Abstract: Provided is an erasing method of a nonvolatile memory device. The erasing method applies a word line erase voltage to a plurality of word lines connected to the memory cells respectively, applies a specific voltage to a ground selection line connected to the ground selection transistor, applies an erase voltage to a substrate in which the memory string formed during the step applying the specific voltage to the ground selection line, and floats the ground selection line in response to a voltage change of the substrate.

Abstract: According to one embodiment, a configuration memory includes first and second data lines, a first memory string which comprises at least first and second nonvolatile memory transistors which are connected in series between a common node and the first data line, a second memory string which comprises at least third and fourth nonvolatile memory transistors which are connected in series between the common node and the second data line, and a flip-flop circuit which comprises a first data holding node connected to the common node and a second data holding node connected to a configuration data output node.

Abstract: An improved method and apparatus for programming advanced nanometer flash memory cells is disclosed.

Abstract: To read multilevel data from a memory cell having a transistor using silicon and a transistor using an oxide semiconductor, without switching a signal for reading the multilevel data in accordance with the number of the levels of the multilevel data. The potential of the bit line is precharged, the electrical charge of the bit line is discharged via a transistor for writing data, and the potential of the bit line which is changed by the discharging is read as multilevel data. With such a structure, the potential corresponding to data held in a gate of the transistor can be read by only one-time switching of a signal for reading data.

Abstract: A memory includes a wordline driver having reduced leakage. The memory includes a storage array coupled to a first voltage supply, and a number of wordline driver units each including a driver inverter. During a low power mode, the voltage of the voltage supply coupled to the wordline circuit is reduced or removed, while the voltage of the voltage supply coupled to the storage array is kept at least at a retention voltage. In addition a p-type transistor is coupled between the array voltage supply and an input to the wordline driver inverter, thereby keeping the output of the wordline driver inverter at a low logic level to prevent inadvertent wordline firing.

Abstract: A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks disposed side by side in a first direction, and a driver disposed on one end of the memory cell array in a second direction orthogonal to the first direction. First select gate lines in the first block and first select gate lines in the second block are connected to the driver after they are commonly connected in one end in the second direction of the memory cell array in a relation of one to one.

Abstract: According to one embodiment, a memory cell, a word line, and a peripheral circuit are provided. In the memory cell, a ferroelectric film is provided for a gate insulating film. The word line is connected to a control gate electrode of the memory cell. In the peripheral circuit, ferroelectric films are provided for gate insulating films and the peripheral circuit is provided near the memory cell. Here, between the same conductive type transistors of the peripheral circuit, a channel impurity concentration of a transistor to which a driving voltage which drives the word line is applied is different from a channel impurity concentration of a transistor to which a voltage which is lower than the driving voltage is applied.

Abstract: A memory circuit includes word lines coupled to a memory array, including a first set of one or more word lines deselected in an erase operation, and a second set of one or more word lines selected in the erase operation. Control circuitry couples the first set of one or more word lines deselected in the erase operation to a reference voltage, responsive to receiving an erase command for the erase operation. Some examples further include a first transistor that switchably couples a word line to a global word line, and a second transistor that switchably couples the word line to a ground voltage. The control circuitry is coupled to the first transistor and the second transistor, wherein the control circuitry has a plurality of modes including at least an erase operation. In a first mode, the first transistor couples the word line to the global word line, and the second transistor decouples the word line from the ground voltage.

Abstract: A memory access method is applied in a memory controller for accessing a memory array, including a number of respective select switches globally controlled with a string select signal. The memory access method includes: enabling the string select signal and disabling the string select signal before a read phase.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cells, a selection transistor, a memory string, a block, and a transfer circuit. The memory cells are stacked on a semiconductor substrate. In the memory string, the memory cells and the selection transistor are connected in series. The block includes a plurality of memory strings. In data write and read, the transfer circuit transfers a positive voltage to a select gate line associated with a selected memory string in a selected block, and a negative voltage to a select gate line associated with an unselected memory string in the selected block, and to a select gate line associated with an unselected block.

Abstract: According to one embodiment, a semiconductor memory device includes a first sub-array including a plurality of first memory cells; a second sub-array including a plurality of second memory cells; a first bit line electrically connected to a first group of the first memory cells; a second bit line electrically connected to a first group of the second memory cells; a bit line connection unit configured to connect the first bit line and the second bit line; a first sense amplifier configured to receive a first voltage from either of the first bit line and the second bit line in a read operation, and transfer a second voltage either of the first bit line and the second bit line in a write operation; a first source line electrically connected to the first memory cells; a second source line electrically connected to the second memory cells; and a source line driver configured to apply voltages to the first source line and the second source line.

Abstract: A semiconductor memory device includes a string of memory cell transistors that are connected to each other in series. A selection transistor is connected between one end of the string of the memory cell transistors and one of a source line and a bit line. A line is selectively connected to a gate electrode of the selection transistor, a driver, or a node that supplies an unselected voltage, or is set to be in a floating state.

Abstract: A hybrid memory device is provided. The hybrid memory device includes a DRAM, a non-volatile memory and a control circuit. The control circuit selects one of output data of the DRAM and output data of the non-volatile memory according to a mode selecting signal and output the selected data. The control circuit outputs data requested to be output from the DRAM when the data requested to be output is in the DRAM, and may output the data requested to be output from the non-volatile memory when the data requested to be output is in the non-volatile memory. Accordingly, the hybrid memory device has a high speed in a read and write operation, and has low power consumption.

Abstract: A memory includes an array of memory cells including rows and columns including segmented word lines along the rows. The segments of the segmented word lines include local word lines. First and second switches are coupled to corresponding first and second ends of local word lines. The memory includes circuitry coupled to the first and second switches to connect bias voltages to the local word lines to induce current flow for thermal anneal. The circuitry includes pairs of global word lines along corresponding rows. The pairs of global word lines include first global word lines coupled to the first switches in the local word lines along the corresponding rows, and second global word lines coupled to the second switches in the local word lines along the corresponding rows. The memory includes bit lines along corresponding columns. Bit lines can comprise local bit lines coupled to global bit lines.

Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.

Abstract: A circuit can include a plurality of storage circuits, each having a pair of first conductivity type transistor having sources commonly connected to a first node, and gates and drains cross-coupled between first and second storage node; and a pair of second conductivity type transistor having sources commonly connected to a second node, and gates and drains cross-coupled between the first and second storage node; wherein each of the second conductivity type transistors comprises a screening region of the first conductivity type formed below the channel region and has a predetermined minimum dopant concentration.

Abstract: Disclosed is a non-volatile memory data protecting device and method. The non-volatile memory data protecting device that is used for protecting non-volatile memory data when a power is shut down in a system, may include a signal delay unit to delay a drop in voltage of an input/output line, a power shutdown sensor to sense power shutdown of a system, and a controller to control the signal delay unit in response to whether the system is shut down.

Abstract: Various embodiments comprise apparatuses and methods including a three-dimensional memory apparatus having upper strings and lower strings. The upper strings can include a first string of memory cells and a second string of memory cells arranged substantially parallel and adjacent to one another. The lower strings can include a third string of memory cells and a fourth string of memory cells arranged substantially parallel and adjacent to one another. The strings can each have a separate sense amplifier coupled thereto. The first and third strings and the second and fourth strings can be configured to be respectively coupled in series with each other during a read operation. Additional apparatuses and methods are described.

Abstract: A flash memory device including a controller to determine higher, M, and lower, N, word-line address bits based on an input word-line address, to determine a selected area of a memory array based on the higher and lower word-line address bits, and an unselected area of the memory array based on the selected area; and a high voltage generator to provide a first pass voltage to a word line of the selected area, and to provide a second pass voltage to a word line of the unselected area. The pass voltages are discriminately applied to the programmed and non-programmed memory cells, enlarging the pass voltage window. The memory array is divided into pluralities of zones to which local voltages are each applied in different levels.

Abstract: An object is to provide a semiconductor device having a novel structure. A first wiring; a second wiring; a third wiring, a fourth wiring; a first transistor including a first gate electrode, a first source electrode, and a first drain electrode; a second transistor including a second gate electrode, a second source electrode, and a second drain electrode are included. The first transistor is provided over a substrate including a semiconductor material and a second transistor includes an oxide semiconductor layer.

Abstract: A method is provided for driving a nonvolatile memory device, including multiple strings, where each string is formed by penetrating plate-shaped word lines stacked on a substrate. The method includes configuring the word lines of a string in multiple zones based on zone configuration information, and applying zone voltages to the zones, respectively. The zone configuration information is varied according to a mode of operation.

Abstract: A nonvolatile memory device including a dummy memory cell and a method of programming the same, wherein the nonvolatile memory device includes a dummy memory cell, and a plurality of memory cells serially connected to the dummy memory cell. The nonvolatile memory device sets a voltage provided to the dummy memory cell according to a distance between a selected memory cell among the plurality of memory cells and the dummy memory cell when a program operation is performed.

Abstract: A pulse-based memory read-out device, including: a pulse generator at a first end of a bit line and a detector at a second end of the bit line. The pulse generator is configured to send an electrical pulse along the bit line from the first end of the bit line. The detector is configured to: detect the electrical pulse at the second end; and output a digital signal representing a current state of a selected memory cell in the bit line, wherein the digital signal is based on an amplitude of the electrical pulse at the second end.

Abstract: A first exemplary aspect of the present invention is a word line selection circuit where address decode signals composed of a power supply voltage and a first voltage lower than a ground voltage are input, and that a word line selection signal composed of the first voltage and a second voltage higher than the power supply voltage is output not via a level shift circuit according to the address decode signals.

Abstract: According to one embodiment, there is provided a non-volatile semiconductor storage device including a non-volatile memory, a monitoring section, a determining section, and a notification processing section. The non-volatile memory includes a plurality of memory cells driven by word lines and a voltage generating section that generates a read voltage to be applied to the word lines. The monitoring section monitors a change in a threshold distribution of the plurality of memory cells upon performing a read processing to read data from the plurality of memory cells by applying the read voltage to the word lines. The determining section determines a degree of deterioration of the non-volatile memory in accordance with a monitoring result by the monitoring section. The notification processing section notifies a life of the non-volatile memory in accordance with a determining result by the determining section.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: An embodiment of an apparatus includes a substrate, a body semiconductor, a vertical memory access line stack over the body semiconductor, and a body connection to the body semiconductor.

Abstract: In performing a read operation of a memory transistor, a control circuit supplies a first voltage to a selected word line connected to a selected memory transistor. A second voltage is supplied to a non-selected word line connected to a non-selected memory transistor other than the selected memory transistor, the second voltage being higher than the first voltage. A third voltage is supplied to a bit line. A fourth voltage lower than the third voltage is supplied to, among source lines, a selected source line connected to a memory string including the selected memory transistor in a selected memory block. A fifth voltage substantially the same as the third voltage is supplied to, among the source lines, a non-selected source line connected to a non-selected memory string in the selected memory block.

Abstract: A nonvolatile memory device configured to apply a wordline erase voltage to a plurality of wordlines connected to a plurality of memory cells, apply an erase voltage to a substrate where a memory cell string is formed while applying a specific voltage to at least one ground selection line connected to at least one ground selection transistor, and float the at least one ground selection line when a target voltage of the substrate reaches a target voltage.

Abstract: A word line driver including a control switch configured to receive a control signal, where the control switch is between a first node configured to receive an operating voltage signal and a second node configured to determine an output of the word line driver. The word line driver further includes a cross-coupled amplifier electrically connected to the second node. The word line driver further includes at least one inverter electrically connected to the cross-coupled amplifier. A semiconductor device including the word line driver and a memory array including at least one electronic fuse.

Abstract: A memory tracking circuit activates a reset signal that resets a word-line pulse generator to switch the memory from an access state to a recess state. Activation is based on (i) a signal received at the far end of a tracking row after a propagation delay and (ii) a signal applied to a transistor-based gate delay. If the memory is in a fast PVT condition such that the gate delay is of less duration than, or substantially equal to, the propagation delay, then a slow-down circuit delays activation of the reset signal to allow sufficient access margin. The delay in the latter case is less than that in the former case. If the memory is in a slow PVT condition such that the gate delay is longer than the propagation delay, then the slow-down circuit does not delay activation of the reset signal to prevent excess access margin.

Abstract: A semiconductor device includes first and second interconnects, a variable resistance element that may assume a first resistance value or a second resistance value in response to the current flowing therein, first and second transistors connected between the first and second interconnects in series with each other on both sides of the variable resistance element, and a power supply circuit unit that delivers the power supply to a control electrode of the first transistor. The power supply circuit unit supplies the power of a first power supply when the variable resistance element is to make transition to the first resistance value and the power supply circuit unit supplies the power of a second power supply when the variable resistance element is to make transition to the second resistance value, thereby allowing transitioning of the resistance values of the variable resistance element.

Abstract: Methods and devices for sensing non-volatile storage are disclosed. Technology disclosed herein reduces the time for sensing operations of non-volatile storage such as read and program verify. In one embodiment, a kicking voltage is applied to a selected word line during a sensing operation. The kicking voltage may be applied to one end of a selected word line during a transition from a first reference voltage to a second reference voltage. The kicking voltage may help the other end of the word line reach the second reference voltage quickly. Since the bit lines can be sensed after the selected word line has reached the target reference voltage, the time delay prior to sensing of the bit lines may be reduced.

Abstract: A system for optimizing drive strength may be utilized for identifying the maximum data transfer rate for different devices and different device configurations. The drive strength may be optimized for input/output (I/O) devices by measuring voltage drops on I/O power supply using different test patterns. The maximum drive strength is identified that satisfies a limit or threshold for the allowed voltage drop level. The test pattern may include a simultaneous toggling of each I/O device. A slew rate for the device may be utilized along with the drive strength for identifying the maximum data transfer rate.

Abstract: A semiconductor memory device, having a memory array which has two memory banks which can be accessed simultaneously is provided. A word line selection circuit selects the word line according to the row address information, and a controller controls the word line selection circuit according to the received instruction. The controller performs the first read operation of the word line selection circuit in response to a first read command, and performs the second read operation of the word line selection circuit in response to a second read command. The first read operation selects the n-th word line of one of the memory banks and selects the (n+1)-th or (n?1)-th word line of the other memory bank, and the second read operation selects the n-th word line of one of the memory banks and selects the n-th word line of the other memory bank.

Abstract: A method for data storage includes accepting data for storage in an array of analog memory cells, which are arranged in rows associated with respective word lines. At least a first page of the data is stored in a first row of the array, and at least a second page of the data is stored in a second row of the array, having a different word line from the first row. After storing the first and second pages, a third page of the data is stored jointly in the first and second rows.

Abstract: An integrated circuit bit line driver system includes a plurality of bit line drivers coupled to respective bit lines of an array of non-volatile memory cells. Each of the bit line drivers includes a bias transistor through which an input signal is coupled to the respective bit line. The bit line driver system includes a bias voltage circuit that generates a bias voltage that is coupled to the respective gates of the bias transistors. The bias voltage circuit initially accelerates the charging of the transistor gates, and subsequently completes charging the gates at a slower rate. The bias voltage is generated using a diode-coupled transistor having electrical characteristics the match those of the bias transistors so that the bias voltage varies with process or temperature variations of the integrated circuit in the same manner as the threshold voltage of the bias transistors vary with process or temperature variations.

Abstract: A source-sensing configuration for non-volatile memory devices to simultaneously read 2 bits in two different memory cells sharing a same word line is disclosed. In a first cell arrangement, a drain of a first read cell is biased and its source and that of two adjacent cells in a direction towards the second read cell are connected through source bit lines to a source sense amplifier. In a second cell arrangement, the drain of the second read cell is biased and its source and that of its two adjacent cells in a direction towards the first read cell are connected through source bit lines to a source sense amplifier. A memory cell acts as a cell pipe and joins together the first and second cell arrangements. Driving all six source bit lines simultaneously allows the 2 bits to be simultaneously read while maintaining currents due to pipe effect substantially minimized.

Abstract: It is an object to provide a semiconductor device in which power consumption can be reduced. It is another object to provide a highly reliable semiconductor device using a programming cell, such as a programmable logic device (PLD). In accordance with a change in a configuration of connections between basic blocks, power supply voltage furnishing to the basic blocks is changed. That is, when the structure of connections between the basic blocks is such that a basic block does not contribute to a circuit, the supply of the power supply voltage to this basic block is stopped. Further, the supply of the power supply voltage to the basic blocks is controlled using a programming cell formed using a field effect transistor whose channel formation region is formed using an oxide semiconductor, the field effect transistor having extremely low off-state current or extremely low leakage current.

Abstract: According to one embodiment, a voltage generation circuit includes a first boost circuit, a voltage division circuit, a first detection circuit, a capacitor and a first switch. The first boost circuit outputs a first voltage. The voltage division circuit divides the first voltage. The first detection circuit is configured to detect a first monitor voltage supplied to the first input terminal, based on a reference voltage which is supplied to a second input terminal of the first detection circuit, and to control an operation of the first boost circuit. The capacitor is connected between an output terminal of the first boost circuit and the first input terminal of the first detection circuit. The first switch cuts off a connection between the capacitor and the first detection circuit, based on an output signal of the first detection circuit, until the first voltage is output from the first boost circuit.

Abstract: The present inventive concept provides a driving method of memory controller controlling nonvolatile memory device using variable resistive element. The memory controller may control a plurality of first memory devices and a second memory device. A number of write drivers in the second memory device may be driven when a number of first memory devices among the plurality of first memory devices are used. A different number of write drivers in the second memory device may be driven when a different number of first memory devices among the plurality of first memory devices are used.

Abstract: Integrated circuit memory devices include an array of memory cells electrically coupled to a plurality of word lines and a word line driver circuit. The word line driver circuit includes a variable-width pulse generator having a first delay unit therein. The word line driver circuit is configured to drive a selected one of the plurality of word lines with a first word line signal having a leading edge synchronized with a leading edge of a clock signal and a trailing edge synchronized with a trailing edge of the clock signal when a one-half period of the clock signal is greater than a length of delay provided by the first delay unit.

Abstract: Apparatus, systems, and methods for providing high voltage to memory devices are provided. One apparatus includes a low voltage input and a two-rail level shifting. The two-rail level shifting is configured to increase the low voltage or to decrease the low voltage to an amount that is less than or equal to a ground potential based on the amount of the low voltage. A system includes a low voltage input for receiving a voltage and a two-rail level shifting coupled to the low voltage input. The two-rail level shifting is configured to increase the voltage to a positive voltage if the voltage is equal to a ground potential and decrease the voltage to a negative voltage if the voltage is greater than the ground potential. One method includes receiving a voltage, modifying the voltage to generate one of a plurality of output voltages, and providing the output voltage to a memory device.

Abstract: A data storage device having a non-volatile memory and a controller and a control method for the non-volatile memory are disclosed. The non-volatile memory has a plurality of blocks for data storage and each block provides a plurality of sectors. The controller allocates erase marker bits in each of the sectors to record the progress of an erase operation performed on the non-volatile memory for resumption of the erase operation when required.

Abstract: A nonvolatile semiconductor memory device of the charge trap type is initialized by reading the memory cells in the device to determine which charge traps hold less than a predetermined minimum charge and injecting charge into these charge traps until all of the charge traps in the device hold at least the predetermined minimum charge. The charge traps are then programmed selectively with data. The initialization procedure shortens the programming procedure by narrowing the initial distribution of charge in the charge traps, and leads to more reliable reading of the programmed data.

Abstract: A word-line driver includes first, second and third transistors. The first transistor includes a gate terminal driven by a first group selection signal, a first conduction terminal driven by a second sub-group selection signal and a second conduction terminal coupled to the word-line. The second transistor includes a gate terminal driven by a second group selection signal, a second conduction terminal driven by the second sub-group selection signal, and a first conduction terminal coupled to the word-line. The third transistor includes a gate terminal driven by a third the group selection signal, a first conduction terminal driven by a first sub-group selection signal, and a second conduction terminal coupled to the word-line.

Abstract: Strings of series-coupled memory cells selectively coupled to the same bit line may facilitate increased memory densities, reduced fabrication steps and faster read operations when compared to traditional memory array architectures. Reading of the memory cells may be accomplished using charge sharing techniques similar to read operations in a DRAM device.

Abstract: A first capacitor includes a plurality of first conductive layers and second conductive layers. The first conductive layers function as a first electrode of the first capacitor, the second conductive layers function as a second electrode of the first capacitor. The first conductive layers and the second conductive layers are arranged alternately in the direction substantially perpendicular to a semiconductor substrate. A control circuit is configured to control a voltage applied to each of first conductive layers and the second conductive layers according to voltages of gates of a plurality of memory transistors, thereby changing a capacitance of the first capacitor.

Abstract: A memory has memory cells in a matrix; a first selection unit selecting any of first signal lines in the memory cells, in response to an access request; a second selection unit selecting any of second signal lines in the memory cells, after the first selection unit starts operating; a first voltage generation unit generating a first power supply voltage supplied to the first selection unit; a second voltage generation unit generating a second power supply voltage supplied to the second selection unit, when a start-up signal is active; a switch short-circuiting first and second power supply lines, when a short-circuit signal is active; and a power supply voltage control unit which activates the start-up signal in response to the access request, activates the short-circuit signal after a predetermined time elapses since activation of the start-up signal, deactivates the short-circuit signal and the start-up signal after completion of access operations.

Abstract: According to example embodiments, a nonvolatile memory device includes a memory cell array including a plurality of memory cells stacked on a substrate, a plurality of word lines connected with the memory cell array, a plurality of pass voltage generators, and a voltage control circuit. The pass voltage generators each include a plurality of current paths and are configured to generate pass driving signals applied to unselected word lines of the plurality of word lines. The voltage control circuit is configured to control rising slopes of the pass driving signals generated from the plurality of pass voltage generators, based on adjusting the number of current paths in each pass voltage generator used to generate each driving signal.