Abstract: A sense amplifier for sensing a line of a semiconductor device comprises a p-channel pull-up transistor for charging the line, an inverter, and a pull-up controller. The p-channel pull-up transistor and the inverter are coupled to the line. The inverter inverts a line voltage of the line. The pull-up controller is coupled to the gate of the p-channel pull-up transistor and operates the p-channel pull-up transistor as a function of the inverted line voltage.

Abstract: Provided is a stacked memory device including a base die and a plurality of core dies. The base die may include: a weak cell address storage unit for storing weak cell addresses; a serialization unit for selecting at least one of the weak cell addresses as a target weak cell address, converting the selected target weak cell address into a serial weak cell address, and outputting a strobe signal synchronized with the serial weak cell address; a deserialization unit for storing the serial weak cell address based on the strobe signal, and converting the stored address into a parallel weak cell address based on a refresh end signal; and a refresh control unit for selecting the parallel weak cell address or a refresh address generated based on a refresh signal, and outputting a target address.

Abstract: Embodiments of the present disclosure describe techniques and configurations for word-line path isolation in a phase change memory (PCM) device. In an embodiment, a method includes increasing a current through a memory cell of a phase change memory (PCM) device, wherein the memory cell is coupled with a capacitor and subsequent to said increasing the current, generating a transient current through the memory cell by discharge of the capacitor to reset the memory cell. In another embodiment, a method includes increasing a current through a memory cell of a phase change memory (PCM) device and controlling the current to be greater than a threshold current and lower than a hold current of the memory cell to set the memory cell. Other embodiments may be described and/or claimed.

Abstract: According to one embodiment, a semiconductor memory device includes first, second, third and fourth MOS transistors, and first and second precharge circuits. A memory cell includes the first, second, third and fourth MOS transistors. Source and drain of the third MOS transistor are connected to between the source or the drain of the first MOS transistor and a first bit line. Source and drain of the fourth MOS transistor are connected to between the source or the drain of the second MOS transistor and a second bit line. The first precharge circuit supplies a voltage to the first and second bit lines in a precharge period during a read operation or a write operation. The second precharge circuit supplies the voltage to the first and second bit lines while in a data holding state.

Abstract: In a semiconductor memory device storing a resistance difference as information, a long time is taken so as to charge and/or discharge a selected cell by an equalizer circuit, which results in a difficulty of a high speed operation. A selection circuit puts, in a selected state, at least three bit lines which includes a selected bit line connected to a selected memory cell together with unselected bit lines adjacent to the selected bit line on both sides of the selected bit line. The selected and the unselected bit lines are coupled to sense amplifiers through an equalizer circuit. The equalizer circuit puts both the selected and the unselected bit lines into charging states and thereafter puts only the selected bit line into a discharging state to perform a sensing operation. On the other hand, the unselected bit lines are continuously kept at the charging states during the sensing operation. This makes it possible to perform the sensing operation at a high speed with a rare malfunction.

Abstract: A resistance change memory includes a memory cell array comprising memory cells including magnetic tunnel junction (MTJ) elements; a write and read circuit which performs a write operation and a read operation for the memory cells; a temperature sensor which outputs temperature information corresponding to a temperature of the memory cell array; and a memory controller which controls the write operation and the read operation by the write and read circuit in response to the temperature information, such that a first time period from a write command input to a pre-charge command input is variable according to the temperature information, while a second time period from an active command input to the pre-charge command input is fixed constant regardless of the temperature information.

Abstract: A memory device comprising a memory array comprising a plurality of memory cells, a plurality of bitlines and a plurality of wordlines for writing to the plurality of memory cells and a sense amplifier coupled to a first bitline of the plurality of bitlines, for reading the contents of a selected memory cell, the sense amplifier comprising a first cascode transistor pair coupled to a second cascode transistor pair, the first cascode transistor pair coupled to the first bitline and a second bitline, and a current comparator coupled to a drain side of the second cascode transistor pair for determining a value of the selected memory cell.

Abstract: A circuit includes a first transistor of a first type, a second transistor of a second type, a sense amplifier, a first data line coupled with a first terminal of the sense amplifier, and a second data line coupled with a second terminal of the sense amplifier. The second type is different from the first type. A first terminal of the first transistor is configured to receive a supply voltage. A second terminal of the first transistor, a third terminal of the first transistor, a second terminal of the second transistor, a third terminal of the second transistor are coupled together and are configured to carry a voltage. A first terminal of the second transistor is configured to receive a reference supply voltage. The first and second data lines are configured to receive a voltage value of the voltage.

Abstract: A memory cell comprising includes a silicon-on-insulator (SOI) substrate, an electrically floating body transistor fabricated on the silicon-on-insulator (SOI) substrate, and a charge injector region. The floating body transistor is configured to have more than one stable state through an application of a bias on the charge injector region.

Abstract: Sense amplifier configurations for memories are described. In these configurations, the differential inputs are boosted proportional to the respective bitline voltage enabling a low-voltage, reliable, faster sense amplifier operation. Disclosed sense amplifiers are also capable of compensating the threshold mismatch between the sensing transistors.

Abstract: A memory device which can keep a stored logic state even when the power is off is provided. A signal processing circuit including the memory device, which achieves low power consumption by stopping supply of power, is provided. The memory device includes a logic circuit including a first node, a second node, a third node, and a fourth node; a first control circuit connected to the first node, the second node, and the third node; a second control circuit connected to the first node, the second node, and the fourth node; a first memory circuit connected to the first node, the first control circuit, and the second control circuit; and a second memory circuit connected to the second node, the first control circuit, and the second control circuit.

Abstract: The present invention relates to a differential amplifier circuit. A differential amplifier circuit has an advantage in that it can improve a voltage drop characteristic attributable to a load current by enhancing response speed. Furthermore, the differential amplifier circuit can improve a bandwidth characteristic by reducing the quiescent current of a class AB amplifier and also improve a slew rate characteristic by adaptively changing a tail current because a signal path is diversified. Accordingly, response speed can be enhanced by an improved bandwidth characteristic, and the current driving ability can be also enhanced by an improved slew rate characteristic.

Abstract: A method and apparatus for operating a memory device with wider difference in array and periphery voltage is presented. The memory device includes a bit line, a complementary bit line, a memory cell, a first pre-charge circuit, and a second pre-charge circuit. The memory cell, the first pre-charge circuit, and the second pre-charge circuit are coupled between the bit line and the complementary bit line. The first pre-charge circuit is configured to pre-charge the bit line and the complementary bit line to a first voltage level. The second pre-charge circuit is configured to pre-charge the bit line and the complementary bit line to a second voltage level that is different than the first voltage level. In some examples, two precharge circuits are configured to operate such that memory access is ensured to be static noise margin safe even under wider difference between two voltage levels.

Abstract: A semiconductor apparatus includes a variable resistor, a variable resistor selection unit configured to electrically couple the variable resistor to a sense amplifier in response to a resistor selection signal, a power supply unit configured to apply a first voltage to the variable resistor selection unit in response to a read signal, and a switch driving unit configured to generate the resistor selection signal in response to a resistor selection control signal, and to raise a voltage of the resistor selection signal when the first voltage is applied to the variable resistor selection unit.

Abstract: A readout circuit with a self-detection circuit and a control method therefor. The circuit comprises a pre-charging circuit and a control circuit, the pre-charging circuit and the control circuit being connected to a first node and used for charging a memory unit. The readout circuit also comprises a detection circuit, the detection circuit and the pre-charging circuit being connected to the first node. The detection circuit comprises a third NOT gate, a fourth NOT gate, a first NAND gate, a sixth NOT gate, a first trigger and an eighth NOT gate. In such a manner of detecting the reversal of the first NOT gate through the reversal of the third NOT gate, the charging duration of the first node (A) can be greatly reduced, thereby reducing the reading duration of the whole circuit. At the same time, the re-occurrence of a state of charging the circuit can be avoided after pre-charging has ended.

Abstract: A driver includes a driving block suitable for driving a data transferred through a first signal line to a second signal line, a first precharge unit suitable for precharging the second signal line with a first driving power during a first precharge operation; and a second precharge unit suitable for precharging the second signal line with a second driving power which is different from the first driving power during a second precharge operation performed subsequent to the first precharge operation.

Abstract: A memory is provided with a write assist circuit that responds to an indication that a write operation on a modeled memory cell is successful by releasing a negative bit line boost.

Abstract: Embodiments include a system, an apparatus, a device, and a method. The apparatus includes a processor, a dynamic memory, and a hardware-implemented memory control circuit. The hardware-implemented control circuit includes a control circuit for establishing an extended refresh period of the dynamic memory based at least in part on a monitored result that indicates an occurrence of a memory loss in the dynamic memory. The hardware-implemented control circuit also includes a control circuit for causing a refresh of the dynamic memory during each of at least two extended refresh periods.

Abstract: A semiconductor memory device is provided which includes a sense amplifier, a bit line connected to a plurality of memory cells of a first memory block, a complementary bit line connected to a plurality of memory cells of a second memory block, a first switch configured to connect the bit line to the sense amplifier, and a second switch configured to connect the complementary bit line to the sense amplifier. The first switch is configured to electrically separate the bit line from the sense amplifier when the second memory block performs a refresh operation.

Abstract: A semiconductor memory device and a method of operating the same are disclosed. The semiconductor memory device includes a memory cell array including memory blocks, a voltage generator configured to generate a precharge voltage; and a read and write circuit coupled to the memory blocks through bit lines, and configured to supply the precharge voltage to the bit lines when a selected memory block is accessed. Here, the precharge voltage varies depending on a distance between the read and write circuit and the selected memory block.

Abstract: A semiconductor apparatus includes a memory region configured to store data transmitted through a first data line and a second data line; and a precharge block configured to precharge the second data line to a level of a first voltage and precharge the first data line to a level of a second voltage higher than the level of the first voltage, based on a write signal.

Abstract: A method and circuit for implementing enhanced performance dynamic evaluation, and a design structure on which the subject circuit resides are provided. The dynamic evaluation circuit includes a combined precharge and keeper device connected to a precharge node. The dynamic evaluation circuit includes control logic providing a control input to the combined precharge and keeper device. The combined precharge and keeper device responsive to the control input holds the precharge node precharged when the precharge node is not discharged early in an evaluate cycle.

Abstract: Techniques and mechanisms for determining a write recovery time of a memory device. In an embodiment, thermal detection logic detects a signal from a thermal sensor indicating a temperature state of a resource of the memory device. A value of a write recovery parameter is set based on the signal from the thermal sensor. In another embodiment, command logic generates a signal to precharge one or more cells of the memory device. The write recovery parameter is used by timer logic to control a timing of the signal to precharge the one or more cells.

Abstract: Bit line sensing methods may be provided. The methods may include pre-charging a first bit line and a second bit line with a bit line pre-charge voltage. The first bit line may be connected to a first input terminal of a first inverter, and the second bit line may be connected to a second input terminal of a second inverter. The method may also include adjusting voltages of the first bit line and the second bit line corresponding to either threshold voltages of first and second pull-down circuits included in the first and second inverters respectively or threshold voltages of first and second pull-up circuits included in the first and second inverters respectively. The method may further include sharing charges of one of the first bit line and the second bit line with charges of a corresponding memory cell and amplifying a voltage difference between the first bit line and the second bit line.

Abstract: The present disclosure provides a sense amplifier. The sense amplifier includes a first inverting circuit, a second inverting circuit, a pre-charge circuit, a voltage adjusting circuit, and a discharge circuit. The first inverting circuit has a first input end and a first output end, and the second inverting circuit has a second input end and a second output end. The pre-charge circuit pulls up the voltage levels on the first and second output ends according to a power voltage during a pre-charge time period. The voltage adjusting circuit respectively receives a bit line voltage and a reference voltage during the pre-charge time period, and adjusts voltages on the first and second output ends respectively according to the voltage on the second and first receiving ends. The discharge circuit pulls down voltage levels on the first and second receiving ends of the voltage adjusting circuit during a discharge time period.

Abstract: Described is an apparatus which comprises: a complementary resistive memory bit-cell; and a sense amplifier coupled to the complementary resistive memory bit-cell, wherein the sense amplifier includes: a first output node; and a first transistor which is operable to cause a deterministic output on the first output node.

Abstract: Embodiments include apparatuses, methods, and systems related to an assist circuit that may be coupled to one or more components of a memory system to selectively lower a supply voltage that is delivered to the component. For example, the assist circuit may be coupled to a plurality of bitcells (e.g., register file bitcells). The assist circuit may selectively lower the supply voltage delivered to the bitcells during at least a portion of a write operation and/or during an inactive state of the bitcells. Additionally, or alternatively, the assist circuit may be coupled to a read circuit to selectively lower the supply voltage delivered to the read circuit during an inactive state of the read circuit. The assist circuit may include a control transistor coupled in parallel with one or more diodes between a main supply rail and a supply node of the bitcells and/or read circuit.

Abstract: Vertical cross-talk is reduced. A correction circuit includes a correction amount calculation unit that calculates a correction amount on the basis of input image data Din and that generates correction amount data U; a correction coefficient generation unit that generates correction coefficient data C which represents a correction coefficient decided upon in accordance with a position in a horizontal scanning direction of a data line to which input image data Din to be corrected is supplied; and a correction unit that corrects the input image data Din on the basis of the correction amount data U and the correction coefficient data C and thereby generates correction image data Dh.

Abstract: A circuit includes a first data line, a first plurality of memory cells coupled with the first data line, and a data transfer circuit coupled with the first data line. The data transfer circuit includes an output logic gate. The data transfer circuit is configured to, in a first operation mode in which the first plurality of memory cells is in a standby mode, set an output node of the output logic gate to be free from electrically coupled with a reference voltage and a supply voltage through the output logic gate. The data transfer circuit is configured to, in a second operation mode in which a memory cell of the first plurality of memory cells is selected to be read, set the output node of the output logic gate to be either electrically coupled with the reference voltage or with the supply voltage through the output logic gate.

Abstract: A method of equilibrating digit lines, a memory array, device, system and wafer for digit lines configured in an open digit line architecture. The digit lines are equilibrated by coupling a terminated end of a first digit line to an equilibration reference and coupling an unterminated end of a second digit line to the terminated end of the first digit line. The memory array is configured with the first and second digit lines arranged directly adjacent to each other.

Abstract: A semiconductor memory device comprises: first lines disposed in a first direction perpendicular to a substrate and extending in a second direction parallel to the substrate; second lines disposed in the second direction and configured to extend in the first direction, the second lines intersecting the first lines; and memory cells disposed at intersections of the first lines and the second lines and each including a variable resistance element. Furthermore, a third line extends in a third direction orthogonal to the first and second directions. A select transistor is connected between the second and third lines. A control circuit controls a voltage applied to the first and third lines, and the select transistor. The control circuit renders conductive at least one of the select transistors and thereby detect a current flowing in the third line, and determines a deterioration state of the select transistor according to a detection result.

Abstract: A self-refresh device, adopted in a memory array including a plurality of memory cells, includes a first word-line selecting module, which is enabled according to a first main-word-line signal, and a self-refresh controller. The first word-line selecting module includes a first selecting device, which selects a first word line according to a first word-line driving signal, and a second selecting device, which selects a second word line according to a second word-line driving signal. The self-refresh controller generates the first word-line driving signal, the second word-line driving signal, and the first main word-line signal to select one of the memory cells corresponding to the selected one of the first word line and the second word line for self-refreshing. When the first word line switches to the second word line, the self-refresh controller maintains the first main word-line signal at the same logic level.

Abstract: A method and various circuit embodiments for low latency initialization of an SRAM are disclosed. In one embodiment, an IC includes an SRAM coupled to at least one functional circuit block. The SRAM includes a number of storage location arranged in rows and columns. The functional circuit block and the SRAM may be in different power domains. Upon initially powering up or a restoration of power, the functional circuit block may assert an initialization signal to begin an initialization process. Responsive to the initialization signal, level shifters may force assertion of various select/enable signals in a decoder associated with the SRAM. Thereafter, initialization data may be written to the SRAM. Writing initialization data may be performed on a row-by-row basis, with all columns in a row being written to substantially simultaneously.

Abstract: A memory includes a word line, a bit line and a complementary bit line. A memory cell has a data node coupled to the bit line and a complementary data node coupled to the complementary bit line. The word line controls access to the memory cell. A circuit is coupled to the bit line and the complementary bit line. The circuit is configured to pull up to a high voltage, pull down to a low voltage, or float the bit line and the complementary bit line based on a first timing of pre-charging and a second timing of write driving. The first timing and the second timing are synchronized.

Abstract: A memory circuit including a memory cell configured to provide a charge, voltage, or current to an associated bit-line; a sense amplifier configured to sense the charge, voltage, or current on the bit-line; a word-line circuit configured to control a word-line of the memory cell; and a tracking circuit configured to track one or more conditions of the memory circuit and provide a timing control signal at an output operative to adaptively control the word-line circuit.

Abstract: A dynamic random access memory device includes a plurality of memory subblocks. Each subblock has a plurality of wordlines whereto a plurality of data store cells are connected. Partial array self-refresh (PASR) configuration settings are independently made. In accordance with the PASR settings, the memory subblocks are addressed for refreshing. The PASR settings are made by a memory controller. Any kind of combinations of subblock addresses may be selected. Thus, the memory subblocks are fully independently refreshed. User selectable memory arrays for data retention provide effective memory control programming especially for low power mobile application.

Abstract: A read operation for a memory device is provided. A selected word line, first and second global bit line groups and a selected first bit line group are precharged. A first cell current flowing through the selected word line, the first and the selected first bit line groups is generated. A first reference current flowing through the second global bit line group is generated. A first half page data is read based on the first cell current and the first reference current. The selected word line, the first and the second global bit line groups are kept precharged.

Abstract: An active precharge circuit for a non-volatile memory array which minimizes write disturb to non-selected memory cells during programming is disclosed. In a programming cycle, all bitlines are pre-charged to a program inhibit voltage level and held at the program inhibit voltage level with current or voltage sources coupled to each of the bitlines in a precharge operation and a following programming operation. In the programming operation, a bitline connected to a memory cell to be programmed is driven to a programming level, such as VSS, while the active precharge circuit is enabled to enable programming thereof. Because the other non-selected bitlines are held at the program inhibit voltage level, they will not be inadvertently programmed when the programming voltage is supplied by the word line.

Abstract: A semiconductor memory device is provided. A cell array includes a DRAM cell connected to one of a pair of bit lines. A bit line sense amplifier is coupled to the pair of bit lines. The bit line sense amplifier discharges a low-level bit line of the pair of bit lines toward a ground level and clamps the low-level bit line to a boosted sense ground voltage in response to a control signal. A sense amplifier control logic generates the control signal having a pulse interval. The low-level bit line is discharged toward the ground level for the pulse interval and after the pulse interval ends, the low-level bit line is clamped to the boosted sense ground voltage.

Abstract: A non-volatile semiconductor memory device includes a memory cell array including a first wire, a second wire crossing the first wire, and a memory cell connected to both the wires at a crossing portion of the first wire and the second wire, the memory cell including a variable resistance element storing data in a non-volatile manner by a resistance value, and a control circuit setting the variable resistance element in first or second resistance state by application of first or second voltage to the memory cell and reading data from the memory cell by application of third voltage to the memory cell. The control circuit applies to the memory cell at predetermined timing weak write voltage causing the variable resistance element to be held in the first resistance state and the second resistance state.

Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Abstract: In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.

Abstract: A semiconductor memory includes a sense amplifier which operates in response to activation of a sense amplifier enable signal and determines logic held in a nonvolatile memory cell according to a voltage of a bit line, the voltage varying with a cell current flowing through a real cell transistor, a replica cell transistor coupled in series between a first node and a ground line, and a timing generation unit. The timing generation unit activates the sense amplifier enable signal when the first node coupled to the ground line via the replica cell transistor changes from a high level to a low level. The replica cell transistor includes a control gate receiving a constant voltage and a floating gate coupled to the control gate. Thus, the activation timing of the sense amplifier can be optimally set in accordance with the electric characteristic of the memory cell.

Abstract: A method and apparatus for modifying a reference voltage between refreshes in a memory device are disclosed. The memory array may include a plurality of memory cells. The memory device may also include a sense amplifier. The sense amplifier may be configured to read data from the plurality of memory cells using a reference voltage. The memory device may also include a sense amplifier reference voltage modification circuit. The sense amplifier reference voltage modification circuit may be configured to detect a triggering event and modify the reference voltage in response to detecting a triggering event.

Abstract: A semiconductor memory device includes an active state detector suitable for detecting whether or not a predetermined time passes after a moment when a normal active command or an additional active pulse is activated in an active state detection mode, and generating an additional precharge pulse based on a detection result, a column controller suitable for generating the additional active pulse based on the additional precharge pulse, a column address, and an external column command in the active state detection mode, and a core region suitable for being activated based on the normal active command or an additional active command corresponding to the additional active pulse, and being precharged based on an additional precharge command corresponding to the additional precharge pulse or a normal precharge command.

Abstract: Examples described include precharge operations and circuitry for performing precharge operations. Digit lines may be driven to ground during a portion of example precharge operations. By driving the digit lines to ground, charge accumulating in bodies of vertical access devices may be discharged to the digit lines in some examples. To drive the digit lines to ground, a dynamic reference may be used where the reference is ground during one portion of the precharge operation and another value, which may be between two supply voltages (e.g. VCC/2), during another portion of the precharge operation.

Abstract: A semiconductor memory device and a method of operating the same are disclosed. The semiconductor memory device includes a memory cell array including memory blocks, a voltage generator configured to generate a precharge voltage; and a read and write circuit coupled to the memory blocks through bit lines, and configured to supply the precharge voltage to the bit lines when a selected memory block is accessed. Here, the precharge voltage varies depending on a distance between the read and write circuit and the selected memory block.

Abstract: A memory includes a plurality of memory blocks, a plurality of global bit lines, a common pre-charging circuit, and a selection circuit. Each memory block includes a pair of bit lines, and a plurality of memory cells coupled to the pair of bit lines. Each global bit line is coupled to at least one of the memory blocks. The pre-charging circuit is configured to pre-charge the global bit lines, one at a time, to a pre-charge voltage. The selection circuit is coupled between the pre-charging circuit and the global bit lines, and configured to couple the global bit lines, one at a time, to the pre-charging circuit.

Abstract: Some aspects of the present disclosure relate to write tracking techniques for memory devices. In some embodiments, a memory device includes an array of SRAM cells, wherein each SRAM cell includes a pair of cross-coupled inverters having complimentary storage nodes, and a pair of access transistors that allow selective access to the complimentary storage nodes, respectively. To help ensure that wordline and bitline pulses are of sufficient length and intensity, one or more write tracking cells track a wordline tracking signal, which is representative of a wordline pulse applied to a wordline. In response to the wordline tracking signal, the write tracking cell internally generates a signal that models bitline loading, and provides an output tracking signal based on the wordline tracking and bitline loading signals. Bitline and/or wordline pulses can then be set based on the output tracking signal.

Abstract: A semiconductor memory device includes a sense amplifier circuit region including first wells disposed in a first direction, a driving circuit region including second wells disposed in a second direction, and a conjunction region disposed at an intersection region of the sense amplifier circuit region and the driving circuit region, a part of each of the first wells extending from the sense amplifier circuit region into the conjunction region, and the second wells being outside of the conjunction region.