Abstract: According to an embodiment, a semiconductor device includes a pre-charge transistor configured to supply a pre-charge voltage to a bit line, a sense amplifier configured to change a logic level of an output signal according to a result of a comparison between a drawing current of a storage element and a reference current, a clamp transistor disposed between the bit line BL and the sense amplifier, and a clamp voltage output transistor, in which a gate of the clamp voltage output transistor is connected to a gate of the clamp transistor, a source of the clamp voltage output transistor is connected to a back gate thereof, the pre-charge voltage is supplied to the source of the clamp voltage output transistor, a drain of the clamp voltage output transistor is connected to the gate thereof, and a ground voltage is supplied to a back gate of the clamp transistor.

Abstract: A method is suggested for determining a state of a memory cell via a sense amplifier the method including applying a first signal to the sense amplifier; sensing a first response; determining a reference signal based on the first signal; sensing a second response based on a second signal that is determined based on the first signal; and determining the state of the memory cell based on the second response and the reference signal. Also, a memory device that is able to determine the state of the memory cell is provided.

Abstract: A storage device includes bit lines including a first bit line and a second bit line, memory units including a first memory string having memory cells connected in series, connected to the first bit line, and a second memory string having memory cells connected in series, connected to the second bit line, word lines each connected in common to a gate of a memory cell in the first string and a gate of a memory cell in the second string, and a controller configured to control voltages applied to the bit lines and the word lines during writing. When writing is performed on a selected memory cell of the first memory string, a first voltage is applied to a selected word line connected to the gate of the selected memory cell while a second voltage higher than a zero voltage is applied to the first bit line.

Abstract: To obtain a booster circuit capable of reducing voltage stress applied to a booster cell, provided is a booster circuit including a plurality of booster cells connected in series. Each of the plurality of booster cells includes a charge transfer transistor connected between an input terminal and an output terminal, and a boost capacitor connected between the input terminal and a clock terminal. Among the plurality of booster cells, a plurality of booster cells at least in a last stage are connected in parallel so that the plurality of booster cells connected in parallel are connected to a booster cell in a previous stage of the last stage by switching the plurality of booster cells in the last stage in accordance with a boosting operation.

Abstract: An apparatus is provided which comprises: a stack of transistors of a same conductivity type, the stack including a first transistor and a second transistor coupled in series and having a common node; and a feedback transistor of the same conductivity type coupled to the common node and a gate terminal of the first transistor of the stack.

Abstract: A memory device includes an array of phase-change memory cells and a word line. The memory device includes a control circuit, a first pull-up MOSFET and a second pull-up MOSFET connected in series between a first power-supply node set at a first supply voltage and the word line, a first pull-down MOSFET and a second pull-down MOSFET connected in series between the word line and a second power-supply node set at a reference potential, and a biasing MOSFET connected between the word line and a third power-supply node set at a second supply voltage higher than the first supply voltage. The first and second pull-up MOSFETs and the first and second pull-down MOSFETs have breakdown voltages lower than the breakdown voltage of the biasing MOSFET.

Abstract: A row decoder includes a plurality of address lines, a first selection circuit and a second selection circuit. The first selection circuit is coupled to the address lines and with a latch function, and configured to enable and latch a first selection signal to select a first word line in a first cell array. The second selection circuit is coupled to the address lines and without the latch function, and configured to enable a second selection signal to select a second word line in a second cell array.

Abstract: A semiconductor device according to an embodiment includes first and second memory cells, a first word line, and first and second bit lines. The first memory cell has a first gate electrode and a first channel. The second memory cell has a second gate electrode and a second channel. The first word line connected with each of the first and second gate electrodes. The first and second bit lines electrically connected with the first and second channels, respectively. The semiconductor device erases data of each of the first and second memory cells, and then shifts respective threshold voltages of the first and second memory cells while making a first voltage between the first gate electrode and the first channel, and a second voltage between the second gate electrode and the second channel. The first voltage is different from the second voltage.

Abstract: A semiconductor memory device includes a cell array including memory cells. A potential generation circuit applies a first potential to the memory cells. A control signal output circuit outputs a control signal based on the first potential. A pulse width adjustment circuit adjusts a pulse width of a word line voltage of the cell array based on the control signal. An amplitude of a voltage applied to bit lines connected to the memory cells is controlled with the pulse width.

Abstract: A device is disclosed that includes first memory cells, second memory cells, a first conductive line and a second conductive line. The first conductive line is electrically disconnected from the second conductive line. The first conductive line receives a first power voltage for the plurality of first memory cells. The second conductive line receives a second power voltage that is independent from the first power voltage, for the plurality of second memory cells.

Abstract: A driver includes a dummy stage and one or more additional stages coupled to the dummy stage. The dummy stage includes a first transistor coupled between an input terminal and an output terminal. The first transistor includes two electrodes forming at least a first capacitor to store at least a portion of static electricity received through the input terminal. The one or more additional stages output gate signals, which may be received, for example, by a display device.

Abstract: A 3D integrated circuit device, including: a first transistor; a second transistor; and a third transistor, where the third transistor is overlaying the second transistor and the third transistor is controlled by a third control line, where the second transistor is overlaying the first transistor and the second transistor is controlled by a second control line, where the first transistor is part of a control circuit controlling the second control line and the third control line, and where the second transistor and the third transistor are self-aligned.

Abstract: A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Abstract: A semiconductor memory device according to the present invention includes a first memory cell, a second memory cell, a dummy transistor, and a voltage control circuit. The first memory cell has a first transistor that is coupled to a first word line, a first source line, and a bit line. The second memory cell has a second transistor that is coupled to a second word line, a second source line, and the bit line. The dummy transistor has the same structure as the first transistor and is coupled to a dummy word line, a dummy source line, and a dummy bit line. When a predetermined voltage for writing data into the first memory cell is to be applied to the first word line, the voltage control circuit couples the dummy bit line to the second source line and applies the predetermined voltage to the first dummy word line.

Abstract: An EPROM device includes bit lines branching from a supply voltage line, a first group of enablement signal lines intersecting the bit lines, unit cells respectively located at cross points of the bit lines and the first group of enablement signal lines, pass transistors, load transistors, comparators, and enablement signal generators. One of the pass transistors and one of the load transistors are coupled in series between the supply voltage line and each of the bit lines. Each of the comparators receives voltages of both ends of any one of the load transistors to generate an output signal. Each of the enablement signal generators receives one of the output signals of the comparators and one of a second group of enablement signals and outputs one of a third group of enablement signals to turn off one of the pass transistors responsive to a program current reaching a reference value.

Abstract: A driver circuit, such as could be used as an off-chip driver for an I/O pin on a memory circuit, is presented. The driver has a PMOS connected between a supply level and the driver's output node. In an active mode, the bulk terminal of the PMOS is connected to the supply level; and in a standby mode, the PMOS's bulk terminal is set to a higher level. This reduces the leakage current through the PMOS in the standby mode, allowing for smaller device with a lower capacitance to be used.

Abstract: A driving circuit includes a driving stage with a first level shifter and a second level shifter. The first level shifter includes an input terminal receiving a first control signal, an inverted input terminal receiving an inverted first control signal, a first output terminal, and a second output terminal. The second level shifter includes an input terminal receiving a second control signal, an inverted input terminal receiving an inverted second control signal, a third output terminal, and a fourth output terminal. The first output terminal and the third output terminal are connected with each other to generate an output signal. The second output terminal and the fourth output terminal are connected with each other to generate an inverted output signal. Moreover, one of the first level shifter and the second level shifter is enabled according to an operation mode of the driving circuit.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: A method of operating a non-volatile memory device includes selecting a first select transistor from among a plurality of select transistors included in a NAND string, and performing a check operation on a first threshold voltage of the first select transistor. The check operation includes comparing the first threshold voltage with a first lower-limit reference voltage level, and performing a program operation on the first select transistor when the first threshold voltage is lower than the first lower-limit reference voltage level. When the first threshold voltage is equal to or higher than the first lower-limit reference voltage level, the check operation on the first threshold voltage is ended.

Abstract: The present disclosure relates to reference and sense architecture in a cross-point memory. An apparatus may include a memory controller configured to select a target memory cell for a memory access operation. The memory controller includes word line (WL) switch circuitry configured to select a global WL (GWL) and a local WL (LWL) associated with the target memory cell; bit line (BL) switch circuitry configured to select a global BL (GBL) and a local BL (LBL) associated with the target memory cell; and sense circuitry including a first sense circuitry capacitance and a second sense circuitry capacitance, the sense circuitry configured to precharge the selected GWL, the LWL and the first sense circuitry capacitance to a WL bias voltage WLVDM, produce a reference voltage (VREF) utilizing charge on the selected GWL and charge on the first sense circuitry capacitance and determine a state of the target memory cell based, at least in part, on VREF and a detected memory cell voltage VLWL.

Abstract: Provided is a gate driving unit including: a plurality of stages configured to be activated sequentially so as to generate gate signals; and a plurality of repair blocks having sizes smaller than the corresponding stages and configured to repair defects of the stages. Each of the repair blocks is disposed proximate to two or more stages so as to be configured to repair defects in the two or more stages.

Abstract: A non-volatile semiconductor memory device comprising a control circuit is provided, the control circuit performing a data erasure by applying predetermined erase voltages to predetermined blocks of a memory cell array including memory cells disposed on each intersection of a plurality of word lines and a plurality of bit lines, and the control circuit applying the erase voltages to the memory cells to erase data by applying word line voltages different to each other to even-numbered word lines and odd-numbered word lines of the memory cell array except to an edge part thereof, and by applying a voltage different to the word line voltages to the word line in the edge part of the memory cell array.

Abstract: An irreproducible and re-emergent unique structure or pattern identifier manufacturing and detection method, system, and apparatus is provided. A non-volatile floating gate charge storage device can include a block of floating gate transistors that can include a semiconductor region, a source region, a drain region, a floating gate region, a tunnel oxide region, an oxide-nitrite-oxide region, and a control gate region. A structure altering stress effect is applied to the block of transistors to create a passage region in a random number of floating gate regions of floating gate transistors which changes charge storage or electrical characteristics of random elements of the block of transistors. The passage region alters charges on a floating gate region to escape in a different manner than pre-alteration form causing the floating gate region to lose its charge. An apparatus for recording and detecting such differences in pre and post alteration can also be provided.

Abstract: An operating method of a storage device includes reading data from a nonvolatile memory using first read parameters and second read parameters and collecting read histories associated with a plurality of read operations. First histories and second histories are determined from the collected read histories. The second read parameters are adjusted according to the first histories, and the first read parameters are adjusted according to the second histories. The read histories include information on read voltages used to perform the read operations, and the first histories and the second histories are determined from the collected read histories according to the number of read voltages having the same level.

Abstract: Phase compensation in an I/O (input/output) circuit includes variable, programmable slope. A phase compensation circuit can apply phase compensation of one slope and dynamically change the slope of the phase compensation to allow for better tracking of environmental conditions. The phase compensation circuit can generate a linear code to apply phase compensation to lock phase of an I/O signal to a phase of a timing signal. The circuit selectively adjusts the linear code with a variable, programmable slope, where the slope defines how much phase compensation is applied per unit change in the linear code. The circuit applies the adjusted linear code to a lock loop to lock the phase of the I/O signal to the phase of the timing signal.

Abstract: A NAND array includes blocks of memory cells. A block of memory cells includes a plurality of strings having channel lines between first and second string select switches. The strings share a set of word lines between the first and second string select switches. A channel-side voltage can be applied to the channel lines. A control voltage can be applied to a selected subset of the first string select switches. The channel lines can be floated at ends of the second string select switches. Tunneling in memory cells coupled to an unselected subset of the first string select switches can be inhibited. Word line-side erase voltages can be applied to word lines in the set of word lines in the block to induce tunneling in memory cells coupled to the word lines and coupled to the selected subset of the first string select switches.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: According to an embodiment, an electronic circuit is described comprising a processing circuit, a power supply configured to supply power to the processing circuit via two supply nodes; a determiner configured to determine whether the voltage between the two supply nodes is above a predetermined reference voltage; and a clock generator configured to generate a clock signal for the processing circuit wherein the clock generator is configured to if the determiner determines that the voltage between the two supply nodes is again, after pausing the generation of clock edges, above the predetermined threshold the clock generator generates a clock edge irrespective of whether it is currently a time point given by the predetermined periodicity.

Abstract: In one memory array embodiment, in order to compensate for bit-line leakage currents by OFF-state bit-cell access devices, a leakage-current reference circuit tracks access-device leakage current over different process, voltage, and temperature (PVT) conditions to generate a leakage-current reference voltage that drives a different leakage-current abatement device connected to each different bit-line to inject currents into the bit-lines to compensate for the corresponding leakage currents. In one implementation, the leakage-current reference circuit has a device that mimics the leakage of each access device configured in a current mirror that drives the resulting leakage-current reference voltage to the different leakage-current abatement devices.

Abstract: One aspect of the technology is a memory device comprising a memory array, a sense circuit, and temperature compensated bias circuitry. The memory array is electrically coupled between a bit line bias circuit and a common source line. The bit line bias circuit generates a temperature compensated sense current through the memory array. The temperature compensated bias circuitry controls the bit line bias circuit to generate the temperature compensated sense current through the memory array.

Abstract: An array structure includes: a plurality of first signal lines and a plurality of sub-arrays. Each of the sub-array includes: a second signal line, a plurality of third signal lines, a plurality of fourth signal lines, a plurality of local decoders at each intersection of the first signal lines, the second signal line and the third signal lines; and a plurality of array cells at each intersection of the first signal lines, the third signal lines and the fourth signal lines. Respective control terminals of the local decoders are implemented by the first signal lines. In response to a selection status of the first signal lines and the second signal line, one of the local decoders selects one of the third signal lines.

Abstract: A number of techniques determine defects in non-volatile memory arrays, which are particularly applicable to 3D NAND memory, such as BiCS type. Word line to word line shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used to determine word line to word line leaks between different blocks. Select gate leak line leakage, for both the word lines and other select lines, is considered, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques determine shorts between bit lines and low voltage circuitry, such as in sense amplifiers.

Abstract: Some examples include provisioning secret material onto an electronic device. For instance, an electronic device may be provided with a provisioning key that can be used for provisioning other secret material on the electronic device. The provisioning key may be encrypted at a secure location using an on-chip key that is also sent to a processor manufacturer. The encrypted provisioning key may subsequently be decrypted by an electronic device having a processor installed that includes the on-chip key. The provisioning key is saved to the device and may then be used for securely provisioning other secret material onto the electronic device, such as one or more keys, one or more digital certificates, or other digital rights management information. Accordingly, the provisioning key provides the device manufacture with the ability to securely install secret material to the electronic device using a key that is never shared outside of a secure environment.

Abstract: An integrated circuit with memory can operate with reduced latency between consecutive operations such as read operations. At a first time, a first operation command is finished on a memory array on an integrated circuit. At a second time, a second operation command is begun on the memory array. A regulated output voltage from the charge pump is coupled to word lines in the memory array. From the first time to the second time, a regulated output voltage is maintained at about a word line operation voltage such as a read voltage.

Abstract: A nonvolatile memory device includes a substrate, a plurality of memory cells stacked in a direction perpendicular to the substrate, word lines connected to the memory cells, a ground select transistor between the memory cells and the substrate, a ground select transistor between the memory cells and the substrate, a ground select line connected to the ground select transistor, a bit line on the memory cells, and a string select transistor between the memory cells and the bit line. In an erase operation, the ground select line is floated at a time when a specific time passes after the erase voltage is provided to the substrate. And the ground select line is floated at different times depending on a temperature.

Abstract: Electrically conductive layers for control gate electrodes of a vertical memory device can be vertically spaced by cavities to reduce capacitive coupling between neighboring electrically conductive gate electrodes. An alternating stack of first material layers and second material layers can be provided. After replacing the second material layers with electrically conductive layers, the first material layers can be removed to form cavities between the electrically conductive layers. A dielectric material can be deposited with high anisotropic deposition rate to form an insulating spacer. For example, a plasma assisted atomic layer deposition process can be employed to deposit a dielectric spacer that include laterally protruding portions that encapsulate the cavities at each level between neighboring pairs of electrically conductive layers. A contact via structure can be formed in the insulating spacer to provide electrical contact to a source region.

Abstract: A method is for operating a nonvolatile memory device, the nonvolatile memory device including at least one string connected to a bit line, the at least one string including a plurality of memory cells connected in series, each of the plurality of memory cells being connected to a respective word line among a plurality of word lines and stacked in a direction perpendicular to a substrate. The method includes applying a word line voltage needed for an operation to a first word line among the word lines, applying a recovery voltage higher than a ground voltage to the first word line after the operation, and then floating the first word line.

Abstract: A system and method is disclosed for adjusting for timing variations between a data signal and an associated data read signal being transmitted from a first chip and received on a second chip.

Abstract: Decoding blocks, memories, and methods for decoding pre-decoded address information are disclosed. One such decoding block includes a first latch and voltage shift circuit configured to receive first pre-decoded address information at first voltage levels and further configured to latch the first pre-decoded address information and shift the voltage levels of the same to second voltage levels. An address decoder includes a second latch and voltage shift circuit configured to receive second pre-decoded address information at the first voltage levels and latch and shift the voltage levels of the same to the second voltage levels. The address decoder is further configured to select control gates of the memory cells of the memory based at least in part on the first and second pre-decoded address information.

Abstract: The invention relates to an electronic memory system, and more specifically, to a system for providing voltage supply protection in a memory device, and a method for providing voltage supply protection in a memory device. According to an embodiment, a system for providing voltage supply protection in a memory device is provided, the system including a memory array including a plurality of memory cells arranged in a plurality of groups of memory cells, and a plurality of current limiting elements, wherein each group of memory cells is associated with at least one current limiting element.

Abstract: A semiconductor device and a method of operating the same. The semiconductor device may include a plurality of memory blocks. Each of the plurality of memory blocks may include a plurality of cell strings extending substantially perpendicular to a semiconductor substrate, the plurality of cell strings sharing a plurality of bit lines, and a plurality of source lines respectively connected to the cell strings and word lines. Page buffers, connected to the bit lines, may store data. A selection switch portion may selectively transmit a voltage corresponding to data stored in the page buffers, and voltages supplied from an external source, to the bit lines and the source lines during the program operation, the read operation and the erase operation. A control circuit may control the page buffers and the selection switch portion.

Abstract: Apparatuses, circuits, and methods are disclosed for biasing signal lines in a memory array. In one such example the memory array includes a signal line coupled to a plurality of memory cells and is configured to provide access to the plurality of memory cells responsive to a biasing condition of the signal line. The memory array also includes a signal line driver coupled to the signal line, the signal line driver configured to provide a biasing signal to the signal line and to provide a preemphasis in the biasing signal responsive to a control signal. The control signal is responsive to an operating condition.

Abstract: According to one embodiment, a single-poly nonvolatile memory (NVM) cell includes a PMOS select transistor on a semiconductor substrate and a PMOS floating gate transistor series connected to the PMOS select transistor. The PMOS floating gate transistor comprises a floating gate and a gate oxide layer between the floating gate and the semiconductor substrate. A protector oxide layer covers and is in direct contact with the floating gate. A contact etch stop layer is disposed on the protector oxide layer such that the floating gate is isolated from the contact etch stop layer by the protector oxide layer.

Abstract: A memory device of the non-volatile type including a memory array having a plurality of memory cells organized as sectors, each sector having a main word line associated with a plurality of local word lines, each local word line coupled to the main word line by a respective local word line driver circuit, each of the local word line driver circuits consisting of a first MOS transistor coupled between the respective main word line and a respective local word line and a second MOS transistor coupled between the respective local word line and a first biasing terminal.

Abstract: In one memory array embodiment, in order to compensate for bit-line leakage currents by OFF-state bit-cell access devices, a leakage-current reference circuit tracks access-device leakage current over different process, voltage, and temperature (PVT) conditions to generate a leakage-current reference voltage that drives a different leakage-current abatement device connected to each different bit-line to inject currents into the bit-lines to compensate for the corresponding leakage currents. In one implementation, the leakage-current reference circuit has a device that mimics the leakage of each access device configured in a current mirror that drives the resulting leakage-current reference voltage to the different leakage-current abatement devices.

Abstract: Various aspects of a nonvolatile memory have an improved erase suspend procedure. A bias arrangement is applied to word lines of an erase sector undergoing an erase procedure interrupted by an erase suspend procedure. As a result, another operation performed during erase suspend, such as a read operation or program operation, has more accurate results due to decreased leakage current from any over-erased nonvolatile memory cells of the erase sector.

Abstract: An embodiment of an apparatus includes a substrate, a body semiconductor, a vertical memory access line stack over the body semiconductor, and a body connection to the body semiconductor.

Abstract: Methods and devices for operating non-volatile storage are disclosed. One or more programming conditions depend on the location of the word line that is selected for programming, which may reduce or eliminate program disturb. The voltage applied to the gate of a select transistor of a NAND string may depend on the location of the selected word line. This could be either a source side or drain side select transistor. This may prevent or reduce program disturb that could result due to DIBL. This may also prevent or reduce program disturb that could result due to GIDL. A negative bias may be applied to the gate of a source side select transistor when programming at least some of the word lines. In one embodiment, progressively lower voltages are used for the gate of the drain side select transistor when programming progressively higher word lines.

Abstract: A three-dimensionally stacked nonvolatile semiconductor memory of an aspect of the present invention including conductive layers stacked on a semiconductor substrate in such a manner as to be insulated from one another, a bit line which is disposed on the stacked conductive layers, a semiconductor column which extends through the stacked conductive layers, word lines for which the stacked conductive layers except for the uppermost and lowermost conductive layers are used and which have a plate-like planar shape, memory cells provided at intersections of the word lines and the semiconductor column, a register circuit which has information to supply a potential suitable for each of the word lines, and a potential control circuit which reads the information retained in the register circuit in accordance with an input address signal of a word line and which supplies a potential suitable for the word line corresponding to the address signal.

Abstract: According to one embodiment, a semiconductor device includes a first voltage generator, a second voltage generator, a first MOS transistor, and a controller. The first voltage generator outputs a first voltage to a first node. The second voltage generator outputs a second voltage to a second node. The first MOS transistor is capable of short-circuiting the first node and second node. The controller performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor. The controller controls a period in which the first MOS transistor is kept in an on state based on time.