Abstract: A semiconductor device includes a plurality of memory mats, each of which includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells that are arranged at intersections of the word lines and the bit lines, and a plurality of dummy word lines, each of which is sandwiched between two corresponding ones of the word lines; a main dummy word line to which the dummy word lines included in the memory mats are commonly electrically connected; and a dummy-word-line control circuit that detects an electric potential of the main dummy word line when a test signal is activated, and outputs an error signal when the electric potential exceeds a predetermined threshold value. According to the present invention, because an electric potential of each of the dummy word lines is directly detected, an address of the word line, which has a short circuit with the dummy word line, can be reliably detected in a short time.

Abstract: This technique may include a semiconductor apparatus configured to perform data read/write operations in a test mode or a normal mode and a tester configured to simultaneously perform a data test and a leakage current test through a write operation using data read by a read operation in the normal mode after writing data into the semiconductor apparatus in the test mode.

Abstract: A memory may include a plurality of word lines to which one or more memory cells are connected, and a control unit suitable for activating and precharging a first word line that is selected based on an address of a high-activated word line during a target refresh operation while sequentially activating and precharging the plurality of word lines in a refresh operation, wherein the control unit is suitable for writing a test data to one or more first memory cells connected to the first word line during the target refresh operation in a test mode, wherein the high-activated word line is a word line activated over a reference number or a reference frequency, among the plurality of word lines.

Abstract: A semiconductor apparatus includes an input buffer configured to buffer and output data inputted from a data input/output pad; a data input control unit configured to transfer data outputted from the input buffer; a data output control unit configured to transfer inputted data to an output buffer; the output buffer configured to buffer data outputted from the data output control unit, and output the buffered data to the data input/output pad; a test data input/output unit configured to latch test inputted data inputted and output test latch data or latch an output of the input buffer and output the test latch data; and a test loop control unit configured to transfer data or the test latch data to the data output control unit.

Abstract: A system for grading blocks may be used to improve memory usage. Blocks of memory, such as on a flash card, may be graded on a sliding scale that may identify a level of “goodness” or a level of “badness” for each block rather than a binary good or bad identification. This grading system may utilize at least three tiers of grades which may improve efficiency by better utilizing each block based on the individual grades for each block. The block leveling grading system may be used for optimizing the competing needs of minimizing yield loss while minimizing testing defect escapes.

Abstract: A method for repairing a memory includes running a built-in self-test of the memory to find faulty bits. A first repair result using a redundant row block is calculated. A second repair result using a redundant column block is calculated. The first repair result and the second repair result are compared. A repair method using either the redundant row block or the redundant column block is selected. The memory is repaired by replacing a row block having at least one faulty bit with the redundant row block or replacing a column block having at least one faulty bit with the redundant column block.

Abstract: An apparatus and method for testing driver write-ability strength on an integrated circuit includes one or more drive detection units each including a number of drivers. At least some of the drivers may have a different drive strength and each may drive a voltage onto a respective driver output line. Each drive detection unit may include a number of keeper circuits, each coupled to a separate output line and configured to retain a given voltage on the output line to which it is coupled. Each detection unit may also include a number of detection circuits coupled to detect the drive voltage on each of the output lines. In one implementation, the drive voltage appearing at the output line of each driver may be indicative of that the driver was able to overdrive the voltage being retained on the output line to which it is coupled by the respective keeper circuits.

Abstract: A non-volatile memory system is disclosed that evaluates during a read before write operation whether to skip programming of portions of group of memory cells during a subsequent write operation. By evaluating skip information during a read before write operation, the write operation can be expedited. The additional overhead for evaluating skip information is consumed during the read before write operation. By performing a skip evaluation during the read before write operation, a full analysis of the availability of skipping programming for memory cells can be performed. Skip evaluations in different embodiments may be performed for entire bay address cycles, column address cycles, and/or sense amplifier address cycles. In some embodiments, some skip evaluations are performed during read before write operations while others are deferred to the write operation. In this manner, the number of data latches for storing skip information can be decreased.

Abstract: A memory device includes a first bank, a second bank, a plurality of interface pads, and a data output unit configured to output compressed data of the first bank through at least one interface pad among the plurality of interface pads and subsequently output compressed data of the second bank through the one interface pad.

Abstract: A storage medium including a plurality of memory cells, a plurality of transmission lines, a driving module and a floating detection module is disclosed. The memory cells store data. The transmission lines are coupled to the memory cells. The driving module accesses the memory cells via the transmission lines. The floating detection module includes a reset unit, a plurality of connectors and a detector. The reset unit is coupled to a detection line. Each of the connectors is coupled between one of the transmission lines and the detection line. The detector determines whether a state of at least one of the transmission lines is a floating state according to a level of the detection line.

Abstract: A memory controller is disclosed. The memory controller is configured to be connected to one or more memory devices via an address and control (RQ) bus. Each of the memory devices have on-die termination (ODT) circuitry connected to a subset of signal lines of the RQ bus, and the memory controller is operable to selectively disable the ODT circuitry in at least one memory device of the one or more memory devices.

Abstract: A method for programming a non-volatile memory including a plurality of blocks, each block including a plurality of sections, each section including at least one page, and each page including a plurality of memory cells. The method includes checking a current section of the plurality of sections against a damaged section table to determine whether the current section is damaged. The damaged section table records information about whether a section in the memory is good or damaged. The method further includes using the current section for programming if the current section is not damaged.

Abstract: A canary circuit with passgate transistor variation is described herein. The canary circuit includes a memory canary circuit that has a plurality of bitcells. Each bitcell has at least a passgate transistor that is driven by a wordline voltage. The canary circuit further includes a regulator circuit that outputs a wordline voltage that accounts for a predetermined offset of a threshold voltage of the passgate transistor. In an embodiment, the regulator circuit is a subtractor circuit that generates the wordline voltage from a reference voltage based in part on the threshold voltage variation of the passgate transistor.

Abstract: Methods, apparatuses, and integrated circuits for measuring leakage current are disclosed. In one such example method, a word line is charged to a first voltage, and a measurement node is charged to a second voltage, the second voltage being less than the first voltage. The measurement node is proportionally coupled to the word line. A voltage on the measurement node is compared with a reference voltage. A signal is generated, the signal being indicative of the comparison. Whether a leakage current of the word line is acceptable or not can be determined based on the signal.

Abstract: To decrease the burden of digital processing, provided is an AD conversion apparatus comprising a pattern generating section that, for each target bit specified one bit at a time moving downward in the output data, generates a pattern signal having a pulse width or number of pulses corresponding to a weighting of the target bit; an integrating section that integrates the pattern signals according to a judgment value for judging a value of the target bit each time a pattern signal is generated, and outputs a reference signal obtained by accumulating the integrated value of each pattern signal; a comparing section that, each time generation of a pattern signal is finished, compares the input signal to the reference signal; and an output section that outputs the output data to have values corresponding to the comparison results obtained after each generation of a pattern signal corresponding to a bit is finished.

Abstract: A system for managing redundancy in a memory device includes memory arrays and associated periphery logic circuits, and redundant memory arrays and associated redundant periphery logic circuits. The memory arrays and a first set of logic circuits associated with the periphery logic circuits corresponding to the memory arrays are connected to the power supply by way of memory I/O switches. The redundant memory arrays and associated redundant periphery logic circuits are connected to the power supply by way of redundant I/O switches. The memory and redundant I/O switches are switched on/off based on an acknowledgement signal generated during a built-in-self-test (BIST) operation of the memory device.

Abstract: A driver for a semiconductor memory includes: a selection controller configured to output a target charge current select signal and a bucket charge current select signal in response to an inputted memory cell address and a target charge current value and a bucket charge current value, which are to be applied to a memory cell of the memory cell address; a current supply unit configured to supply a target charge current to the memory cell of the memory cell address in response to the target charge current select signal; and a bucket charge current supply unit configured to supply a bucket charge current to the memory cell of the memory cell address, in order to pre-charge the memory cell of the memory cell address in response to the bucket charge current select signal.

Abstract: An apparatus according to an embodiment comprises a first storage, a second storage, an input unit, a shift number determining unit, and an output unit. The first storage stores identification information of sectors and defective information indicating a presence of defect on the data line, while associating the identification information and the defective information. The second storage has storage regions in a number larger than the first number. The input unit inputs data to the second storage by the first number at a time. The shift number determining unit determines a shift number. The output unit outputs the data stored in the storage regions which is after a head storage region by the shift number, as the data is to be supplied to the data line having no defect sector based upon the defective information, and outputs information that differs from the data to the defective data line.

Abstract: A semiconductor memory device includes a data transmission unit configured to transmit first input data to only a first global line driver or to the first global line driver and a second global line driver in response to a test signal, and a transmission element configured to transmit second input data only to the second global line driver in response to the test signal.

Abstract: A memory device includes a memory array, a plurality of input/output pins, a mask signal generator, an input/output block. The memory array is configured to output read data including a plurality of data bits. The mask signal generator is configured to generate at least one data mask signal. The input/output block is configured to mask bits having a logic level among the plurality of data bits in the read data to output the masked read data to the plurality of input/output pins.

Abstract: A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: A method of forming a circuitry includes providing a substrate comprising a plurality of die. Each die includes a plurality of resistive random access memory (RRAM) storage cells. The method further includes concurrently initializing substantially all of the RRAM storage cells on the same wafer. Initializing can include applying a voltage potential across the RRAM storage cells.

Abstract: A testing circuit in an integrated circuit indirectly measures a voltage at a node of other circuitry in the integrated circuit. The testing circuit includes a transistor having a control electrode, a first conducting electrode coupled to a first pad, a second conducting electrode coupled to a terminal of a power supply, and one or more switches for selectively coupling the control electrode to one of the node and a second pad. A method includes determining a relationship between drain current and gate voltage of the transistor when the control electrode is coupled to the second pad. A voltage at the node is determined by relating the current through the first conducting electrode of the transistor when control electrode is coupled to the node.

Abstract: Aspects of the invention provide for a structure and method for determining a degree of process variation skew between a plurality of bit cells in a static random-access-memory (SRAM) column architecture. In one embodiment, a structure includes: a plurality of bit cells within a static random access memory (SRAM) column architecture; a digital-to-analog converter (DAC) connected to the bit cells through a pair of multiplexers; and a pre-charge circuit connected to the bit cells through the pair of multiplexers, wherein the DAC and the pre-charge circuit control and test the bit cells to determine a degree of process variation skew between each of the bit cells.

Abstract: A semiconductor memory device includes an internal clock generation unit configured to generate an internal clock including periodic pulses during a period of a test mode; a DQ information signal generation block configured to generate DQ information signals which are sequentially enabled, in response to the internal clock; and a data output block configured to output the DQ information signals to DQ pads during a period of the test mode.

Abstract: Memory self-repair circuitry includes a memory cell array on a chip, and built-in self test (BIST) circuitry on the chip coupled to the memory cell array. The BIST circuitry is configured to perform a magnetic random access memory (MRAM) write operation to write addresses of failed memory cells in the memory cell array to a failed address sector also in the memory cell array. The memory self-repair circuitry also includes first select circuitry coupled between the BIST circuitry and the memory cell array. The first select circuitry is configured to selectively couple an output of the BIST circuitry and an input to the memory cell array.

Abstract: A method to trim a reference voltage source formed on an integrated circuit includes configuring the integrated circuit in a test mode; providing a power supply voltage and a trim code sequence to the integrated circuit where the power supply voltage is provided by a precision reference voltage source; generating a target voltage on the integrated circuit using the power supply voltage; generate a reference voltage using the reference voltage source formed on the integrated circuit; applying one or more trim codes in the trim code sequence to the reference voltage source to adjust the reference voltage; comparing the reference voltage generated based on the trim codes to the target voltage; asserting a latch signal in response to a determination that the reference voltage generated based on a first trim code is equal to the target voltage; and storing the first trim code in response to the latch signal being asserted.

Abstract: A semiconductor device includes a memory region suitable for providing a plurality of read data in parallel at every read operation cycle, an output path suitable for outputting the plurality of read data at a set time in response to an internal clock and one or more internal control signals at the every read operation cycle, and an output path control unit suitable for generating the internal control signal in response to a read command and generating the internal clock in response to a system clock, wherein a shifting time of a first edge of the internal clock is adjusted by a set level at the every read operation cycle during a test mode.

Abstract: A potential of a gate of the transistor of the memory cell is held at a predetermined potential VGM which is between a potential VGL used in normal holding and a threshold of the transistor Vth. When the potential is held for a predetermined period, the memory cell becomes in a similar state in which the memory cell is held at a potential VGL in 10 years. A memory cell, which does not hold data sufficiently at this time, can be judged not to hold data for 10 years in normal use.

Abstract: A low-pin-count non-volatile memory (NVM) embedded an integrated circuit can be accessed without any additional pins. The NVM has one or more memory cells and at least one of the NVM cells can have at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector can be coupled to a second supply voltage line and has a selecting signal. The integrated circuit can include at least one test mode detection circuit to activate a test mode upon detecting an abnormal (or out of normal) operation condition(s). Once a test mode is activated, at least one I/O or supply voltage of the integrated circuit can be used as the I/O or supply voltage of the NVM to select at least one NVM cell for read, program into nonvolatile, or volatile state. At least one NVM cell can be read during ramping of at least one supply voltage line.

Abstract: A memory system includes a memory controller with a plurality N of memory-controller blocks, each of which conveys independent transaction requests over external request ports. The request ports are coupled, via point-to-point connections, to from one to N memory devices, each of which includes N independently addressable memory blocks. All of the external request ports are connected to respective external request ports on the memory device or devices used in a given configuration. The number of request ports per memory device and the data width of each memory device changes with the number of memory devices such that the ratio of the request-access granularity to the data granularity remains constant irrespective of the number of memory devices.

Abstract: Disclosed herein is a device that includes a clock generation circuit that generates an internal clock signal during a normal operation and stops generation of the internal clock signal during a wafer-level burn-in test, a clock tree line that transmits the internal clock signal, and a selector that supplies a dummy clock signal, which is different from the internal clock signal, to the clock tree line during the wafer-level burn-in test.

Abstract: One or more techniques or systems for controlling a voltage divider are provided herein. In some embodiments, a control circuit is configured to bias a pull up unit of a voltage divider using an analog signal, thus enabling the voltage divider to be level tunable. In other words, the control circuit enables the voltage divider to output multiple voltage levels. Additionally, the control circuit is configured to bias the pull up unit based on a bias timing associated with a pull down unit of the voltage divider. For example, the pull up unit is activated after the pull down unit is activated. In this manner, the control circuit provides a timing boost, thus enabling the voltage divider to stabilize more quickly.

Abstract: A method of identifying a damaged bitline address in a non-volatile memory device is introduced. The non-volatile memory device includes a memory cell array and a plurality of bit lines crossing the memory cell array. Each bit line has a first end and a second end. The bit lines are divided into a first group and a second group. The method includes applying a source voltage (charging) or ground voltage (discharging) to a specific group of bit lines, testing the bit lines in two testing stages (open-circuit testing and short-circuit testing) by the principle that no damaged bit line can be charged or discharged, and acquiring an address data of a damaged bit line according to a status data stored in a page buffering circuit and related to whether a bit line is damaged, thereby dispensing with a calculation process for estimating the address of the damaged bit line.

Abstract: In one embodiment described herein, on-die programmable fuses may be used. On-die programmable fuses may be programmed by entities other than the chip manufacturer after the fuse array chip has been manufactured and shipped out. However, other non-volatile memories may also be used.

Abstract: Aspects of the invention provide a bypass structure for a memory device for reducing unknown test values, and a related method. In one embodiment, a bypass structure for a memory device is disclosed. The bypass structure includes: a logic gate configured to receive a test signal and a clock signal; and an output latch configured to receive an output of the logic gate, an output of the memory device, and a bypass data signal, wherein the output latch is configured to hold the bypass data signal and bypass the output of the memory device in response to asserting the test signal, such that unknown data from the output of the memory device is bypassed.

Abstract: A semiconductor memory device includes a write controller configured to transmit a first input data that is supplied through a first pad, to a first global I/O line and a second global I/O line when a write operation is executed in a test mode. The semiconductor memory device further includes a first write driver configured to store the first input data via the first global I/O line in a first cell block when the write operation is executed in the test mode. The semiconductor memory device further includes a first I/O line driver configured to supply signals to the first global I/O line and a first test I/O line in response to a first output data supplied from the first cell block when a read operation is executed in the test mode.

Abstract: A memory bank includes memory cells and an additional cell to determine an operating voltage of the memory bank. The additional cell has an operating margin that is less than a corresponding operating margin of the other memory cells in the memory bank.

Abstract: A semiconductor chip includes a memory array including a plurality of memory cells, a plurality of terminals including a plurality of test terminals to output a result of a specific test, and a circuit that outputs the result to a selected one of the plurality of test terminals based on a chip identification data.

Abstract: A reprogrammable memory, which can be, programmed a limited number of times. A plurality of one-time programmable elements are combined by a logic arrangement such that the output of that logic arrangement may be reprogrammed a limited number of times.

Abstract: A non-volatile memory device includes a first sector including a first sector selection transistor and a first plurality of pages connected to the first sector selection transistor, and a second sector including a second sector selection transistor and a second plurality of pages connected to the second sector selection transistor. Each of the first and second plurality of pages includes a memory transistor and a selection transistor, and a number of pages in the first plurality of pages is greater than a number of pages in the second plurality of pages.

Abstract: A system and methods for programming a set of data onto non-volatile memory elements, maintaining copies of the data pages to be programmed, as well as surrounding data pages, internally or externally to the memory circuit, verifying programming correctness after programming, and upon discovering programming error, recovering the safe copies of the corrupted data to be reprogrammed in alternative non-volatile memory elements. Additionally, a system and methods for programming one or more sets of data across multiple die of a non-volatile memory system, combining data pages across the multiple die by means such as the XOR operation prior to programming the one or more sets of data, employing various methods to determine the correctness of programming, and upon identifying data corruption, recovering safe copies of data pages by means such as XOR operation to reprogram the pages in an alternate location on the non-volatile memory system.

Abstract: A method for testing a memory device includes entering a test mode in which multiple memory banks operate in a same manner, allowing a row corresponding to a row address in the multiple memory banks to be activated, latching a bank address and the row address corresponding to the multiple memory banks, writing same data in a column selected by a column address in the multiple memory banks, reading the data written in the writing of the data from the multiple memory banks, checking whether the data read from the multiple memory banks in the reading of the data are equal to each other, and programming the row address to locations designated by the bank address latched in the latching in a nonvolatile memory when the data read from the multiple memory banks are different from each other.

Abstract: Systems and methods for detecting power attacks related to subnormal read voltage on an integrated circuit. Upon initiating power up of the integrated circuit and prior to reading configuration information from non-volatile memory (NVM), test cells associated with the NVM are read first. The test cells share a common power supply with the NVM and output read values from the test cells are configured to deviate from values pre-programmed in the test cells when a subnormal read voltage is applied on the common power supply. Thus, by comparing the output read values with the pre-programmed values, it can be determined whether voltage of the common power supply is subnormal, wherein configuration information will be read incorrectly at a subnormal read voltage. If the voltage is subnormal, power up is aborted. Otherwise, power up is allowed to proceed by reading the configuration information from the NVM.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to read or write performance of a phase change memory.

Abstract: A method of testing a semiconductor memory device includes writing first data to a memory cell array in the semiconductor memory device, loading second data from the memory cell array onto a plurality of data pads of the semiconductor memory device, rewriting the second data to the memory cell array, and outputting test result data through one or more test pads. The first data is received from an external device through the one or more test pads, which correspond to one or more of the plurality of data pads. The test result data is based on the rewritten data in the memory cell array.

Abstract: Methods for determining a program window and memory devices are disclosed. One such method for determining the program window measures an amount of program disturb experienced by a particular state and determines the program window responsive to the amount of program disturb.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of blocks. The blocks includes a first selection transistor, a second selection transistor, a plurality of memory cell transistors, a first selection gate line and a second selection gate line, and word lines. One of the blocks holds information on a word line, a first selection gate line and/or a second selection gate line including a short-circuiting defect.

Abstract: A memory card and methods for testing memory cards are disclosed herein. The memory card has a test interface that allows testing large numbers of memory cards together. Each memory card may have a serial data I/O contact and a test select contact. The memory cards may only send data via the serial data I/O contact when selected, which may allow many memory cards to be connected to the same serial data line during test. Moreover, existing test socket boards may be used without adding additional external circuitry. Thus, cost effective testing of memory cards is provided. In some embodiments, the test interface allows for a serial built in self test (BIST).