Abstract: Apparatuses and techniques are described for programming a memory device with reduced temperature-based changes in the threshold voltage distribution (Vth). Different memory cells can have different values of a temperature coefficient, Tco, and high-Tco memory cells may tend to be at the lower tail of a Vth distribution. The memory cells are programmed using a first set of verify voltages which are temperature-independent. If the temperature at the time of the programming is less than a specified temperature, the high-Tco memory cells are identified and programmed further in a second pass using a second set of verify voltages which are temperature-dependent. Further, the second pass is configured to provide a narrower Vth distribution width than the first program pass. The second pass may use a smaller program pulse step size and/or an elevated bit line voltage.

Abstract: An erasing method used in a flash memory comprising at least one memory block divided into a plurality of memory sectors is illustrated. Whether the memory block or the memory sector corresponding to an address has at least one under-erased transistor memory cell according to a sector enable signal is verified, wherein the sector enable signal is determined according to whether the memory block has at least one over-erased transistor memory cell. The transistor memory cells of the memory block or the memory sector will be erased according to the sector enable signal if the memory block or the memory sector corresponding to the address that has the under-erased transistor memory cell.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a data storage circuit and a control circuit. The data storage circuit holds first data to be written into the memory cell and holds 1 bit data calculated from the first data. The control circuit writes the data of n bits into the memory cell in a first write operation and then executes a second write operation. The control circuit carries out the following control in the second write operation. It reads data stored in the memory cell in the first write operation. It restores the first data based on the data read from the memory cell and the 1 bit data held in the data storage circuit. It writes the restored first data into the memory cell.

Abstract: According to one embodiment, a memory device comprises a first memory cell configured to store data, a first word line connected to the first memory cell, a first circuit configured to supply a voltage to the first word line, a second circuit configured to control the first circuit, and a sequencer configured to control the first circuit and the second circuit. The sequencer, when data is written to the first memory cell, determines whether a condition is satisfied or not. The sequencer causes the second circuit to generate a first voltage, when the sequencer determines that the condition is not satisfied, and causes the second circuit to generate a second voltage which is higher than the first voltage, when the sequencer determines that the condition is satisfied.

Abstract: A flash memory device includes a flash memory comprising a plurality of pages for storing data, a control circuit configured to select a page of the plurality of pages in response to a received command, an accumulator configured to obtain a signal value of the selected page, and a comparator configured to compare the signal value with a predetermined value. The control circuit generates an indication signal indicative of a state of the selected page based on a comparison result.

Abstract: According to an embodiment, a semiconductor memory device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells, a word line driving circuit, a sense amplifier circuit, and a controller. The memory cell connected to the selected word line is written with data using a write sequence including a plurality of write loops each including a write operation of applying a write voltage to the selected word line by the word line driving circuit and a verify operation of detecting data of the memory cell by the sense amplifier circuit. The controller determines an (n+k)-th (where n is an integer not less than 1 and k is an integer not less than 2) verify operation based on comparison between an n-th verify operation and an (n+1)-th verify operation in the write sequence.

Abstract: A memory device includes a memory block coupled to a plurality of word lines arranged in parallel with each other between a first select line and a second select line, peripheral circuits supplying a verify voltage and a pass voltage to the first select line, the second select line, and the word lines, selectively discharging the first select line, the second select line and the word lines, and verifying memory cells coupled to a selected word line of the word lines, and a control logic controlling the peripheral circuits so that potentials of the selected word line, unselected word lines and the first and second select lines are the same as each other after verifying the memory cells and the first and second select lines are discharged after discharging the selected and unselected word lines, and an operating method thereof.

Abstract: Sensing in non-volatile memory is performed using bias conditions that are dependent on the position of a selected memory cell within a group of non-volatile memory cells. During sensing, a selected memory cell receives a reference voltage while the remaining memory cells receive a read or verify pass voltage. For at least a subset of the unselected memory cells, the pass voltage that is applied is dependent upon the position of the selected memory cell in the group. As programming progresses from a memory cell at a first end of a NAND string toward a memory cell at a second end of the NAND string, for example, the pass voltage for at least a subset of the unselected memory cells that have already been subjected to programming may be increased. This technique may reduce the effects of an increased channel resistance that occurs as more memory cells are programmed.

Abstract: Adaptive read reference voltage tracking techniques are provided that employ charge leakage mitigation. An exemplary device for use with multi-level memory cells, comprises a controller configured to: after a predefined time interval that approximates a settling time after a programming of the multi-level memory cells until a charge leakage of one or more of the multi-level memory cells has settled, determine a plurality of read reference voltages for the multi-level memory cells using a post-programming adaptive tracking algorithm; and employ the plurality of read reference voltages to read data from the multi-level memory cells. The reference voltage offsets are optionally determined based on a shift in the read reference voltages after the predefined time interval since the programming of the multi-level memory cells.

Abstract: A method for managing a flash storage system includes measuring an operation time to complete a data operation on a flash memory block of a flash memory device of the flash storage system. The method includes updating, based on the measured operation time, a running average time for the flash memory device to complete the data operation. The method includes comparing the updated running average time to a threshold time. The method includes adjusting an operating parameter for the flash memory device to perform the data operation based on the comparison.

Abstract: A memory system may include: a memory device including a plurality of storage regions; and a controller. The controller may be coupled between a host and the memory device, and perform a read retry operation when a read error occurs in any one of the storage regions based on occurrence possibilities for a plurality of different type of defects in any one storage region where a read error occurred.

Abstract: Memory devices include an array of memory cells and circuitry for control and/or access of the array of memory cells, wherein the circuitry is configured to perform a method including applying a particular voltage to an unselected access line of a program operation, sensing a current of a selected access line of the program operation while applying the particular voltage to the unselected access line, indicating a fail status of the program operation if an absolute value of the sensed current of the selected access line is greater than a particular current, and proceeding with the program operation if the absolute value of the sensed current of the selected access line is less than a particular current.

Abstract: Disclosed are a semiconductor memory device and an operating method thereof. The semiconductor memory device includes: a memory cell array including a plurality of memory blocks sharing one or more drain select lines; a peripheral circuit configured to perform a program operation on the memory cell array; and a control logic configured to control the peripheral circuit to coding-program one or more drain select transistors included in each of the plurality of memory blocks.

Abstract: In one embodiment, an apparatus comprises a controller to determine an erase state of a first memory deck independently from an erase state of a second memory deck, the first memory deck comprising a first plurality of wordlines and a first channel, the first memory deck comprising a first plurality of memory cells that are each coupled to the first channel and a respective one of the first plurality of wordlines; the second memory deck comprising a second plurality of wordlines and a second channel, the second channel coupled to the first channel, the second memory deck comprising a second plurality of memory cells that are each coupled to the second channel and a respective one of the second plurality of wordlines; and determine an erase state of the second memory deck independently from an erase state of the first memory deck.

Abstract: An erase-verify method for a three-dimensional (3D) memory and a memory system are provided. The 3D memory includes at least one memory cell string including a plurality of memory cells, and the memory cells include a first group of memory cells and a second group of memory cells. Each of the memory cells is coupled to a word line. The method comprises the following steps. A first erase-verify operation is performed on the first group of memory cells. After performing the first erase-verify operation on the first group of memory cells, a second erase-verify operation is performed on the second group of memory cells in condition that the first group of memory cells are verified as erased successfully.

Abstract: Apparatuses and methods for charging a global access line prior to accessing memory are described. An example apparatus may include a memory array of a memory. A plurality of global access lines may be associated with the memory array. The global access line may be charged to a ready-access voltage before any access command has been received by the memory. The global access line may be maintained at the ready-access voltage during memory access operations until the receipt of a post-access command. The post-access command may reset the global access line to an inactive voltage.

Abstract: Methods include applying a first voltage to channel regions of a plurality of memory cells; applying a lower second voltage to each access line of a plurality of access lines coupled to the memory cells other than a first set of access lines; applying a lower third voltage to the first set of access lines while applying the first voltage and the second voltage; determining a desired voltage level of the third voltage for a subsequent set of access lines; and applying the third voltage to the subsequent set of access lines while applying the first voltage and while applying the second voltage to each access line of the plurality of access lines other than the subsequent set of access lines. Methods further include methods of determining the desired voltage level for the third voltage for each set of access lines.

Abstract: A memory device is provided. The memory device includes: a memory array having a plurality of cells; a regulator, coupled to the memory, the regulator being configured to provide a bit line voltage to a selected cell of the memory array and to provide a bias voltage; and a controllable current source, coupled to the memory array, the controllable current source being configured to conduct a controllable current in the controllable current source until a cell current of the selected cell reaches a threshold.

Abstract: Methods and systems to refresh a nonvolatile memory device, such as a phase change memory. In an embodiment, as a function of system state, a memory device performs either a first refresh of memory cells using a margined read reference level or a second refresh of error-corrected memory cells using a non-margined read reference level.

Abstract: A memory device includes a memory block including a plurality of stacked sub-memory blocks, peripheral circuits configured to perform program, read and erase operations on the memory block or on a block selected from among the sub-memory blocks, and a control logic configured to control the peripheral circuits so that, during a read operation on the memory block, if a block on which a partial erase operation has been performed is not present among the sub-memory blocks, voltages to be used for the read operation are set and so that, if a block on which the partial erase operation has been performed is present among the sub-memory blocks, the voltages to be used for the read operation are varied depending on a position of a sub-memory block that is a target of the read operation.

Abstract: A sense amplifier for a memory circuit that can sense into the deep negative voltage threshold region is described. A selected memory cell is sensed by discharging a source line through the memory cell into the bit line and sense amplifier. While discharging the source line through the memory cell into the sense amplifier, a voltage level on the discharge path is used to set the conductivity of a discharge transistor to a level corresponding to the conductivity of the selected memory cell. A sense node is then discharged through the discharge transistor. To reduce noise, a decoupling capacitor is connected to the control gate of the discharge transistor and an auxiliary keeper current is run through the discharge transistor.

Abstract: A semiconductor device includes a substrate comprising a WELL region, a gate electrode comprising a gate length disposed on the WELL region, and first and second drift regions which overlap with the gate electrode. The first and second draft regions may overlap with the gate electrode at an overlapping length which is a percentage of the gate length.

Abstract: Sensing in non-volatile memory is performed using bias conditions that are dependent on the position of a selected memory cell within a group of non-volatile memory cells. During sensing, a selected memory cell receives a reference voltage while the remaining memory cells receive a read or verify pass voltage. For at least a subset of the unselected memory cells, the pass voltage that is applied is dependent upon the position of the selected memory cell in the group. As programming progresses from a memory cell at a first end of a NAND string toward a memory cell at a second end of the NAND string, for example, the pass voltage for at least a subset of the unselected memory cells that have already been subjected to programming may be increased. This technique may reduce the effects of an increased channel resistance that occurs as more memory cells are programmed.

Abstract: According to one embodiment, a memory system includes a storage medium including a first cell transistor, a first data latch, and a second data latch; and a first controller. The first controller is configured to instruct to the storage medium to, after instructing the storage medium to write data into the first cell transistor and before completion of the writing of the data into the first cell transistor, suspend a process being performed to the first cell transistor, read data from the first data latch, read data from the second data latch, and read data from the first cell transistor.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell, a second memory cell, a first word line electrically coupled to the first memory cell, a second word line electrically coupled to the second memory cell, and a control circuit configured to supply voltages to the first word line and the second word line. In a read, the control circuit applies a first voltage to the first word line and a second voltage to the second word line, applies, after applying the first voltage to the first word line and the second voltage to the second word line, a third voltage lower than the first voltage and the second voltage to the second word line, and applies, after applying the third voltage to the second word line, the third voltage to the first word line.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory device may leverage non-volatile memory properties of a ferroelectric capacitor—e.g., that a ferroelectric capacitor may remain polarized at one of two states without a voltage applied across the ferroelectric capacitor—to activate a subset of sensing components corresponding to multiple memory cells with a common word line. For example, a first and second set of memory cells with a common word like may be selected for a read operation. A first set of sensing components corresponding to the first set of memory cells may be activated for the read operation, and a second set of sensing components that correspond to the second set of memory cells may be maintained in a deactivated state.

Abstract: Technology for a memory device operable to program memory cells in the memory device is described. The memory device can include a plurality of memory cells and a memory controller. The memory controller can perform a first programming pass to program a memory cell in the plurality of memory cells. A defined number of blanket programming pulses can be applied to the memory cell during the first programming pass. The blanket programming pulses may not include verify operations. The memory controller can perform a second programming pass to program the memory cell. A defined number of program and verify (PV) pulses can be applied to the memory cell during the second programming pass.

Abstract: Provided is a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory unit including a plurality of memory blocks; a voltage supply circuit configured to generate a plurality of operating voltages and output the generated operating voltages to at least two global line groups during a program operation on the memory unit; a pass circuit configured to couple word lines of the memory blocks to the at least two global line groups; and a control logic configured to control the voltage supply circuit and the pass circuit such that during a program verify operation of the program operation, a program verify voltage is applied to a selected memory block of the memory blocks, and a set voltage is applied to a share memory block sharing with the selected memory block among unselected memory blocks.

Abstract: A memory device includes a memory block coupled to a plurality of word lines arranged in parallel with each other between a first select line and a second select line, peripheral circuits supplying a verify voltage and a pass voltage to the first select line, the second select line, and the word lines, selectively discharging the first select line, the second select line and the word lines, and verifying memory cells coupled to a selected word line of the word lines, and a control logic controlling the peripheral circuits so that potentials of the selected word line, unselected word lines and the first and second select lines are the same as each other after verifying the memory cells and the first and second select lines are discharged after discharging the selected and unselected word lines, and an operating method thereof.

Abstract: A non-volatile memory device may include a memory cell array including a plurality of planes, a page buffer connected to the memory cell array and corresponding to each of the plurality of planes, and a decoupling circuit. The page buffer is configured to receive a bit line voltage control signal (BLSHF) via a first node. The decoupling circuit is connected to the first node. The decoupling circuit includes at least one decoupling capacitor configured to execute charge sharing via the first node.

Abstract: Technology for a memory device is described. The memory device can include a plurality of memory cells and a memory controller. The memory controller can apply a first voltage level to a selected wordline associated with the plurality of memory cells during a body reset operation. The memory controller can apply a second voltage level to an unselected wordline associated with the plurality of memory cells during the body reset operation. The selected wordline can transit to a stable negative pillar potential, such that selected memory cells associated with the selected wordline can have a reduced threshold voltage instability.

Abstract: A memory control method includes providing a memory including a first area and a second area, and reading data in the first area and the second area when receiving data to be stored. The method also includes selecting, from the first area and the second area, an area in which the data is in an erased state. In addition, the method includes performing a programming operation on each memory cell in the selected area to write the data to be stored into the selected area. Further, the method includes—performing an erase operation on a remaining area in the first area and the second area to perform a next data writing process, after writing the data to be stored into the selected area.

Abstract: In one embodiment, an apparatus includes a non-volatile memory, a one-time programmable (OTP) memory, and a processor operative to write data values to the non-volatile memory and then initiate programming of a first bit of the OTP memory, the first bit being associated with locking the non-volatile memory from further data being written thereto, and after the non-volatile memory has been locked from further data being written thereto, initiate programming of the second bit of the OTP memory in order to lock the non-volatile memory from further data being erased therefrom.

Abstract: Apparatuses and methods for performing memory operations are described. In an example apparatus, a memory is configured to receive a memory instruction and perform a memory operation responsive to the memory instruction. The memory is further configured to provide an acknowledgement indicative of an end of the variable latency period wherein the acknowledgement includes information related to an acceptance of a memory instruction. Data associated with the memory instruction is exchanged with the memory following the acknowledgement. In an example method a read instruction and an address from which read data is to be read is received. A write operation is suspended responsive to the read instruction and an acknowledgement indicative of an end of the variable latency period is provided. Read data for the read instruction is provided and the write operation is continued to be suspended for a hold-off period following completion of the read operation.

Abstract: An advantageous write verify operation for bipolar memory devices is disclosed. The verify operation is performed under the same bias conditions as the write operation. Thus, the verify operation reduces disturb conditions caused when verify operation is performed in opposite bias to write operation. The advantageous write verify operation may be performed with control logic on source and bit lines. In another embodiment, the advantageous write operation is performed with mux coupled to control logic. The mux determines whether verify (0) or verify (1) operation should be performed based on data in a program latch. Moreover, the mux may select bias conditions for read operations based on a register bit. Trim circuits optionally provide guard banding and modify reference voltages for verify operations performed in opposite polarity to normal read operation.

Abstract: A power switch circuit includes a first transistor, a second transistor and a current source. A first source/drain terminal and a gate terminal of the first transistor receive a first supply voltage and a second supply voltage, respectively. A second source/drain terminal and a body terminal of the first transistor are connected with a node z. An output signal is outputted from the node z. A first source/drain terminal and a gate terminal of the second transistor receive the second supply voltage and the first supply voltage, respectively. A second source/drain terminal and a body terminal of the second transistor are connected with the node z. The current source is connected between a bias voltage and the node z. The first supply voltage, the second supply voltage or the bias voltage is selected as the output signal.

Abstract: A storage device includes a nonvolatile memory device including a plurality of memory cells, the memory cells divided into a plurality of pages, and a controller configured to control the nonvolatile memory device. The storage device is configured to collect two or more write data groups to be written to two or more pages, to simultaneously perform a common write operation with the two or more pages based on the two or more write data groups, and to sequentially perform an individual write operation with each of the two or more pages based on the two or more write data groups.

Abstract: A method and memory for stressing a plurality of non-volatile memory cells is provided. The method includes entering a memory cell stressing mode and providing one or more erase stress pulses to the plurality of non-volatile memory cells; determining that a threshold voltage of at least a subset of the plurality of non-volatile memory cells has a first relationship that is either greater than or less than a first predetermined voltage; providing one or more program stress pulses to the plurality of memory cells; and determining that the threshold voltage of at least a subset of the plurality of memory cells has a second relationship to a second predetermined voltage that is different than the first relationship.

Abstract: A semiconductor memory device includes a memory cell array, a read/write circuit and a control logic. The memory cell array includes a plurality of memory cells. The read/write circuit is configured to write data to the memory cell array or read data from the memory cell array. The control logic is configured to control the read/write circuit to perform a read/write operation for the memory cell array. The memory cell array includes a plurality of memory blocks, and each of the memory blocks includes a plurality of sub-blocks. During an operation of erasing a sub-block in a memory block, the control logic selects a sub-block to be erased regardless of a sequence in which the sub-blocks have been programmed, and determines an erase verify voltage based on a position of the selected sub-block.

Abstract: An apparatus is described. The apparatus includes a non volatile memory device that includes a controller to implement a coarse write process for the non volatile memory device. The non volatile memory device includes storage cells to store more than two logic states, wherein, the coarse write process is to perform a verify operation early in the coarse write process to identify less responsive storage cells and provide additional charge to the less responsive storage cells as compared to non less responsive storage cells that are to be programmed to a same logical state as the less responsive storage cells without performing a following verify operation after each pulse of charge applied during the coarse write process.

Abstract: A data latch circuit includes a first inverter circuit having a first input terminal and a first output terminal, and connected between a first voltage source and a second voltage source, a second inverter circuit having a second input terminal electrically connected to the first output terminal and a second output terminal electrically connected to the first input terminal, and connected between the first voltage source and the second voltage source, a first transistor electrically connected between the first voltage source and the first inverter circuit, a second transistor electrically connected between the second voltage source and the first inverter circuit, a first switch circuit that controls an electrical connection between the first output terminal and a first bus, and a second switch circuit that controls an electrical connection between the first output terminal and a second bus.

Abstract: A non-volatile memory includes a power switch circuit and a non-volatile cell array. The power switch circuit includes a first transistor, a second transistor and a current source. A first source/drain terminal and a gate terminal of the first transistor receive a first supply voltage and a second supply voltage, respectively. A second source/drain terminal and a body terminal of the first transistor are connected with a node z. A first source/drain terminal and a gate terminal of the second transistor receive the second supply voltage and the first supply voltage, respectively. A second source/drain terminal and a body terminal of the second transistor are connected with the node z. The current source is connected between a bias voltage and the node z. A power terminal of the non-volatile cell is connected with the node z for receiving an output signal.

Abstract: A control voltage searching method is provided. Firstly, a control pulse with a preset control voltage and a preset pulse width is generated, and a control action on a memory cell. If the pulse count of the control pulse is smaller than a first number, the control voltage plus a first increment is set as an updated value of the control voltage. If the pulse count of the control pulse is not smaller than a first number, a first-stage verifying action is performed to judge whether the memory cell passes a first-stage verification test. If the memory cell passes the first-stage verification test, a second-stage verifying action is performed to judge whether the memory cell passes a second-stage verification test. If the memory cell passes the second-stage verification test, a target value of the control voltage is acquired.

Abstract: An erase operation includes one or more erase depth checks to detect the occurrence of shallow erased memory cells at the end of an erase process. Memory cells are subjected to erase and erase verification until erase verification success is achieved. At the end of successful erase verification, a subset of memory cells is read to detect an erase depth or level of the memory cells. If the erase depth check indicates that the subset memory cells are in a shallow erased condition, additional erasing and verification is performed.

Abstract: Methods of operating a memory device include programming a page of a memory block of the memory device using a particular starting programming voltage, determining a programming voltage indicative of a programming efficiency of the page of the memory block during programming of the page of the memory block, storing a representation of the programming voltage indicative of the programming efficiency of the page of the memory block, setting a starting programming voltage for a different page of the memory block in response to the stored representation of the programming voltage indicative of the programming efficiency of the page of the memory block, and programming the different page of the memory block using its starting programming voltage.

Abstract: Apparatus and methods are disclosed, including an apparatus having first and second units of vertically arranged strings of memory cells, each unit including multiple tiers of a semiconductor material, each tier including an access line of at least one memory cell and a channel of a decoder transistor, wherein the channel of the decoder transistor of each of the multiple tiers of the first unit of memory cells is coupled to the channel of the decoder transistor of a corresponding tier of the second unit of memory cells. Methods of forming such apparatus are disclosed, as well as methods of operation, and other embodiments.

Abstract: A method of controlling a cycle for writing at least one data item to at least one memory slot of the electrically programmable and erasable read-only memory type disposed in an electronic circuit supplied by a supply voltage includes a controlled increase of the duration of the write cycle in the presence of a decrease in the supply voltage.

Abstract: Apparatuses and methods for variable latency memory operations are disclosed herein. An example apparatus may include a memory configured to provide first information during a variable latency period indicating the memory is not available to perform a command, wherein the first information is indicative of a remaining length of the variable latency period, the remaining length is one of a relatively short, normal, or long period of time, the memory configured to provide second information in response to receiving the command after the latency period.

Abstract: Apparatuses and methods for performing memory operations are described. An example apparatus includes a memory operation controller. The memory operation controller is configured to receive memory instructions and decode the same to provide internal signals for performing memory operations for the memory instructions. The memory operation controller is further configured to provide information indicative of a time for a variable latency period of a memory instruction during the variable latency period. In an example method, a write instruction and an address to which write data is to be written is received at a memory and an acknowledgement indicative of an end of a variable latency period for the write instruction is provided. After waiting a variable bus turnaround after the acknowledgement, write data for the write instruction is received.

Abstract: A display apparatus includes a display panel and a first gate driver. The display panel includes a plurality of data lines extending in a first direction, and a plurality of gate lines extending in a second direction obliquely inclined toward the first direction and spaced apart from each other in a third direction crossing the second direction. The plurality of gate lines includes a first gate line group and a second gate line group respectively disposed in first and second display areas of the display panel. The first gate driver is configured to drive at least one gate line of the second gate line group while driving at least one gate line of the first gate line group.