Abstract: A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of an operational amplifier.

Abstract: A signal processing circuit using a nonvolatile memory circuit with a novel structure is provided. The nonvolatile memory circuit is formed using a transistor including an oxide semiconductor and a capacitor connected to one of a source electrode and a drain electrode of the transistor. A high-level potential is written to the memory circuit in advance, and this state is kept in the case where data to be saved has a high-level potential, whereas a low-level potential is written to the memory circuit in the case where data to be saved has a low-level potential. Thus, a signal processing circuit with improved writing speed can be provided.

Abstract: Techniques and circuitry are disclosed for implementing non-volatile storage that exploit bias temperature instability (BTI) effects of high-k/metal-gate n-type or p-type metal oxide semiconductor (NMOS or PMOS) transistors. A programmed bitcell of, for example, a memory or programmable logic circuit exhibits a threshold voltage shift resulting from an applied programming bias used to program bitcells. In some cases, applying a first programming bias causes the device to have a first state, and applying a second programming bias causes the device to have a second state that is different than the first state. Programmed bitcells can be erased by applying an opposite polarity stress, and re-programmed through multiple cycles. The bitcell configuration can be used in conjunction with column/row select circuitry and/or readout circuitry, in accordance with some embodiments.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: Some embodiments include methods of reading memory cells. The memory cells have a write operation that occurs only if a voltage of sufficient absolute value is applied for a sufficient duration of time; and the reading is conducted with a pulse that is of too short of a time duration to be sufficient for the write operation. In some embodiments, the pulse utilized for the reading may have an absolute value of voltage that is greater than or equal to the voltage utilized for the write operation. In some embodiments, the memory cells may comprise non-ohmic devices; such as memristors and diodes.

Abstract: A data retention period of a memory circuit is lengthened, power consumption is reduced, and a circuit area is reduced. Further, the number of times written data can be read to one data writing operation is increased. A memory circuit has a first field-effect transistor, a second field-effect transistor, and a third field-effect transistor. A data signal is input to one of a source and a drain of the first field-effect transistor. A gate of the second field-effect transistor is electrically connected to the other of the source and the drain of the first field-effect transistor. One of a source and a drain of the third field-effect transistor is electrically connected to a source or a drain of the second field-effect transistor.

Abstract: A memory system is provided, which includes a nonvolatile memory module including a plurality of nonvolatile memory devices, and a memory module controller configured to control the nonvolatile memory module. At least two nonvolatile memory devices of the plurality of nonvolatile memory devices are configured to store serial presence detect (SPD) information. The memory module controller is configured to read the SPD information from the nonvolatile memory module and to set a communication mode with the nonvolatile memory module based on the read SPD information.

Abstract: A memory device can include a plurality of memory elements programmable between different impedance states; and circuits configured to apply first electrical conditions to one group of memory elements and second electrical conditions, different from the first electrical conditions, to another group of memory elements to vary a speed of an access operation to the different groups of memory elements.

Abstract: A method and apparatus for continued operation of a memory module, including a first and second memory device, when one of memory devices has failed. The method includes receiving a write operation request to write a data word, having first and second sections, by a first memory module. The memory module may have a first memory device and a second memory device, for respectively storing the first and second sections of the data word. A determination if one of the first and second memory devices is inoperable is made. If one of the first and second memory devices is inoperable, a write operation is performed by writing the first and second sections of the data word to the operable one of the first and second memory devices.

Abstract: Methods, and circuits, are disclosed for operating a programmable memory device. One method embodiment includes storing a value as a state in a first memory cell and as a complementary state in a second memory cell. Such a method further includes determining the state of the first memory cell using a first self-biased sensing circuit and the complementary state of the second memory cell using a second self-biased sensing circuit, and comparing in a differential manner an indication of the state of the first memory cell to a reference indication of the complementary state of the second memory cell to determine the value.

Abstract: A non-volatile memory device is disclosed, which performs a sensing operation using a current. The non-volatile memory device includes a cell array including one or more unit cells, configured to read or write data, a current-voltage converter configured to convert a sensing current corresponding to data stored in the unit cell into a sensing voltage, and perform a precharge operation of the sensing voltage upon receiving the sensing current in response to a current driving signal at an activation time point of a word line of the cell array, and a sense-amp configured to compare the sensing voltage with a predetermined reference voltage, and amplify the compared result.

Abstract: A memory device, system and method for allowing an early read operation after one or more write operations is provided according to an embodiment of the present invention. The memory device comprises an interface for providing a first write address, a first write data, and a read address. A memory core is coupled to the interface and includes a first memory section having a first data path and a first address path and a second memory section having a second data path and a second address path. In an embodiment of the present invention, the first data and first address path is independent of the second data and second address path. The first write data is provided on the first data path responsive to the first write address being provided on the first address path while a read data is provided on the second data path responsive to the read address being provided on the second address path.

Abstract: A semiconductor storage apparatus provides a large capacity phase-change memory possessing high speed operation, low electrical current, and high-reliability. During the period that a read-out start signal is activated in the memory region control circuit and the block of pairs of sense-latch and write driver is performing the verify read in the upper section memory region; the write enable signals in the memory region control circuit are activated and the block of pairs of sense-latch and write driver perform rewrite operation of the data in the lower section memory region. This type of operation allows cancelling out the time required for the verify read and the time required for the time-division write operation by performing the verify read in one memory region, while performing time-division rewrite in other memory region, to achieve both higher reliability rewrite operation along with suppressing the rewrite operation peak electrical current.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell consisting essentially of one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. The device includes data sense circuitry coupled to the memory cell. The data sense circuitry comprises a word line coupled to the gate region and a bit output coupled to the source region or the drain region.

Abstract: In one embodiment, a method includes, in response to assertion of a write-enable signal at a memory array that comprises a plurality of words, sequentially and at a first clock frequency writing data to the memory array starting at a beginning of the memory array until the memory array is full. The method includes, independent of the writing of data to the memory array, asynchronously and at a second clock frequency that is slower than the first clock frequency reading data from the memory array based on read addresses received at the memory array.

Abstract: Nonvolatile memory apparatuses and methods of operating the same. A nonvolatile memory apparatus includes a nonvolatile memory cell array including a plurality of memory cells; an address decoder configured to receive computation data that indicates a computation from among a plurality of computations and an input data for computation, and the address decoder configured to output an address of the nonvolatile memory cell array corresponding to the indicated computation and input data, the nonvolatile memory cell array being configured to output result data stored at the output address, the result data corresponding to a previous computation performed before receipt of the computation data; and a reading unit configured to read the result data output from the nonvolatile memory cell array.

Abstract: A semiconductor memory device includes, in part, a first data I/O block and a second data I/O block. During a write operation, the first data I/O block transmits input data supplied through a first pad to a first global I/O line, and further generates a write internal signal. The second data I/O block transmits the write internal signal to a second pad in response to a monitor enable signal. During a read operation, the first data I/O block supplies data from the first global I/O line to a first pad, and further generates a read internal signal. The second data I/O block transmits the read internal signal to the second pad in response to a monitor enable signal.

Abstract: A static random-access memory (SRAM) cell which includes: a sampling switch and a feedback switch; and a first inverter and a second inverter connected in series whereby an output of the first inverter is connected to an input of the second inverter. An input of the first inverter is connected to a data input of the SRAM cell via the sampling switch, and to a data output of the SRAM cell independent of the feedback switch, an output of the second inverter is connected to the input of the first inverter via the feedback switch, and first and second clock inputs of the SRAM cell are configured to control the sampling switch and the feedback switch, respectively.

Abstract: A nonvolatile memory device comprises a nonvolatile cell array comprising a memory cell and a reference cell, a clamping circuit electrically connected to the memory cell and configured to clamp a voltage applied to a data sensing line during a read operation, and a clamping voltage generation unit configured to generate a clamping voltage responsive to a first voltage having a level based on the reference cell, and to feed back the clamping voltage to the clamping circuit.

Abstract: A memory module that includes a buffer and a plurality of synchronous memory devices. The memory module also includes bidirectional bus lines, and each of the synchronous memory devices has bidirectional data terminals. The buffer is configured to regenerate signals received on the bus lines for receipt by the synchronous memory devices, and to regenerate signals received from any one of the synchronous memory devices for receipt by the bus lines. The memory module may further include command lines and a clock line for providing commands and a clock signal to the synchronous memory devices via a command buffer. The combined data bus width of the memory module may be greater than the data bus width of any single one of synchronous memory device, and the total address space provided by the memory module may be larger than the data space for any single synchronous memory device.

Abstract: A memory device includes a memory cell array and a data input/output circuit. The memory cell array includes a plurality of memory cells connected to a plurality of bit lines and a plurality of word lines. The data input/output circuit is configured to receive data from external data pins of the memory device, output the received data to the memory cell array through a plurality of input/output lines electrically coupled to the plurality of bit lines, receive data read from the memory cell array through the plurality of input/output lines, and output the read data through the external data pins. For each external data pin, the data input/output circuit is configured to output data received at the external data pin to a corresponding input/output line. The corresponding input/output line is selected in response to bit values of a set of bits included in the received data.

Abstract: A method of reading data from an accessed memory cell of an accessed column of an accessed section of a memory array includes, in the accessed section, electrically coupling a first voltage source of at least three voltage sources to a corresponding column internal ground node of the accessed column; and electrically coupling the first voltage source to a corresponding column internal ground node of an un-accessed column. The memory array has at least one segment, the at least one segment has at least one section, and each section has at least one column. Each column has at least three switches and a column internal ground node capable of being electrically coupled to at least three voltage sources through a corresponding one of the at least three switches.

Abstract: To provide a write amplifier that is connected to bit lines, a read amplifier that is connected to the bit lines via a first switch, and a relief memory element that includes a write port that is connected to the bit lines via a second switch, and a read port that is connected to the read amplifier via a third switch. When there is a request to access a defective memory cell, during a write operation, the second switch is turned on and write data is supplied from the write amplifier to the relief memory element via the bit lines, and during a read operation, the first switch is turned off and the third switch is turned on, and then read data read from the relief memory element is supplied to the read amplifier without being routed via the bit lines.

Abstract: A method of suppressing propagation of leakage current in an array of switching devices. The method includes providing a dielectric breakdown element integrally and serially connected to a switching element within each of the switching device. A read voltage (for example) is applied to a selected cell. The propagation of leakage current is suppressed by each of the dielectric breakdown element in unselected cells in the array. The read voltage is sufficient to cause breakdown in the selected cells but insufficient to cause breakdown in the serially connected, unselected cells in a specific embodiment. Methods to fabricate of such devices and to program, to erase and to read the device are provided.

Abstract: An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.

Abstract: In an embodiment, an integrated circuit includes a memory and a control circuit configured to cause an inversion of at least a portion of the data stored in the memory to more evenly balance the amount of time that a given memory cell in the memory stores a binary one or a binary zero. In some implementations, the inversion may be controlled for the memory as a whole via a global indication. In other implementations, data may be inverted on a row-by-row or column-by-column basis. In other embodiments, the global indication may be changed at each boot of a device including the integrated circuit.

Abstract: A semiconductor memory device includes a memory block configured to store a data inputted/outputted through a data transfer line, a data output block configured to output the data loaded on the data transfer line in response to a source clock, wherein the data output block is controlled to be coupled with the data transfer line in response to a write operation signal, a write operation signal generation block configured to generate the write operation signal in response to an operation selection signal and a reference clock lagging behind the source clock by a set time, and a data input block configured to load the data on the data transfer line in response to the write operation signal.

Abstract: A memory system that includes a memory device and a memory bank. During operation, the memory device receives a request to concurrently access a data word at a first row in a first storage region of the memory bank and error information associated with the data at a second row in a second storage region of the memory bank. The memory request includes a first row address identifying the first row and a second row address identifying the second row. Next, the memory device routes the first row address and the second row address to a first row decoder and a second row decoder in the memory bank, respectively. Finally, the memory device uses the first row decoder to decode the first row address to access the first row and concurrently uses the second row decoder to decode the second row address to access the second row.

Abstract: An input-output line sense amplifier configured to drive input data signals over an input-output signal line to an output driver circuit, the input-output line sense amplifier having an output driver stage having a plurality of different programmable output drive capacities to tailor the output drive of the sense amplifier.

Abstract: In a storage device including a plurality of storage regions, in order to synchronize input/output control of data into/from the storage region, a writing sequence or a reading sequence of the data into or from the storage region is stored, one of the storage regions to be accessed is selected in accordance with the stored sequence, and the synchronization control of input/output processing into/from an intermediate buffer is carried out, which allows an intermediate buffer control mechanism to be applied to various intermediate buffers.

Abstract: An entry including multiple bits of unit cells each storing data bit is coupled to a match line. The match line is supplied with a charging current having a restricted current value smaller than a match line current flowing in a one-bit miss state in one entry, but larger than a match line current flowing in an all-bit match state in one entry. A precharge voltage level of a match line is restricted to a voltage level of half a power supply voltage or smaller. Power consumption in a search cycle of a content addressable memory can be reduced, and a search operation speed can be increased.

Abstract: A data output circuit of a semiconductor memory apparatus includes: a data control driver configured to drive rising data and falling data to output control rising data and control falling data or drive level data to output the control rising data and the control falling data, in response to an output level test signal; a DLL clock control unit configured to drive a rising clock and a falling clock to output a control rising clock and a control falling clock in response to an enable signal and the output level test signal; and a clock synchronization unit configured to synchronize the control rising data and the control falling data with the control rising clock and the control falling clock to output serial rising data and serial falling data.

Abstract: A memory includes an array of memory cells with each memory cell coupled to an associated pair of bit lines. Read control circuitry is configured to activate a number of addressed memory cells in order to couple each addressed memory cell to its associated pair of bit lines. Sense amplifier circuitry is then coupled to the bit lines to determine the data value stored in each addressed memory. In a speculative read mode of operation, the sense amplifier circuitry evaluates the differential signals. Error detection circuitry is then used to capture the differential signals on the associated pair of bit lines for each addressed memory cell, and to apply an error detection operation to determine if the differential signals as evaluated by the sense amplifier circuitry had not developed to the necessary degree and, in that event, an error signal is asserted.

Abstract: An embodiment may include local row and column circuitry that are local to a memory cell of a memory device. Either the local row circuitry or the local column circuitry may be electrically isolated, at least in part, from at least one remaining portion of the memory device during the establishing of a voltage differential between the local row circuitry and the local column circuitry that is to permit the memory cell to be read during a read of the memory cell. The read may occur subsequent to the establishing of the voltage differential. Many variations, modifications, and alternatives are possible without departing from this embodiment.

Abstract: A method of controlling a plurality of memory cells in a row. The method includes controlling a switching element using at least one write word line signal to raise a voltage of a node connected to the plurality of memory cells in the row when the plurality of memory cells in the row operate in a first mode. The method further includes controlling at least one transistor using the at least one write word line signal to connect the plurality of memory cells in the row to a reference voltage when the plurality of memory cells in the row operate in a second mode.

Abstract: With a serial interface memory device of this invention, a read-out rate of data is increased, while an increase in a size of a circuit is suppressed. An EEPROM is provided with a memory cell array storing data, a row address decoder and a column address decoder that select an address of the memory cell array in accordance with an address signal serially inputted in synchronization with a clock, sense amplifiers SA0-SA5, SA_M0 and SA_M1 each provided corresponding to each bit of the data, and a shift register that outputs the data read out from the sense amplifiers serially from a first bit. The column address decoder commences reading out two candidate data for the first bit by inputting each of the two candidate data to each of the two sense amplifiers SA_M0 and SA_M1, respectively, before all bits of the column address signal are established.

Abstract: There is provided a storage control device including a read processing unit that reads data and inversion state information indicating whether the data is in an inverted state or a non-inverted state from a specific region of a memory cell array that stores the data and the inversion state information with first intensity in association, and a write processing unit that writes data obtained by inverting the data and a state obtained by changing a state indicated by the inversion state information to an opposite state in the specific region with second intensity that is different from the first intensity.

Abstract: A reading method of a memory is provided. The memory has a turn on window. The reading method comprises the following steps. A reading voltage is provided. The reading voltage is shown if the reading voltage is located in the turn on window. The reading voltage is updated by moving a predetermined distance if the reading voltage is not located in the turn on window. The predetermined distance is cut by half before the step of updating the reading voltage is performed again.

Abstract: Methods, apparatuses, and systems for comparing threshold voltages of a plurality of flash memory cells to a plurality of reference voltages. A number of flash memory cells having threshold voltages that fall within each bin of a plurality of bins is determined. The plurality of bins each represent a plurality of threshold voltage ranges. A threshold voltage distribution of the plurality of flash memory cells is calculated based at least in part on the number of flash memory cells that fall into each of the bins.

Abstract: A synchronous type semiconductor storage device includes an array unit which includes a cell array and sense amplifiers. The synchronous type semiconductor storage device includes a read/write pulse generator which generates a read pulse signal and a write pulse signal according to a clock signal, the clock signal defining one cycle time of a read operation and a write operation with respect to the array unit as one cycle. The synchronous type semiconductor storage device includes a secondary amplifier which is activated according to the read pulse signal to read out data stored in the sense amplifiers through the read/write line. The synchronous type semiconductor storage device includes a write driver which is activated according to the write pulse signal to write data in the sense amplifiers through the read/write line.

Abstract: A semiconductor memory device includes a read circuit configured to sequentially output a plurality of compressed data corresponding to all banks which are to be tested in response to a plurality of bank addresses and a read enable signal during a test mode and a pad configured to transfer the compressed data which are sequentially outputted from the read circuit to an outside of the semiconductor memory device.

Abstract: A semiconductor memory apparatus includes a resistive memory cell coupled between a bit line and a bit line bar; a control unit configured to couple the bit line to a first node and apply a reference voltage to a second node in response to a first sense amplifier enable signal and a second sense amplifier enable signal; a data output sense amplifier configured to sense and amplify a voltage of the first node and a voltage of the second node; a data transfer unit configured to couple the first and second nodes to a data line and a data line bar in response to a column select signal; and a data input unit configured to drive the bit line and the bit line bar according to voltage levels of the first and second nodes in response to a write enable signal.

Abstract: A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that are vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.

Abstract: Providing for resistive random access memory (RRAM) having high read speeds is described herein. By way of example, a RRAM memory can be powered at one terminal by a bitline, and connected at another terminal to a gate of a transistor having a low gate capacitance (relative to a capacitance of the bitline). With this arrangement, a signal applied at the bitline can quickly switch the transistor gate, in response to the RRAM memory being in a conductive state. A sensing circuit configured to measure the transistor can detect a change in current, voltage, etc., of the transistor and determine a state of the RRAM memory from the measurement. Moreover, this measurement can occur very quickly due to the low capacitance of the transistor gate, greatly improving the read speed of RRAM.

Abstract: A three-device non-volatile memory cell includes a first resistive device, a second resistive device connected to the first resistive device in a mutual complementary manner, and a third resistive device connected to both said first resistive device and said second resistive device in a mutual complementary manner. A memory array includes a set of read lines intersecting a set of bit lines, a set of program lines intersecting said bit lines, memory cells disposed at intersections between the intersecting set of bit lines. Each of the memory cells includes a program resistive device connected to one of the program lines, a read resistive device connected to one of the read lines, and a bit resistive device connected to one of the bit lines and connected to the program device and the read device in a mutual complementary manner.

Abstract: A method for calibration of a memory controller may include determining if an unused memory location exists in memory. The method may include writing a first pattern to the unused memory location in response to a determination that the unused memory location exists. The method may include determining if a second pattern exists in the memory in response to a determination that the unused memory location does not exist. The method may include iteratively modifying a first delay of a first delay control module among a plurality of delay values. The method may include reading from a memory location including the first pattern or the second pattern for each iteration of modification of the first delay. The method may include modifying one or more second delays, each second delay associated with one of one or more second delay control modules, based on the results of reading from the memory location.

Abstract: An object of the present invention is to provide a semiconductor device combining transistors integrating on a same substrate transistors including an oxide semiconductor in their channel formation region and transistors including non-oxide semiconductor in their channel formation region. An application of the present invention is to realize substantially non-volatile semiconductor memories which do not require specific erasing operation and do not suffer from damages due to repeated writing operation. Furthermore, the semiconductor device is well adapted to store multivalued data. Manufacturing methods, application circuits and driving/reading methods are explained in details in the description.

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for memory cell sensing using negative voltage. One method includes applying a negative read voltage to a selected access line of an array of memory cells, applying a pass voltage to a number of unselected access lines of the array, and sensing whether a cell coupled to the selected access line is in a conductive state in response to the applied negative read voltage.

Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.