Abstract: A number (Nwl) of programmed word lines in a block of NAND strings is determined by measuring a reference combined current (Iref) in the block when all of the memory cells are in a conductive state. Subsequently, to determine if a word line is a programmed word line, an additional combined current (Iadd) in the block is measured with a demarcation voltage applied to the selected word line. The selected word line is determined to be programmed word lines if Idd is less than Iref by at least a margin. Nwl can be used to adjust an erase-verify test of an erase operation by making the erase-verify test relatively hard to pass when the number is relatively small and relatively easy to pass when the number is relatively large. Or, Nwl can be used to identify a next word line to program in the block.

Abstract: Methods and systems are disclosed for dynamic healing of non-volatile memory (NVM) cells within NVM systems. The dynamic healing embodiments described herein relax damage within tunnel dielectric layers for NVM cells that occurs over time from charges (e.g., holes and/or electrons) becoming trapped within these tunnel dielectric layers. NVM operations with respect to which dynamic healing processes can be applied include, for example, erase operations, program operations, and read operations. For example, dynamic healing can be applied where performance for the NVM system degrades beyond a selected performance level for an NVM operation, such as elevated erase/program pulse counts for erase/program operations and bit errors for read operations. A variety of healing techniques can be applied, such as drain stress processes, gate stress processes, and/or other desired healing techniques.

Abstract: According to example embodiments, a read method of a nonvolatile memory device includes Disclosed is a read method of a nonvolatile memory device which includes selecting one of a plurality of vertical strings in a nonvolatile memory device, judging a channel length between a common source line and a selected one of the plurality of vertical strings, selecting a sensing manner corresponding to the judged channel length, and performing a sensing operation according to the selected sensing manner. The plurality of vertical strings may extend in a direction perpendicular to a substrate of the nonvolatile memory device.

Abstract: A semiconductor memory device includes a memory cell array having memory cells coupled to a plurality of word lines and a peripheral circuit group configured to supply a pass voltage to unselected word lines among the plurality of word lines, wherein the peripheral circuit group stepwise raises the pass voltage supplied to the unselected word lines to a target level.

Abstract: A semiconductor memory device is kept in a busy state by controlling a ready/busy pad when a detection signal is output since an external voltage is less than a reference voltage, prevents generation of an operating voltage by a pump circuit by preventing generation of a pump clock, and resets a microcontroller by preventing generation of micro clock. Accordingly, the semiconductor memory device may be prevented from malfunctioning through a series of operations when the external voltage is less than the reference voltage.

Abstract: A semiconductor memory device includes a block decoder configured to output block selection signals for selecting memory blocks in response to a row address signal, a first memory block including a first drain select line, a first source select line, and a first word line group including a plurality of first word lines disposed between the first drain select line and the first source select line, the first memory block disposed between the block decoder and a first switching group, the first switching group configured to transmit first operating voltages to the first memory block in response to a first block selection signal among the block selection signals, and a first block word line configured to transmit the first block selection signal to the first switching group and disposed over the first memory block to avoid overlapping with the first word line group.

Abstract: A semiconductor device comprises an array of memory cells. Each of the memory cells includes a tunnel dielectric, a well region including a first current electrode and a second current electrode, and a control gate. The first and second current electrodes are adjacent one side of the tunnel dielectric and the control gate is adjacent another side of the tunnel dielectric. A controller is coupled to the memory cells. The controller includes logic to determine when to perform a healing process in the tunnel dielectric of the memory cells, and to apply a first voltage to the first current electrode of the memory cells during the healing process to remove trapped electrons and holes from the tunnel dielectric.

Abstract: This nonvolatile semiconductor memory device comprises: a memory cell array configured having a plurality of blocks arranged therein, each of the blocks configured as an arrangement of NAND cell units, each of the NAND cell units configured having a plurality of electrically rewritable memory cells and a select transistor connected in series; and a row decoder configured to select anyone of the blocks of the memory cell array and supply to any one of said blocks a voltage required in various kinds of operations. The row decoder comprises: a plurality of first transfer transistors each disposed in a first region and connected to any one of the memory cells; and a plurality of second transfer transistors each disposed in a second region and connected to the select transistor, the second region being a residual region of the first region.

Abstract: A nonvolatile semiconductor memory device comprises a memory cell array, a staircase voltage generator, and a decode and level shift circuit. The memory cell array comprises a plurality of memory cells and a plurality of bit lines coupled to the plurality of memory cells. The staircase voltage generator generates a staircase voltage having a staircase waveform that varies in at least two steps. The decode and level shift circuit selects one of said plurality of bit lines and applies the staircase voltage as a program voltage to the selected bit line.

Abstract: A voltage generator of a nonvolatile memory device includes a pump circuit for generating a pump output voltage by performing a pumping operation and raise or maintain the output voltage in response to a double enable signal or a single enable signal, a first regulator for comparing a first division voltage with a first reference voltage and generating the double enable signal according to a result of the comparison, a second regulator for comparing a second division voltage with a second reference voltage and outputting the voltage of the first level as a first regulation voltage, and a third regulator for comparing the second division voltage with the second reference voltage and generating the single enable signal according to a result of the comparison.

Abstract: A testing circuit in an integrated circuit indirectly measures a voltage at a node of other circuitry in the integrated circuit. The testing circuit includes a transistor having a control electrode, a first conducting electrode coupled to a first pad, a second conducting electrode coupled to a terminal of a power supply, and one or more switches for selectively coupling the control electrode to one of the node and a second pad. A method includes determining a relationship between drain current and gate voltage of the transistor when the control electrode is coupled to the second pad. A voltage at the node is determined by relating the current through the first conducting electrode of the transistor when control electrode is coupled to the node.

Abstract: According to one embodiment, there is provided an output circuit including a driver transistor and a pre-driver circuit. The driver transistor is connected to an output terminal. The pre-driver circuit is configured to turn ON/OFF the driver transistor. The pre-driver circuit includes a first transistor, a second transistor, a third transistor. The first transistor is configured to control ON speed of the driver transistor. The second transistor is connected in parallel with the first transistor. The second transistor is configured to control ON speed of the driver transistor. The third transistor is connected in parallel with the first transistor and in series with the second transistor. The third transistor is configured to activate or deactivate the second transistor.

Abstract: A nonvolatile memory apparatus includes: a memory cell area including a plurality of memory cells connected to a word line and a bit line; a program time controller configured to determine a program voltage application time for a selected word line, as the selected word line is selected in response to a program command and an address signal; and a controller configured to apply a program voltage to the selected word line according to the program voltage application time determined by the program time controller.

Abstract: A programming method for suppressing deterioration of an insulating layer in a memory cell is provided. In the programming method for a flash memory of the invention, a cell unit including programming units that have been programmed is electrically isolated from a bit line; a cell unit not including programming units is electrically coupled with the bit line; a programming voltage is applied to selected word lines; and a pass voltage is applied to non-selected word lines. Moreover, during a period of applying the programming voltage, carriers are generated in a P-well, and hot carriers passing through a depletion region and accelerated by an electric field are injected into the memory cell.

Abstract: According to example embodiments of inventive concepts, a nonvolatile memory device includes a memory cell array including a plurality of memory cells; a word line driver configured to at least one of select and unselect a plurality of word lines connected with the plurality of memory cells, respectively, and to supply voltages to the plurality of word lines; and a read/write circuit configured to apply bias voltages to a plurality of bit lines connected with the plurality of memory cells. The read/write circuit may be configured to adjust levels of the bias voltages applied to the plurality of bit lines according to location of a selected word line among the plurality of word lines.

Abstract: A memory includes a self-timed column imitating a bitline loading, a self-timed row imitating a self-timed word-line, a self-timed bitcell performing a dummy write in a write cycle, a writer driver coupled to the self-timed bitcell for an actual write, and an edge detection circuit coupled to the self-timed bitcell for tracking a write cycle time.

Abstract: Word line switch transistors in a well in a substrate may be back biased. A memory array having non-volatile storage devices may be in a separate well in the substrate. The well of the word line switch transistors may be biased separately from the well of the non-volatile storage devices. Word line switch transistors may be back-biased during an erase operation. A first voltage may be applied to a first terminal of word line switch transistors that are coupled to blocks selected for erase. The first voltage may be applied to a first terminal of word line switch transistors that are coupled to blocks that are not selected for erase. The first voltage is passed to word lines in selected blocks, but is not passed to word lines in unselected blocks.

Abstract: A device includes a non-volatile memory and a control unit, wherein the control unit is configured to change over programming of data of the non-volatile memory from a first programming mode to a second, different programming mode based on the occurrence of a control signal.

Abstract: A word line driver that includes a pull up transistor for biasing a node of a stack of transistors that are located between a high supply voltage terminal and a low supply voltage terminal. The node is biased at a voltage that is between the high supply voltage and the low supply voltage. The stack of transistors includes a stack of decode transistors and a cascode transistor. The cascode transistor is located between the node and a second node of the stack that is coupled to an inverting circuit.

Abstract: A memory structure comprises a semiconductor strip having a multi-gate channel region, the p-type terminal region adjacent a first side of the channel region and an n-type terminal region adjacent the second side of the channel region. A plurality of word lines is arranged to cross the semiconductor strip at cross points in the channel region. The bit line is coupled to a first end of the semiconductor strip, and a reference line is coupled to a second end of the semiconductor strip. Charge storage structures are disposed between the word lines in the plurality word lines and the channel region of the semiconductor strip, whereby memory cells are disposed in series along the semiconductor strip between the bit line and the reference line. Biasing unselected word lines can be used to select n-channel or p-channel modes in a single selected cell for read, program or erase.

Abstract: A memory includes a plurality of blocks in which each block includes a plurality of memory cells. The memory includes a set of charge pumps which apply voltages to the plurality of blocks. A method includes selecting a block of the plurality of memory blocks; determining an array size of the selected block; determining a set of program/erase voltages based on the array size and temperature from a temperature sensor; and programming/erasing the selected block, wherein the set of program/erase voltages are applied by the set of charge pumps during the programming/erasing of the selected block.

Abstract: A word line driver circuit includes a first transistor having its gate coupled to a first node configured to receive a word line select signal. A second transistor has its gate coupled to the first node and a drain coupled to a drain of the first transistor at a second node that is coupled to a word line. A word line assist control circuit is coupled to the first node, to the word line, and to a gate of a third transistor. The word line assist control circuit is configured to turn on or turn off the third transistor to adjust a voltage of the word line.

Abstract: A FLASH memory cell includes a control gate over a floating gate over a substrate. A wall line and an erase gate each is disposed adjacent to a respective sidewall of the control gate. A first source/drain (S/D) region is disposed in the substrate and adjacent to a sidewall of the wall line. A second S/D region is disposed in the substrate and adjacent to the sidewall of the floating gate. A method of operating the FLASH memory cell includes applying a first voltage level to the control gate. A second voltage level is applied to the word line. The second voltage level is lower than the first voltage level. A third voltage level is applied to the first S/D region. A fourth voltage level is applied to the second S/D region. The fourth voltage level is higher than the third voltage level. The erase gate is electrically floating.

Abstract: The present disclosure relates to a method for writing in an EEPROM memory, the method comprising steps of: storing the bits of a word to be written in first memory units, erasing a word to be modified, formed by first memory cells connected to a word line and first bit lines, reading bits stored in the memory cells of a word line WL<i>, in a first read mode and storing the bits read in second memory units, reading in a second read mode the bits stored in the memory cells of the word line, and programming each memory cell of the word line connected to a memory unit storing a bit in the programmed state of the word to be written, of an erased word or of a word comprising a bit having different states in the first and second read modes.

Abstract: A data transfer circuit includes a plurality of first lines, a second line suitable for receiving data from a first line selected among the first lines, a third line suitable for transferring data to the first line selected among the first lines, a plurality of driving units, each suitable for driving the second line based on the data from the corresponding first line in a first operation, and a plurality of connection units, each suitable for coupling the third line to the corresponding first line when the corresponding first line is selected in a second operation.

Abstract: Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device.

Abstract: A 3D nonvolatile memory has memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction over a semiconductor substrate. It has vertical local bit lines and a plurality of staircase word lines. Each staircase word line has a series of alternating segments and risers elongated respectively in the x-direction and z-direction traversing across the plurality of planes in the z-direction with a segment in each plane. Methods of forming a slab of multi-plane memory with staircase word lines include processes with one masking and with two maskings for forming each plane.

Abstract: According to an aspect of the present invention, it is provided: a nonvolatile semiconductor memory device comprising: a plurality of bit lines arranged in a first direction; a plurality of source lines arranged in the first direction, the plurality of source lines being parallel to the plurality of bit lines, the plurality of source lines being distinct from the plurality of bit lines; a plurality of memory gate lines arranged in a second direction perpendicular to the first direction; a plurality of memory cells arranged in a matrix, each of the plurality of memory cells including a p type MIS nonvolatile transistor having a first terminal, a second terminal, a channel between the first terminal and the second terminal, a gate insulation film formed on the channel, a gate electrode connected to one corresponding memory gate line of the plurality of memory gate lines, and a carrier storage layer formed between the gate insulation film and the gate electrode, the first terminal being connected to one correspo

Abstract: A semiconductor memory device includes stacked memory strings in which at least some adjacent memory strings share a common source line. During a read operation for a selected memory string, a first current path is formed from a bit line of the selected memory string to the common source line through the selected memory string. A second current path is formed from the bit line of the selected memory string, through the common source line, to a bit line of an adjacent unselected memory string. This reduced path resistance enhances device reliability in read mode.

Abstract: A method of erasing a nonvolatile memory device, which includes a plurality of memory blocks each formed of a plurality of strings, includes applying an erase voltage to a well of a selected memory block of the memory blocks, each memory block including at least two dummy cells located between a string or ground selection transistor and memory cells; and applying or inducing different levels of voltages to respective gates of the at least two dummy cells.

Abstract: A memory device includes: a plurality of nonvolatile memory sections configured to allow one memory cell to record data of a plurality of bits, and to include a corresponding number of pages to the plurality of bits in accordance with a plurality of the memory cells as a write control unit; and a control section configured to control writing and reading data to and from the plurality of nonvolatile memory sections, wherein among the plurality of nonvolatile memory sections, if data is written into one of the nonvolatile memory sections, the data is written for each page in sequence from a low-order page to a high-order page, and when the data is written into the low-order page, control is performed such that the data to be written into the low-order page is written into any area of the other of the nonvolatile memory sections at same timing.

Abstract: A flash memory device may operate from two supply voltages, one being provided externally, and the other being generated within the flash memory device from the external supply voltage. The flash memory device may be provided with a selectable-level buffer for interfacing with either low supply voltage or high supply voltage integrated circuits. To provide even greater flexibility, the flash memory device may be provided with the capability of receiving a second supply voltage from an external source, which may take precedence over the internally-generated second supply voltage or may be combined with the internally-generated second supply voltage.

Abstract: According to one embodiment, there is provided a non-volatile semiconductor storage device including a non-volatile memory, a monitoring section, a determining section, and a notification processing section. The non-volatile memory includes a plurality of memory cells driven by word lines and a voltage generating section that generates a read voltage to be applied to the word lines. The monitoring section monitors a change in a threshold distribution of the plurality of memory cells upon performing a read processing to read data from the plurality of memory cells by applying the read voltage to the word lines. The determining section determines a degree of deterioration of the non-volatile memory in accordance with a monitoring result by the monitoring section. The notification processing section notifies a life of the non-volatile memory in accordance with a determining result by the determining section.

Abstract: A method for improving sub-word line response comprises generating a variable substrate bias determined by at least one user parameter. The variable substrate bias is applied to a sub-word line driver in a selected sub-block of a memory. A voltage disturbance on a sub-word line in communication with the sub-word line driver is minimized by modifying a variable substrate bias of the sub-word line driver to change a transconductance of the sub-word line driver thereby.

Abstract: A flash memory controller, a non-transitory computer readable medium and a method for reading flash memory cells of a flash memory module. The method may include calculating a group of read thresholds to be applied during a reading operation of a set of flash memory cells that belong to a certain row of the flash memory module based upon a compressed representation of reference read thresholds associated with multiple reference rows of the flash memory module; and reading the set of flash memory cells by applying the group of reference read thresholds to provide read results.

Abstract: A non-volatile memory (NVM) system has a normal mode, a standby mode and an off mode that uses less power than the standby mode. The NVM system includes an NVM array that includes NVM cells and NVM peripheral circuitry. Each NVM cell includes a control gate. A controller is coupled to the NVM array, applies a voltage to the control gates and power to the peripheral circuitry during the standby mode, and applies an off-mode voltage to the control gates and removes power from the NVM peripheral circuitry during the off mode.

Abstract: Methods for programming memory cells. One such method for programming memory cells includes generating an encoded stream using a data stream and programming the memory cells using the encoded stream to represent the data stream. A particular bit position of the encoded stream has a first voltage level when the particular bit position of the data stream has a particular logical state, and the particular bit position of the encoded stream has either a second voltage level or a third voltage level when the particular bit position of the data stream has a logical state other than the particular logical state.

Abstract: A semiconductor memory device includes memory cells and a voltage generating circuit for generating a voltage for memory cells. The first voltage generating circuit includes a first diode connected between first and second nodes, a first transistor connected between the output terminal and a third node and having a gate connected to the second node, a second transistor connected between the third node and a fourth node and having a gate connected to the second node, a third transistor connected between the output terminal and the first node and having a gate connected to the fourth node, a second diode connected between the first and fourth nodes, and a charge pump circuit configured to supply a voltage to the fourth node. The first voltage generating circuit functions to adjust the generated voltage when it overshoots a desired value which may be caused by capacitive coupling with adjacent wirings.

Abstract: The present invention provides a row decoder of a semiconductor storage device that prevents an increase in a circuit area while maintaining a high operation speed. Namely, the row decoder of the semiconductor storage device includes a word line selection circuit that has voltage application MOS transistors for each of plural word lines, the voltage application MOS transistors applying a normal voltage to the word lines corresponding to memory cells selected among plural memory cells positioned at a portion where the plural word lines intersect plural bit lines in a predetermined normal operation, and applying a high voltage in a predetermined high voltage operation; and a level shift circuit that outputs the normal voltage or a ground voltage lower than the normal voltage in the normal operation, and that outputs the normal voltage or the high voltage in the high voltage operation, to the voltage application MOS transistor.

Abstract: Techniques are presented to improve the performance, accuracy and power consumption of on-chip voltage biasing and transmission for highly loaded RC networks (such as wordlines or bitlines in NAND or 3D memory arrays) that are otherwise limited by the physics of RC time constant. When transitioning the near-end voltage of the network, an under-drive or over-drive level is applied, combined with feedback control to estimate when the far-end voltage approaches the desired level.

Abstract: A hybrid charge pump and control circuit for use in a memory device is disclosed.

Abstract: In a 3D stacked non-volatile memory device, the threshold voltages are evaluated and adjusted for select gate, drain (SGD) transistors at drain ends of strings of series-connected memory cells. To optimize and tighten the threshold voltage distribution, the SGD transistors are read at lower and upper levels of an acceptable range. SGD transistors having a low threshold voltage are subject to programming, and SGD transistors having a high threshold voltage are subject to erasing, to bring the threshold voltage into the acceptable range. The evaluation and adjustment can be repeated such as after a specified number of program-erase cycles of an associated sub-block. The condition for repeating the evaluation and adjustment can be customized for different groups of SGD transistors. Aspects include programming SGD transistors with verify and inhibit, erasing SGD transistors with verify and inhibit, and both of the above.

Abstract: A non-volatile semiconductor memory device includes a plurality of cell units and a data writing unit. The cell unit includes first and second select gate transistors and a memory string including a plurality of memory cells. The data writing unit sequentially writes lower page data and upper page data corresponding to the lower page data to a selected memory cell selected in order from one close to the first select gate transistor to the second select gate transistor, and performs a first writing operation of writing the lower page data to the selected memory cell and a second writing operation of writing the upper page data to the selected memory cell after the first writing operation for n (n is an integer equal to or greater than 2) non-selected memory cells which are adjacent to a side of the selected memory cell close to the second select gate transistor.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: Techniques are disclosed herein for performing an Internal Data Load (IDL) to sense non-volatile storage elements. Read pass voltages that are applied to the two neighbor word lines to a selected word line may be adjusted to result in a more accurate IDL. The read pass voltage for one neighbor may be increased by some delta voltage, whereas the read pass voltage for the other neighbor may be decreased by the same delta voltage. In one aspect, programming of an upper page of data into a word line that neighbors a target word line is halted to allow lower page data in the target memory cells to be read using an IDL and preserved in data latches while programming the upper page in the neighbor word completes. Preservation of the lower page data provides for a cleaner lower page when later programming the upper page into the target memory cells.

Abstract: A test circuit for detecting a leakage defect in a circuit under test includes a test stimulus circuit operative to drive an otherwise defect-free, characteristically capacitive node in the circuit under test to a prescribed voltage level, and an observation circuit having at least one threshold and adapted for connection with at least one node in the circuit under test. The observation circuit is operative to detect a voltage level of the node in the circuit under test and to generate an output signal indicative of whether the voltage level of the node is less than the threshold. The voltage level of the node being less than the threshold is indicative of a first type of leakage defect, and the voltage level of the node being greater than the threshold is indicative of a second type of leakage defect.

Abstract: A method of programming a memory system by selectively applying a program voltage to a selected wordline connected to a memory transistor to be programmed. A first bias voltage is applied to a first wordline adjacent to the source side of the selected wordline. The first bias voltage is also applied to a second wordline adjacent to the drain side of the selected wordline. A second bias voltage is applied to a third wordline adjacent to the drain side of the second wordline. A third bias voltage is applied to a fourth wordline adjacent to the source side of the first wordline. A pass voltage is also applied to the remaining wordlines that do not have one of a bias voltage and a program voltage applied, the pass voltage a selected voltage level.

Abstract: A nonvolatile semiconductor memory device comprises multiple memory strings each including a plurality of first and second groups of serially connected memory cells, and a back gate transistor serially connected between the first and second groups of memory cells, a plurality of word lines, each word line being connected to a control gate of a different memory cell in each of the memory strings, a voltage generating circuit configured to generate control voltages of different voltage levels, and a control circuit configured to control application of control voltages to the word lines and the back gate line. A control voltage applied to the back gate line may be varied depending on how far a selected word line is from the back gate line, and a control voltage applied to unselected word lines may be varied depending on how far the unselected word line is from the selected word line.

Abstract: Nonvolatile memory devices including three transistor unit cells are provided. The nonvolatile memory device includes a selection transistor having a first terminal and a second terminal, a first charge trap transistor electrically connected in series to the first terminal of the selection transistor, a second charge trap transistor electrically connected in series to the second terminal of the selection transistor, and a word line electrically connected to gate electrodes of the selection transistor, the first charge trap transistor and the second charge trap transistor. Related methods are also provided.

Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.