Abstract: A method of decreasing the test time to determine data retention (e.g. leakage current) of a memory cell having a floating gate for the storage of charges thereon. The memory cell is characterized by the leakage current having a rate of leakage which is dependent upon the absolute value of the voltage of the floating gate. The memory cell is further characterized by a first erase voltage and a first programming voltage, applied during normal operation, and a first read current detected during normal operation. The method applies a voltage greater than the first erase voltage or greater than the first programming voltage, to over erase the floating gate. The memory cell including the floating gate is subject to a single high temperature bake. The memory cell is then tested for data retention of the floating gate based on the single high temperature bake.

Abstract: Provided is an electrically erasable and programmable nonvolatile semiconductor memory device having a tunnel region; the tunnel region and the peripheral of the tunnel region are dug down to be made lower, and a depletion electrode, to which an arbitral potential is given to deplete a part of the tunnel region through a depletion electrode insulating film, is arranged in the lowered drain region.

Abstract: The degree of integration and the number of rewriting of a semiconductor device having a nonvolatile memory element are improved. A first MONOS nonvolatile-memory-element and a second MONOS nonvolatile-memory-element having a large gate width compared with the first MONOS nonvolatile-memory-element are mounted together on the same substrate, and the first MONOS nonvolatile-memory-element is used for storing program data which is scarcely rewritten, and the second MONOS nonvolatile-memory-element is used for storing processed data which is frequently rewritten.

Abstract: Three-dimensional (3D) nonvolatile memory devices include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region. A recess is provided, which extends partially (or completely) through the common source region. A vertical stack of nonvolatile memory cells are provided on the substrate. This vertical stack of nonvolatile memory cells includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess. Gate dielectric layers are provided, which extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region.

Abstract: Provided is an electrically erasable and programmable nonvolatile semiconductor memory device having a small hole in a second conductivity-type drain region, a tunnel insulating film formed on the surface of the hole, and a protrusion extended from the floating gate electrode and arranged to fill the hole. Further a tunneling restriction region which is an electrically floating first conductivity type region arranged in a vicinity of the surface of the drain region around the hole to define the size of the tunnel region through which the tunnel current flows.

Abstract: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device includes a plurality of stacked semiconductor layers and a plurality of memory cell transistors which is formed on each of a plurality of semiconductor layers and serially connected. Memory cell transistors disposed on different semiconductor layers are serially connected to include one cell string forming a current path in a plurality of semiconductor layers, a first selection transistor serially connected to one edge portion of the cell string and a second selection transistor serially connected to the other edge portion of the cell string.

Abstract: A non-volatile memory device is provided, including a substrate formed of a single crystalline semiconductor, pillar-shaped semiconductor patterns extending perpendicular to the substrate, a plurality of gate electrodes and a plurality of interlayer dielectric layers alternately stacked perpendicular to the substrate, and a charge spread blocking layer formed between the plurality of gate electrodes and the plurality of interlayer dielectric layers.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes a plurality of cell array layers, each cell array layer including: a plurality of semiconductor layers that extends in a first direction; gate insulating layers; a plurality of floating gates arranged in the first direction; inter-gate insulating layers; and a plurality of control gates that extends in a second direction intersecting semiconductor layers, and faces the floating gates via the inter-gate insulating layers, in which, in the cell array layers adjacent each other in a stacking direction, the control gates of a lower cell array layer and the control gates of the an upper cell array layer are intersecting each other, and the floating gates within the lower cell array layer and the semiconductor layers within the upper cell array layer are aligned in position with each other.

Abstract: A method of charging a floating gate in a nonvolatile memory cell comprises bringing a substrate channel within the memory cell to a first voltage, bringing a control gate to a programming voltage, and floating the substrate channel voltage while the control gate is at the programming voltage. Memory devices include state machines or controllers operable to perform the described method, and operation of such a state machine, memory device, and information handling system are described.

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for healing non-volatile memory cells. One method includes biasing a first select gate transistor coupled to a string of memory cells at a first voltage, biasing a second select gate transistor coupled to the string at a second voltage, applying a first healing voltage to a first edge word line in order to extract charge accumulated between the first select gate transistor and a first edge memory cell stack of the string, and applying a second healing voltage to a second edge word line in order to extract charge accumulated between the second select gate transistor and a second edge memory cell stack of the string.

Abstract: The present invention discloses a flash memory and the fabrication method and the operation method for the same. The flash memory comprises two memory cells of vertical channels, wherein a lightly-doped N type (or P type) silicon is used as a substrate; a P+ region (or an N+ region) is provided on each of the both ends of the silicon surface, and two channel regions perpendicular to the surface are provided therebetween; an N+ region (or a P+ region) shared by two channels is provided over the channels; a tunneling oxide layer, a polysilicon floating gate, a block oxide layer and a polysilicon control gate are provided sequentially on the outer sides of each channel from inside to outside; and the polysilicon floating gate and the polysilicon control gate are isolated from the P+ region by a sidewall oxide layer. The whole device is a two-bit TFET type flash memory with vertical channels which has better compatibility with prior-art standard CMOS process.

Abstract: A semiconductor memory includes a plurality of nonvolatile memory cells arranged in a matrix and coupled to control gate lines, selection gate lines, bit lines, and source lines, and includes a source line control unit. The source line control unit, at a time of program operation, sets one of the source lines coupled to a row of the memory cells including a program memory cell to a high level voltage, and sets at least one of the remaining source lines coupled to a row of a non-program memory cells to be higher than a low level voltage of the selection gate lines and to be lower than the high level voltage of an unselection bit line. Thereby, a leak current lowering a voltage of the source lines at the time of program operation can be blocked off, and a program operation time may be shortened.

Abstract: Memory cells may have channel-supporting material, dielectric material over the channel-supporting material, carrier-trapping material over the dielectric material and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. A memory cell may be provided which has a channel-supporting material, a dielectric material over the channel-supporting material, a carrier-trapping material over the dielectric material, and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. It may be determined if carriers are trapped in the carrier-trapping material to thereby ascertain a memory state of the memory cell.

Abstract: Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region.

Abstract: A non-volatile memory cell and methods for programming, erasing and reading thereof are provided. A non-volatile memory cell includes a well region having a first conductive type. A first transistor and a second transistor having a second conductive type are disposed on the well region, wherein a first gate of the first transistor is coupled to a second gate of the second transistor. The first transistor and the second transistor share a drain region, coupling to a bit line. A first source region of the first transistor and a second region of the second transistor are coupled to a first select line and a second line, respectively. A bit is stored in the first and second gates by controlling the first select line and the second line. A bit stored in the first and second gates is erased by controlling the first select line or the second line.

Abstract: A non-volatile memory cell and methods for programming, erasing and reading thereof are provided. A non-volatile memory cell includes a substrate having a first conductive type. A first transistor, a second transistor and a select transistor having a second conductive type are disposed in the substrate, wherein a first gate of the first transistor is coupled to a second gate of the second transistor. A source region of the first transistor is coupled to a bit line. A drain region of the second transistor and a gate of the select transistor are coupled to a select gate line. A drain region of the first transistor is coupled to a source region of the select transistor. A drain region of the select transistor is coupled to a select line.

Abstract: A flash memory device includes a memory cell array including a plurality of memory cells; a bit line voltage control signal generator generating and outputting a bit line voltage control signal; and a page buffer unit connected to the memory cell array through a plurality of bit lines, and controlling voltage levels of the plurality of bit lines in response to the bit line voltage control signal output from the bit line voltage control signal generator, wherein the plurality of bit lines comprise a first bit line and a second bit line adjacent to the first bit line, wherein during a bit line pre-charging operation in which the first bit line is in a program inhibited state and the second bit line is in a programming state, the page buffer unit increases a voltage level of the first bit line in response to the bit line voltage control signal, wherein the increase in the voltage level of the first bit line causes a voltage level of the second bit line to increase, and wherein a voltage level of the bit line vol

Abstract: An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line. A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration of an erase operation, or at a predetermined or adaptively determined erase-verify iteration, such as based on a number of program-erase cycles.

Abstract: In some embodiments, write wordline boost may be obtained from wordline driver boost and/or from bit line access transistor boost.

Abstract: The semiconductor device includes a source line, a bit line, a signal line, a word line, memory cells connected in parallel between the source line and the bit line, a first driver circuit electrically connected to the source line and the bit line through switching elements, a second driver circuit electrically connected to the source line through a switching element, a third driver circuit electrically connected to the signal line, and a fourth driver circuit electrically connected to the word line. The memory cell includes a first transistor including a first gate electrode, a first source electrode, and a first drain electrode, a second transistor including a second gate electrode, a second source electrode, and a second drain electrode, and a capacitor. The second transistor includes an oxide semiconductor material.

Abstract: The invention provides methods for programming a floating gate. A floating gate tunneling device is used with an analog comparing device in a circuit having a floating reference node and an offset-mitigating feedback loop for iteratively programming a floating gate, or multiple floating gates.

Abstract: A method of controlling a vertical dual-gate DRAM provides a short circuit state, a clearing state and a false broken circuit state. In the short circuit state, a first gate and a second gate at two sides of a first pillar are controlled to respectively have a turn-on voltage to form electric connection between a drain and a source at two ends of the first pillar. In the clearing state, the first gate and second gate are controlled to respectively have a clearing voltage to disconnect electric connection between the drain and source at two ends of the first pillar. The false broken circuit state is entered after the clearing state has been finished. The invention does not separate gates between neighboring pillars, but controls ON/OFF of transistors electrically so that no current leakage is generated in the clearing state and problem of inaccurate data reading can be prevented.

Abstract: A 3D stacked AND-type flash memory structure comprises several horizontal planes of memory cells arranged in a three-dimensional array, and each horizontal plane comprising several word lines and several of charge trapping multilayers arranged alternately, and the adjacent word lines spaced apart from each other with each charge trapping multilayer interposed between; a plurality of sets of bit lines and source lines arranged alternately and disposed vertically to the horizontal planes; and a plurality of sets of channels and sets of insulation pillars arranged alternatively, and disposed perpendicularly to the horizontal planes, wherein one set of channels is sandwiched between the adjacent sets of bit lines and source lines.

Abstract: A semiconductor device including a nonvolatile memory cell in which a writing transistor which includes an oxide semiconductor, a reading transistor which includes a semiconductor material different from that of the writing transistor, and a capacitor are included is provided. Data is written to the memory cell by turning on the writing transistor and applying a potential to a node where a source electrode (or a drain electrode) of the writing transistor, one electrode of the capacitor, and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor, so that the predetermined amount of charge is held in the node. Further, when a p-channel transistor is used as the reading transistor, a reading potential is a positive potential.

Abstract: A unit block circuit of a semiconductor device includes a first well, a first pickup unit configured to form a closed loop over the first well, a first transistor including a first gate and a first active region, and formed within the first pickup unit, and a first reservoir capacitor formed in a spare within the first pickup unit and arranged in a major-axis direction of the first gate of the first transistor, wherein the first reservoir capacitor comprises a second active region and a second gate, the second gate being formed over the second active region.

Abstract: A non-volatile DRAM cell includes a pass-gate transistor and a cell capacitor. A read operation of the non-volatile cell begins by positively charging the cell capacitor. A cell capacitor of an associated dummy non-volatile DRAM cell is fully charged. The pass-gate transistor is activated and if the pass-gate transistor is erased it does not turn on and if it is programmed, it turns on. Charge is shared on the complementary pair of pre-charged bit lines connected to the non-volatile DRAM cell and its associated Dummy non-volatile DRAM cell. A sense amplifier detects the difference in the data state stored in the pass-gate transistor. The program and erase of the non-volatile DRAM cell is accomplished Gate-induced drain-lowering (GIDL) assisted band-to-band tunneling and Fowler-Nordheim tunneling respectively. Programming or erasing a selected row of cells does not affect the data states of the cells in the unselected rows.

Abstract: The semiconductor device includes the nonvolatile memory cell in the main surface of a semiconductor substrate. The nonvolatile memory cell has a first insulating film over the semiconductor substrate, a conductive film, a second insulating film, the charge storage film capable of storing therein charges, a third insulating film over the charge storage film, a first gate electrode, a fourth insulating film in contact with the set of stacked films from the first insulating film to the foregoing first gate electrode, a fifth insulating film juxtaposed with the first insulating film over the foregoing semiconductor substrate, a second gate electrode formed over the fifth insulating film to be adjacent to the foregoing first gate electrode over the side surface of the fourth insulating film, and source/drain regions with the first and second gate electrodes interposed therebetween. The conductive film and the charge storage film are formed to two-dimensionally overlap.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: A method, system and apparatus for determining whether any un-programmed cell is affected by charge disturb by comparing the voltage threshold of the un-programmed cells against a reference voltage. If the voltage threshold for the un-programmed cell exceeds the reference voltage, the failed or defective un-programmed cell will be then be programmed. This will change the defective un-programmed cell to a new programmed value. To account for the location of the failing memory cell, address syndrome bits are used to identify the location of the defective memory cell.

Abstract: A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; a inner insulating film provided between the memory layer and the semiconductor pillar; a outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential.

Abstract: A relaxed metal pitch architecture may include a bit line and a first active area string and a second active area string. The bit line may be directly coupled to the first active area string and to the second active area string. The relaxed metal pitch architecture may be applied to a non-volatile memory structure.

Abstract: The memory device includes a memory cell unit of the electrically erasable and programmable non-volatile type including two memory cells respectively connected to two bit lines via two bit line select transistors. The common terminal between the bit line select transistor and the floating-gate transistor of each memory cell of the memory cell unit is connected to the control gate of the floating-gate transistor of the other memory cell of the memory cell unit.

Abstract: At the time of reading, an unselected word line voltage is fixed to a first predetermined voltage (0 V or 3 V), and when selecting a word line, a selected word line voltage is set to a second predetermined voltage (?3.5 V or 0 V). This configuration eliminates an application of a pulsed voltage to the word line at the time of reading, making it possible to reduce an influence of read disturbance. In addition, even when a voltage in a range from a power source voltage to a ground voltage or a voltage over the power source voltage is required at the time of reading, it becomes a voltage about 1.5 times an absolute value of the power source voltage. Therefore, a voltage step-up circuit having a large number of stages is not required, and as a result, it is possible to achieve a reduced operation time with a low power consumption.

Abstract: One embodiment in accordance with the invention can include a semiconductor device that includes: a groove that is formed in a semiconductor substrate; bottom oxide films that are formed on both side faces of the groove; two charge storage layers that are formed on side faces of the bottom oxide films; top oxide films that are formed on side faces of the two charge storage layers; and a silicon oxide layer that is formed on the bottom face of the groove, and has a smaller film thickness than the top oxide films.

Abstract: Techniques for programming a non-volatile memory device, such as a Flash memory, include floating source lines of memory cells based on a data pattern that is being programmed to the memory device. The source lines to float are selected such that a distance between drain bit lines and source bit lines of different memory cells in a row is maximized. In this manner, leakage current between these drain bit lines and source bit lines can be decreased.

Abstract: A non-volatile memory cell and methods for programming, erasing and reading thereof are provided. A non-volatile memory cell includes a substrate having a first conductive type. A first transistor, a second transistor and a select transistor having a second conductive type are disposed in the substrate, wherein a first gate of the first transistor is coupled to a second gate of the second transistor. A source region of the first transistor is coupled to a bit line. A drain region of the second transistor and a gate of the select transistor are coupled to a select gate line. A drain region of the first transistor is coupled to a source region of the select transistor. A drain region of the select transistor is coupled to a select line. A bit is stored in the first and second gates by controlling the bit line and the select gate line. A bit stored in the first and second gates is erased by controlling the bit line and the select gate line.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: A non-volatile memory cell and methods for programming, erasing and reading thereof are provided. A non-volatile memory cell includes a well region having a first conductive type. A first transistor and a second transistor having a second conductive type are disposed on the well region, wherein a first gate of the first transistor is coupled to a second gate of the second transistor. The first transistor and the second transistor share a drain region, coupling to a bit line. A first source region of the first transistor and a second region of the second transistor are coupled to a first select line and a second line, respectively. A bit is stored in the first and second gates by controlling the first select line and the second line. A bit stored in the first and second gates is erased by controlling the first select line or the second line.

Abstract: p-type wells are provided within an n-type embedded well of a semiconductor substrate lying in an area for forming a flash memory, in a state of being isolated from one another. A capacitance section, a data write/erase charge injection/discharge section and a data read MIS•FET are disposed in each of the p-type wells. The capacitance section is disposed between the data write/erase charge injection/discharge section and the data read MIS•FET. In the data write/erase charge injection/discharge section, writing and erasing of data by an FN tunnel current at a channel entire surface are performed.

Abstract: The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.

Abstract: Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

Abstract: In one embodiment, the non-volatile memory device includes a well of a first conductivity type formed in a substrate, and a first plurality of memory cell transistors connected in series to a bit line formed in the well. A buffer is formed in the substrate outside the well and is connected to the bit line. At least one de-coupling transistor is configured to de-couple the buffer from the bit line, and the de-coupling transistor is formed in the well.

Abstract: A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.

Abstract: A semiconductor memory device includes a transfer circuit and a control circuit. The transfer circuit which includes a p-type MOS transistor with a source to which is applied a first voltage and an n-type MOS transistor to whose gate the drain of the p-type MOS transistor is connected and the first voltage is transferred, to whose source a second voltage is applied, and whose drain is connected to a load. The control circuit which turns the p-type MOS transistor on and off and which turns the p-type MOS transistor on to make the p-type MOS transistor transfer the second voltage to the load and, during the transfer, turns the p-type MOS transistor off to make the gate of the n-type MOS transistor float at the first voltage.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: A multiple time programmable (MTP) memory cell, in accordance with an embodiment, includes a floating gate PMOS transistor, a high voltage NMOS transistor, and an n-well capacitor. The floating gate PMOS transistor includes a source that forms a first terminal of the memory cell, a drain and a gate. The high voltage NMOS transistor includes a source connected to ground, an extended drain connected to the drain of the PMOS transistor, and a gate forming a second terminal of the memory cell. The n-well capacitor includes a first terminal connected to the gate of the PMOS transistor, and a second terminal forming a third terminal of the memory cell. The floating gate PMOS transistor can store a logic state. Combinations of voltages can be applied to the first, second and third terminals of the memory cell to program, inhibit program, read and erase the logic state.

Abstract: Provided is a method of operating a nonvolatile memory device to perform a programming operation or an erase operation. The method includes applying a composite pulse including a direct current (DC) pulse and an AC perturbation pulse to the nonvolatile memory device to perform the programming operation or the erase operation.

Abstract: Provided is a semiconductor memory device including: multiple bit lines arranged in parallel to one another; multiple sense-amplifier bit lines arranged away from end portions of the bit lines; a fourth sense-amplifier bit line formed with a wire of a first layer arranged below the bit lines; selection transistors with a pair of gate electrodes arranged in a direction normal to the first to sixth bit lines; a first wire arranged below the bit lines and the sense-amplifier bit lines, and having an end portion extending to below the third bit line and connected to the bit line; a third wire formed with a layer of the gate electrode used as a wire, the third wire including a first end portion positioned below the fourth sense-amplifier bit line and connected to the fourth sense-amplifier bit line, and a second end portion positioned below the second sense-amplifier bit line; and a fourth wire formed with a wire of the first layer and arranged between the third wire and the second sense-amplifier bit line to conn

Abstract: There is provided a non-volatile memory which enables high accuracy threshold control in a writing operation. In the present invention, a drain voltage and a drain current of a memory transistor are controlled to carry out a writing operation of a hot electron injection system, which is wherein a charge injection speed does not depend on a threshold voltage. FIGS. 1A and 1B are views of a circuit structure for controlling the writing. In FIGS. 1A and 1B, an output of an operational amplifier 103 is connected to a control gate of a memory transistor 101, a constant current source 102 is connected to a drain electrode, and a source electrode is grounded. The constant current source 102 and a voltage Vpgm are respectively connected to two input terminals of the operational amplifier 103.

Abstract: Integrated circuit flash memory devices, such as NAND flash memory devices, include an array of regular flash memory cells, an array of dummy flash memory cells and an erase controller. The erase controller is configured to concurrently apply a different predetermined bias voltage to the dummy flash memory cells than to the regular flash memory cells during an erase operation of the integrated circuit flash memory device. Related methods are also described.