Abstract: A memory device including a first memory sector and a second memory sector, each of which includes a respective plurality of local bit lines, which may be selectively coupled to a plurality of main bit lines. The memory device further includes a first amplifier and a second amplifier, and a routing circuit, arranged between the main bit lines and the first and second amplifiers. The routing circuit includes: a first lower switch, arranged between a first lower main bit line and a first input of the first amplifier; a second lower switch, arranged between the first lower main bit line and a first input of the second amplifier; a first upper switch, arranged between a first upper main bit line and the first input of the first amplifier; and a second upper switch, arranged between the first upper main bit line and the first input of the second amplifier. The second inputs of the first and second amplifiers are coupled to a second lower main bit line and to a second upper main bit line, respectively.

Abstract: An object of the present disclosure is to provide a content addressable memory realizing higher speed of a search access. A content addressable memory includes: a plurality of memory cells; a match line coupled to the plurality of memory cells; a search line coupled to each of the plurality of memory cells; a match line output circuit coupled to the match line; and a potential changing circuit coupled to the match line and changing the potential of the match line.

Abstract: There are provided a memory system and an operating method thereof. A memory system includes: a memory device configured to generate first read voltages and second read voltages, based on initial read voltages and first and second offset voltages, in response to a user read command, and output first data and second data, which are acquired by performing read operations on multi-bit memory cells, based on the first read voltages and the second read voltages; and a memory controller configured to output the user read command, wherein the memory controller includes a state counter configured to count numbers of data bits respectively corresponding to a plurality of threshold voltage states from the first data and the second data, and extract numbers of memory cells respectively included in a plurality of threshold voltage regions divided by the first read voltages and the second read voltages by calculating the counted result.

Abstract: A test apparatus may be provided. The test apparatus may include a delay compensator configured to generate delayed read data by delaying read data according to a difference between an external turnaround delay value provided externally from the test apparatus and a turnaround delay detection value detected within the test apparatus. The test apparatus may include a determination circuit configured to perform a test result determination operation by comparing the delayed read data with reference data. The turnaround delay detection value may be generated by detecting a time of from a point of time when write data including a read command as the reference data is output to a point of time when the read data is received.

Abstract: A memory macro includes a first memory cell array, first tracking circuit, first pre-charge circuit coupled to a first end of the first tracking bit line and a second pre-charge circuit coupled to a second end of the first tracking bit line. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first set of control signals, a second set of memory cells configured as a first set of pull-down cells responsive to a second set of control signals, and a first tracking bit line. The first set of pull-down cells and first set of loading cells are configured to track a memory cell of the first memory cell array. The first and second pre-charge circuit are configured to charge the first tracking bit line to a voltage level responsive to a third set of control signals.

Abstract: A memory device may include a first half memory block, a second half memory block, a row decoder group, and a read/write circuit which may be disposed between the first half memory block and the second half memory block. The read/write circuit may be coupled to the first half memory block and the second half memory block through a first bit line and a second bit line. The row decoder group may be configured to simultaneously select the first half memory block and the second half memory block in response to a single block selection signal.

Abstract: A semiconductor memory device includes a cell array that includes a first row block and a second row block, a bit line sense amplifier block that senses data stored in the first row block or the second row block, a local sense amplifier that latches the sensed data transferred from the bit line sense amplifier block, and a switch that connects the local sense amplifier with a selected one of a first global data line and a second global data line in response to a select signal. The second row block may be placed at an edge of the cell array, and the switch connects the local sense amplifier with the first global data line when the first row block is activated and connects the local sense amplifier with the second global data line when the second row block is activated.

Abstract: Method and Apparatuses for transmitting and receiving commands for a semiconductor device are described. An example apparatus includes: a memory device including a plurality of banks, each bank including a plurality of memory cells; and a memory controller that transmits a first command and a plurality of address signals indicative of a memory cell in a first bank of the plurality of banks at a first time. The first command is indicative of performing a first memory operation, and a second memory operation different from the first memory operation. The memory device receives the first command and the plurality of address signals and further performs the second memory operation to the first bank responsive, at least a part, to the plurality of address signals and the first command.

Abstract: A method for accessing a plurality of DRAM devices each having a plurality of banks, the plurality of DRAM devices being interconnected to receive common address and command signals. The method includes receiving a first chip selection address and a first bank address with an active command to activate a first bank in a first DRAM device of the plurality of DRAM devices. A first bank active flag is set, corresponding to the first bank address, in the first DRAM device of the plurality of DRAM devices. A second bank address with a column command is received. A second bank is accessed in a second DRAM device of the plurality of DRAM devices having a set bank active flag corresponding to the second bank address.

Abstract: A technique is described for performing a maintenance operation within an apparatus that is used to control access to a memory device. The apparatus has a storage device for storing access requests to be issued to the memory device, and maintenance circuitry for performing a maintenance operation on storage elements provided within the storage device. Memory access execution circuitry is used to issue to a physical layer interface access requests selected from the storage device, for onward propagation from the physical layer interface to the memory device. Control circuitry is responsive to a training event to initiate a training operation of the physical layer interface. In addition, the control circuitry is further responsive to the training event to trigger performance of the maintenance operation by the maintenance circuitry whilst the training operation is being performed.

Abstract: Apparatuses and methods for implementing access line loads for sense amplifiers for open access line sensing. An example apparatus may include a memory array comprising a plurality of sense amplifiers. A first sense amplifier is coupled to a first access line segment and to a second access line segment and a second sense amplifier is coupled to a third access line segment and to a load segment. The first, second, and third access line segments are coupled to a respective plurality of memory cells. The load segment comprise load circuitry configured to provide a capacitive load to the second sense amplifier based on a capacitive load of the third access line segment.

Abstract: Devices and methods include, for a memory device, generating a main input-output line signal on a main input-output line using driving circuitry. The main input-output line is coupled to multiple sensing amplifiers. Each of the sensing amplifiers each locally generate a local data line from the main data line. Each of the sensing amplifiers also includes multiple local sensing amplifiers that are selectively coupled to the generated local data line for overwriting data in the respective local sensing amplifiers.

Abstract: Apparatuses and methods for reducing row address (RAS) to column address (CAS) delay are disclosed. An example apparatus includes a memory including a sense amplifier configured to, during a precharge phase, couple a first gut node of the sense amplifier to a second gut node of the sense amplifier and to a precharge voltage while the first gut node and the second gut node are coupled to a first digit line and a second digit line, respectively, at a first time. The sense amplifier is further configured to, during the precharge phase, decouple the first gut node from the first digit line and decouple the second gut node from the second digit line at a second time that is after the first time. The sense amplifier is further configured to transition to an activation phase in response to an activate command at a third time after the second time to perform a sense operation.

Abstract: Memory devices may employ flip-flops with paired transistors in sense amplifying circuitry to sense charges stored in memory cells. Paired transistors may present mismatches in electrical characteristics, which may affect the sensitivity of the sense amplifying circuitry. Embodiments include systems and methods that compensate and/or mitigate mismatches in the electrical characteristics of the paired transistors. To that end, the memory devices may sense the mismatches during a compensation period and pre-compensate the read-out of data lines to improve the sensibility of the sense amplifying circuitry.

Abstract: A layout of a sense amplifier includes a pre-charge and equalizer area. A pre-charge transistor, an equalizer transistor and a gate line are disposed within the pre-charge and equalizer area. The gate line and the pre-charge transistor share a share plug. The share plug serves as a gate contact plug for the gate line and a source/drain contact plug for the pre-charge transistor.

Abstract: A memory control circuit according to the disclosure includes a memory control section that selectively uses a first issuing mode in which a plurality of control commands are issued without performing bank group interleaving and a second issuing mode in which the bank group interleaving is performed and the plurality of control commands are issued, and thereby issues the control commands to a plurality of bank groups in a memory having a bank group function.

Abstract: Techniques are provided herein to increase a rate of data transfer across a large number of channels in a memory device using multi-level signaling. Such multi-level signaling may be configured to increase a data transfer rate without increasing the frequency of data transfer and/or a transmit power of the communicated data. An example of multi-level signaling scheme may be pulse amplitude modulation (PAM). Each unique symbol of the multi-level signal may be configured to represent a plurality of bits of data.

Abstract: Methods, systems, and devices for operating a memory cell or memory cells are described. Cells of a memory array may be pre-written, which may include writing the cells to one state while a sense component is isolated from digit lines of the array. Read or write operations may be executed at the sense component while the sense component is isolated, and the cell may be de-isolated (e.g., connected to the digit lines) when write operations are completed. The techniques may include techniques accessing a memory cell of a memory array, isolating a sense amplifier from a digit line of the memory array based at least in part on the accessing of the cell, firing the sense amplifier, and pre-writing the memory cell of the memory array to a second data state while the sense amplifier is isolated. In some examples, the memory cell may include a ferroelectric memory cell.

Abstract: A memory includes a first memory cell; and a second memory cell. A selectable current path is coupled between the first memory cell and the second memory cell. The selectable current path includes a first transistor. A first amplifier is coupled in a first feedback arrangement between the first memory cell and the first transistor. During a read operation of the first memory cell, a current through the first memory cell is substantially equal to a current through the second memory cell. The memory cell may include a magnetic tunnel junction (MTJ).

Abstract: Devices, systems, and methods for reducing noise couplings between propagation lines for size efficiency. In one embodiment, a memory device is provided, comprising a memory array and an input/output (I/O) circuit. The I/O circuit can include a first plurality of global data lines and a second plurality of global data lines. The second plurality of global data lines are directly interleaved between the first plurality of global date lines and are configured to shield the first plurality of global data lines. In some embodiments, the first plurality of global data lines are shorter in length than the second plurality of global data lines and are switched before the second plurality of global data lines are switched.

Abstract: A phase change memory device may include a plurality of word lines, a plurality of bit lines, a phase change memory cell, and a discharging circuit. The word lines and the bit lines may intersect each other. The phase change memory cell may be positioned at an intersection point between the word lines and the bit lines. The discharging circuit may be configured to apply a ground voltage to a non-selected word line adjacent to a selected word line or a non-selected bit line adjacent to a selected bit line.

Abstract: A nonvolatile memory device includes multi-level cells. A sensing method of the nonvolatile memory device includes: precharging a bit line and a sense-out node during a first precharge interval; identifying a first state of a selected memory cell, by developing the sense-out node during a first develop time and sensing a first voltage level of the sense-out node; precharging the sense-out node to a second sense-out precharge voltage; and identifying the first state of the selected memory cell from a second state adjacent thereto, by developing the sense-out node during a second develop time different from the first develop time and sensing a second voltage level of the sense-out node.

Abstract: Methods, systems, and devices supporting unregulated voltage stacked memory are described. A memory device may include one or more memory cells used to store information (e.g., in the form of a logic state) and configured into a number of memory banks. In some embodiments, the memory cells may be stacked. The memory device may also include multiple power supplies, which may be arranged in a series configuration between the memory banks. A memory control logic may be coupled in series with the power supplies and configured to equalize power across stacked memory cells when performing a read operation or a write operation to any of the plurality of stacked memory cells.

Abstract: A semiconductor device with a memory unit of which the variations in the operation timing are reduced is provided. For example, the semiconductor device is provided with dummy bit lines which are arranged collaterally with a proper bit line, and column direction load circuits which are sequentially coupled to the dummy bit lines. Each column direction load circuit is provided with plural NMOS transistors fixed to an off state, predetermined ones of which have the source and the drain suitably coupled to any of the dummy bit lines. Load capacitance accompanying diffusion layer capacitance of the predetermined NMOS transistors is added to the dummy bit lines, and corresponding to the load capacitance, the delay time from a decode activation signal to a dummy bit line signal is set up. The dummy bit line signal is employed when setting the start-up timing of a sense amplifier.

Abstract: A memory device having a plurality sections of memory cells, such as ferroelectric memory cells (hybrid RAM (HRAM) cells) may provide for concurrent access to memory cells within independent sections of the memory device. A first memory cell may be activated, and it may be determined that a second memory cell is independent of the first memory cell. If the second memory cell is independent of the first memory cell, the second memory cell may be activated prior to the conclusion of operations at the first memory cell. Latching hardware at memory sections may latch addresses at the memory sections in order to allow a new address to be provided to a different section to access the second memory cell.

Abstract: A technique for reducing power consumption of a content addressable memory (CAM) system is provided. In a CAM system, an equalizer circuit is coupled to a border portion between a plurality of match line parts generated by dividing each match line corresponding to a piece of entry data, and a precharge circuit precharges each of the match line parts collectively corresponding to a piece of entry data to voltage VDD or VSS. When comparing the entry data and search data, the equalizer circuit couples, in accordance with a control signal, the match line parts after the match line parts are precharged by the precharge circuit. In an equalization period, search operation through the search line is started. A search transistor for comparing search data and entry data includes an NMOS search transistor.

Abstract: A semiconductor memory apparatus includes a driving voltage providing circuit suitable for selectively providing a first driving voltage, a second driving voltage, a third driving voltage, a ground voltage, and a precharge voltage to a first driving line and a second driving line in response to an active signal, a cell characteristic information signal, and a precharge signal. The semiconductor memory apparatus also includes a sense amplifier suitable for operating by being applied with voltages provided from the first and second driving lines.

Abstract: A semiconductor storage device includes an SRAM memory cell composed of a drive transistor, a transfer transistor and a load transistor, an I/O circuit that is connected to bit lines connected to the memory cell, and an operating mode control circuit that switches an operating mode of the I/O circuit between a resume standby mode and a normal operation mode, wherein the I/O circuit includes a write driver that writes data to bit lines, a sense amplifier that reads data from the bit lines, a first switch inserted between the bit lines and the write driver, a second switch inserted between the bit lines and the sense amplifier, a precharge circuit that precharges the bit lines, and a control circuit that controls the first and second switches and the precharge circuit according to a signal from the operating mode control circuit.

Abstract: A ternary sense amplifier and an SRAM array realized by the ternary sense amplifier are provided. The ternary sense amplifier comprises the 1st CNFET transistor, the 2nd CNFET transistor, the 3rd CNFET transistor, the 4th CNFET transistor, the 5th CNFET transistor, the 6th CNFET transistor, the 7th CNFET transistor, the 8th CNFET transistor, the 9th CNFET transistor, the 10th CNFET transistor, the 11th CNFET transistor, the 12th CNFET transistor and the 13th CNFET transistor; the SRAM array comprises a ternary sense amplifier, a ternary memory array, the 1st inverter, the 2nd inverter, the 3rd inverter, the 4th inverter, the 14th CNFET transistor, the 15th CNFET transistor, the 16th CNFET transistor, the 17th CNFET transistor, the 18th CNFET transistor and the 19th CNFET transistor; it features in low power consumption, less postponement and high yield of chips.

Abstract: A first sequence of data bits is shifted into storage elements of a signal receiver during a first sequence of bit-time intervals, and a memory access command indicates that a second sequence of data bits is to be received within the signal receiver during a second sequence of bit-time intervals. Contents of the shift-register storage elements are conditionally overwritten with a predetermined set of seed bits, depending on whether one or more bit-time intervals will transpire between the first and second sequences of bit-time intervals. Equalization signals generated based, at least in part, on contents of the shift-register storage elements are used to adjust respective signal levels representative of one or more bits of the second sequence of data bits.

Abstract: A memory device with low power consumption is provided. The memory device includes a sense amplifier, bit lines, memory cells, and first transistors. The bit lines are provided over a layer comprising the sense amplifier. The memory cells are provided over a layer comprising the bit lines. The memory cell includes a second transistor and a capacitor. The sense amplifier and the bit lines are electrically connected to each other through the first transistors. The sense amplifier may include at least one layer of a conductor.

Abstract: A semiconductor device is disclosed, which relates to a technology for a sense-amplifier (sense-amp) configured to compensate for mismatch of a sensing bit-line. The semiconductor device includes a sense-amplifier configured to selectively control connection between a pair of bit lines and a pair of sensing bit lines in response to a connection control signal in an offset compensation period, and precharge a pull-down power-supply line with a bit line precharge voltage level in the offset compensation period. The semiconductor device also includes a pull-down voltage controller configured to increase a voltage of the pull-down power-supply line by a predetermined level in response to a pull-down control signal in the offset compensation period.

Abstract: Methods, devices, and systems are disclosed that generally perform a time delay determination of a voltage change on a signal node to determine a corresponding signal value on another node causing the voltage change. In an example the circuit device includes a first circuit configured to couple, when enabled, a signal value onto a first node, and a read circuit having an input coupled to the first node. The read circuit is configured to effect a voltage transition of a signal node at a variable rate corresponding to the voltage of the first node, and to determine the signal value based upon a time-to-transition measurement of the signal node.

Abstract: According to one embodiment, a display device comprises pixel electrodes formed in a display area, drive electrodes opposed to the pixel electrodes, first and second line groups formed in a non-display area, a first switch configured to apply a voltage for display or a drive signal to the drive electrodes, and a scanner configured to control the first switch. In the above structure, the first and second line groups are disposed with a space between the first line group and the second line group, and at least a part of the scanner is disposed in the space between the first line group and the second line group.

Abstract: A display device includes pixels at respective crossing regions of scan lines and data lines, a scan driver that is configured to supply a scan signal to the scan lines, and a data driver that is configured to supply a pre-emphasis voltage to the data lines using a first constant for controlling a voltage value of the pre-emphasis voltage, and using a second constant for controlling a supply time of the pre-emphasis voltage, and supply data signals to the data lines after the supply of the pre-emphasis voltage, wherein at least one of the first or second constants is stored in each channel corresponding to each of the data lines.

Abstract: A memory device with low power consumption is provided. The memory device includes a sense amplifier, bit lines, memory cells, and first transistors. The bit lines are provided over a layer comprising the sense amplifier. The memory cells are provided over a layer comprising the bit lines. The memory cell includes a second transistor and a capacitor. The sense amplifier and the bit lines are electrically connected to each other through the first transistors. The sense amplifier may include at least one layer of a conductor.

Abstract: A device includes memory cells, a reference circuit, and a sensing unit. The reference circuit includes a first reference switch, a second reference switch, and reference storage units. The first reference switch is turned on when a reference word line is activated. The second reference switch is turned on when the reference word line is activated. The reference storage units include a first reference storage unit and a second reference storage unit. The first reference storage unit generates a first signal having a first logic state when the first reference switch is turned on. The second reference storage unit generates a second signal having a second logic state when the second reference switch is turned on. The sensing unit determines a logic state of the bit data of one of the memory cells according to the first signal and the second signal.

Abstract: A semiconductor device may be provided. The semiconductor device may include sense-amplifier test device. The sense-amplifier test device may include a drive signal generator configured to generate a test voltage applying signal for supplying a ground voltage to a pull-up power-supply line of a sense-amplifier. The sense-amplifier test device may include a sense-amplifier driver configured to supply a ground voltage to the pull-up power-supply line of the sense-amplifier, based on the test voltage applying signal.

Abstract: A Dynamic Random Access Memory (DRAM) controller includes a memory interface and a processor. The memory interface is configured to communicate with a DRAM including one or more memory banks. The processor is configured to receive Input/Output (I/O) commands, each I/O command addressing a respective memory bank and a respective row within the memory bank to be accessed in the DRAM, to further receive one or more indications, indicative of likelihoods that a subsequent I/O command will address a same row in a same memory bank as a previous I/O command, to adaptively set, based on the indications, a policy of deactivating rows of the DRAM, and to execute the I/O commands in the DRAM in accordance with the policy.

Abstract: A semiconductor device may include a word line selector configured to generate an active signal for selecting a word line, based on a row address. The active signal may be divided into a read active signal generated based on a read command and a write active signal generated based on a write command.

Abstract: Provided herein is a memory system and an operation method thereof. The memory system may include a memory controller including a read retry table in which a plurality of codes are stored, and configured to output a selected code among the plurality of codes during a read retry operation. The memory system may include a memory device configured to store data, and perform the read retry operation according to the codes received from the memory controller.

Abstract: A discharge circuit includes first and second transistors of a first polarity, third and fourth transistors of a second polarity, and first and second current sources having first ends electrically connected to first end of the third transistor and first end of the fourth transistor, respectively, and second ends supplied with a first voltage. First end of the first transistor is supplied with a second voltage higher than the first voltage. First end of the second transistor is electrically separated from the first end of the first transistor. Gate and second end of the first transistor, gate of the second transistor, and second end of the third transistor are electrically connected to one another. Second end of the second transistor, gate of the third transistor, and second end and gate of the fourth transistor are electrically connected to one another.

Abstract: Embodiments of mechanisms for forming power gating cells and virtual power circuits on multiple active device layers are described in the current disclosure. Power gating cells and virtual power circuits are formed on separate active device layers to allow interconnect structure for connecting with the power source be formed on a separate level from the interconnect structure for connecting the power gating cells and the virtual power circuits. Such separation prevents these two types of interconnect structures from competing for the same space. Routings for both types of interconnect structures become easier. As a result, metal lengths of interconnect structures are reduced and the metal widths are increased. Reduced metal lengths and increased metal widths reduce resistance, improves resistance-capacitance (RC) delay and electrical performance, and improves interconnect reliability, such as reducing electro-migration.

Abstract: According to one embodiment, a semiconductor storage device includes: a first bank that includes a first memory cell group and writes data into the first memory cell group upon receipt of a first command; a second bank that includes a second memory cell group and writes data into the second memory cell group upon receipt of the first command; and a delay controller that issues the first command for the first bank upon receipt of a second command, and issues the first command for the second bank after an interval of at least a first period.

Abstract: A semiconductor storage device includes an SRAM memory cell composed of a drive transistor, a transfer transistor and a load transistor, an I/O circuit that is connected to bit lines connected to the memory cell, and an operating mode control circuit that switches an operating mode of the I/O circuit between a resume standby mode and a normal operation mode, wherein the I/O circuit includes a write driver that writes data to bit lines, a sense amplifier that reads data from the bit lines, a first switch inserted between the bit lines and the write driver, a second switch inserted between the bit lines and the sense amplifier, a precharge circuit that precharges the bit lines, and a control circuit that controls the first and second switches and the precharge circuit according to a signal from the operating mode control circuit.

Abstract: An electronic paper display apparatus including a display driving unit, an electronic paper display panel and a detection circuit unit is provided. The display driving unit generates at least one driving signal. The electronic paper display panel is coupled to the display driving unit. The display driving unit drives the electronic paper display panel to display an image by the at least one driving signal, and the electronic paper display panel outputs the at least one driving signal. The detection circuit unit is coupled to the electronic paper display panel to receive the at least one driving signal outputted by the electronic paper display panel, and detect a display status of the electronic paper display panel according to the at least one driving signal. Besides, a detection method of an electronic paper display apparatus is also provided.

Abstract: A controller device and an operation method for a non-volatile memory with 3-dimensional architecture are provided. The controller device includes an error checking and correcting (ECC) circuit and a controller. The controller is coupled to the non-volatile memory and the ECC circuit. The controller may access a target wordline of the non-volatile memory in accordance with a physical address. The controller groups a plurality of wordlines of the non-volatile memory into a plurality of wordline groups, wherein different wordline groups have different codeword structures. The controller controls the ECC circuit according to the codeword structure of the wordline group of the target wordline, and the ECC circuit generates a codeword to be stored in the target wordline or check a codeword from the target wordline under control of the controller.

Abstract: A semiconductor memory device may include a row address generating circuit, a row active pulse generating circuit and a word line activating circuit. The row address generating circuit may generate a row address in response to a refresh command, a row active pulse, and a normal address. The row active pulse generating circuit may generate a row active pulse in response to a refresh signal and an active signal. The word line activating circuit may selectively enable a word line in response to the row address and the row active pulse.

Abstract: This description is directed to a dynamic random access memory (DRAM) array having a plurality of rows and a plurality of columns. The array further includes a plurality of cells, each of which are associated with one of the columns and one of the rows. Each cell includes a capacitor that is selectively coupled to a bit line of its associate column so as to share charge with the bit line when the cell is selected. There is a segmented word line circuit for each row, which is controllable to cause selection of only a portion of the cells in the row.

Abstract: Apparatus include an array of memory cells, a controller to perform access operations on the array of memory cells, a clock signal node, a counter having an input selectively connected to the clock signal node, and a clock generator having an output connected to the input of the counter.