Abstract: A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.

Abstract: The present technology relates to an electronic device. According to the present technology, a memory device may include a plurality of memory cells, a defect detector, and a test controller. The defect detector may generate defect information indicating a defect state in which a value of a cell current measured in a sensing operation on selected memory cells among the plurality of memory cells is less than a threshold value. The test controller may count fail bits from a result of a test operation performed on the selected memory cells using a test reference current in response to the defect information, and set a bit line voltage to be used in the sensing operation based on a comparison result between a number of fail bits detected in the test operation and a reference number.

Abstract: A method for operating a three-dimensional (3D) memory device includes performing a first read operation for sensing a first memory cell of a first transistor string, and performing a subsequent second read operation for sensing a second memory cell of a second transistor string. Performing the first read operation includes applying a first bit line voltage to a first bit line, and maintaining the first bit line basically undischarged after data state of the first memory cell is detected.

Abstract: It is determined whether a write disturb capability associated with a first location of a memory device satisfies a threshold criterion. Responsive to determining that the write disturb capability associated with the first location of the memory device satisfies the threshold criterion, a plurality of memory units is remapped to a second location of the memory device, wherein a write disturb capability associated with the second location of the memory device does not satisfy the threshold criterion.

Abstract: Circuits and methods are described herein for controlling a bit line precharge circuit. For example, a control circuit includes a first latch circuit and a second latch circuit. The first latch circuit is configured to receive a first light sleep signal. The first latch circuit generates a second light sleep signal according to a clock signal. The second latch circuit is configured to receive the second light sleep signal. The second latch circuit generates a third light sleep signal according to a sense amplifier enable signal. The second latch circuit provides the third light sleep signal to a bit line reading switch, so the bit line reading switch is cutoff after a sense amplifier is enabled.

Abstract: A semiconductor memory device includes a memory cell connected between a bit line and a source line, a sense amplifier having a first transistor provided between at least two transistors of the sense amplifier and the bit line, and a controller which executes a read operation to read data stored by the memory cell. In the read operation, the controller applies a first voltage to the first transistor and a second voltage to the source line during a first time period, applies a third voltage to the first transistor and a fourth voltage to the source line during a second time period after the first time period, and applies the first voltage to the first transistor and a fifth voltage to the source line during a third time period after the second time period.

Abstract: A memory device includes a sense amplifier (SA) latch coupled to a sense node. A dynamic latch (DL) is connected to the SA latch and coupled to sense node. A sense line includes the sense node and is selectively connected to the SA latch, the DL, and a bit line that is coupled to a memory cell string. Control logic is coupled to the SA latch and the DL, and to: cause a pre-program verify voltage to boost the sense node; and, in response to detecting a high bit value stored in SA latch, cause a voltage to turn on set transistor(s) of DL so that a first bias voltage or a second bias voltage is stored at a latch transistor. The first bias voltage is useable for slow programming of a selected memory cell and the second bias voltage is useable for fast programming of the selected memory cell.

Abstract: A nonvolatile memory device includes a memory cell array having cell strings that each includes memory cells stacked on a substrate in a direction perpendicular to the substrate. A row decoder is connected with the memory cells through word lines. The row decoder applies a setting voltage to at least one word line of the word lines and floats the at least one word line during a floating time. A page buffer circuit is connected with the cell strings through bit lines. The page buffer senses voltage changes of the bit lines after the at least one word line is floated during the floating time and outputs a page buffer signal as a sensing result. A counter counts a number of off-cells in response to the page buffer signal. A detecting circuit outputs a detection signal associated with a defect cell based on the number of off-cells.

Abstract: According to one embodiment, a semiconductor memory device includes a first conductor extending in a first direction, bit lines, sense amplifiers, and a second conductor extending in the first direction. A plurality of first memory cells being connected to the first conductor. The bit lines respectively connected to the first memory cells. The first sense amplifiers are respectively connected to a plurality of first bit lines included in the bit lines, each of the first sense amplifiers including a first sense node, and a first transistor connected between the first sense node and a corresponding one of the first bit lines. The second conductor function as gate electrodes of the first transistors included in the first sense amplifiers.

Abstract: Memory devices might include an array of memory cells, a plurality of access lines, and control logic. The array of memory cells includes a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines is connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The control logic is configured to: open the array of memory cells for multiple read operations; read first page data from respective memory cells coupled to a selected access line of the plurality of access lines; read second page data from the respective memory cells coupled to the selected access line; and close the array of memory cells subsequent to reading the first page data and the second page data.

Abstract: According to an exemplary embodiments, the disclosure is directed to a memory circuit which includes not limited to a first half sense amplifier circuit connected to a first plurality of memory cells through a first bit line and configured to receive a unit of analog electrical signal from each of the first plurality of memory cells and to generate a first half sense amplifier output signal corresponding to the first bit line based on a first gain of the half sense amplifier and an accumulation of the units of analog signals, a locking code register circuit configured to receive a locking data and to generate a digital locking sequence, and a source selector circuit configured to receive the digital locking sequence and to generate a first adjustment signal to adjust the first half sense amplifier output signal corresponding to the first bit line by adjusting the first gain.

Abstract: A method of testing a non-volatile memory (NVM) array includes heating the NVM array to a target temperature, and while the NVM array is heated to the target temperature, programming a subset of the NVM cells to first resistance levels and obtaining a first current distribution, programming the subset of NVM cells to second resistance levels and obtaining a second current distribution, calculating a current threshold level from the first and second current distributions, and for each of the NVM cells, programing the NVM cell to one of the first or second resistance levels, and using the current threshold level to determine a first pass/fail (P/F) status and a second P/F status at the programmed resistance level. A bit error rate (BER) of the NVM array is calculated based on the first and second current distributions and the first and second P/F status of each of the NVM cells.

Abstract: A semiconductor memory device includes a memory cell array including memory cells, a peripheral circuit performing a read/verify operation of selected memory cells, and a control logic circuit controlling the read/verify operation of the peripheral circuit. The control logic circuit controls the peripheral circuit to apply a first voltage to a selected word line connected to the selected memory cells, float unselected word lines adjacent to the selected word line among unselected word lines, apply a first under-drive voltage lower than the first voltage to the selected word line during at least a partial period in which the unselected word lines adjacent to the selected word line are floated, and apply a second voltage higher than the first under-drive voltage and lower than the first voltage to the selected word line.

Abstract: According to an embodiment, a memory controller obtains first data in a first page using a first voltage, obtains a first shift amount based on a first and second number. The first and second numbers represent numbers of bits each of which has different values in a first and second manner between the first data and first expected data. The controller obtains second data in the second page using a second voltage and a second shift amount, and obtains a third shift amount based on a third and fourth number, the third and fourth numbers respectively represent numbers of bits each of which has different values in the first and second manner between the second data and second expected data.

Abstract: A memory device includes a memory cell array, a page buffer circuit, and a counting circuit. The page buffer circuit includes a first and second page buffer columns connected to the memory cell array. The first page buffer column includes a first page buffer unit and the second page buffer column includes a second page buffer unit in a first stage. The first page buffer unit performs a first sensing operation in response to a first sensing signal, and the second page buffer unit performs a second sensing operation in response to a second sensing signal. The counting circuit counts a first number of memory cells included in a first threshold voltage region from a result of the first sensing operation, and counts a second number of memory cells included in a second threshold voltage region from a result of the second sensing operation.

Abstract: In a method for accessing memory cells, a first read operation is performed on a first memory cell to read a first data value from the first memory cell. During the first read operation, a first variable current source provides a first assessment current having a first current level to a first bitline coupled to the first memory cell. A second read operation is performed on the first memory cell to read a second data value from the first memory cell. During the second read operation, the first variable current source manipulates the first current level to provide a second current level to the first bitline. A difference between the first current level and the second current level is based on whether the first data value that was read during the first read operation was a first data state or a second data state.

Abstract: A storage device includes: a memory device including a plurality of memory cells, the memory device performing a read operation of reading data stored in selected memory cells among the plurality of memory cells; and a memory controller for receiving a read request from a host, and controlling the memory device to perform the read operation corresponding to the read request. The memory controller includes a read voltage inferrer for, when the read operation is completed, receiving read information on the read operation from the memory device, performing a read quality evaluation operation of evaluating the read operation based on the read information, and performing a read voltage inference operation of inferring a secondary read level corresponding to the read information according to a result of the performing the read quality evaluation operation.

Abstract: A page buffer circuit includes a sensing latch circuit and a caching latch circuit. The sensing latch circuit is configured to receive and sense data that is stored in a memory cell during a normal read operation. The caching latch circuit is configured to receive and sense the data that is stored in the memory cell during a suspend read operation.

Abstract: A modeling method of flicker noise of small-sized semiconductor device is provided, which includes steps of measuring flicker noise of the small-sized semiconductor device under different gate voltages to obtain device noise data; separating noise obtained by testing under the different gate voltages in frequency domain, to obtain noise spectrums resulted from Random Telegraph Noise (RTN) defects and a noise spectrum resulted from mobility fluctuation; processing the noise spectrums resulted from the changes of the charged states of the RTN defects to obtain Svg,I; processing the noise spectrum resulted from the mobility fluctuation to obtain Sid,II/III; and obtaining a total current noise intensity model, which is expressed as: Sid=Sid,I+Sid,II/III.

Abstract: A memory device includes a memory cell array, and a page buffer circuit connected to the memory cell array through a plurality of bit lines, including a plurality of page buffers arranged in correspondence with the bit lines and each of which includes a sensing node. The plurality of page buffers include a first page buffer, and the first page buffer includes: a first sensing node configured to sense data by corresponding to a first metal wire at a lower metal layer; and a second metal wire electrically connected to the first metal wire and at an upper metal layer located above the lower metal layer, and a boost node corresponding to a third metal wire adjacent to the second metal wire of the upper metal layer and configured to control a boost-up and a boost-down of a voltage of the first sensing node.

Abstract: A controller is configured to program the memory cells to a first set of data states in a first programming pass and to a greater second set of data states in a second programming pass. The controller performs the first programming pass on the first word line. The controller then repeats the process of programming a portion of another word line and then comparing an upper tail of an erased data state of the first word line to a critical voltage until the upper tail of the erased data state of the first word line exceeds the critical voltage by a threshold. In response to the upper tail of the erased data state exceeding the critical voltage by the threshold, the controller then alternates between the first and second programming passes until the first programming pass is completed on the remaining word lines of the memory block.

Abstract: A semiconductor device includes a first memory cell array including a plurality of first memory cells, a plurality of first reference cells and a plurality of first dummy cells, a second memory cell array including a plurality of second memory cells, a plurality of second reference cells and a plurality of second dummy cells, an input/output circuit provided between the first memory cell array and the second memory cell array, a first column decoder connected between the first memory cell array and the input/output circuit and a second column decoder connected between the second memory cell array and the input/output circuit. The second column decoder connects one of the plurality of second dummy cells and the plurality of second memory cells to a selected sense amplifier of the input/output circuit, when the first column decoder connects a selected first memory cell to the selected sense amplifier.

Abstract: A method for performing a program verify operation with respect to a target memory cell in a memory structure of a non-volatile memory system is provided. The method may include the step of determining a location of the target memory cell within the structure and, based upon the determined location of the target cell and with respect to each programmable memory state: (1) applying a first sense signal at a first point in time, and (2) applying a second sense signal at a second point in time. A time interval between the first and the second points in time is equal to a predetermined optimal time period plus or minus an offset parameter time value.

Abstract: A sensing device for a non-volatile memory includes a reference circuit, two switches, a sensing circuit and a judging circuit. The reference circuit is connected to a first node. A first terminal of the first switch is connected with the first node and a control terminal of the first switch receives an inverted reset pulse. A first terminal of the second switch is connected with the first node, a second terminal of the second switch receives a ground voltage, and a control terminal of the second switch receives a reset pulse. The sensing circuit is connected between the second terminal of the first switch and a second node. The sensing circuit generates a first sensed current. The judging circuit is connected to the second node. The judging circuit receives the first sensed current and generates an output data according to the first sensed current.

Abstract: A memory device includes a memory array including a plurality of wordline groups, each wordline group of the plurality of wordline groups including a set of even wordlines and a set of odd wordlines, and control logic, operatively coupled with the memory array, to perform operations including identifying a set of failing wordline groups from the plurality of wordline groups, the set of failing wordline groups including at least one failing wordline group determined to have failed a first erase verify of an erase verify process, and causing a second erase verify of the erase verify process to be performed sequentially with respect to each failing wordline group of the set of failing wordline groups.

Abstract: A page buffer circuit includes an intermediate circuit, a data storage circuit and an enhancive circuit. The intermediate circuit is coupled to a bit line coupled to a memory region and configured to apply a voltage having a voltage level, corresponding to a status of the memory region, to a sensing node. The data storage circuit is configured to store, therein, a value that corresponds to the status of the memory region in response to the voltage level. The enhancive circuit is coupled to the sensing node and configured to increase a capacitance of the sensing node in an enhancive interval during a selected operation.

Abstract: A memory device for improving the speed of a program operation and an operating method thereof is provided. The memory device includes a memory cell array including a plurality of memory cells, a voltage generator configured to generate voltages for one or more program operations and a verify operation performed on the plurality of memory cells, a control logic configured to perform a control operation on the plurality of memory cells so that a first program and a second program loop are performed, a second program operation being performed based on a compensation voltage level determined based on a result of the first verify operation, and a plurality of bit lines connected to the memory cell array, wherein the first verify operation includes first even sensing and second even sensing on even-numbered bit lines, and first odd sensing and second odd sensing on odd-numbered bit lines.

Abstract: A read voltage level correction method, a memory storage device, and a memory control circuit unit are provided. The method includes: using a first read voltage level as an initial read voltage level to perform a first data read operation on a first physical unit among multiple physical units to obtain a second read voltage level used to successfully read the first physical unit; recording association information between the first read voltage level and the second read voltage level in a transient look-up table; and performing a second data read operation according to a read level tracking table and the association information recorded in the transient look-up table.

Abstract: A circuit for monitoring usage of an active field effect transistor (FET) includes the active FET and a reference FET, formed in a same structure as the active FET. The active FET and the reference FET both are pFET or both are nFET, and are stacked on each other at a common gate. The circuit also includes a differential current sense circuit (DCSC) and a plurality of switches for connecting terminals of the FETs to logic voltage, ground voltage, and/or the DCSC. The DCSC is configured to measure and compare currents through each of the active and reference FETs when a threshold voltage is applied to the common gate.

Abstract: Methods, systems, and devices for operating a memory array with variable page sizes are described. The page size may be dynamically changed, and multiple rows of the memory array may be accessed in parallel to create the desired page size. A memory bank of the array may contain multiple memory sections, and each memory section may have its own set of sense components (e.g., sense amplifiers) to read or program the memory cells. Multiple memory sections may thus be accessed in parallel to create a memory page from multiple rows of memory cells. The addressing scheme may be modified based on the page size. The logic row address may identify the memory sections to be accessed in parallel. The memory sections may also be linked and accessing a row in one section may automatically access a row in a second memory section.

Abstract: A memory comprises a substrate, and word lines, bit lines and memory cells located on one side of the substrate. Each of the memory cells comprises a transistor comprising: a semiconductor layer comprising a source contact region, a channel region and a drain contact region connected sequentially; a primary gate electrically connected to one of the word lines; a source electrically connected to one of the bit lines and the source contact region of the semiconductor layer, respectively; a drain electrically connected to the drain contact region of the semiconductor layer; and a secondary gate electrically connected to the drain, wherein an orthographic projection of the primary gate on the substrate and an orthographic projection of the secondary gate on the substrate are at least partially overlapped with an orthographic projection of the channel region of the semiconductor layer on the substrate, respectively.

Abstract: The semiconductor memory device of the embodiment includes: a substrate; a first memory pillar extending in a first direction from the substrate, the first memory pillar including first memory cell transistors, a first selection transistor, a second selection transistor, second memory cell transistors, a third selection transistor, a fourth selection transistor, third memory cell transistors, a fifth selection transistor, a sixth selection transistor, fourth memory cell transistors, a seventh selection transistor, and an eighth selection transistor; a first select gate line; first word lines; a second select gate line; a third select gate line; second word lines; a fourth select gate line; a fifth select gate line; third word lines; a sixth select gate line; a seventh select gate line; fourth word lines; and an eighth select gate line.

Abstract: A nonvolatile memory device according to the embodiment includes: a first inverter; and a second inverter cross-coupled to the first inverter, wherein the second inverter includes a pull-up transistor, a pull-down transistor, and a ferroelectric field effect transistor having gate nodes connected to each other, and a restore transistor having one electrode connected to the ferroelectric field effect transistor, and the second inverter stores data in a nonvolatile manner.

Abstract: A memory device includes a memory array including a cell, and a controller coupled to the memory array. The controller is configured to control sequentially applying programming voltage pulses to the cell. A pulse width of each of the programming voltage pulses decreases as a pulse count of the programming voltage pulses increases.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a conductive region, a first data line, a second data line, a first memory cell coupled to the first data line and the conductive region, a second memory cell coupled to the second data line and the conductive region, a conductive structure, and a conductive line. The first memory cell includes a first transistor coupled to a second transistor, the first transistor including a first charge storage structure. The second memory cell includes a third transistor coupled to a fourth transistor, the third transistor including a second charge storage structure. The conductive structure is located between and electrically separated from the first and second charge storage structures. The conductive line forms a gate of each of the first, second, third, and fourth transistors.

Abstract: In accordance with an embodiment, a circuit includes: a trimmable reference current generator having a temperature dependent current output node, the trimmable reference current generator including: a proportional to absolute temperature (PTAT) current generation circuit; a first programmable current scaling circuit coupled to the PTAT current generation circuit and including a first output coupled to the temperature dependent current output node; a constant current generation circuit; a second programmable current scaling circuit coupled to the constant current generation circuit and including a first output coupled to the temperature dependent current output node; and a reference interface circuit having an input coupled to the temperature dependent current output node and an output configured to be coupled to a reference current input of a memory sense amplifier.

Abstract: A non-volatile memory device includes a control circuit configured to connect to a bit line that is connected to one or more non-volatile memory cells. The control circuit includes a first plurality of data latches connected to a first local data bus to store first program-verify pass/fail bits and a second plurality of data latches connected to a second local data bus to store second program-verify pass/fail bits for second non-volatile memory cells. The non-volatile memory device further includes a shared isolation latch and one or more interface circuits connected to the first local data bus and the second local data bus. The one or more interface circuits are configured to selectively block the first program-verify pass/fail bits from the first plurality of latches and the second program-verify pass/fail bits from the second plurality of latches according to an indicator bit stored in the shared isolation latch.

Abstract: An apparatus is provided that includes a memory die having a first memory cell, and a controller connected to the memory die. The controller is configured to apply a plurality of programming pulses to the first memory cell, apply a plurality of first verify pulses to the first memory cell, determine from the first verify pulses that the first memory cell has been programmed to a first programmed memory state, apply a single second verify pulse to the first memory cell after determining that the first memory cell has been programmed to the first programmed memory state, determine from the single second verify pulse that the first memory cell is no longer programmed to the first programmed memory state, and apply an additional programming pulse to the first memory cell.

Abstract: Methods, systems, and devices for reference voltage adjustment for word line groups are described. In some examples, one or more components of a memory system may determine a duration that data has been stored to one or more memory cells. Based on the duration, a voltage value of one or more reference voltages may be adjusted accordingly. For example, a voltage value of one or more reference voltages may be adjusted based on the duration. Moreover, the reference voltage values may be adjusted differently in response to the memory cells having stored data for a relatively longer duration, as opposed to memory cells that have stored data for a relatively shorter duration. The adjusted reference voltages may be used during a subsequent read operation. The voltage value of the one or more reference voltages may be adjusted on a word-line group by word-line group basis.

Abstract: Methods, systems, and devices for signal development circuitry layouts in a memory device are described. A memory device may include signal development circuitry that is positioned in multiple levels of a memory die relative to a substrate. For example, a set of first transistors used for developing access signals may be located on a first level of a memory die, and a set of second transistors used for developing the access signals may be located on a second level of the memory die. Formation of the set of first transistors and the set of second transistors may involve processing operations that are common with the formation of other transistors on a respective level, such as cell selection transistors, deck selection transistors, shunting transistors, and other transistors of the respective level.

Abstract: A nonvolatile memory device includes a plurality of bit lines that is connected with a plurality of cell strings, a common source line that is connected with the plurality of cell strings, at least one dummy bit line that is provided between the common source line and the plurality of bit lines, a control logic circuit that generates at least one dummy bit line driving signal in response to a command from an external device, and a dummy bit line driver that selectively provides a first voltage to the at least one dummy bit line in response to the dummy bit line driving signal.

Abstract: A storage device includes a nonvolatile memory device and a memory controller. An operating method of the storage device includes sending, at the memory controller, a first read command and first offset information to the nonvolatile memory device, performing, at the nonvolatile memory device, first read operations based on the first read command and the first offset information, sending, at the nonvolatile memory device, a result of the first read operations as first data to the memory controller, sending, at the memory controller, a second read command, read voltage levels, and second offset information to the nonvolatile memory device, performing, at the nonvolatile memory device, second read operations based on the second read command, the read level information, and the second offset information, and sending, at the nonvolatile memory device, results of the second read operations as second data to the memory controller.

Abstract: The memory device includes a controller that is configured to program the memory cells of a selected word line in a plurality of program-verify iterations. During a verify portion at least one of the program-verify iterations, the controller determines a threshold voltage of at least one memory cell relative to a first verify low voltage VL1, a second verify low voltage VL2, and a verify high voltage VH associated with a data state being programmed. The controller also maintains a count of program-verify iterations since the at least one memory cell passed a verify high voltage of a previously programmed data state or discharges a sense node through a channel including the at least one memory cell and compares a discharge time to predetermined sense times associated with the first and second verify low voltages and with the verify high voltage.

Abstract: Systems of screening memory cells of a memory include modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven with respect to a nominal operating voltage on the wordline. In a write operation, one or both of the bitline and wordline may be overdriven or underdriven with respect to corresponding a nominal operating voltage. Such a system has margin control circuity, which may be in the form of bitline and wordline margin controls, to modulate bitline and wordline voltages, respectively, in the memory cells of the memory array.

Abstract: A method for performing memory access of a Flash cell of a Flash memory includes: performing a plurality of sensing operations respectively corresponding to a plurality of sensing voltages to generate a first digital value and a second digital value of the Flash cell, the second digital value representing at least one candidate threshold voltage of the Flash cell; determining a threshold voltage of the Flash cell according to whether the at least one candidate threshold voltage is high or low; determining soft information of a bit stored in the Flash cell according to the threshold voltage of the Flash cell; and using the soft information to perform soft decoding.

Abstract: Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including performing a read operation on a block of the memory device by applying a read reference voltage to a selected wordline of the block and applying a pass-through voltage having a first value to a plurality of unselected wordlines of the block; detecting a read error in response to performing the read operation; and setting the pass-through voltage to a second value, wherein the second value is greater than the first value.

Abstract: An apparatus is provided that includes a plurality of word lines that include a plurality of word line zones, a plurality of non-volatile memory cells coupled to the plurality of word lines, and a control circuit coupled to the non-volatile memory cells. The control circuit is configured to determine a corresponding initial program voltage for each of the word line zones. Each corresponding initial program voltage is determined based on a number of program erase cycles.

Abstract: The present disclosure describes embodiments of a device with memory and a processor. The memory is configured to store integrated circuit (IC) trim and redundancy information. The processor is configured to extract bits from the IC trim and redundancy information, perform a hashing function on the extracted bits to generate hashed bits, and in response to statistical properties of the hashed bits meeting one or more criteria, output the hashed bits. In some embodiments, the memory that stores the IC trim and redundancy information can be different from other memory used by the device for other operations (e.g., accessing user data and program data that have been written into system memory).

Abstract: A sense amplifier, a control method of the sense amplifier, and a memory are provided. The sense amplifier includes: a first power input terminal, a second power input terminal, a first switch transistor, a second switch transistor, a third switch transistor, a fourth switch transistor, a fifth switch transistor, a first negative-channel metal-oxide semiconductor (NMOS) transistor, a second NMOS transistor, a first positive-channel metal-oxide semiconductor (PMOS) transistor and a second PMOS transistor.

Abstract: A memory device including a plurality of memory cells, a peripheral circuit, and a control logic. The peripheral circuit performs a first read operation using a plurality of read voltages on selected memory cells. The control logic controls the peripheral circuit to perform a cell counting operation, adjust remaining read voltages among the plurality of read voltages based on a read offset table and a cell count which is a result of the cell counting operation, and perform a first read operation on the selected memory cell with the remaining read voltages, in the first read operation. The control logic performs a read data output operation of a second read operation performed before the first read operation and the cell counting operation corresponding to the first read operation in parallel among a plurality of successively performed read operations.