circuit, and a reference circuit. The read circuit stores a read threshold voltage that was read from a selected memory cell. The verify circuit stores a target threshold voltage that is compared to the read threshold voltage to generate an inhibit signal when the target and read threshold voltages are substantially equal. The reference circuit stores a reference threshold voltage that can be used to translate the read threshold voltage to compensate for a transistor voltage drop and/or temperature variations.

Abstract: Several preferred embodiments of 1S1F 16T NVSRAM, 1S1F 20T NVSRAM, 1S2F 22T NVSRAM, 1S2F 14T NVSRAM cells are proposed, regardless of 1-poly, 2-poly, PMOS or NOS flash cell structures. Two separate sourcelines for the paired flash Strings are also proposed for easy adding ability for the NVSRAM circuit to detect the marginally erased Vt0 and marginally programmed Vt1 of the paired flash cell. By increasing an resistance added to common SRAM power line, the pull-down current through flash Strings to grounding source line can be made much larger than the pull-up current to improve SFwrite program operation. Simple method by increasing flash cell channel length to effectively enhance coupling area is applied to secure SRAM-to-Flash store operation under self-boost-program-inhibit scheme. 1S2F architecture also provide flexibility for alternate erasing and programming during both a recall and store operation.

Abstract: A nonvolatile latch circuit that includes a logic circuitry comprising at least an input terminal, a clock terminal, an output terminal, and a nonvolatile memory element. The logic circuitry is electrically coupled to a high voltage source at a first source terminal and to a low voltage source at a second source terminal. The nonvolatile memory element is electrically coupled to the output terminal at a first end and to a intermediate voltage source at a second end. A logic state of the latch circuit responds to an input signal during an active period of a clock signal. A logic state of the nonvolatile memory element is controlled by a bidirectional current running between the first and second ends. An electrical potential of the intermediate voltage source is higher than that of the low voltage source but lower than that of the high voltage source.

Abstract: A method for data storage includes storing first data bits in a set of multi-bit analog memory cells at a first time by programming the memory cells to assume respective first programming levels. Second data bits are stored in the set of memory cells at a second time that is later than the first time by programming the memory cells to assume respective second programming levels that depend on the first programming levels and on the second data bits. A storage strategy is selected responsively to a difference between the first and second times. The storage strategy is applied to at least one group of the data bits, selected from among the first data bits and the second data bits.

Abstract: A nonvolatile memory system is described with novel architecture coupling nonvolatile storage memory with random access volatile memory. New commands are included to enhance the read and write performance of the memory system.

Abstract: According to one embodiment, a memory system includes a semiconductor memory including a memory core having first and second circuits and an input/output circuit, a control device, a voltage control circuit which generates first to third drive voltages, and the first to third power supply lines separated from each other. The voltage control circuit supplies the first drive voltage to the first circuit through the first power supply line, the second drive voltage lower than the first drive voltage to the input/output circuit and the control device through the second power supply line, and the third drive voltage to the second circuit through the third power supply line.

Abstract: This invention discloses a low-voltage fast-write 12T or 14T PMOS NVSRAM cell structure which comprises a 6T LV SRAM cell and one pairs of two 3T or 4T HV PMOS Flash strings. Due to reverse threshold voltage definition of PMOS and NMOS flash cell, this PMOS NVSRAM cell has the advantage over the NMOS NVSRAM cell to have the same data polarity between SRAM and Flash pairs during the data writing operation. In addition, this PMOS NVSRAM's PMOS Flash cell uses similar low-current FN-tunneling scheme as NMOS NVSRAM, thus the fast data program and erase can be achieved in a big density up to 100 Mb simultaneously. As a result, low power voltage operation of NVSRAM with 1.2V VDD can be much easier to be designed without coupling the FSL line to any VDD level during the flash data loading into SRAM cell during a power-on period.

Abstract: A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the

Abstract: An object is to provide a semiconductor device in which stored data can be retained even when power is not supplied, and there is no limitation on the number of write cycles. The semiconductor device includes a source line, a bit line, a first signal line, a second signal line, a word line, a memory cell connected between the source line and the bit line, a first driver circuit electrically connected to the bit line, a second driver circuit electrically connected to the first signal line, a third driver circuit electrically connected to the second signal line, and a fourth driver circuit electrically connected to the word line and the source line. The first transistor is formed using a semiconductor material other than an oxide semiconductor. The second transistor is formed using an oxide semiconductor material.

Abstract: A Dynamic Random Access Memory (DRAM) cell and a semiconductor Non-Volatile Memory (NVM) cell are incorporated into a single Non-Volatile Dynamic Random Access Memory (NVDRAM) cell. The NVDRAM cell is operated as the conventional DRAM cell for read, write, and refreshment on dynamic memory applications. Meanwhile the datum in the NVM cells can be directly loaded into the correspondent DRAM cells in the NVDRAM cell array without applying intermediate data amplification and buffering leading to high speed non-volatile data access. The datum in DRAM cells can be also stored back to the correspondent semiconductor NVM cells in the NVDRAM cells for the datum required for non-volatile data storage. The NVDRAM of the invention can provide both fast read/write function for dynamic memory and non-volatile memory storage in one unit memory cell.

Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.

Abstract: According to one embodiment, there is provided a fusion memory including a first memory cell array formed of a NAND cell unit and a second memory cell array formed of a DRAM cell on a semiconductor substrate. The NAND cell unit is formed of a non-volatile memory cell having a two-layer gate structure in which a first gate and a second gate are stacked, and a selective transistor connecting the first and second gates of the non-volatile memory cell. The DRAM cell is formed of a cell transistor having a structure same as the structure of the selective transistor, and a MOS capacitor having a structure same as the structure of the non-volatile memory cell or the selective transistor.

Abstract: A signal processing circuit that consumes less power by stop of supply of power for a short time. In a storage element, before supply of power is stopped, data in a first storage circuit is stored to a second storage circuit, and the data is read from the second storage circuit and a verification circuit can determine whether or not the data in the second storage circuit matches the data in the first storage circuit. After supply of power is restarted, the data in the second storage circuit is stored to the first storage circuit, and the verification circuit can determine whether or not the data in the second storage circuit matches the data in the first storage circuit. In such a manner, verification can be performed without requiring a time for verification.

Abstract: Techniques to utilize a very low power state with a memory subsystem that includes one or more non-volatile memory devices and a volatile memory system. A memory controller is coupled with the one or more non-volatile memory devices and the volatile memory system. The memory controller comprising at least an embedded control agent and memory locations to store state information. The memory controller to selectively enable and disable the one or more non-volatile memory devices. The memory controller transfers the state information to the volatile memory system prior to entering a low power state. Control circuitry is coupled with the memory controller. The control circuitry to selectively enable and disable operation of the memory controller.

Abstract: A nonvolatile latch circuit according to the present invention wherein the outputs of an inverter circuit and other inverter circuit which are cross-coupled are connected to each other via a series circuit in which a transistor, a variable resistance element, and other transistor are connected in this order; a store operation and a restore operation for a latch state are controlled by application of a voltage to control terminals of the transistor and the other transistor; and both end potentials of the variable resistance element are summed, an amount of the sum is amplified and inverted, and the inverted amount is returned to an input of the inverter circuit or the other inverter circuit, thereby restoring a logic state in which a forming process of the variable resistance element can be performed.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: A plurality of non-volatile storage elements on a common active layer are offset from neighbor non-volatile storage elements. This offsetting of non-volatile storage elements helps reduce interference from neighbor non-volatile storage elements. A method of manufacture is also described for fabricating the offset non-volatile storage elements.

Abstract: A nonvolatile memory device comprises a nonvolatile memory chip comprising a static latch, first and second dynamic latches that receive the data stored in the static latch through a floating node, and a memory cell configured to store multi-bit data. The nonvolatile memory device performs a refresh operation on the first dynamic latch where externally supplied first single bit data is stored in the first dynamic latch, performs a refresh operation on the second dynamic latch where externally supplied second single bit data is stored in the second dynamic latch, and programs the memory cell using the data stored in the first and second dynamic latches after the first and second single bit data are stored in the respective first and second dynamic latches.

Abstract: According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.

Abstract: A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.

Abstract: An object is to provide a semiconductor device with a novel structure in which stored data can be retained even when power is not supplied, and does not have a limitation on the number of times of writing operations. A semiconductor device includes a source-bit line, a first signal line, a second signal line, a word line, and a memory cell connected between the source-bit lines. The memory cell includes a first transistor, a second transistor, and a capacitor. The second transistor is formed including an oxide semiconductor material. A gate electrode of the first transistor, one of a source and drain electrodes, and one of electrodes of the capacitor are electrically connected to one another. The source-bit line and a source electrode of the first transistor are electrically connected to each other. Another source-bit line adjacent to the above source-bit line and a drain electrode of the first transistor are electrically connected to each other.

Abstract: A semiconductor device with a reduced area and capable of higher integration and larger storage capacity is provided. A multi-valued memory cell including a reading transistor which includes a back gate electrode and a writing transistor is used. Data is written by turning on the writing transistor so that a potential according to the data is supplied to a node where one of a source electrode and a drain electrode of the writing transistor and a gate electrode of the reading transistor are electrically connected to each other, and then turning off the writing transistor and holding a predetermined potential in the node. Data is read by supplying a reading control potential to a control signal line connected to one of a source electrode and a drain electrode of the reading transistor, and then detecting potential change of a reading signal line.

Abstract: A memory system includes nonvolatile memory having a plurality of memory cells of storage capacity of a specified number of bits equal to or greater than two bits, and a number-of-rewrites management table managing numbers of rewrites of the memory cells. The memory system includes a controller writing to the memory cells in a number of bits in accordance with a write request of a host, dividing the memory cells into groups in dependence on storage capacity after the numbers of rewrites of the memory cells managed by the number-of-rewrites management table exceed a specified number, and writing to the memory cells of the group corresponding to storage capacity of the number of bits in accordance with the write request of the host.

Abstract: It is an object to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied, and does not have a limitation on the number of writing operations. A semiconductor device includes a plurality of memory cells each including a transistor including a first semiconductor material, a transistor including a second semiconductor material that is different from the first semiconductor material, and a capacitor, and a potential switching circuit having a function of supplying a power supply potential to a source line in a writing period. Thus, power consumption of the semiconductor device can be sufficiently suppressed.

Abstract: This invention discloses several embodiments of a low-voltage fast-write NVSRAM cells, made of either of a 2-poly floating-gate type flash cell or a 1-poly charge-trapping SONOS or MONOS flash cell with improvement by adding a Bridge circuit. This Bridge circuit is preferably inserted between each LV 6T SRAM cell and each HV Flash cell that comprises one paired complementary Flash strings. The Flash strings can be made of either 2T or 3T Flash strings. The tradeoff of using either a 2T or a 3T Flash string is subject to the gate area penalty and required design specs. One improvement for adding the Bridge circuit into the NVSRAM cell is to ensure the data writing between Flash cell and SRAM cell with the same polarity and to allow the operation down to low 1.2V Vdd.

Abstract: An integrated circuit and methods of operating same are described. In an embodiment of the integrated circuit included is an array of memory cells, where each of the memory cells includes a resistance-change storage element and a thyristor-based storage element coupled in series. In embodiments of the methods included are methods for data transfer, data tracking, and operating a memory array.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation.

Abstract: A low-power programmable LSI that can perform dynamic configuration is provided. The programmable LSI includes a plurality of logic elements. The plurality of logic elements each include a configuration memory. Each of the plurality of logic elements performs different arithmetic processing and changes an electrical connection between the logic elements, in accordance with the configuration data stored in the configuration memory. The configuration memory includes a set of a volatile storage circuit and a nonvolatile storage circuit. The nonvolatile storage circuit includes a transistor whose channel is formed in an oxide semiconductor layer and a capacitor whose one of a pair of electrodes is electrically connected to a node that is set in a floating state when the transistor is turned off.

Abstract: There are provided at least one or more of substrate processing apparatuses that process a substrate, and a group management device connected to each substrate processing apparatus, so that the group management device monitors an operation state of the substrate processing apparatus, thereby grasping a timing of updating a program of the substrate processing apparatus, and when the timing arrives, updates the program.

Abstract: Methods and apparatus for programming a memory include programming cells to a first threshold voltage, verifying programming using a first verify voltage, and applying a test read voltage to verify again that the cells are programmed to the first threshold voltage. The test read voltage is lower than the first verify voltage.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

Abstract: A semiconductor memory device including a flash memory that includes a page, wherein the page includes a plurality of memory cells connected to even bitlines and odd bitlines of the flash memory, and the memory cells are disposed in a plurality of sectors. The semiconductor memory device also includes a memory controller configured to provide the flash memory with a read address that identifies sectors to be read. The flash memory is configured to determine a sequence of even sensing and odd sensing based on the read address and perform the even sensing and the odd sensing according to the determined sequence. In addition, the flash memory is configured to sense data of at least one identified sector that includes memory cells connected to the even bitlines during the even sensing and sense data of at least one identified sector that includes memory cells connected to the odd bitlines during the odd sensing.

Abstract: A nonvolatile memory system is described with novel architecture coupling nonvolatile storage memory with random access volatile memory. New commands are included to enhance the read and write performance of the memory system.

Abstract: Techniques for providing a semiconductor memory device are disclosed. In one particular embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns, each memory cell. Each of the memory cell may include a first region coupled to a source line, a second region coupled to a bit line, and a body region capacitively coupled to at least one word line via a gate region and disposed between the first region and the second region, wherein the body region may include a plurality of floating body regions and a plurality of floating gate regions capacitively coupled to the at least one word line.

Abstract: In at least one embodiment, a memory cell includes a substrate having a top surface and a first conductivity type; a first region having a second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer; a gate positioned between the first and second regions and above the top surface; and a nonvolatile memory configured to store data upon transfer from the body region.

Abstract: A semiconductor random access memory device includes a memory cell including a resistor whose resistance varies by formation and disappearance of a filament due to an oxidation-reduction reaction of metal ions, a memory area configured to include a first memory area operable in a nonvolatile mode in which a stored content thereof is not lost by a power-off event, and a second memory area operable in a volatile mode in which the stored content thereof is lost by the power-off event, each of the first memory area and the second memory area including the plurality of the memory cells, a register circuit that stores information including a first address information indicating the first memory area, and a second address information indicating the second memory area, and a control circuit that controls the nonvolatile mode, and the volatile mode, with reference to the information stored in the register circuit.

Abstract: The methods and structures described are used to prevent protrusion of contact metal (such as W) horizontally into gate stacks of neighboring devices to affect the work functions of these neighboring devices. The metal gate under contact plugs that are adjacent to devices and share the (or are connected to) metal gate is defined and lined with a work function layer that has good step coverage to prevent contact metal from extruding into gate stacks of neighboring devices. Only modification to the mask layout for the photomask(s) used for removing dummy polysilicon is involved. No additional lithographical operation or mask is needed. Therefore, no modification to the manufacturing processes or additional substrate processing steps (or operations) is involved or required. The benefits of using the methods and structures described above may include increased device yield and performance.

Abstract: Apparatus and methods for determining pass/fail condition of memories are disclosed. In at least one embodiment, a set of common lines, one for each rank of page buffers corresponding to a page, determine the pass/fail status of all connected memory cells, and the pass/fail status results for each line can be combined to determine a pass/fail for the page of memory.

Abstract: Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region.

Abstract: In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories.

Abstract: A volatile memory area includes a plurality of second memory cells, a third select transistor, and a fourth select transistor. The plurality of second memory cells are electrically connected in series, and stacked above the substrate. The third select transistor is connected to one end of the plurality of second memory cells, and connected to a second bit line. The fourth select transistor is connected to the other end of the plurality of second memory cells, and unconnected to a second source line. A controller is configured to supply a first voltage to all gates of the second memory cells. The first voltage is capable of turning on the plurality of second memory cells.

Abstract: Memory cell structures and methods are described herein. One or more memory cells include a transistor having a charge storage node, a dielectric material positioned between the charge storage node and a channel region of the transistor, the channel region positioned between a source region and a drain region, and a first electrode of a diode coupled to the charge storage node.

Abstract: A memory circuit includes a high voltage region providing storage of a nonvolatile bit, and a low voltage region providing at least partial storage of a volatile bit. The high and low voltage regions are isolated from one another and formed by a plurality of transistors in series between a current source and a bit line.

Abstract: A single polycrystalline silicon floating gate nonvolatile memory cell has a MOS capacitor and a storage MOS transistor fabricated with dimensions that allow fabrication using current low voltage logic integrated circuit process. The MOS capacitor has a first plate connected to a gate of the storage MOS transistor to form a floating gate node. The physical size of the MOS capacitor is relatively large (approximately 10 time greater) when compared to a physical size of the storage MOS transistor to establish a large coupling ratio (greater than 80%) between the second plate of the MOS capacitor and the floating gate node. When a voltage is applied to the second plate of the MOS capacitor and a voltage applied to the source region or drain region of the MOS transistor establishes a voltage field within the gate oxide of the MOS transistor such that Fowler-Nordheim edge tunnel is initiated.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

Abstract: A process of operating a memory circuit involves RECALLing a state of a volatile memory cell from a nonvolatile memory cell, and inverting an output of the volatile memory cell after every other RECALL.

Abstract: A semiconductor memory device includes a memory cell array, first and second data caches, and a control circuit. The control circuit is configured to control, with use of the first and second data caches, a read operation of reading data from the selected memory cell of the memory cell array, and a write operation of writing data in the selected memory cell of the memory cell array. The control circuit is configured to execute, at a time of the read operation, an arithmetic operation of the data held in the first data cache by using the first and second data caches, and to generate the data which is to be written in the selected memory cell.