Abstract: A semiconductor memory device includes: a memory array including a plurality of memory cells; and a peripheral circuit configured to change a voltage level of a bit line connected to a program target cell according to a threshold voltage of the program target cell among the memory cells during a program operation.

Abstract: An error management system for a data storage device can generate soft-decision log-likelihood ratios (LLRs) for upper and lower pages of memory cells in MLC solid-state media. Disclosed are systems and methods for generating lumped-LLR for upper pages, wherein at least some voltage threshold reads are linked together in order to reduce the number of reads. Efficiency and reliability are thereby improved.

Abstract: According to one embodiment, there is provided a semiconductor memory device including a memory cell array, a storage unit, a selection unit, a startup processing unit, and an operation control unit. The memory cell array includes memory cells. The storage unit stores a plurality of operating parameters. The selection unit accesses the storage unit and selects a first operating parameter for operating the memory cells from among the plurality of operating parameters stored in the storage unit, based on a first instruction input. The startup processing unit performs a power startup and reads out the first operating parameter from the storage unit and sets the first operating parameter so as to be ready for use, based on a second instruction input. The operation control unit uses the first operating parameter set by the startup processing unit in order to operate the memory cells.

Abstract: A NAND flash memory unit is described, including a string of memory cells connected in series, S/D regions coupled to two terminals of the string, at least one select transistor couple between a terminal of the string and an S/D region, and at least one erase transistor couple between the at least one select transistor and an S/D region. The select transistor is for selecting the string of memory cells. The erase transistor is for reducing Vt-shift of the select transistor.

Abstract: A nonvolatile memory device comprises a memory cell array, a page buffer, and a bit line connection signal controller. The memory cell array comprises a plurality of word lines and bit lines arranged in rows and columns, and a plurality of memory cells connected to the respective word lines and bit lines. The page buffer connects a selected bit line among the plurality of bit lines to the page buffer, applies a precharge voltage to the selected bit line, and senses a voltage of the selected bit line after developing of the selected bit line according to a bit line connection signal, during a read operation. The bit line connection signal controller changes the bit line connection signal according to a control signal, during the read operation.

Abstract: A flash memory is disclosed. The flash memory includes a flash memory chip; a serial-to-parallel converter for receiving and converting a serial data to a parallel data; and a data mode decision circuit connected to an output terminal of the serial-to-parallel converter for generating an inversion control signal through the parallel data and for applying an inversion processing to the parallel data and then outputting an inverted parallel data to the flash memory chip under the control of the inversion control signal. By converting the serial data to a parallel data and then writing the parallel data into the flash memory chip, a lower proportion of the inversion control signal to the total amount of data is achieved, and therefore less area is consumed while the same programming efficiency and average programming power is maintained compared with a flash memory adopting the bit inversion technique of the prior art.

Abstract: A memory includes first and second select gate transistors, memory cells, a source line, a bit line, a selected word line which is connected to a selected memory cell as a target of a verify reading, a non-selected word line which is connected to a non-selected memory cell except the selected memory cell, a potential generating circuit for generating a selected read potential which is supplied to the selected word line, and generating a non-selected read potential larger than the selected read potential, which is supplied to the non-selected word line, and a control circuit which classifies a threshold voltage of the selected memory cell to one of three groups by verifying which area among three area which are isolated by two values does a cell current of the selected memory cell belong, when the selected read potential is a first value.

Abstract: A nonvolatile semiconductor memory device of the charge trap type is initialized by reading the memory cells in the device to determine which charge traps hold less than a predetermined minimum charge and injecting charge into these charge traps until all of the charge traps in the device hold at least the predetermined minimum charge. The charge traps are then programmed selectively with data. The initialization procedure shortens the programming procedure by narrowing the initial distribution of charge in the charge traps, and leads to more reliable reading of the programmed data.

Abstract: A method for data storage includes accepting data for storage in a memory that includes multiple analog memory cells and supports a set of built-in programming commands. Each of the programming commands programs a respective page, selected from a group of N pages, in a subset of the memory cells. The subset of the memory cells is programmed to store M pages of the data, M>N, by performing a sequence of the programming commands drawn only from the set.

Abstract: A non-volatile memory device (and method of manufacture) is disclosed and structured to enable a write operation using an ionization impact process in a first portion of the device and a read operation using a tunneling process in a second portion of the device. The non-volatile memory device (1) increases hot carrier injection efficiency, (2) decreases power consumption, and (3) enables voltage and device scaling in the non-volatile memory devices.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: In a non-volatile memory system, a programming operation applies programming pulses to a target word line, determines when a specified number of the non-volatile storage elements reach a defined verify level, and counts a specified number of the programming pulses after the specified number of the non-volatile storage elements reach the defined verify level. Upon completion of the counting, faster-programming storage elements are distinguished from slower-programming storage elements. Programming continues for of at least some of the faster-programming non-volatile storage elements, with an associated programming speed-based slow down measure imposed thereon, and for at least some of the slower-programming non-volatile storage elements without imposing a programming speed-based slow down measure.

Abstract: A non-volatile storage system performs programming for a plurality of non-volatile storage elements and selectively performs re-erasing of at least a subset of the non-volatile storage elements that were supposed to remain erased, without intentionally erasing programmed data.

Abstract: Memory devices and programming methods are disclosed. In an embodiment of one such method, a memory cell is programmed to at least a first threshold voltage. After programming the memory cell to at least the first threshold voltage, the memory cell is read, using a read voltage that is less than the first threshold voltage. After reading the memory cell, the memory cell is programmed to at least a second threshold voltage that is greater than the first threshold voltage.

Abstract: Memory systems include at least one nonvolatile memory array having a plurality of rows of nonvolatile multi-bit (e.g., N-bit, where N>2) memory cells therein. A control circuit is also provided, which is electrically coupled to the nonvolatile memory array. The control circuit is configured to program at least two pages of data into a first row of nonvolatile multi-bit memory cells in the nonvolatile memory array using a first sequence of read voltages to verify accuracy of the data stored within the first row. The control circuit is also configured to read the at least two pages of data from the first row using a second sequence of read voltages that is different from the first sequence of read voltages. Each of the read voltages in the first sequence of read voltages may be equivalent in magnitude to a corresponding read voltage in the second sequence of read voltages.

Abstract: Devices, circuitry, and methods for improving matching between semiconductor circuits are shown and described. Measuring a difference in matching between semiconductor circuits may be performed with a test current generator and test current measurement circuit, and adjusting a threshold voltage of a semiconductor component of at least one circuit until the difference between the circuits is at a desired difference may be performed with a program circuit.

Abstract: A nonvolatile semiconductor memory can reduce variations in an amount of current during data writing operation. This allows for the writing of data to memory cells with high precision. The nonvolatile semiconductor memory includes a plurality of memory cells, word lines connected to the memory cells, and bit lines connected to each of the memory cells. At least two of the bit lines are selected, and a current is simultaneously supplied from a power supply line to those memory cells which are connected to the selected bit lines in order to write data thereto. The nonvolatile semiconductor memory also includes charge amount measurement units for measuring respective amounts of charge stored in the memory cells. The nonvolatile semiconductor memory also includes current path switching circuits connected to the respective bit lines.

Abstract: A memory controller has a digital signal processor. The digital signal processor is configured to output a digital data signal of M+N bits of program data intended for programming a memory cell of a memory device. The digital signal processor is configured to receive a digital data signal of M+L bits read from the memory cell of the memory device and to retrieve from the received digital data signal M bits of data that were stored in the memory cell.

Abstract: In a nonvolatile memory array that stores randomized data, the program level—the number of states per cell stored in a population of memory cells—may be determined from the aggregated results of a single read step. A circuit for aggregating binary results of a read step includes parallel transistors with control gates connected to the data latches holding the binary results, so that current flow through the combined transistors depends on the binary results.

Abstract: Memory devices and methods are disclosed. An embodiment of one such method includes programming a first memory cell to a first program level by applying a first series of programming pulses to a control gate of the first memory cell, where the programming pulses of the first series have voltages that sequentially increase by a certain first voltage; and programming a second memory cell to a second program level that is higher than the first program level by applying a second series of programming pulses to a control gate of the second memory cell, where the programming pulses of the second series have voltages that sequentially increase by a certain second voltage less than the certain first voltage.

Abstract: A method includes determining a programming step size for a word line of a memory in a data storage device. The programming step size is determined at least partially based on a count of memory elements of the word line to be programmed to a particular state.

Abstract: Cells of a solid-state, non-volatile memory are assigned to one of a plurality of groups. Each group is defined by expected symbols stored in the cells in view of actual symbols read from the cells. Based on cell counts within the groups, it can be determined that a shift in a reference voltage will reduce a collective bit error rate of the cells. The shift can be applied to data access operations affecting the cells.

Abstract: A data writing method for writing data into a memory cell of a rewritable non-volatile memory module, and a memory controller and a memory storage apparatus using the same area provided. The method includes recording a wear degree of the memory cell and adjusting an initial write voltage and a write voltage pulse time corresponding to the memory cell based on the wear degree thereof. The method further includes programming the memory cell by applying the initial write voltage and the write voltage pulse time, thereby writing the data into the memory cell. Accordingly, data can be accurately stored into the rewritable non-volatile memory module by the method.

Abstract: Subject matter disclosed herein relates to techniques to operate memory.

Abstract: A non-volatile semiconductor memory device, comprising: a non-volatile memory array, storing multi-values by setting a plurality of different threshold voltages for each memory cell, and a control circuit, controlling a write-in operation to the memory cell array. When data have been written into the memory cell, the control circuit selects an adjacent word line, uses an erasing level to perform write-in which is weaker than the data write-in, and verifies soft programming of the amount of one page, such that a narrow-banded erasing level distribution is realized in an adjacent memory cell.

Abstract: The present disclosure includes apparatuses and methods for determining soft data for combinations of memory cells. A number of embodiments include an array of memory cells including a first and a second memory cell each programmable to one of a number of program states, wherein a combination of the program states of the first and second memory cells corresponds to one of a number of data states, and a buffer and/or a controller coupled to the array and configured to determine soft data associated with the program states of the first and second memory cells and soft data associated with the data state that corresponds to the combination of the program states of the first and second memory cells based, at least in part, on the soft data associated with the program states of the first and second memory cells.

Abstract: Methods and memories having switching points for changing Vstep increments according to a level of a multilevel cell being programmed include programming at a smaller Vstep increment in narrow threshold voltage situations and programming at a larger Vstep increment where faster programming is desired.

Abstract: An EEPROM cell including a transfer gate that can suppress a data disturbance phenomenon of the EEPROM cell is provided. The EEPROM cell includes: an inverter; a control plate; a tunneling plate; a data output metal oxide semiconductor field effect transistor (MOSFET) that is connected to the inverter; a floating plate that is connected to the inverter; a tunneling capacitor area that is formed between the floating plate and the tunneling plate; and a transfer gate that is connected to the tunneling plate. As the transfer gate is added between a bit line and the tunneling plate of the EEPROM cell, in a standby (or unselected) operation of the EEPROM cell, the tunneling plate is floated.

Abstract: A memory device can include a load circuit coupled in series with at least one memory element between two nodes and configured to enable a programming current to flow through the memory element to lower its impedance, and configured to enable an erase current to flow through the element in a direction opposite to the program current, the erase current varying in response to an erase voltage applied across the two nodes as the memory element impedance increases.

Abstract: A memory string includes a semiconductor layer, a charge accumulation layer, and a conductive layer. The semiconductor layer extends in a direction perpendicular to the semiconductor substrate and functions as a body of a memory cell. The charge accumulation layer may accumulate charges. The conductive layer sandwiches the charge accumulation layer with the semiconductor layer, and functions as a gate of the memory cell. The control circuit performs, before a read operation, a refresh operation of rendering the selected memory cell and a non-selected memory cell conductive to conduct a current from a first end to a second end of the memory string.

Abstract: Embodiments described herein generally relate to programming and erasing a FLASH memory. In an embodiment, a method of programming or erasing the contents of a block of a FLASH memory includes determining a voltage of a pulse based on an age of the block and outputting the pulse to at least a portion of the block. The pulse is used to program or erase the block.

Abstract: A nonvolatile memory device is programmed by performing a plurality of program loops each comprising applying a program voltage to a selected wordline to change a threshold voltage of a selected memory cell, and applying a verification voltage to the selected wordline to verify a program state of the selected memory cell. In each program loop, the nonvolatile memory device determines a program condition and increments the program voltage by an amount determined according to the program condition.

Abstract: A control circuit controls erase operation to erase data of memory transistors, correction write operation, and correction write verify operation. In the correction write operation, a erase threshold level of a memory transistor is moved to a positive threshold level after the erase operation. In the correction write verify operation, whether or not a threshold level of the result of the correction write operation reaches a first value is determined. In the correction write operation, the control circuit executes the correction write operation with respect to plural memory units connected to a common one of the bit lines as a group. The control circuit sequentially executes the correction write verify operation with respect to plural memory units in which the correction write operation is executed.

Abstract: A method of operating a semiconductor memory device may include increasing threshold voltage of memory cells by performing an LSB program operation on the memory cells having first state, decreasing threshold voltage of memory cells to be programmed to second state of the memory cells to a level lower than a first level in unit of a memory cell for an MSB program operation, and increasing threshold voltage of memory cells to be programmed to third state of the memory cells to a level higher than a second level, which is higher than the first level, in unit of a memory cell for an MSB program operation.

Abstract: A series of programming pulses are applied to a memory cell to be programmed. A program verify pulse, at an initial program verify voltage, is applied to the memory cell after each programming pulse. The initial program verify voltage is a verify voltage that has been increased by a quick charge loss voltage. The quick charge loss voltage is subtracted from the initial program verify voltage after either a programming pulse has reached a certain reference voltage or a quantity of programming pulses has reached a pulse count threshold.

Abstract: Techniques are described herein for detecting and recovering over-erased memory cells in a flash memory device. In one embodiment, a flash memory device includes a memory array including a plurality of blocks of memory cells. The device also includes a command interface to receive a command from a source external to the memory device. The device also includes a controller including logic to perform a leakage-suppression process in response to the command. The leakage-suppression process includes performing a soft program operation to increase a threshold voltage of one or more over-erased memory cells in a given block of memory cells and establish an erased state.

Abstract: A method includes measuring a saturation current flowing through one or more analog memory cells. A wear level of the memory cells is deduced from the measured saturation current. Storage of data in the memory cells is configured based on the deduced wear level.

Abstract: A calibration module generates a plurality of calibration codes respectively for a first plurality of transistors located along (i) a plurality of bit lines and (ii) a first word line of a memory array. Each of the calibration codes is based on a distance of a corresponding one of the plurality of bit lines from an input of the first word line. A voltage generator outputs a first voltage generated based on a first plurality of codewords to an input of a second word line. A control module determines values of threshold voltages of a second plurality of transistors located along (i) the plurality of bit lines and (ii) the second word line based on (a) the first plurality of codewords and (b) currents sensed through the second plurality of transistors, and adjusts the values of the threshold voltages based on the calibration codes.

Abstract: In one aspect, a storage device includes a plurality of storage strings, each comprising a serial interconnection of a plurality of active storage elements, each storage element having a part for maintaining a storage state and a part of modulating a current through the element according to the storage state. The device also includes mapping circuitry for selectively sensing a storage state of a storage element in a storage string by forming current though the storage element that is a non-linear function of the storage state. In some examples, the mapping circuitry comprises reference string of active elements, and the mapping circuitry selectively senses a storage state by forming a difference in currents in the sensed storage string and in the reference string that is a non-linear function of the storage state. In some examples, the active storage elements comprise floating gate transistors.

Abstract: A non-volatile memory chip having SLC blocks acting as a write cache for MLC blocks for high density storage requires constant copying or folding of SLC blocks into MLC blocks. To avoid the time-consuming toggling out and in of the pages of the entire SLC block for ECC checking by a controller chip, only a small sample is checked. An optimal read point for reading the memory cells in the sample of the SLC block is dynamically determined by trying different read points so that the data is read within an error budget. Once the optimal read point is determined, it is used to read the entire SLC block without further error checking. Then the SLC block can be copied (blind folded) to the MLC block with the confidence of being within the error budget.

Abstract: In one implementation, a memory device includes non-volatile memory, a memory controller communicatively coupled to the non-volatile memory over a first bus, and a host interface through which the memory controller communicates with a host device over a second bus. The memory device can also include a signal conditioner of the host interface adapted to condition signals to adjust a signal level of signals received over the second bus based on signal level data received from the host device, wherein the signal level data relates to a voltage level of signals generated by the host device to encode data transmitted across the second bus.

Abstract: An apparatus is described that is configured to modify a signal to at least substantially remove a noise portion from the signal. In one or more implementations, the apparatus is a collaborative filtering module that is configured to communicatively couple to a memory array having a plurality of memory cell blocks. The memory array is configured to furnish a signal representative of data stored within the plurality of memory cell blocks. The collaborative filtering module is configured to determine a noise distribution associated with the plurality of memory cell blocks and generate a noise prediction, which is based upon the noise distribution, when a read operation for the plurality of memory cell blocks is issued. The collaborative filtering module is also configured to modify the signal utilizing the noise prediction to at least substantially remove noise from the signal.

Abstract: Memory devices and methods of operating memory devices are shown. Configurations described include circuits to perform a single check between programming pulses to determine a threshold voltage with respect to desired benchmark voltages. In one example, the benchmark voltages are used to change a programming speed of selected memory cells.

Abstract: A threshold voltage distribution scheme for multi-level Flash cells where an erase threshold voltage and at least one programmed threshold voltage lie in an erase voltage domain. Having at least one programmed threshold voltage in the erase voltage domain reduces the Vread voltage level to minimize read disturb effects, while extending the life span of the multi-level Flash cells as the threshold voltage distance between programmed states is maximized. The erase voltage domain can be less than 0V while a program voltage domain is greater than 0V. Accordingly, circuits for program verifying and reading multi-level Flash cells having a programmed threshold voltage in the erase voltage domain and the program voltage domain use negative and positive high voltages.

Abstract: According to one embodiment, a nonvolatile semiconductor memory includes a source line connected to first and second cell units, a cell-source driver setting the source line on a fixed potential in a programming, a data latch circuit temporary storing program data, a hookup circuit connecting one of the first and second bit lines to the data latch circuit, and connecting the other one of the first and second bit lines to the source line, in the programming, a level detection circuit detecting a potential level of the source line, and a control circuit determining a completion of a charge of the first and second bit lines when the potential level of the source line is larger than a threshold value, and making a charge time of the first and second bit lines variable, in the programming.

Abstract: Devices, systems, methods, and other embodiments associated with selectively accessing memory are described. In one embodiment, a method detects an indication indicative of whether to program fast access pages or slow access pages of a flash memory. In response to the detected indication, data is programmed from a volatile memory: (1) to the fast access pages of the flash memory while skipping the slow access pages, or (2) to the slow access pages while skipping the fast access pages.

Abstract: A programmable non-volatile configuration circuit uses a pair of non-volatile memory devices arranged in a pull-up and pull-down arrangement. The non-volatile memory devices have floating gates that overlaps a variable portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. The invention can be used in environments to store configuration data for programmable logic devices, field programmable arrays, and many other applications.

Abstract: Methods and solid state drives are disclosed, for example a solid state drive that is adapted to receive and transmit analog data signals representative of bit patterns of three or more levels (such as to facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits). Programming of the solid state drive, comprising an array of non-volatile memory cells, might include adjusting the level of each memory cell being programmed in response to a desired performance level of a controller circuit.

Abstract: Methods of programming a memory and memories are disclosed. In at least one embodiment, a memory is programmed by determining a pretarget threshold voltage for a selected cell, wherein the pretarget threshold voltage is determined using pretarget threshold voltage values for at least one neighbor cell of the selected cell.

Abstract: Various aspects of a NAND memory include a control circuit that applies a read bias arrangement to a plurality of word lines to read a selected data value stored on a plurality of memory cells by measuring current flowing between the first end and the second end of the series of memory cells. The read bias arrangement is applied to word lines of the plurality of word lines applies only word line voltages less than a second maximum of a second threshold voltage distribution.