Abstract: To provide a memory element where a desired potential can be stored as data without an increase in the number of power source potentials. The memory element stores data in a node which is brought into a floating state by turning off a transistor a channel of which is formed in an oxide semiconductor layer. The potential of a gate of the transistor can be increased by capacitive coupling between the gate and a source of the transistor. With the structure, a desired potential can be stored as data without an increase in the number of power source potentials.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a memory cell array including cell strings coupled between bit lines and a common source line, each of the cell strings comprising a plurality of memory cells stacked above a substrate. The semiconductor memory device also includes a peripheral circuit configured to supply a negative voltage to one or more word lines coupled to the cell strings and supply a positive voltage to the common source line, wherein the peripheral circuit supplies the positive voltage and the negative voltage before a program operation is performed.

Abstract: An Ultra-low power programming method for N-channel semiconductor Non-Volatile Memory (NVM) is disclosed. In contrast to the grounded voltage at the source electrode of an N-channel semiconductor NVM for the conventional Channel Hot Electron Injection (CHEI) programming, the source electrode in the programming method of the invention is necessarily floating with no voltage bias to prevent applied electrical fields toward the source electrode. The drain electrode of the N-channel semiconductor NVM is reversely biased with a positive voltage VDB relative to the substrate to facilitate the valence band electrons in the P-type substrate to tunnel to the conducting band of the N-type drain electrode. A positive high gate voltage pulse is then applied to the gate electrode of the N-channel semiconductor NVM to collect the surface energetic electrons toward the charge storage material.

Abstract: Devices, memory arrays, and methods are disclosed. In an embodiment, one such device has a source/drain zone that has first and second active regions, and an isolation region and a dielectric plug between the first and second active regions. The dielectric plug may extend below upper surfaces of the first and second active regions and may be formed of a dielectric material having a lower removal rate than a dielectric material of the isolation region for a particular isotropic removal chemistry.

Abstract: An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line. A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration of an erase operation, or at a predetermined or adaptively determined erase-verify iteration, such as based on a number of program-erase cycles.

Abstract: Erasing memory cells in certain 3-D NAND charge-storage memory arrays is achieved by rapidly charging vertical conductors using Gate Induced Drain Leakage (GIDL) current generated in select transistors. When bit line voltage drops below its nominal value, select line voltage is controlled to maintain a constant voltage difference between bit line voltage and select line voltage thus maintaining a gate-drain voltage difference in select transistors that provides sufficient GIDL current for erase.

Abstract: A semiconductor device including a nonvolatile memory cell in which a writing transistor which includes an oxide semiconductor, a reading transistor which includes a semiconductor material different from that of the writing transistor, and a capacitor are included is provided. Data is written to the memory cell by turning on the writing transistor and applying a potential to a node where a source electrode (or a drain electrode) of the writing transistor, one electrode of the capacitor, and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor, so that the predetermined amount of charge is held in the node. Further, when a p-channel transistor is used as the reading transistor, a reading potential is a positive potential.

Abstract: The disclosure relates to an electrically erasable and programmable memory comprising at least one word of memory cells with first and second control gate transistors in parallel to apply a control gate voltage to the memory cells of the word. The memory also comprises s first control circuit to supply a first control voltage to a control terminal of the first control gate transistor through a first current limiter, and a second control circuit to supply a second control voltage to a control terminal of the second control gate transistor through second current limiter.

Abstract: A method of erasing a nonvolatile memory device, which includes a plurality of memory blocks each formed of a plurality of strings, includes applying an erase voltage to a well of a selected memory block of the memory blocks, each memory block including at least two dummy cells located between a string or ground selection transistor and memory cells; and applying or inducing different levels of voltages to respective gates of the at least two dummy cells.

Abstract: Upon selecting non-volatile storage elements to be sensed, the system obtains information about the position of these non-volatile storage elements, determines sensing parameters based at least in part on this information, pre-charges a charge storage device and, while maintaining the voltage level of the bit lines of these memory cells at a constant value, applies a reference signal to these non-volatile storage elements for a certain duration of time, afterwards determining whether, for the certain duration of time, the current conducted by these non-volatile storage elements exceeds a predetermined value.

Abstract: An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line. A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration of an erase operation, or at a predetermined or adaptively determined erase-verify iteration, such as based on a number of program-erase cycles.

Abstract: Techniques are disclosed herein for erasing non-volatile storage elements. A sequence of increasing erase voltages may be applied to a substrate. The select line may be floated and many of the word lines may be held at a low voltage (e.g., close to 0V). However, the voltage applied to an edge word may be increased in magnitude relative to a previous voltage applied to the edge word line for at least a portion of the sequence of erase voltages. The edge word line could be the word line that is immediately adjacent to the select line. The increasing voltage applied to the edge word line may prevent or reduce damage to oxides between the select line and edge word line. It may also help to regulate the e-field across a tunnel oxide of memory cells on the edge word line.

Abstract: An interconnection matrix consists of a plurality of semiconductor Non-Volatile Memory (NVM) forming an M×N array. Semiconductor NVM devices in the array are either programmed to a high threshold voltage state or erased to a low threshold voltage state according to a specific interconnection configuration. Applied with a gate voltage bias higher than the low threshold voltage and lower than the high threshold voltage to the control gates of the entire semiconductor NVM devices in the array, the configured interconnection network is formed. The disclosed interconnection matrix can be applied to configuring circuit routing in Integrated Circuit (IC).

Abstract: A method of programming a memory is provided. The memory has a first cell, having a first S/D region and a second S/D region shared with a second cell. The second cell has a third S/D region opposite to the second S/D region. When programming the first cell, a first voltage is applied to a control gate of the first cell, a second voltage is applied to a control gate of the second cell to slightly turn on a channel of the second cell, a third and a fourth voltage are respectively applied to the first and the third S/D regions, and the second S/D region is floating. A carrier flows from the third S/D region to the first S/D region, and is injected into a charge storage layer of the first cell by source-side injection.

Abstract: Embodiments described herein generally relate to verifying that a FLASH memory has been erased. In an embodiment, a method of erase verifying a memory column of a FLASH memory includes applying a pass gate voltage to even numbered memory transistors while applying an erase verify voltage to the odd numbered memory transistors. Applying a string current to the memory column allows a probe to determine if the string current is successfully traversing the memory column, and thus verifying that the odd numbered memory transistors were erased. The even numbered memory transistors are verified in the following cycle.

Abstract: An apparatuses and methods for inferring threshold voltage distributions associated with memory cells via interpolation. A determining soft data for a group of memory cells each programmed to one of a number of data states, wherein the soft data comprises a number of different soft data values, determining a quantity of memory cells associated with each of the different soft data values, and inferring at least a portion of a threshold voltage distribution associated with the group of memory cells via an interpolation process using the determined quantities of memory cells associated with each of the different soft data values.

Abstract: This invention discloses circuit and methods of a NAND-based 2T-string NOR flash cell structure as a building block for a fast random-read NOR flash memory. The key concept of this new set of bias conditions in cell array improves over the critical concern of punch-through issue when cell is migrating to the more advanced technology node of next generation. The invention adopts a novel preferable symmetrical 2T-string NOR flash cell. Each NAND or NAND like cell of this 2T-string NOR cell is to store 2 bits and is preferable to be made of N-channel device. The cell is preferable to use Fowler-Nordheim Tunneling scheme for both erase and program operations. The invention is to provide a novel 2T-string NOR flash cell structure made of N-channel device offering most flexible erase sizes in unit of byte, page, sector, block and chip with the least program and erase disturbances.

Abstract: A non-volatile semiconductor device and a method for operating the same are disclosed, where the non-volatile semiconductor device includes a gate dielectric layer, a p-type floating gate, a coupling gate, a first p-type source/drain, a second p-type source/drain, a first contact plug and a second contact plug. The gate dielectric layer is formed on a n-type semiconductor substrate. The p-type floating gate is formed on the gate dielectric layer. The first p-type source/drain and the second p-type source/drain are formed in the n-type semiconductor substrate. The first and second contact plugs are formed on the first and second p-type source/drains respectively. The coupling gate consists essentially of a capacitor dielectric layer and a third contact plug, where the capacitor dielectric layer is formed on the p-type floating gate, and the third contact plug is formed on the capacitor dielectric layer.

Abstract: In a conventional DRAM, when the capacitance of a capacitor is reduced, an error of reading data easily occurs. A plurality of cells are connected to one bit line MBL_m. Each cell includes a sub bit line SBL_n_m and 4 to 64 memory cells (a memory cell CL_n_m—1 or the like). Further, each cell includes selection transistors STr1—n—m and STr2—n—m and an amplifier circuit AMP_n_m that is a complementary inverter or the like is connected to the selection transistor STr2—n—m. Since parasitic capacitance of the sub bit line SBL_n_m is sufficiently small, potential change due to electric charge in a capacitor of each memory cell can be amplified by the amplifier circuit AMP_n_m without an error, and can be output to the bit line.

Abstract: Each memory cell of a plurality of memory cells of a memory has a well, source and drain regions, a storage layer, and a gate. The memory cells are in a matrix. Same column drain regions connect to the same bit line, same row gates connect to the same word line, and same column source regions connect to the same source line. The memory is programmed by applying a first voltage to a word line electrically connected to a memory cell of the plurality of memory cells, applying a second voltage different from the first voltage by at least a programming threshold to a bit line electrically connected to the memory cell, applying a third voltage different from the first voltage by at least the programming threshold to a source line electrically connected to the memory cell, and applying a substrate voltage to the plurality of memory cells.

Abstract: The disclosure relates to a hot electron injection MOS transistor, comprising source and drain regions formed in a semiconductor substrate, a control gate, and a floating gate comprising electrically conductive nanoparticles. The control gate comprises a first portion arranged at a first distance from the substrate, a second portion arranged at a second distance less than the first distance from the substrate, and an intermediary portion linking the first and the second portions.

Abstract: Complementary Electrical Erasable Programmable Read Only Memory (CEEPROM) is disclosed. CEEPROM cell comprises a pair of non-volatile memory elements and one access transistor. The two elements of the non-volatile memory pair are configured to be one with high electrical conductance and the other with low electrical conductance. The positive voltage VDD for digital value “1” and ground voltage VSS for digital value “0” are connected to the two input nodes of the two non-volatile elements respectively after configuration. The digital signal either VDD or VSS passed through the high conductance non-volatile memory element in the pair is directly accessed by the access transistor without applying a sense amplifier as the conventional EEPROM would require. Without sense amplifiers, the digital data in CEEPROM can be fast accessed. The power consumption and the silicon areas required for sense amplifiers can be saved as well.

Abstract: According to one embodiment, there is provided a nonvolatile semiconductor memory device including a substrate, a laminated film which has a configuration where first insulating layers and first electrode layers are alternately laminated in a first direction vertical to the substrate, a second insulating layer formed on an inner wall of a first through hole pierced in the first insulating layers and the first electrode layers along the first direction, an intermediate layer formed on a surface of the second insulating layer, a third insulating layer formed on a surface of the intermediate layer, and a pillar-like first semiconductor region which is formed on a surface of the third insulating layer and extends along the first direction.

Abstract: An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line. A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration of an erase operation, or at a predetermined or adaptively determined erase-verify iteration, such as based on a number of program-erase cycles.

Abstract: Methods and devices for operating non-volatile storage are disclosed. One or more programming conditions depend on the location of the word line that is selected for programming. Applying a selected word line dependent program condition may reduce or eliminate program disturb. The voltage applied to a common source line may depend on the location of the word line that is selected for programming. This may prevent or reduce punch-through conduction, which may prevent or reduce program disturb. The voltage applied to bit lines of unselected NAND strings may depend on the location of the word line that is selected for programming. This may prevent or reduce punch-through conduction.

Abstract: Some embodiments include a memory device and methods of forming the memory device. One such memory device includes a first group of memory cells, each of the memory cells of the first group being formed in a cavity of a first control gate located in one device level of the memory device. The memory device also includes a second group of memory cells, each of the memory cells of the second group being formed in a cavity of a second control gate located in another device level of the memory device. Additional apparatus and methods are described.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region.

Abstract: A semiconductor memory device includes a substantially planar substrate; a memory string vertical to the substrate, the memory string comprising a plurality of storage cells; and a plurality of elongated word lines, each word line including a first portion substantially parallel to the substrate and connected to the memory string and a second portion substantially inclined relative to the substrate and extending above the substrate, wherein a first group of the plurality of word lines are electrically connected to first conductive lines disposed at a first side of the memory string, and a second group of the plurality of word lines are electrically connected to second conductive lines disposed at a second side of the memory string.

Abstract: A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process.

Abstract: A Graphene Flash Memory (GFM) device is disclosed. In general, the GFM device includes a number of memory cells, where each memory cell includes a graphene channel, a graphene storage layer, and a graphene electrode. In one embodiment, by using a graphene channel, graphene storage layer, and graphene electrode, the memory cells of the GFM device are enabled to be scaled down much more than memory cells of a conventional flash memory device. More specifically, in one embodiment, the GFM device has a feature size less than 25 nanometers, less than or equal to 20 nanometers, less than or equal to 15 nanometers, less than or equal to 10 nanometers, or less than or equal to 5 nanometers.

Abstract: A non-volatile memory device includes channel structures that each extend in a first direction, wherein the channel structures each include channel layers and interlayer dielectric layers that are alternately stacked; source structure extending in a second direction crossing the first direction and connected to ends of the channel structures, wherein the source structure includes source lines and interlayer dielectric layers that are alternately stacked; and word lines extending in the second direction and formed to surround the channel structures.

Abstract: A non-volatile memory device includes a semiconductor substrate and a tunnel insulating layer and a gate electrode. A multiple tunnel insulation layer with a plurality of layers, a charge storage insulation layer, and a multiple blocking insulation layer with layers are sequentially stacked between the gate electrode and the tunnel insulating layer. A first diffusion region and a second diffusion region in the semiconductor substrate are adjacent to opposite respective sides of the gate electrode. When a voltage is applied to the gate electrode and the semiconductor substrate to form a voltage level difference therebetween, a minimum field in the tunnel insulation layer is stronger than in the blocking insulation layer. A minimum field at a blocking insulation layer can be stronger than at a tunnel insulation layer, and the migration probability of charges through the tunnel insulation layer can be higher than through the blocking insulation layer.

Abstract: A blocking semiconductor layer minimizes penetration of implant species into a semiconductor layer beneath the blocking semiconductor layer. The blocking semiconductor layer may have grains with relatively fine or small grain sizes and/or may have a dopant in a relatively low concentration to minimize penetration of implant species into the semiconductor layer beneath the blocking semiconductor layer.

Abstract: A non-volatile semiconductor device and a method for operating the same are disclosed, where the non-volatile semiconductor device includes a gate dielectric layer, a n-type floating gate, a coupling gate, a first n-type source/drain, a second n-type source/drain, a first contact plug and a second contact plug. The gate dielectric layer is formed on a p-type semiconductor substrate. The n-type floating gate is formed on the gate dielectric layer. The first n-type source/drain and the second n-type source/drain are formed in the p-type semiconductor substrate. The first and second contact plugs are formed on the first and second n-type source/drains respectively. The coupling gate consists essentially of a capacitor dielectric layer and a third contact plug, where the capacitor dielectric layer is formed on the n-type floating gate, and the third contact plug is formed on the capacitor dielectric layer.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: Method and apparatus for sanitizing a non-volatile memory, such as a flash memory array. In accordance with various embodiments, a memory cell is sanitized by using a write circuit to accumulate charge on a floating gate of the cell to a level such that application of a maximum available read sensing voltage to a control gate of the cell is insufficient to place the cell in a conductive state.

Abstract: The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.

Abstract: Integrated circuit flash memory devices, such as NAND flash memory devices, include an array of regular flash memory cells, an array of dummy flash memory cells and an erase controller. The erase controller is configured to concurrently apply a different predetermined bias voltage to the dummy flash memory cells than to the regular flash memory cells during an erase operation of the integrated circuit flash memory device. Related methods are also described.

Abstract: The present invention provides circuits, systems, and methods for programming a floating gate. As described herein, a floating gate tunneling device is used with an analog comparison device in a circuit having a floating reference node and an offset-mitigating feedback loop for iteratively programming a floating gate or multiple floating gates.

Abstract: Some embodiments include apparatuses and methods having memory cells and access lines coupled to the memory cells. In one such apparatus, the access lines include a first access line and a second access line. The first access line can be adjacent to the second access line. The memory cells include a memory cell associated with the second access line. A module can be configured to apply a voltage to the first access line during an operation of accessing the memory cell associated with the second access line, and to place the second access line in a floating state during at least a portion of a time interval within the operation. Other embodiments including additional apparatus and methods are described.

Abstract: An electronic device including a set of functional block, and a biasing block for generating a set of bias voltages for the functional blocks. The electronic device further includes a holding block coupled between the biasing block and the functional blocks for providing each bias voltage to at least one corresponding functional block, for each bias voltage the holding block including a capacitive element for storing the bias voltage, and a switch element switchable between an accumulation condition wherein provides the bias voltage from the biasing block to the capacitive element and to the at least one corresponding functional block, and a release condition wherein isolates the capacitive element from the biasing block and provides the bias voltage from the capacitive element to the at least one corresponding functional block, and a control block for alternately switching the switching elements between the accumulation condition and the release condition.

Abstract: A semiconductor memory device according to one embodiment of the present invention includes a dielectric film configured to store information depending on presence or absence of a conductive path therein, and a plurality of electrodes provided to contact a first surface of the dielectric film. The conductive path can be formed between two electrodes arbitrarily selected form the plurality of electrodes. The conductive path has a rectifying property of allowing a current to flow more easily in a first direction connecting arbitrary two electrodes than in a second direction opposite to the first direction. The largest possible number of the conductive paths that may be formed is larger than the number of the plurality of electrodes.

Abstract: A nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; an inner insulating film provided between the memory layer and the semiconductor pillar; an outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In an erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential.

Abstract: Memory devices are disclosed, such as those that include a semiconductor-on-insulator (SOI) NAND memory array having a boosting plate. The boosting plate may be disposed in an insulator layer of the SOI substrate such that the boosting plate exerts a capacitive coupling effect on a p-well of the memory array. Such a boosting plate may be used to boost the p-well during program and erase operations of the memory array. During a read operation, the boosting plate may be grounded to minimize interaction with p-well. Systems including the memory array and methods of operating the memory array are also disclosed.

Abstract: Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

Abstract: Nonvolatile memory devices include a two-dimensional array of nonvolatile memory cells having a plurality of memory cells of unequal size therein. These memory cells may include those that have unequal channel widths associated with respective word lines and those having unequal channel lengths associated with respective bit lines that are connected to corresponding strings of nonvolatile memory cells (e.g., NAND-type strings). Control circuitry is also provided that is electrically coupled to the two-dimensional array of nonvolatile memory cells. This control circuitry may operate to concurrently program first and second nonvolatile memory cells having unequal sizes from an erased state (e.g., logic 1) to an equivalent programmed state (e.g., logic 0).

Abstract: According to one embodiment, a nonvolatile semiconductor memory device comprises a first memory cell, a second memory cell, and a control circuit. The first memory cell is connected to a first word line. The second memory cell is connected to a second word line which is adjacent to the first word line and has a width different from a width of the first word line. The control circuit applies a first voltage to the first word line and a second voltage different from the first voltage to the second word line. At least one of the first voltage and the second voltage is corrected by the control circuit based on write loop counts of the first memory cell and the second memory cell when the first memory cell and the second memory cell are write target cells in a write operation.

Abstract: A semiconductor memory device according to one embodiment of the present invention includes a dielectric film configured to store information depending on presence or absence of a conductive path therein, and a plurality of electrodes provided to contact a first surface of the dielectric film. The conductive path can be formed between two electrodes arbitrarily selected form the plurality of electrodes. The conductive path has a rectifying property of allowing a current to flow more easily in a first direction connecting arbitrary two electrodes than in a second direction opposite to the first direction. The largest possible number of the conductive paths that may be formed is larger than the number of the plurality of electrodes.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device includes a semiconductor layer having a channel, a first insulating film provided on the channel, a floating electrode provided on the first insulating film, a second insulating film provided on the floating electrode, and a gate electrode provided on the second insulating film, and changes its data memory state by injection of charges into the floating electrode.