Abstract: A radiation hardened memory element includes at least two delay elements for maintaining radiation hardness. In an example, the memory element is an SRAM cell. Both delays are coupled together in series so that if either one of the delays fails, a delay will still be maintained within the SRAM cell. The critical areas of the delays may be positioned so that a common line of sight cannot be made between each delay and a circuit node.

Abstract: Described herein are various principles for designing, manufacturing, and operating integrated circuits having functional components and one or more metal interconnect layers, where the dimensions of signal lines of the metal interconnect layers are larger than dimensions of the functional components. In some embodiments, a signal line may have a width greater than a width of a terminal of a functional component to which the signal line is connected. In some embodiments, two functional components formed in a same functional layer of the integrated circuit may be connected to metal signal lines in different metal interconnect layers. Further, the metal signal lines of the different metal interconnect layers may overlap some distance.

Abstract: A memory circuit includes a bit cell that receives a word line, complementary bit lines and an array supply voltage; a word line driver coupled to the word line, the word line driver receiving one of the array supply voltage and a periphery supply voltage; and a word line suppression circuit coupled to the word line. The word line suppression circuit includes a diode and a switch coupled in series. The switch is responsive to the array supply voltage. The word line suppression circuit limits a word line voltage to a value lower than the array supply voltage such that the static noise margin (SNM) of the bit cell is increased.

Abstract: Circuits, devices and methods are provided, such as an amplifier (e.g., a voltage regulator) that includes a feedback circuit that supplies negative feedback through a feedback path. One such feedback path includes a capacitance coupled in series with a “one-way” isolation circuit through which a feedback signal is coupled. The “one-way” isolation circuit may allow the feedback signal to be coupled from a “downstream” node, such as an output node, to an “upstream” node, such as a node at which an error signal is generated to provide negative feedback. However, the “one-way” isolation circuit may substantially prevent variations in the voltage at the upstream node from being coupled to the capacitance in the isolation circuit. As a result, the voltage at the upstream node may quickly change since charging and discharging of the capacitance responsive to voltage variations at the upstream node may be avoided.

Abstract: A monitoring circuit and method, wherein a voltage waveform having a linear falling edge is applied to a first node of at least one test memory cell (e.g., a plurality of test memory cells connected in parallel). The input voltage at the first node is captured when the output voltage at a second node of the test memory cell(s) rises above a high reference voltage during the falling edge. Then, a difference is determined between the input voltage as captured and either (1) the output voltage at the second node, as captured when the input voltage at the first node falls below the first reference voltage during the falling edge, or (2) a low reference voltage. This difference is proportional to the static noise margin (SNM) of the test memory cell(s) such that any changes in the difference noted with repeated monitoring are indicative of corresponding changes in the SNM.

Abstract: A semiconductor memory apparatus includes a plurality of memory banks, wherein each memory bank includes a bank control unit configured to reduce a voltage level of a first node to a ground voltage level when the memory bank is selected to perform a predetermined operation; an error control unit configured to supply an external voltage to the first node when the memory bank is not selected to perform the predetermined operation; and a signal generation unit configured to generate a bank operation signal in response to the voltage level of the first node.

Abstract: In at least one embodiment, a sense amplifier circuit includes a pair of bit lines, a sense amplifier output, a keeper circuit, and a noise threshold control circuit. The keeper circuit is coupled to the pair of bit lines and includes an NMOS transistor coupled between a power node and a corresponding one of the pair of bit lines. The keeper circuit is sized to supply sufficient current to compensate a leakage current of the corresponding bit line and configured to maintain a voltage level of the corresponding bit line. The noise threshold control circuit is connected to the sense amplifier output and the pair of bit lines. The noise threshold control circuit comprises a half-Schmitt trigger circuit or a Schmitt trigger circuit.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of an operational amplifier.

Abstract: A semiconductor memory device comprises a memory cell; a first bit line and a second bit line connected to the memory cell; and a sense amplifier operative to amplify the voltage between the first and second bit lines. The sense amplifier includes a first and a second drive transistor configuring a transistor pair for differential amplification, and a first and a second capacitor connected between the sources of the first and second drive transistors and a source control terminal, respectively. The sense amplifier precharges the first and second drive transistors on the drain side prior to sensing, thereby holding the threshold information on the first and second drive transistors in the first and second capacitors, and compensates for the source voltages on the first and second drive transistors by the threshold information held in the first and second capacitors at the time of sensing.

Abstract: A semiconductor memory device includes a first page buffer group including a plurality of page buffers coupled to memory cells of a first memory array through bit lines, a second page buffer group, a coupling circuit configured to couple an output terminal and an inverse output terminal of a selected page buffer of the first page buffer group to a first local I/O line and a first inverse local I/O line, respectively, or an output terminal and an inverse output terminal of a selected page buffer of the second page buffer group to a second local I/O line and a second inverse local I/O line, respectively, in response to a column select signal, and a sense amplifier configured to detect a voltage difference between the first local I/O line and the first inverse local I/O line or between the second local I/O line and the second inverse local I/O line.

Abstract: A semiconductor device has a ZQ circuit (40) which generates impedance control information and an output buffer having an impedance controlled in response to the impedance control information. A plurality of control bits constituting the impedance control information are serially transferred from the ZQ circuit.

Abstract: A read process for a 3D stacked memory device provides an optimum level of channel boosting for unselected memory strings, to repress both normal and weak-erase types of read disturbs. The channel is boosted by controlling of voltages of bit lines (Vbl), drain-side select gates (Vsgd_unsel), source-side select gates (Vsgs_unsel), a selected level (word line layer) of the memory device (Vcg_sel), and unselected levels of the memory device (Vcg_unsel). A channel can be boosted by initially making the drain-side and source-side select gates non-conductive, to allow capacitive coupling from an increasing Vcg_unsel. The drain-side and/or source-side select gates are then made conductive by raising Vsgd_unsel and/or Vsgs_unsel, interrupting the boosting. Additionally boosting can occur by making the drain-side and/or source-side select gates non-conductive again while Vcg_unsel is still increasing. Or, the channel can be driven at Vbl.

Abstract: Memories, sense amplifiers, and methods for amplifying a current input are disclosed, including a sense amplifier including a bias circuit configured to provide a bias voltage having a magnitude responsive to maintaining a substantially constant loop gain, and further including an amplifier stage coupled to the bias circuit to receive the bias voltage and configured to amplify a input current at an input-output node, a loop gain of the current amplifier stage is controlled at least in part to the bias voltage.

Abstract: An apparatus is described that is configured to modify a signal to at least substantially remove a noise portion from the signal. In one or more implementations, the apparatus is a collaborative filtering module that is configured to communicatively couple to a memory array having a plurality of memory cell blocks. The memory array is configured to furnish a signal representative of data stored within the plurality of memory cell blocks. The collaborative filtering module is configured to determine a noise distribution associated with the plurality of memory cell blocks and generate a noise prediction, which is based upon the noise distribution, when a read operation for the plurality of memory cell blocks is issued. The collaborative filtering module is also configured to modify the signal utilizing the noise prediction to at least substantially remove noise from the signal.

Abstract: Memory devices and methods are provided for reducing simultaneous switching output noise and power supply noise during burst data write and refresh operations. An embodiment of a memory device according to the present invention includes a first power domain coupled to some of the components of the memory device and a second power domain coupled to different components of the memory device. One or more distributed power domain coupling circuits may be coupled to the first and second power domains. The power domain coupling circuit includes a controller configured to generate an enable signal responsive to control signals, data signals, or any combination thereof. The power domain coupling circuit also includes coupling circuitry coupled to the first and second power domains and coupled to the controller. The coupling circuitry is configured to couple the first and second power domains together responsive to the enable signal.

Abstract: Methods, apparatuses, and integrated circuits for measuring leakage current are disclosed. In one such example method, a word line is charged to a first voltage, and a measurement node is charged to a second voltage, the second voltage being less than the first voltage. The measurement node is proportionally coupled to the word line. A voltage on the measurement node is compared with a reference voltage. A signal is generated, the signal being indicative of the comparison. Whether a leakage current of the word line is acceptable or not can be determined based on the signal.

Abstract: A method of setting a reference current of a nonvolatile memory device comprises measuring a noise characteristic of each of multiple reference cells, and selecting at least one of the reference cells as a reference cell for generating a reference current according to the measured noise characteristics.

Abstract: The semiconductor device includes a termination control unit configured to generate a termination enable signal and termination resistance information in response to termination activation information, dynamic activation information, normal resistance information, and dynamic resistance information wherein the termination enable signal is activated when a delay lock loop is inactivated, and a termination unit configured to be controlled in response to the termination enable signal and terminate an interface pad by using a resistance value determined by the termination resistance information.

Abstract: There is provided a technique for ensuring both an SNM and a write margin simultaneously in a semiconductor device having static memory cells. A semiconductor device has a plurality of static memory cells. The semiconductor device includes a memory cell array having the static memory cells arranged in a matrix, a temperature sensor circuit for sensing a temperature in the semiconductor device, and a word driver for controlling a voltage supplied to a word line of the memory cell array based on an output of the temperature sensor circuit at the time of writing to or reading from a memory cell.

Abstract: In a sense circuit for DRAM memory cell a switch is provided between the bit line BL and local bit line LBL connected to the memory cells for isolation and coupling of these bit lines. The bit line BL is precharged to the voltage of VDL/2, while the local bit line LBL is precharged to the voltage of VDL. VDL is the maximum amplitude voltage of the bit line BL. A sense amplifier SA comprises a first circuit including a differential MOS pair having the gate connected to the bit line BL and a second circuit connected to the local bit line LBL for full amplitude amplification and for holding the data. When the bit line BL and local bit line LBL are capacitance-coupled via a capacitor, it is recommended to use a latch type sense amplifier SA connected to the local bit line LBL.

Abstract: A static random access memory (SRAM) cell having a dedicated read port separated from a write port comprises a first and a second bit-line placed in parallel forming a complimentary bit-line pair for the dedicated read port, a first and second metal line adjacently flanking in both side of and in parallel to the first bit-line, the first and second metal line being formed in the same metal layer as the first bit-line and having a first and second predetermined distance to the first bit-line, respectively, and a third and fourth metal line adjacently flanking in both side of and in parallel to the second bit-line, the third and fourth metal line being formed in the same metal layer as the second bit-line and having a third and fourth predetermined distance to the second bit-line, respectively, wherein the first predetermined distance is equal to the third distance and the second predetermined distance is equal to the fourth distance for keeping the first and second bit-lines having balanced capacitance loading

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: Described herein is an apparatus for dynamically adjusting a voltage reference level for optimizing an I/O system to achieve a certain performance metric. The apparatus comprises: a voltage reference generator to generate a voltage reference; and a dynamic voltage reference control unit, coupled with the voltage reference generator, to dynamically adjust a level of the voltage reference in response to an event. The apparatus is used to perform the method comprising: generating a voltage reference for an input/output (I/O) system; determining a worst case voltage level of the voltage reference; dynamically adjusting, via a dynamic voltage reference control unit, the voltage reference level based on determining the worst case voltage level; and computing a center of an asymmetrical eye based on the dynamically adjusted voltage reference level.

Abstract: Methods and apparatus for providing finFET SRAM cells. An SRAM cell structure is provided including a central N-well region and a first and a second P-well region on opposing sides of the central N-well region, having an area ratio of the N-well region to the P-well regions between 80-120%, the SRAM cell structure further includes at least one p-type transistor formed in the N-well region and having a gate electrode comprising a gate and a gate dielectric over a p-type transistor active area in the N-well region; and at least one n-type transistor formed in each of the first and second P-well regions and each n-type transistor having a gate electrode comprising a gate and a gate dielectric over an n-type transistor active area in the respective P-well region. Methods for operating the SRAM cell structures are disclosed.

Abstract: A memory interface circuit is provided, comprising: a first signal output circuit configured to output a first signal via a first signal line to a first I/O terminal; a second signal output circuit configured to output a second signal via a second signal line to a second I/O terminal; and a noise cancellation circuit having at least one phase adjusting element and at least one gain adjusting element to reduce a noise signal induced on the second signal line due to the presence of the first signal on the first signal line, wherein the second signal line is disposed adjacent to the first signal line.

Abstract: There is provided a non-volatile storage device including: a bit line that is connected to a non-volatile storage element and is applied with a voltage of magnitude corresponding to the logic value stored in the storage element; a charging section that charges the bit line to a voltage of equivalent magnitude to the reference voltage; a voltage generation section that is connected between the reference voltage line and the bit line, comprises a capacitance load for generating coupling charge when charging by the charging section has been performed, and employs the capacitance load to generate a voltage according to a difference between the magnitude of the voltage of the reference voltage line and the magnitude of the voltage of the bit line as a voltage expressing the comparison result; and a charge absorbing section for absorbing the coupling charge generated by the capacitance load.

Abstract: A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage.

Abstract: A method and apparatus for accessing a non-volatile memory cell. In some embodiments, a memory block provides a plurality of memory cells arranged into rows and columns. A read circuit is configured to read a selected row of the memory block by concurrently applying a control voltage to each memory cell along the selected row and, for each column, using a respective local sense amplifier and a column sense amplifier to successively differentiate a voltage across the associated memory cell in said column to output a programmed content of the row.

Abstract: An output driving circuit includes a first pull-up transistor, a first pull-down transistor and a second pull-down transistor. The first pull-up transistor is configured to generate a first output signal at the output node in response to a first control signal. The first pull-down transistor is configured to generate a second output signal at the output node in response to a second control signal. The second pull-down transistor is configured to connect the output node to the first ground voltage in response to a third control signal. The memory device including the output driving circuit may be insensitive to noise and may have little data transmission error.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A semiconductor memory device comprises a cell array, voltage generation circuits, and a control circuit. The cell array comprises memory cell strings. The voltage generation circuits are arranged below the cell array. Each of the memory cell strings comprises a semiconductor layer, control gates, and memory cell transistors. The semiconductor layer comprises a pair of pillar portions, and a connecting portion. The control gates intersect the pillar portion. The memory cell transistors are formed at intersections of the pillar portion and the control gates. In a write operation and a read operation, the control circuit does not drive voltage generation circuits which give noise to memory cell strings as a write target and a read target, and drives voltage generation circuits which do not give noise to the memory cell strings as the write target and the read target.

Abstract: A semiconductor device has a hierarchical bit line structure and comprises first and second local bit lines transmitting first and second signals of first and second memory cells corresponding to a selected word line, and first and second global bit lines electrically connected to the first and second local bit lines through first and second switches, first and second sense amplifiers connected to the first and second global bit lines, and a control circuit. During a first period after the first and second memory cells are simultaneously accessed, the control circuit controls the first switch to conduction state so that the first sense amplifier amplifies the first signal and controls the second switch to non conduction state. During a second period after sensing of the first sense amplifier finishes, the control circuit controls the second switch to conduction state so that the second sense amplifier amplifies the second signal.

Abstract: A method includes performing a write operation on memory cells of a memory array to a first logic state using a voltage of a charge pump. A portion of the write operation is performed on the memory cells of the memory array using the voltage of the charge pump. A level of the voltage is compared to a reference. If the level of the voltage is below the reference, the write operation is continued with an increased level of the voltage by reducing load on the charge pump by providing the voltage on a reduced number of memory cells, wherein the reduced number of memory cells is a first subset of the memory cells.

Abstract: A high density, low voltage, and low-power one time programmable (OTP) memory is based on core cells with a one transistor design. A CLEAN pulse is directed to a single shunt device at the output of the column decoder so spurious charges that may have been stored in the floating nodes can be cleaned up. Such arrangement also allows for the simultaneous initialization of bit lines, data lines, and sensing lines to zero. Core area layout size is substantially reduced, and operational power requirements are exceeding low making these particularly suitable in HF and UHF RFID applications.

Abstract: An embodiment includes configuring a current-limiting device to place along a power-supply bus to limit current through a first complimentary-metal-oxide semiconductor (CMOS) circuit coupled to the power-supply bus so that current does not exceed a trigger current level of a pnpn diode in a second CMOS circuit coupled to the power bus.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: A data input circuit includes a valid strobe signal generation circuit and a data strobe signal counter. The valid strobe signal generation circuit is configured to remove a pulse of an internal strobe signal generated and generate a valid strobe signal. The pulse may have been generated during a preamble period. The data strobe signal counter is configured to count the valid strobe signal according to burst length information and generate a write latch signal for aligning data at a time of a write operation.

Abstract: Systems and methods for determining optimal memory device precharge voltages are provided herein. In addition, systems and methods for providing localized sense amplification and circuit assist circuitry are described herein. Embodiments provide for determining precharge multipliers that may be used to determine the optimal precharge voltage based on a precharge source voltage. According to embodiments, the precharge source voltage may be Vdd or Vcs. Optimizing the precharge voltage maximizes memory device performance and functional characteristics, including, but not limited to, stability, efficiency, power, writability, and reliability.

Abstract: An electronic circuit for which a coil 22 is disposed overlapping with a memory array region to carry out communications by inductive coupling between stacked and mounted chips by the coil 22. Because intersections 1 and 2 between the coil 22 and a bit line 15 are located at a pair of positions that are equal to each other in wiring length from both terminals a and g of the coil 22, interference from the bit line 15 to the coil 22 results in the same phase and same amplitude at both ends of the coil 22, and can thus be eliminated by a differential amplifier. Thereby, a coil antenna can be disposed so that, even when a coil antenna to carry out communications by inductive coupling is disposed overlapping with a memory array region, little interference occurs from a memory array wiring to communications by the coil antenna.

Abstract: In some embodiments related to a memory array, a sense amplifier (SA) uses a first power supply, e.g., voltage VDDA, while other circuitry, e.g., signal output logic, uses a second power supply, e.g., voltage VDDB. Various embodiments place the SA and a pair of transferring devices at a local IO row, and a voltage keeper at the main IO section of the same memory array. The SA, the transferring devices, and the voltage keeper, when appropriate, operate together so that the data logic of the circuitry provided by voltage VDDB is the same as the data logic of the circuitry provided by voltage VDDA.

Abstract: A semiconductor device may include, but is not limited to, a first signal line, a second signal line, and a first shield line. The first signal line is supplied with a first signal. The first signal is smaller in amplitude than a potential difference between a power potential and a reference potential. The second signal line is disposed in a first side of the first signal line. The second signal line is supplied with a second signal. The second signal is smaller in amplitude than the potential difference. The first shield line is disposed in a second side of the first signal line. The second side is opposite to the first side. The first shield line reduces a coupling noise that is applied to the first shield line from the second side.

Abstract: A memory circuit includes a bit cell that receives a word line, complementary bit lines and an array supply voltage; a word line driver coupled to the word line, the word line driver receiving one of the array supply voltage and a periphery supply voltage; and a word line suppression circuit coupled to the word line. The word line suppression circuit includes a diode and a switch coupled in series. The switch is responsive to the array supply voltage. The word line suppression circuit limits a word line voltage to a value lower than the array supply voltage such that the static noise margin (SNM) of the bit cell is increased.

Abstract: The demand for reducing the size and increasing the degree of integration of semiconductor memory devices has increased. In a semiconductor memory device, a smoothing capacitor which has to be provided therein for stabilizing a power supply voltage etc. is formed in an underlying layer of memory cells A and B to overlap the two memory cells A and B which are adjacent each other. Thus, an area occupied by the smoothing capacitor having a large capacity can be reduced to increase the degree of integration, and the smoothing capacitor having a large capacity can be provided in the semiconductor memory device.

Abstract: A process-tolerant large-swing sense amplifier with latching capability includes top-array and bottom-array access. The sense amplifier provides improved tolerance to process variation, reduces design complexity, reduces power consumption, and reduces the physical footprint of the circuit. In addition, the sense amplifier provides write-through functionality through the read data bus.

Abstract: A method of controlling a vertical dual-gate DRAM provides a short circuit state, a clearing state and a false broken circuit state. In the short circuit state, a first gate and a second gate at two sides of a first pillar are controlled to respectively have a turn-on voltage to form electric connection between a drain and a source at two ends of the first pillar. In the clearing state, the first gate and second gate are controlled to respectively have a clearing voltage to disconnect electric connection between the drain and source at two ends of the first pillar. The false broken circuit state is entered after the clearing state has been finished. The invention does not separate gates between neighboring pillars, but controls ON/OFF of transistors electrically so that no current leakage is generated in the clearing state and problem of inaccurate data reading can be prevented.

Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A dynamic wordline assist circuit for improving performance of an SRAM. An SRAM is disclosed that includes a plurality of memory cells, wherein each memory cell is coupled to a wordline and a pair of bitlines; and a wordline assist circuit coupled to the wordline, wherein the wordline assist circuit includes a first input for activating the wordline assist circuit during a read or write cycle and includes a second input for deactivating the wordline assist circuit during the read or write cycle after a delay.

Abstract: A method for data storage includes providing at least first and second readout configurations for reading storage values from analog memory cells, such that the first readout configuration reads the storage values with a first sense time and the second readout configuration reads the storage values with a second sense time, shorter than the first sense time. A condition is evaluated with respect to a read operation that is to be performed over a group of the memory cells. One of the first and second readout configurations is selected responsively to the evaluated condition. The storage values are read from the group of the memory cells using the selected readout configuration.

Abstract: A memory interface circuit is provided, comprising: a first signal output circuit configured to output a first signal via a first signal line to a first I/O terminal; a second signal output circuit configured to output a second signal via a second signal line to a second I/O terminal; and a noise cancellation circuit having at least one phase adjusting element and at least one gain adjusting element to reduce a noise signal induced on the second signal line due to the presence of the first signal on the first signal line, wherein the second signal line is disposed adjacent to the first signal line.