Abstract: An embodiment provides a method, including: determining current validity timing of a non-volatile memory device having changing validity timing via: writing information to a non-volatile memory device; waiting a time after the writing; and reading the information written to the non-volatile memory device following the time. Other aspects are described and claimed.

Abstract: A semiconductor device includes two or more memory chips electrically coupled. Each of the memory chips includes global lines, a MUX unit, a selection unit, and an output unit. The global lines transmit data stored in memory cells. The MUX unit receives the data loaded onto the global lines to output a test data. The selection unit is inserted into two or more of the global lines and configured to output the test data instead of the data loaded onto the two or more global lines, in a test mode. The output unit is coupled to the global lines and is configured to output the data in a normal mode, and output the test data received from any one of the two or more global lines connected to the selection unit to an I/O pad based on information about the memory chip in a test mode.

Abstract: A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.

Abstract: A memory array has a plurality of rows including a plurality of memory words. Each first bit of a plurality of first bits is associated with a memory word of the each row. A state of the each first bit indicates whether the associated memory word has had an error. Each redundancy row of a plurality of redundancy rows includes a plurality of redundancy words. Each redundancy word is associated with a memory word. A corrected data cache has at least one repair word configured to store corrected data and at least one status bit associated with the at least one repair word, the status bit indicating whether the corrected data stored in the repair word is a pending repair. The corrected data cache is configured to write the corrected data stored in the repair word to at least one of a counterpart memory word or a counterpart redundancy word.

Abstract: A semiconductor memory device includes: a burst start signal generation unit configured to generate a first burst start signal by delaying a write pulse by a first period, generate a second burst start signal by delaying the write pulse by a second period, and selectively transmit the first or second burst start signal as a select burst start signal in response to a test signal; an input control signal generation unit configured to generate an input control signal in response to the first burst start signal; and a write command generation unit configured to generate a write driver enable signal in response to the select burst start signal.

Abstract: Data, normally read using a page-by page read process, can be recovered from memory cells connected to a broken word line by performing a sequential read process. To determine whether a word line is broken, both a page-by page read process and a sequential read process are performed. The results of both read processes are compared. If the number of mismatches between the two read processes is greater than a threshold, it is concluded that there is a broken word line.

Abstract: An anti-fuse circuit in which anti-fuse program data may be monitored outside of the anti-fuse circuit and a semiconductor device including the anti-fuse circuit are disclosed. The anti-fuse circuit includes an anti-fuse array, a data storage circuit, and a first selecting circuit. The anti-fuse array includes one or more anti-fuse blocks including a first anti-fuse block having a plurality of anti-fuse cells and the anti-fuse array is configured to store anti-fuse program data. The data storage circuit is configured to receive and store the anti-fuse program data from the anti-fuse array through one or more data buses. The first selecting circuit is configured to output anti-fuse program data of a selected anti-fuse block of the one or more anti-fuse blocks in response to a first selection signal.

Abstract: A method and an apparatus for testing a memory are provided, and the method is adapted for an electronic apparatus to test the memory. In the method, a left edge and a right edge of a first waveform of a clock signal for testing the memory are scanned to obtain a maximum width between two cross points of the left edge and the right edge. A central reference voltage of a data signal outputted by the memory is obtained, and a data width between two cross points of the central reference voltage and a left edge and a right edge of a second waveform of the data signal is obtained. Whether a difference between the data width and the maximum width is greater than a threshold is determined; if the difference is greater than the threshold, the memory is determined to be damaged.

Abstract: A read voltage generation circuit includes a register unit configured to store an initial read voltage code, a counter circuit configured to change a read voltage code in every read-retry operation, wherein an initial value of the read voltage code is the initial read voltage code; and a voltage generation circuit configured to generate a read voltage corresponding to a read voltage code produced by the counter circuit.

Abstract: A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.

Abstract: A memory may comprise a first bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, a second bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, and a control circuit configured to activate, in the case where a word line corresponding to an inputted address among the first to Nth word lines in a bank selected between the first bank and the second bank is replaced with a Kth (1?K?M) redundancy word line among the first to Mth redundancy word lines during an operation in a first mode, at least one adjacent word line adjacent to the Kth redundancy word line of the selected bank.

Abstract: A semiconductor integrated circuit includes a fuse circuit comprising a fuse configured to generate a fuse state signal corresponding to a rupture state of the fuse in response to an enable signal, a fuse state decision unit configured to determine whether or not the fuse state signal is normal based on a test signal, and generate an output enable signal according to a determination result, and a driving unit configured to output the fuse state signal in response to the output enable signal.

Abstract: A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.

Abstract: A semiconductor memory device may be effectively evaluated by a test that compares the phase of an internally generated control signal with the phase of an internally generated clock signal. Specifically, if the phase of the internal data strobe signal IDQS is synchronized with the phase of the internal clock signal ICLK through the test, the data strobe signal DQS may also be synchronized with the external clock signal CLK. Thus, the test may prevent certain critical parameters, for example, AC parameter tDQSCK, from being out of an allowable range over PVT (process, voltage, and temperature variation). The test helps ensure that the semiconductor memory device will operate properly in read mode.

Abstract: A semiconductor apparatus includes a memory chip which includes: a memory area; a data input/output block configured to communicate with the memory area; and a data transmission/reception block configured to connect one of a plurality of channels and a pad to the data input/output block, wherein the plurality of channels are configured to input and output normal data to and from another chip, and the pad is configured to input and output test data.

Abstract: A memory includes first to Nth word lines, first to Mth redundancy word lines configured to replace M number of word lines among the first to Nth word lines, and a control circuit configured to activate at least one adjacent word line adjacent to a Kth redundancy word line (1?K?M) in response to an active signal, in the case where a word line corresponding to an inputted address among the first to Nth word lines is replaced with the Kth redundancy word line among the first to Mth redundancy word lines in a first mode.

Abstract: A data input/output (I/O) device includes a plurality of data units and an I/O assembly. The plurality of data units is coupled to a global I/O (GIO) line through corresponding local I/O (LIO) lines and configured to receive or transmit a plurality of data groups through the corresponding LIO lines. At least one of the plurality of data units have a different operation speed. The I/O assembly performs serial/parallel conversion operations on the plurality of data groups including a high-speed data group and outputs results of the serial/parallel conversion operations. The high-speed data group is output from the at least one of the plurality of data units having the different operation speed.

Abstract: Data input circuits are provided. The data input circuit includes a drive clock signal generator, a data transmitter and a write driver. The drive clock signal generator is configured to shift and delay a final clock signal generated in response to a pulse of a sampled clock signal and configured to generate a drive clock signal in response to the delayed final clock signal. The data transmitter is configured to output input data signals as write input data signals in response to the drive clock signal. The write driver is configured to receive the write input data signals in response to the drive clock signal to drive signals on global lines.

Abstract: A method for limiting writing of data to a specific memory cell without disconnecting a wiring of a memory cell array or placing a prober in contact with a memory cell, a row, or a column is provided. Row address data and column address data of a memory cell to which data cannot be written are stored in a register. Enable data which controls data writing is stored in the register. Next, in order to write data to a memory cell, row address data and column address data of a memory cell to which data is written, writing enable data, and the like are output from a logic circuit; thus, writing of data to a memory cell corresponding to the address data stored in the register is inhibited.

Abstract: Embodiments of a memory are disclosed that may reduce the likelihood of a miss-read while reading a weak data storage cell. The memory may include a number of data storage cells, a column multiplexer, a first sense amplifier and a second sense amplifier, and an output circuit. The gain level of the first sense amplifier may be higher than the gain level of the second sense amplifier. The output circuit may include a multiplexer and the multiplexer may be operable to controllably select one of the outputs of the first and second sense amplifiers and pass the value of the selected sense amplifier. The output circuit may include a node that couples the outputs of the first and second sense amplifiers and the outputs of the first and second sense amplifiers may be able to be set to a high impedance state.

Abstract: An integrated circuit including a first interface, a decoder, and a controller. The first interface is configured to (i) write encoded data in a portion of a flash memory, and (ii) read the encoded data back from the flash memory. The decoder is configured to (i) according to an error correction code, decode the encoded data read back from the flash memory, and (ii) based on the decoded data, determine a number of decoding errors corresponding to the decoded data. The controller is configured to, in response to the number of decoding errors being greater than or equal to a first threshold, cease accessing the portion of the flash memory. The first threshold is less than a number of errors correctable by the error correction code for the portion of the flash memory.

Abstract: A method includes reading, at a memory controller, data from a first dynamic random-access memory (DRAM) die layer of a DRAM stack. The method also includes writing the data to a second DRAM die layer of the DRAM stack. The method further includes sending a request to a test engine to test the first DRAM die layer after writing the data to the second DRAM die layer.

Abstract: A RAM to be diagnosed is divided into n (n being an integer of 3 or greater) pieces of base regions. In an idle time of periodic processing performed in a system in which the RAM is incorporated, two base regions are selected from the divided base regions, and the selected two base regions are diagnosed using a diagnostic method capable of detecting a coupling fault. Thereafter, in an idle time of the periodic processing, operations to select an unselected pair of base regions and diagnose the selected pair are repeated, so as to diagnose all combinations of pairs.

Abstract: An embodiment of a method for automated test pattern generation (ATPG), a system for ATPG, and a memory configured for ATPG. For example, an embodiment of a memory includes a first test memory cell, a data-storage memory cell, and a test circuit configured to enable the test cell and to disable the data-storage cell during a test mode.

Abstract: A memory device includes a repair circuit including a fail bit location information table configured to store row and column addresses of a defective cell in a normal area of a memory cell array. The repair circuit also includes a row address comparison unit configured to compare the row address of the defective cell with a row address of a first access cell received from the outside, and to output a first row match signal when the defective cell's row address matches the row address of the first access cell, and a column address comparison unit configured to compare the column address of the defective cell with a column address of the first access cell received from the outside, and to output a first column address replacement signal if the column address of the defective cell is the same as the column address of the first access cell.

Abstract: A semiconductor apparatus includes a test unit including: a data determination unit configured to receive a plurality of data, determine whether the plurality of data are identical or not, and output the determination result as a compression signal; and an output control unit configured to output the compression signal as a test result in response to a test mode signal and a die activation signal.

Abstract: A semiconductor device includes a data verification device. The data verification device includes a data storage unit for storing data to be input to a memory region in response to a first or second control signal, an input data verifier for deactivating an output of a sense amplifier in response to the first control signal and transmitting the input data stored in the data storage unit to an external pad, and a sense-amplifier verifier for transmitting the input data stored in the data storage unit to the sense amplifier upon in response to the second control signal.

Abstract: An embodiment of the invention discloses a method for testing a memory cell in an SRAM. The number of dummy memory cells on a single dummy word line used to drive the dummy bit lines is selected. A binary logical value is written to a memory cell in the SRAM. The single dummy word line and a word line containing the memory cell in the SRAM are driven to logical high values concurrently. A dummy bit line, driven by the dummy memory cells, drives an input of a buffer to a binary logical value stored in the dummy memory cells. An output of the buffer enables a sense amp to amplify a voltage developed across the bit lines electrically connected to the memory cell.

Abstract: A method for testing an integrated circuit includes, in a burn-in test mode, two steps during which gate oxides of conductive high voltage MOS transistors of the integrated circuit are subjected to a first test voltage, and blocked high voltage MOS transistors of the integrated circuit are subjected to a second test voltage. The first test voltage is set to a value higher than a high supply voltage supplied to the high voltage MOS transistors in a normal operating mode, to make the gate oxides of transistors considered as insufficiently robust break down. The second test voltage is set to a value lower than the first test voltage and which can be supported by the blocked transistors, the states of the transistors being changed between the two steps.

Abstract: A memory subsystem includes a test engine coupled to a memory controller that can provide memory access transactions to the memory controller, bypassing a memory address decoder. The test engine hardware is configurable for different tests. The test engine identifies a range of addresses through which to iterate a test sequence in response to receiving a software instruction indicating a test to perform. For each iteration of the test, the test engine, via the selected hardware, generates a memory access transaction, selects an address from the range, and sends the transaction to the memory controller. The memory controller schedules memory device commands in response to the transaction, which causes the memory device to execute operations to carry out the transaction.

Abstract: A driver for semiconductor memory, comprising: a storage unit configured to match and store a memory cell address and bucket charge current data corresponding to the memory cell address; a selection controller configured to receive the memory cell address and a target charge current data, and output a bucket charge current select signal and a target charge current select signal corresponding to the bucket charge current data and the target charge current data, respectively, by referring to the storage unit; and a current supply unit configured to supply a bucket charge current and a target charge current in response to the bucket charge current select signal and the target charge current select signal, respectively.

Abstract: A method and an apparatus for testing a memory are provided, and the method is adapted for an electronic apparatus to test the memory. In the method, a left edge and a right edge of a first waveform of a clock signal for testing the memory are scanned to obtain a maximum width between two cross points of the left edge and the right edge. A central reference voltage of a data signal outputted by the memory is obtained, and a data width between two cross points of the central reference voltage and a left edge and a right edge of a second waveform of the data signal is obtained. Whether a difference between the data width and the maximum width is greater than a threshold is determined; if the difference is greater than the threshold, the memory is determined to be damaged.

Abstract: A nonvolatile memory device includes a memory cell array including a main cell area and a retention flag cell area, a retention check unit configured to compare a read result for retention flag cells included in the retention flag cell area to a reference value, and determine a retention state of the retention flag cells according to a comparison result, and a control logic configured to provide a retention check result based on the retention state to the external device in response to a retention check request provided from an external device.

Abstract: Provided is a semiconductor memory device in which a plurality of first and second data lines coupled to a memory cell array are alternately arranged. The semiconductor memory device includes a first write driving circuit configured to load a plurality of first write data transmitted through a plurality of third data lines into the plurality of first data lines in response to a first write enable signal; a second write driving circuit configured to load a plurality of second write data transmitted through a plurality of fourth data lines into the plurality of second data lines in response to a second write enable signal; and a column control circuit configured to activate at least one of the first and second write enable signals during a given period, in response to a plurality of data width option modes, during a parallel test mode.

Abstract: A memory subsystem includes a test engine coupled to a memory controller that can provide memory access transactions to the memory controller, bypassing a memory address decoder. The test engine receives a command to cause it to generate transactions to implement a memory test. The command identifies the test to implement, and the test engine generates one or more memory access transactions to implement the test on the memory device. The test engine passes the transactions to the memory controller, which can schedule the commands with its scheduler. Thus, the transactions cause deterministic behavior in the memory device because the transactions are executed as provided, while at the same time testing the actual operation of the device.

Abstract: A method of correcting stored data includes reading data stored in a portion of a nonvolatile memory. The method includes, for each particular bit position of the read data, updating a count of data error instances associated with the particular bit position in response to detecting that the read data differs from a corresponding reference value of the particular bit position. The reading of the first portion and the updating of the counts of data error instances are performed for a particular number of repetitions. The method includes identifying each bit position having an associated count of data error instances equal to the particular number of repetitions as a recurring error bit position.

Abstract: Methods and apparatus are provided for determining level-thresholds for q-level memory cells. A plurality of the memory cells are read to obtain respective read signal components. The read signal components are processed in dependence on signal level to produce a signal level vector, comprising a series of elements, indicative of the distribution of read signal components in order of signal level. The signal level vector is scanned with a sliding window of length greater than the spacing of successive window positions in the scan. At each window position, a metric Mi is calculated in dependence on the elements of the signal level vector in the window. A level-threshold for successive memory cell levels is then determined in dependence on variation of the metric over the scan.

Abstract: An error test routine tests for a type of memory error by changing a content of a memory module. A memory handling procedure isolates the memory error in response to a positive outcome of the error test routine. The error test routine and memory handling procedure are to be performed at runtime transparent to an operating system. Information corresponding to isolating the memory error is stored.

Abstract: An integrated circuit chip comprising at least one programmable built-in self-repair (PBISR) for repairing memory is described. The PBISR comprises an interface that receives signals external to the integrated chip. The PBISR further includes a port slave module that programs MBISR registers, program and instruction memory. The PBISR further comprises a programmable transaction engine and a programmable checker. Further, the MBISR comprises an eFUSE cache that implements logic to denote defective elements.

Abstract: A sense amplifier test circuit that may allow for detecting soft failures may include a voltage generator circuit, a sense amplifier, and a detection circuit. The voltage generator may be operable to controllably supply different differential voltages to the sense amplifier, and the detection circuit may be operable to detect an analog voltage on the output of the sense amplifier.

Abstract: A method of testing the operational margin of an information storage device having marked random variations, and an information storage device having the function of self-diagnosing the operational margin, are provided. The test method includes testing an information storage device including a plurality of memory bits as the test condition is set so as to be outside a range of conditions that may be presupposed in real use of the information storage device and of counting the number of memory bits that fail in operation. The test method also includes verifying the size of the operational margin of the information storage device based on the count value. The test condition is made severe and the reference value is set to a fairly large value to enable the operational margin against the noise to be tested highly accurately.

Abstract: An apparatus is contemplated for storing and providing configuration data to a microprocessor. The apparatus has a core, disposed on a die, and a fuse array, disposed on the die and coupled to the core, where the fuse array comprises a plurality of semiconductor fuses programmed with compressed configuration data for the core, where the compressed configuration data is generated by compression of data within a virtual fuse array that corresponds to the core, and where the core accesses and decompresses the compressed configuration data upon power-up/reset, for initialization of elements within the core.

Abstract: A semiconductor memory device is provided with a plurality of memory cells connected to a plurality of word lines, a word-line leakage detector configured to detect a leakage current generated on at least one of the plurality of word lines, and a controller configured, when a leakage current is detected by the word-line leakage detector, to determine that a block including a memory cell connected to a word line through which the leakage current is flowing is defective. The word-line leakage detector has a detection voltage generator configured to generate a detection voltage in accordance with the leakage current, a comparator configured to generate a flag signal having output logic that is inverted depending on whether the detection voltage exceeds a predetermined threshold voltage, and an adjuster configured to adjust a current amount by diverting part of the leakage current in accordance with an ambient temperature.

Abstract: The various embodiments described herein include systems, methods and/or devices used to packaging non-volatile memory. In one aspect, the method includes, selecting, from a set of non-volatile memory die, a plurality of non-volatile memory die on which predefined die-level and sub-die level tests have been deferred until after packaging, in accordance with predefined criteria and predefined statistical die performance information corresponding to the set of non-volatile memory die. The method further includes packaging the selected plurality of non-volatile memory die into a memory device. After said packaging, the method further includes performing a set of tests on the plurality of non-volatile memory die in the memory device to identify respective units of memory within the non-volatile memory die in the memory device that meet predefined validity criteria, wherein the set of tests performed include the deferred predefined die-level and sub-die level tests.

Abstract: The invention relates to a semiconductor device including N memory modules, N being greater than or equal to three, each module having an array of memory cells arranged in rows and columns, a write circuit coupled to each module and configured to write data in the memory cells, a read circuit coupled to each module and configured to supply output data from the memory cells, a module selection circuit configured to individually select one memory module in a regular operation mode, and to collectively select two or more of the modules in a parallel mode, and a comparator circuit coupled to the N modules and configured to compare, in the parallel mode, the output data supplied by the N modules.

Abstract: A memory device automatically correcting the effect of collisions of high-energy particles, comprising at least one memory cell, and further comprising: retention means for retaining, for a determined period, a single copy of the stored value stored in said memory cell; detection means for detecting a change of state of said memory cell, by comparing the stored value stored in said memory cell with the value in retention in said retention means; and management means suitable for determining whether a detected change of state of said memory cell is due to a high-energy particle and, in which case, to automatically command a reloading of the stored value stored in said retention means into said memory cell.

Abstract: Memory controllers, memory devices and methods are provided in which test data is transmitted and signal parameters are varied. The transmitted test data is read, and based on a comparison between transmitted test data and read test data a transmitter impedance is adjusted.

Abstract: A method of screening complementary metal-oxide-semiconductor CMOS integrated circuits, such as integrated circuits including CMOS static random access memory (SRAM) cells, for n-channel transistors susceptible to transistor characteristic shifts over operating time. For the example of SRAM cells formed of cross-coupled CMOS inverters, static noise margin and writeability (Vtrip) screens are provided. Each of the n-channel transistors in the CMOS SRAM cells are formed within p-wells that are isolated from p-type semiconductor material in peripheral circuitry of the memory and other functions in the integrated circuit. Forward and reverse body node bias voltages are applied to the isolated p-wells of the SRAM cells under test to determine whether such operations as read disturb, or write cycles, disrupt the cells under such bias. Cells that are vulnerable to threshold voltage shift over time can thus be identified.

Abstract: A latch-based array includes a plurality of columns and rows. Each column comprises a plurality of slave latches that all latch in parallel a master-latched data output from the column's master latch during normal operation. In a fault-testing mode of operation, one of the slaves in the column latches an inverted version of the master-latched data output while the remaining slave latches in the column latch the master-latched data output. In this fashion, the slave latches are decorrelated in a single write operation.

Abstract: The present disclosure includes apparatuses and methods related to performing compare and/or report operations using sensing circuitry. An example method can include charging an input/output (IO) line of a memory array to a voltage. The method can include determining whether data stored in the memory array matches a compare value. The determination of whether data stored matches a compare value can include activating a number of access lines of the memory array. The determination can include sensing a number of memory cells coupled to the number of access lines. The determination can include sensing whether the voltage of the IO line changes in response to activation of selected decode lines corresponding to the number of memory cells.