Abstract: The present disclosure is directed to a sense amplifier architecture for a memory device having a plurality of memory cells. Groups of non-volatile memory cells store respective codewords formed by stored logic states, logic high or logic low, of the memory cells of the group. The sense amplifier architecture has a plurality of sense amplifier reading branches, each sense amplifier reading branch coupled to a respective memory cell and configured to provide an output signal, which is indicative of a cell current flowing through the same memory cell; a comparison stage, to perform a comparison between the cell currents of memory cells of a group; and a logic stage, to determine, based on comparison results provided by the comparison stage, a read codeword corresponding to the group of memory cells.

Abstract: A semiconductor device includes a first memory cell and a dummy region adjacent to the first memory cell. The first memory cell includes a first transistor. The dummy region includes a cut-off transistor. The cut-off transistor has a first terminal electrically coupled to a second terminal of the first transistor. The cut-off transistor has a third terminal electrically coupled to ground.

Abstract: A programming method of a non-volatile memory cell is provided. The non-volatile memory cell includes a memory transistor. Firstly, a current limiter is provided, and the current limiter is connected between a drain terminal of the memory transistor and a ground terminal. Then, a program voltage is provided to a source terminal of the memory transistor, and a control signal is provided to a gate terminal of the memory transistor. In a first time period of a program action, the control signal is gradually decreased from a first voltage value, so that the memory transistor is firstly turned off and then slightly turned on. When the memory transistor is turned on, plural hot electrons are injected into a charge trapping layer of the memory transistor.

Abstract: A non-volatile memory system includes a control circuit connected to non-volatile memory cells. The control circuit is configured to concurrently program memory cells connected to different word lines that are in different sub-blocks of different blocks in different planes of a die.

Abstract: The dynamic memory array of a DRAM device is operated using at least two voltages. The first voltage, which is used to power the sense amplifiers during sense (i.e., read) operations and most other column operations (e.g., precharge, activate, write), is the operating (i.e., switching) voltage of a majority of the digital logic circuitry of the DRAM device. The second voltage, which determines the voltage written to the capacitor of the DRAM cells (i.e., bitline voltage) is greater than the operating (i.e., switching) voltage of a majority of the digital logic circuitry of the DRAM device. The digital logic circuitry is operated using a supply voltage that is lower than the voltage written to the capacitors of the DRAM array. This allows lower voltage swing digital logic to be used for a majority of the logic on the DRAM device while writing a larger voltage to the DRAM cells.

Abstract: An electronic device including: a regulator circuit configured to output a regulated voltage based on a reference voltage and a feedback voltage; and an oscillator configured to generate an output frequency signal based on a reference frequency signal and the regulated voltage output from the regulator circuit, wherein the regulator circuit includes: a feedback loop configured to output the regulated voltage based on a difference between the reference voltage and the feedback voltage; a first capacitor; a precharge circuit connected to the feedback loop, and configured to charge the first capacitor with a second voltage which is based on a first voltage; a first switch configured to connect the precharge circuit with the first capacitor; and a second switch configured to connect the first capacitor with the feedback loop.

Abstract: In an embodiment, a device includes: a first dielectric layer over a substrate; a word line over the first dielectric layer, the word line including a first main layer and a first glue layer, the first glue layer extending along a bottom surface, a top surface, and a first sidewall of the first main layer; a second dielectric layer over the word line; a first bit line extending through the second dielectric layer and the first dielectric layer; and a data storage strip disposed between the first bit line and the word line, the data storage strip extending along a second sidewall of the word line.

Abstract: The present application discloses a memory device, a programming method and a memory system. The memory device comprises: a memory cell array comprising a plurality of word lines and a plurality of bit lines; each of the word lines comprising at least two word line segments; each of the word line segment in the word line having different signal transmission distances from a word line driver; different word line segments in the word line corresponding to different bit lines respectively; the word line driver configured to apply a word line voltage to the word line; a bit line driver configured to apply different bias voltages to different bit lines corresponding to the different word line segments respectively during application of a programming pulse.

Abstract: The present disclosure relates to integrated circuits, and more particularly, to a wordline system architecture supporting an erase operation and current-voltage (I-V) characterization and methods of manufacture and operation. In particular, the present disclosure relates to a structure including: a twin cell circuit which is connected to a wordline of a memory array; a sourceline driver which is connected to a sourceline of the memory array for providing a cell level current-voltage (I-V) access of the twin cell circuit; and an integrated analog multiplexor which is connected to the twin cell circuit.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

Abstract: A semiconductor storage device includes a memory cell array and a control circuit. The memory cell array includes a plurality of memory strings, a plurality of word lines, each of which is connected to the memory strings, and a plurality of bit lines connected to the memory strings, respectively. The plurality of bit lines are grouped into a plurality of bit line groups. The control circuit is configured to receive a read command and first address information specifying one or more of the bit line groups. The control circuit is configured to, in response to the read command, read data selectively from each memory string connected to each bit line in the one or more bit line groups specified by the first address information, and output the read data.

Abstract: A method of operating a semiconductor memory device includes a plurality of program loops for programming selected memory cells among a plurality of memory cells. Each of the plurality of program loops includes setting a state of a bit line connected to the selected memory cells, applying a program voltage to a word line connected to the selected memory cells, and performing a verify operation on the selected memory cells using a first pre-verify voltage, a second pre-verify voltage greater than the first pre-verify voltage, and a main verify voltage greater than the second pre-verify voltage. A first program permission cell, a second program permission cell, a third program permission cell, and a program prohibition cell are determined by performing the verify operation.

Abstract: The present disclosure relates to an electronic device. A memory device includes a plurality of memory cells coupled to a plurality of word lines, a voltage generator generating program-related voltages to be applied to the plurality of word lines, an address decoder transferring the program-related voltages to the plurality of word lines, and an operation controller controlling the voltage generator and the address decoder to apply a program voltage to a selected word line among the plurality of word lines, a second pass voltage to adjacent word lines neighboring the selected word line, a first pass voltage to remaining word lines except for the selected word line and the adjacent word lines, and to apply a ground voltage to the selected word line and the first pass voltage to the adjacent word lines during a first period.

Abstract: Disclosed is a memory device includes a memory block that is connected with a plurality of wordlines, a voltage generating circuit configured to output a first non-selection voltage through a plurality of driving lines, and an address decoding circuit configured to connect the plurality of driving lines with unselected wordlines of the plurality of wordlines. During a wordline setup period for the plurality of wordlines, the voltage generating circuit floats first driving lines corresponding to first unselected wordlines of the unselected wordlines from among the plurality of driving lines when the first unselected wordlines reach a first target level, and floats second driving lines corresponding to second unselected wordlines of the unselected wordlines from among the plurality of driving lines when the second unselected wordlines reach a second target level different from the first target level.

Abstract: According to one embodiment, there is provided a non-volatile semiconductor storage device including a non-volatile memory, a monitoring section, a determining section, and a notification processing section. The non-volatile memory includes a plurality of memory cells driven by word lines and a voltage generating section that generates a read voltage to be applied to the word lines. The monitoring section monitors a change in a threshold distribution of the plurality of memory cells upon performing a read processing to read data from the plurality of memory cells by applying the read voltage to the word lines. The determining section determines a degree of deterioration of the non-volatile memory in accordance with a monitoring result by the monitoring section. The notification processing section notifies a life of the non-volatile memory in accordance with a determining result by the determining section.

Abstract: A memory device and programming method thereof are provided. A memory cell array includes a first dummy word line set, plural word lines and a second dummy word line set in sequence. The method includes: grouping the word lines into word line groups; generating at least one pass bias set having plural pass biases that are respectively corresponding to each word line group; selecting one word line for programming, and determining that the selected word line belongs to a specific word line group; and according to a programming sequence, applying a corresponding pass bias in the plural pass biases of the at least one pass bias set to at least one dummy word line in one of the first and the second dummy word line sets, wherein the corresponding pass bias corresponds to the specific word line group.

Abstract: Apparatus and methods are disclosed, such as a method that includes precharging channel material of a string of memory cells in an unselected sub-block of a block of memory cells to a precharge voltage during a first portion of a programming operation. A programming voltage can then be applied to a selected memory cell in a selected sub-block of the block of memory cells during a second portion of the programming operation. The selected memory cell is coupled to a same access line as an unselected memory cell in the unselected sub-block. Additional methods and apparatus are disclosed.

Abstract: Methods, systems, and devices for skipping pages for weak wordlines of a memory device during pre-programming are described. A memory device may be configured to operate in a first mode involving skipping one or more pages (e.g., a lower page (LP)) associated with a set of wordlines. In some examples, a testing system may determine the set of wordlines (e.g., weak wordlines) for which to skip pages according to performance degradation for the wordlines in response to applying a threshold temperature to a test memory device. In the first mode, the memory device may store (e.g., pre-program) data in a subset of pages distinct from the skipped pages. The memory device may switch to a second mode in response to a trigger condition. In the second mode, the memory device may use each page associated with the wordlines and may refrain from skipping the one or more pages.

Abstract: According to one embodiment, a non-volatile memory includes a plurality of groups and a memory controller configured to execute a first operation. Each of the plurality of groups includes a plurality of cell units. Each of the plurality of cell units includes a plurality of memory cells. The first operation includes: based on a first correction amount associated with a target group, reading data from the target group; and updating the first correction amount to a second correction amount based on the data. The memory controller is configured to: select a first group as the target group; and when a condition is satisfied, select a second group as the target group after performing the first operation related to the first group.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a memory block including a plurality of memory cells that are coupled to a plurality of word lines, a peripheral circuit configured to perform a read operation by applying a read voltage to a selected word line, among the plurality of word lines, and applying a first pass voltage to target word lines, wherein the target word lines are adjacent to the selected word line, among unselected word lines other than the selected word line, and a control logic configured to decrease the read voltage based on a read voltage variation and to decrease the first pass voltage based on a pass voltage variation when the read voltage decreases, wherein the pass voltage variation is less than the read voltage variation.

Abstract: Numerous embodiments of a transceiver for providing high voltages for use during erase or program operations in a non-volatile memory system are disclosed. In one embodiment, a transceiver comprises a PMOS transistor and a native NMOS transistor. In another embodiment, a transceiver comprises a PMOS transistor, an NMOS transistor, and a native NMOS transistor.

Abstract: A memory device which includes a control logic circuit that generates a write enable signal based on a write command, a first memory cell connected with a first word line and a first column line, a first write circuit that receives first write data to be stored in the first memory cell through a first write input/output line and applies a write voltage to a first data line based on the first write data in response to the write enable signal, and a first column multiplexer circuit that selects the first column line and connects the first column line with the first data line in response to a first column select signal, such that the write voltage is applied to the first memory cell. The first write circuit applies the write voltage to a bulk port of the first column multiplexer circuit in response to the write enable signal.

Abstract: A semiconductor circuit and an operating method for the same are provided. The semiconductor circuit includes strings. The strings include a first string and a second string. The first string includes a first device unit and a second device unit in series. The first string has a weight signal W1. The first device unit has an input signal A. The second device unit has an input signal B. The second string includes a third device unit and a fourth device unit in series. The second string has a weight signal W2. The third device unit has an input signal ?. The fourth device unit has an input signal B. An output signal of the semiconductor circuit is a sum of output string signals of the strings.

Abstract: Image sensors with improved negative pump voltage settling, and circuitry for the same, are disclosed herein. In one embodiment, a power supply settling circuit includes a negative charge pump and a reference voltage generator. An output of the negative charge pump is selectively coupled to a first node of the negative pump settling circuit via a first switch, and an output of the reference voltage generator is selectively coupled to a second node of the negative pump settling circuit via a second switch. The first node is further selectively coupled to ground via a third switch, and the second node is further selectively coupled to ground via a fourth switch. The first node can additionally be coupled to a first pad, and the second node can additionally be coupled to a second pad. The pads can each be coupled to a capacitor, such as an off-chip capacitor.

Abstract: A word line driver circuit may at least include multiple word line drivers, each of which including a PMOS transistor and at least one NMOS transistor. The multiple word line drivers include multiple PMOS transistors and multiple NMOS transistors. The multiple PMOS transistors are arranged side by side, and in an arrangement direction of the multiple PMOS transistors, a part of the multiple NMOS transistors are located on a side of the multiple PMOS transistors, and another part of the NMOS transistors are located on another side of the multiple PMOS transistors.

Abstract: Apparatuses, systems, and methods for managing storage and retrieval of metadata at a memory. A metadata column address generator, during an metadata access operation, is configured to decode a subset of less than all of the bits of the column address to determine a metadata column address and a metadata column plane address corresponding to a particular one of column planes of a memory array. A column decoder is configured to facilitate a double cycle access operation to write data to or retrieve data from the plurality of column planes based on the column address and to write metadata to or retrieve metadata from a particular column corresponding to the metadata column address of the particular one of the column planes corresponding to the column plane address.

Abstract: A method includes forming a first-tier alternating stack of first insulating layers and first sacrificial material layers, forming a joint dielectric layer over the first-tier alternating stack, such that the joint dielectric layer is thicker than each of the first insulating layers and the first sacrificial material layers, forming a second-tier alternating stack of second insulating layers and second sacrificial material layers over the joint dielectric layer and the first-tier alternating stack, performing a level-shift anisotropic etch process to form a recess trench or via cavities vertically extending through the second-tier alternating stack and down to the joint dielectric layer, and performing an extension etching process to extend the recess trench or the via cavities through at least the joint dielectric level. At least one of etching time or etching power used during the extension etching process is different from that used during the level-shift anisotropic etch process.

Abstract: The present disclosure includes apparatuses, methods, and systems for pre-decoder circuitry. An embodiment includes a memory array including a plurality of memory cells, decoder circuitry coupled to the memory array, wherein the decoder circuitry comprises a first n-type transistor having a first gate and a second n-type transistor having a second gate, and pre-decoder circuitry configured to provide a bias condition for the first gate and second gate to provide a selection signal to one of the plurality of memory cells, wherein the bias condition comprises: a positive voltage for the first gate and a negative voltage for the second gate for a positive configuration for the memory cells, and zero volts for the first gate and the negative voltage for the second gate for a negative configuration for the memory cells.

Abstract: The disclosure includes apparatuses, methods, and systems for pre-decoder circuitry. An embodiment includes a memory array including a plurality of memory cells, decoder circuitry coupled to the array and comprising a first and second n-type transistor having a first and second gate, respectively, and pre-decoder circuitry to provide a bias condition for the first and second gate to provide a selection signal to one of the cells. The bias condition comprises a positive voltage for the first gate and a negative voltage for the second gate for a positive memory cell configuration, and zero volts for the first gate and the negative voltage for the second gate for a negative memory cell configuration. The pre-decoder circuitry comprises first pre-decoder circuitry to provide the positive voltage for the first gate and the zero volts for the second gate and second pre-decoder circuitry to provide the negative voltage for the second gate.

Abstract: A data recovery method is applied to a memory device which has a target memory cell, a target word line and an adjacent word line adjacent to the target word line. The target word line is connected to a gate of the target memory cell. The adjacent word line is connected to a gate of an adjacent memory cell, and the adjacent memory cell is adjacent to the target memory cell. In the data recovery method, a first program voltage is applied to the target memory cell through the target word line, and a second program voltage is concurrently applied to the adjacent memory cell through the adjacent word line.

Abstract: A read disturb information isolation system includes a storage subsystem including a plurality of blocks that each include a plurality of rows, and a read disturb information isolation subsystem that is coupled to the storage system. For at least one of the plurality of blocks, the read disturb information isolation system retrieves data from at least a subset of rows in that block, identifies read disturb information for that data, performs at least one isolation operation on that read disturb information to generate isolated read disturb information, and provides that isolated read disturb information to a read temperature identification subsystem. The read temperature identification subsystem may then use the isolated read disturb information provided by the read disturb information isolation subsystem to generate a local logical storage element read temperature map.

Abstract: A semiconductor memory device and a method for fabricating the same are provided. The semiconductor memory device includes a plurality of gate stacks separated by a plurality of slit structures, and each of the gate stacks includes: a first stack including three or more first conductive patterns spaced apart from one another at substantially a same level; a second stack formed on the first stack and including second conductive patterns and interlayer dielectric layers alternately stacked; and a plurality of channel structures penetrating the second stack and the first stack.

Abstract: An integrated circuit device that has improved write margin at low operating voltages is disclosed. The integrated circuit device can include an SRAM array that has end power select circuits that can include selection circuits that provide a controllable impedance path between a power supply potential and an array power line. A power supply detection circuit may provide an assist enable signal when a power supply potential is low enough that write assist is needed. A power control circuit may provide end power control signals to end power select circuits to selectively control an impedance path between a power supply potential and an array power line to provide an I-R drop to a selected memory cell. In this way, write margins may be improved at low operating voltages.

Abstract: A semiconductor storage device of an embodiment includes a memory block, a resistance measurement circuit, and a control circuit. The memory block includes first to third control signal lines connected to gates of a first select gate transistor, a plurality of memory cell transistors, and a second select gate transistor. The resistance measurement circuit measures resistance of at least one control signal line among the first to third control signal lines. The control circuit performs erase, program, and read of data at the plurality of memory cell transistors included in the memory block. The control circuit determines, based on a measurement result of the resistance measurement by the resistance measurement circuit, whether to set a fail status to a result of erase verify that verifies the erase.

Abstract: An apparatus is provided that includes a word line coupled to a word line driver circuit, bit lines, a plurality of non-volatile memory cells each coupled to the word line and a corresponding one of the bit lines, and a control circuit coupled to the word line and the bit lines. The control circuit is configured to program the memory cells by causing the word line driver to apply a program pulse to the word line, and biasing each bit line to a corresponding bit line voltage that has a value that varies based on a distance between the word line driver and the corresponding bit line.

Abstract: A non-volatile memory includes a plurality of word lines connected to non-volatile memory cells, a plurality of driver lines configured to carry one or more word line voltages, and a plurality of word line switches that selectively connect the driver lines to the word lines. To more efficiently utilize space on the die, the word line switches are arranged in a plurality of three dimensional stacks such that each stack of the plurality of stacks comprises multiple word line switches vertically stacked.

Abstract: A nonvolatile semiconductor memory device includes a control circuit configured to control a soft program operation of setting nonvolatile memory cells to a first threshold voltage distribution state of the nonvolatile memory cells. When a characteristic of the nonvolatile memory cells is in a first state, the control circuit executes the soft program operation by applying a first voltage for setting the nonvolatile memory cells to the first threshold voltage distribution state to first word lines, and applying a second voltage higher than the first voltage to a second word line. When the characteristic of the nonvolatile memory cells is in a second state, the control circuit executes the soft program operation by applying a third voltage equal to or lower than the first voltage to the first word lines and applying a fourth voltage lower than the second voltage to the second word line.

Abstract: A memory device includes a controller that performs a program verification after a first program pulse is applied to the at least one non-volatile memory cell. The first program pulse is applied during a data program operation and the data program operation includes applying program pulses to program multi-bit data to the at least one non-volatile memory cell. The controller also determines a program mode for the at least one non-volatile memory cell based on a result of the program verification, and changes at least one of a level of a first control voltage based on the program mode. The first control voltage is applied to a drain select line coupled to the at least one non-volatile memory cell.

Abstract: Control logic in a memory device initiates a program operation on a memory array, the program operation comprising a seeding phase. During the seeding phase, the control logic causes a seeding voltage to be applied to a string of memory cells in a data block of the memory array during the seeding phase of the program operation and causes a first positive voltage to be applied to a first plurality of word lines of the data block during the seeding phase, wherein each of the first plurality of word lines is coupled to a corresponding memory cell of a first plurality of memory cells in the string of memory cells, the first plurality of word lines comprising a selected word line associated with the program operation.

Abstract: A three dimensional non-volatile memory structure includes word lines connected to non-volatile memory cells arranged in blocks. A plurality of word line switches are connected to the word lines and one or more sources of voltage. The word line switches are arranged in groups of X word line switches such that each group of X word line switches is positioned in a line under Y blocks of non-volatile memory cells and has a length that is equal to the width of the Y blocks of non-volatile memory cells, where X>Y.

Abstract: A memory device may include a first set of word lines in a first zone and a second set of word lines in a second zone. When programming memory cells coupled to a first target word line of the first set of word lines, a first pass voltage may be applied to at least one word line of the first set of word lines. When programming memory cells coupled to a second target word line of the second set of word lines, a second pass voltage may be applied to at least one word line of the second set of word lines. The at least one word line of the first set of word lines and the at least one word line of the second set of word lines have been programmed. The second pass voltage may be higher than the first pass voltage.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a plurality of memory cells, a peripheral circuit, and a control logic. The memory cells may be coupled to a plurality of word lines. The peripheral circuit may perform a memory operation on selected memory cells. The control logic may control the peripheral circuit, during the memory operation, to apply an operating voltage to a selected word line, among the plurality of word lines, coupled to the selected memory cells, a first pass voltage to target word lines adjacent to the selected word line among unselected word lines, based on whether the operating voltage is lower than or equal to a reference voltage, and a second pass voltage, having a lower level than the first pass voltage, to remaining unselected word lines, other than the target word lines.

Abstract: The present disclosure includes apparatuses and methods related to configurable trim settings on a memory device. An example apparatus can include configuring a set of trim settings for an array of memory cells such that the array of memory cells have desired operational characteristics in response to being operated with the set of trim settings.

Abstract: Provided is an anti-fuse memory circuit. The anti-fuse memory circuit includes a memory array, a bit line (BL), and a word line (WL); an anti-fuse memory cell (FsBIn) electrically connected to the bit line (BL) through a first switch transistor (1Add); a second switch transistor (2Add) configured to connect the bit line (BL) to a transmission wire (100); a third switch transistor (3Add) configured to discharge the transmission wire (100); a reading module (102) including a first input end (+) connected to the transmission wire (100), a second input end (?) for receiving a reference voltage (VTRIP), and a sampling input end (C) for receiving a sampling signal (CLK); and a compensation module (101), connected to the third switch transistor (3Add) and configured to slow down a drop speed of a voltage at the transmission wire (100).

Abstract: A memory is provided that is configured to practice a sleep mode without retention in which a both bitcell array and a memory periphery are powered down responsive to an assertion of sleep mode without retention control signal. The sleep mode without retention control signal is also asserted during a DVS scan to power down the bitcell array. The memory includes a power management circuit that responds to an assertion of a DVS scan control signal to prevent the assertion of the sleep mode without retention control signal from causing a power down of the memory periphery during the DVS scan. The memory periphery may thus be thoroughly tested by the DVS scan because leakage current from the bitcell array is prevented by the powering down of the bitcell array.

Abstract: The present disclosure includes apparatuses and methods for acceleration of data queries in memory. A number of embodiments include an array of memory cells, and processing circuitry configured to receive, from a host, a query for particular data stored in the array of memory cells, wherein the particular data corresponds to a search key generated by the host, search portions of the array of memory cells for the particular data corresponding to the search key, determine data stored in the portions of the array of memory cells that matches the search key, and transfer the data that matches the search key to the host.

Abstract: To overcome a shortage of area for horizontal metal lines to connect word line switch transistors to corresponding word lines and for pass through signal lines, it is proposed to implement multiple architectures for the word line hook up regions. For example, some areas of a die will be designed to provide extra horizontal metal lines to connect word line switch transistors to word lines and other areas of the die will be designed to provide extra pass through signal lines.

Abstract: Technology for mitigating interference to select transistors in 3D memory is disclosed. In one aspect, a control circuit pre-charges a first set of bit lines to a first voltage and pre-charges a second set of bit lines to a second voltage greater than the first voltage. The control circuit may increase the voltage on the first set of bit lines to the second voltage while the second set of bit lines are floating to couple up the voltages on the second set of bit lines to a voltage greater than the second voltage. The higher voltage on the second set of bit lines compensates for interference that some of the select transistors may experience from an adjacent select line. For example, the higher voltage can prevent a leakage current in the select transistors from occurring. Preventing the leakage current can improve boosting of NAND channel voltages, thereby preventing program disturb.

Abstract: Provided are a circuit for generating a bias signal and a clock input circuit for applying the circuit for generating a bias signal. The circuit for generating a bias signal includes: a first subcircuit, a first terminal of the first subcircuit being connected to a power supply voltage by means of a first node, a second terminal of the first subcircuit being connected to a current stabilization circuit by means of a second node, the first subcircuit being configured to generate a bias signal and output the bias signal by means of the second node, and the current stabilization circuit being configured to provide a constant current to the second node; and a second subcircuit, two terminals of the second subcircuit being respectively connected to the first node and the second node, the second subcircuit including a first resistor element and a first switch element connected in series.

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a memory cell string having first, second, third, fourth, and fifth memory cells; access lines including first, second, third, fourth, and fifth access lines coupled to the first, second, third, fourth, and fifth memory cells, respectively, and a module. The first memory cell is between the second and third memory cells. The second memory cell is between the first and fourth memory cells. The third memory cell is between the first and fifth memory cells. The module is to couple the first access line to a ground node at a first time of a memory operation, couple the second and third access lines to the ground node at a second time of the operation after the first time, and couple the fourth and fifth access lines to the ground node at a third time of the operation after the second time.