Abstract: A semiconductor memory device is disclosed, which includes a memory cell array including a plurality of memory cells, a built-in self-test circuit which writes test pattern data including binary 0 and binary 1 in the memory cells in units of a page to perform a test for the memory cells, a plurality of sense amplifiers which hold a plurality of data read from the memory cells in units of a page, and a detection circuit which collectively detects the plurality of data held by the sense amplifiers and outputs a detection result to the built-in self-test circuit.

Abstract: A semiconductor storage device according to one aspect of the present invention includes a reference voltage source connected to a capacitor of a cell included in a memory, a buffer circuit holding data to be written in the cell, and a counter noise generator outputting a counter noise current canceling a noise current generated by rewriting the data in the cell to the reference voltage source according to the data held in the buffer circuit.

Abstract: A memory array includes a sensing circuit for sensing bit line current while keeping the voltage of the selected bit line substantially unchanged. The word lines and bit lines are biased so that essentially no bias voltage is impressed across half-selected memory cells, which substantially eliminates leakage current through half-selected memory cells. The bit line current which is sensed arises largely from only the current through the selected memory cell. A noise detection line in the memory array reduces the effect of coupling from unselected word lines to the selected bit line. In a preferred embodiment, a three-dimensional memory array having a plurality of rail-stacks forming bit lines on more than one layer, includes at least one noise detection line associated with each layer of bit lines. A sensing circuit is connected to a selected bit line and to its associated noise detection line.

Abstract: A multi-level dynamic memory device includes a bit line pair that is divided into a main bit line pair and a sub-bit line pair, first and second sense amplifiers that are connected between the main bit line pair and between the sub-bit line pair, first and second coupling capacitors that are cross-coupled between the main bit pair and the sub-bit pair, respectively; and first and second correction capacitors that are connected in parallel to the first and second coupling capacitors, respectively, and whose capacitance is adjusted by a control voltage signal.

Abstract: The present invention provides a sensing scheme for semiconductor memory. N-type devices coupling between ground and a bit line and a bit line-bar of memory cells quickly discharge a bit line and a bit line-bar during non-accessing mode. During data accessing mode, one P-type device of an SRAM memory cell pulls up bit line or bit line-bar node slowly to minimize the inductive coupling noise and VDD, Ground bouncing, hence allows smaller amount of differential voltage input to the sense amplifier and results in lower power consumption. A self-timer counts the needed time and sends a signal to enable the current driven sense amplifier and to turn off the word line to avoid further pulling up the bit line or bit line-bar voltage and to reduce the power dissipation.

Abstract: A shielding circuit for preventing a sense current of a target cell from the influence of a source current of first adjacent cell includes a pre-discharge device, first and second biasing units, first and second voltage pull-down units, and a connection units. The pre-discharge device is for setting the voltage of the sense node to a negative voltage. The first and second biasing units are for biasing the source voltage of the target and the first adjacent cell equal to a biasing voltage, respectively. The first and second voltage pull-down units are for pulling down the source voltage of the target and the first adjacent cell closing to a ground level, respectively. The connection unit is for receiving and outputting the sense current passing through the first biasing unit to the sense node.

Abstract: A write operation is performed in a memory device. During a first stage of the write operation, a signal is applied to gating circuitry at a first voltage level for coupling a data bus line to a bit line when the data bus line is unmasked and for decoupling the data bus line from the bit line when the data bus line is masked. During one or more subsequent stages of the write operation, the signal voltage level is changed for enabling completion of the write operation.

Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A data input/output circuit of a semiconductor memory device has a data inversion determination function. In an input mode, the data input/output circuit inverts an input data group in response to an input inversion flag and transmits the inverted input data group to a memory cell array. In an output mode, the data input/output circuit inverts a data group, output from the memory cell array, when the output data group satisfies a predetermined inversion condition, and transmits the inverted output data group to the outside of the data input/output circuit. In this case, an output inversion flag, indicating that the output data group is to be inverted, is generated. Further, the data input/output circuit stores the input inversion flag in the memory cell array in the input mode, and compares the input inversion flag, stored in the memory cell array, with the output inversion flag in the output mode.

Abstract: A flash memory device includes a core region, high-voltage pump regions disposed at one side of the core region, and a peripheral control region disposed at one side of the core region and between the high-voltage pump regions.

Abstract: Memory devices configured to reduce coupling noise between adjacent wordlines in a memory array. More specifically, wordline drivers are interleaved such that adjacent wordlines are driven by wordline drivers enabled by different row decoders. Each wordline driver includes a weak transistor to ground and a strong transistor to ground. By disabling the wordline driver on the wordlines directly adjacent to the active wordlines, a path is provided to drive the coupling noise from the active wordline to ground through the strong transistor.

Abstract: A compact dynamic random access memory (DRAM) cell and highly efficient methods for using the DRAM cell are disclosed. The DRAM cell provides reading, writing, and storage of a data bit on an ASIC chip. The DRAM cell includes a first transistor acting as a pass gate and having a first source node, a first gate node, and a first drain node. The DRAM cell also includes a second transistor acting as a storage device and having a second drain node that is electrically connected to the first drain node to form a storage node. The second transistor also includes a second source node and a second gate node. The second source node is electrically floating, thus increasing the effective storage capacitance of the storage node.

Abstract: A word line driver is provided for accessing a DRAM cell embedded in a conventional logic process. The DRAM cell includes a p-channel access transistor coupled to a cell capacitor. The word line driver includes an n-channel transistor located in a p-well, wherein the p-well is located in a deep n-well. The deep n-well is located in a p-type substrate. A word line couples the drain of the n-channel transistor to the gate of the p-channel access transistor. A negative boosted voltage supply applies a negative boosted voltage to the p-well and the source of the n-channel transistor. The negative boosted voltage is less than ground by an amount equal to or greater than the threshold voltage of the p-channel access transistor. The deep n-well and the p-type substrate are coupled to ground. The various polarities can be reversed in another embodiment.

Abstract: A semiconductor memory device includes a memory cell array, an output buffer circuit and an input buffer circuit. The memory cell array includes a plurality of memory cells holding data. The output buffer circuit outputs data read from the memory cells. The input buffer circuit receives an address signal for the memory cells and includes a noise filter to remove noise. The filter length of the noise filter is variable according to the output capability of the data in the output buffer circuit.

Abstract: A circuit for removing noise from an input signal includes a falling edge signal delaying circuit configured to output a first delay output signal generated by delaying a falling edge of a first output signal for a preset time; a falling edge sensing circuit configured to sense the falling edge of the first output signal, and generate a pulse signal in accordance with the sense; a flip-flop configured to output the first delay output signal in accordance with an input clock signal; and a first logic operation circuit configured to perform a logic operation on an output signal of the flip-flop and the first output signal delayed for the preset time, thereby generating a second output signal.

Abstract: A sense amplifier overdriving circuit includes a first voltage driver which supplies an internal voltage from an internal voltage terminal to a sense amplifier in response to a first enabling signal, a logic unit which logically operates a block select signal for selection of a cell block and a second enabling signal enabled for a predetermined time after enabling of the first enabling signal, and outputs the resultant signal, and a second voltage driver which supplies an external voltage to the internal voltage terminal in response to the signal output from the logic unit. The sensing amplifier overdriving circuit may be used in a semiconductor device.

Abstract: The disclosed embodiments relate to a method and apparatus for identifying short circuits in an integrated circuit device. The method may comprise the acts of programming a first memory cell associated with a first digit line to a first data value, programming a second memory cell associated with a second digit line to a second data value, the second data value being complementary with respect to the first data value, firing a first sense amplifier associated with the first digit line, firing a second sense amplifier associated with the second digit line after a time delay with respect to the act of firing the first sense amplifier associated with the first digit line, detecting a measured data value associated with the second digit line, and comparing the measured data value to the second data value to determine whether the first digit line is short circuited to the second digit line.

Abstract: A serial power capacitor device is provided which includes a noise suppressing circuit which includes a plurality of capacitive elements for suppressing a power noise, and a stabilizing circuit which stabilizes an operation of the noise suppressing circuit by compensating for variations in leakage current of the capacitive elements. The plurality of capacitive elements may, for example, be a plurality of power capacitors connected in series between a power source voltage and a ground voltage, and the stabilizing circuit may, for example, include a plurality of resistors connected in series between the power source voltage and the ground voltage. The resistors may, for example, be connected in parallel to the respective power capacitors, and a resistive value of each of the resistors may, for example, be less than an intrinsic resistive value of the power capacitors, respectively. The capacitive elements may, for example, be formed by DRAM cells or by metal oxide semiconductor (MOS) transistors.

Abstract: A data bus inversion (DBI) circuit includes at least one DBI block configured to invert an input data signal based on the logic state of input data bits. The DBI block includes a comparison deciding unit configured to generate, in a first mode, a comparison signal based on the number of changed bits by comparing respective bit signals of the input data signal and a previous input data signal. The comparison deciding unit generates an inversion control signal which controls whether the input data will be inverted or not. In a second mode, the comparison deciding unit generates an inversion control signal based on the predominant logic state of the input data signal bits. A data converting unit is configured to invert the input data signal in response to the inversion control signal. Method embodiments are also disclosed.

Abstract: A memory device including a circuit for actively driving a reference voltage in a memory device is disclosed. A circuit integrated in a memory device and coupled to an external voltage source substantially eliminates fluctuations in the reference voltage of the memory device caused by power supply changes and noise occurring in the memory device by generating a constant voltage and good current drive from the external voltage source.

Abstract: The present invention provides a method of decreasing program disturb in memory cells, comprising: finding an initial programming condition that ensure programming memory cell normally; selecting one parameter from the initial programming condition as a variable for the program disturb test; performing the program disturb test to the memory cell for at least two values of the variable; obtaining a programming condition with minimum program disturb based on the result of the program disturb test; and applying the programming condition with minimum program disturb as the programming condition for memory cell. The method according to the present invention can minimize the program disturb for the memory cell and can be performed easily.

Abstract: The present invention provides a method for decreasing program disturb in memory cells, comprising: finding an initial programming condition that ensures programming memory cell normally; selecting two parameters from the initial programming condition as variables for a program disturb test; performing the program disturb test to the memory cell for at least two combined values of the variables; obtaining a programming condition with minimum program disturb based on the result of the program disturb test; and applying the programming condition with minimum program disturb as the programming condition for memory cell. The method according to the present invention can minimize the program disturb in memory cells and can be performed easily.

Abstract: A dynamic random access memory (DRAM) is provided that has separate array and peripheral power busing to isolate array noise from peripheral circuits such as delay lock loops during row activations and read/write memory operations. A switch connects the array power bus to another separate power bus for a limited period of time during a DRAM refresh cycle to provide additional current to the DRAM arrays. The switch disconnects the array power bus from the other power bus preferably before the end of the refresh cycle.

Abstract: A set of memory cell test structures and a method for assessing of the static noise margin (SNM) of a memory cell or cells, using discrete point measurement structures provided either on-chip or within the scribe lines. A set of memory structures may comprise first and second test structures, individually comprising a memory cell, having one or more left and right half-bit test structures having hard-wired connections between select nodes of each memory cell half-bit and one or more voltage supplies. The half-bits of the first test structure are configured for measuring respective left and right standby SNM values, and the half-bits of the second test structure are configured for measuring respective left and right cell ratio values at respective output nodes of the structures, using applied supply voltages for on-chip assessment of the static noise margin of the memory cells.

Abstract: A circuit for eliminating a skew between data and a clock signal in an interface between a semiconductor memory device and a memory controller includes an edge information storage unit which stores edge information output from the semiconductor memory device, a pseudo data pattern generating unit which outputs pseudo data including a pattern similar to actually transmitted data, a phase detecting unit which receives the edge information from the edge information storage unit and the pseudo data from the pseudo data pattern generating unit to detect a phase difference between the data and the clock signal and generate a corresponding detection result, and a phase control unit which controls a phase of the clock signal according to the corresponding detection result from the phase detecting unit, so as to eliminate a per-data input/output pin skew in a data write and read operation of the semiconductor memory device.

Abstract: Certain embodiments of the inventions provide an integrated circuit (IC) having a processor operatively coupled to a PVT (process-voltage-temperature) source and an adjustable memory. The processor receives from the source an input characterizing the present PVT condition and generates a command for the memory based on that input. In response to the command, the memory adjusts its internal circuit structure, clock speed, and/or operating voltage(s) to optimize its performance for the present PVT condition. Advantageously, the ability to adjust the memory so that it can maintain its functionality and deliver an acceptable level of performance under unfavorable PVT conditions provides additional flexibility in choosing circuit design options, which can produce area savings and/or increase the yield of acceptable ICs during manufacture.

Abstract: A Static Random Access Memory (SRAM) matrix with a read assist is described. The read assist reduces the probability associated with an SRAM matrix becoming upset by a radiation event. Each SRAM cell within the SRAM matrix includes an active delay for increasing Single Event Upset (SEU) tolerance. The described SRAM matrix also includes a read assist coupled to each column of the SRAM matrix. The read assists store values associated with a row of SRAM cells, one SRAM cell of which is to be written to. If a radiation event occurs on any of the SRAM cells not being written to, the read assist restores an original value associated with the upset SRAM cell.

Abstract: A semiconductor memory device comprising: a sense amplifier which includes a pair of first NMOS transistors and a pair of PMOS transistors connected to a bit line pair as a complementary pair; a back bias generating circuit which generates a back bias voltage to be applied to the first NMOS transistors in a state in which a predetermined current is flowing through a second NMOS transistor having approximately the same operating characteristic as that of the first NMOS transistors, and performs a feedback control in response to a threshold voltage of the second NMOS transistor; and control means which performs control in a sensing operation of the sense amplifier such that the pair of first NMOS transistors operates previously and after a lapse of a predetermined time the pair of first PMOS transistors operates.

Abstract: An apparatus and method for improving the performance of an electronic device is disclosed. An idle voltage state is introduced by an adaptive voltage generator when providing or removing a high voltage signal from a line or a node in a circuit. The idle state reduces the undesirable effects of switching disturbances caused by sudden voltage changes in a line or node.

Abstract: A memory device includes a plurality of pairs of complimentary bit lines and a plurality of latch circuits. Each pair of the plurality of pairs of complimentary bit lines is coupled to a column of memory cells. Each latch circuit has an input coupled to a data line and a first output and a second output to provide complementary latched values dependent upon a value of the data line. For each latch of the plurality of latches, the first output is coupled to a first bit line of a pair of the plurality such that a value of the first bit line is continuously determined by the first output during memory device operation and the second output is coupled to a second bit line of the pair such that a value of the second bit line is continuously determined by the second output during memory device operation.

Abstract: The present invention is generally directed to a DRAM cell design with folded digitline sense amplifier. In one illustrative embodiment, a memory array having a plurality of memory cells having an effective size of 6F2 is disclosed which has a plurality of dual bit active areas, each of the active areas having a substantially longitudinal axis, and a plurality of digitlines on a 3F-pitch arranged in a folded digitline architecture, wherein the active areas are positioned such that the longitudinal axis of the active areas is oriented at an angle with respect to a centerline of the digitlines.

Abstract: Memory circuits capable of preventing false programming caused by power-up sequence are provided, in which a programmable unit comprises a plurality of programmable elements, a source bus coupled between an external programming voltage and the programmable elements, a switching unit connected between the external programming voltage and the source bus, comprising a control terminal, and a level shifter, shifting a voltage level of an enabling signal to a first power voltage from a second power voltage lower than the external programming voltage. When the second power voltage is not ready during power up, the level shifter sets the control terminal of the switching unit to a predetermined logic level such that the switching unit is turned off and the source bus is disconnected from the external programming voltage thereby preventing false programming.

Abstract: A set of memory cell test structures and a method are disclosed for assessment of the static noise margin (SNM) of a memory cell or an array of such cells, for example, of SRAM cells of an integrated circuit device, using discrete point measurement structures provided either on-chip or within the scribe lines. In one embodiment, the set of memory structures comprises first and second test structures, individually comprising a memory cell, having one or more left and right half-bit test structures having hard-wired connections between select nodes of each memory cell half-bit and one or more voltage supplies. The half-bits of the first test structure are configured for measuring respective left and right standby SNM values, and the half-bits of the second test structure are configured for measuring respective left and right cell ratio values at respective output nodes of the structures, using applied supply voltages for on-chip assessment of the static noise margin of the memory cells.

Abstract: A dual structure is introduced to the transistor in a flip-flop or a data input step controlled by a clock of a semiconductor logic circuit. The dual structure is formed by connecting a transistor with a MOS transistor having a channel of the same conductivity type in series with respect to the line of a source or drain and connecting their gates to each other, or by connecting an inverter with p-MOS transistors, one for VDD side and one for VSS side of the output step. The dual structure prevents single event phenomenon in a semiconductor logic circuit, such as inverter, SRAM and data latch circuit.

Abstract: A semiconductor memory device is provided that uses a single wordline to access both storage cells of a so-called twin cell. A memory device comprises a plurality of wordlines and a plurality of bitlines in an array, with a plurality of storage cells at certain intersections of wordlines and bitlines. A plurality of sense amplifiers are provided, each of which is connected to at least a first pair of bitlines to detect a voltage difference on the bitlines caused by the charge from a twin storage cell comprised of first and second storage cells at the intersection of a single wordline with said first pair of bitlines, respectively. As a result, each cell of a twin storage cell can be accessed with a single wordline.

Abstract: According to some preferred embodiments of the present invention, a semiconductor memory device includes an array of memory cells and plural pairs of complementary bit lines, each pair of the complementary bit lines being connected to the memory cells arranged in the same column. The array is divided into plural memory blocks each including plural memory cells arranged in the same column. The corresponding complementary bit lines of the plural memory blocks are connected to corresponding common complementary data lines, respectively. Some pairs of the complementary data lines are crossed at least one time so that the complementary data lines of each pair of the some pairs of the complementary data lines are reversed in position and that the crossed data line and a non-cross data line are arranged alternately whereby crosstalk to be generated between adjacent data lines are reduced.

Abstract: A duty cycle correction (DCC) circuit receives first and second clock signals and outputs a duty cycle adjusted clock signal, and a control circuit detects a process variation and controls respective slew rates of the first and second clock signals based on the detected process variation. The DCC circuit may include a first inverter having an input that receives the first clock signal, a second inverter having an input that receives the second clock signal, a third inverter having an input commonly connected to outputs of the first and second inverters, a first variable capacitor connected between the input of the first inverter and a ground voltage, and a second variable capacitor connected between the input of the first inverter and the ground voltage. In this case, the respective capacitance values of the first and second variable capacitors are set by the control circuit.

Abstract: An SRAM (Static Ransom Access Memory) has a refreshing unit for performing a refreshing operation to maintain a state of an electric charge in a memory cell in order to prevent stored data from being destructed by a latch-up phenomenon to maintain the stored data certainly even when a soft error occurs due to a neutron.

Abstract: The effects of a self-erase phenomenon when accessing imprinted ferroelectric memory cells that have non-conductive electrode interfaces that reduce remnant polarization and decrease signal margin are eliminated. A self-erase control pulse asserted after an access pulse is utilized. The self-erase control pulse has a magnitude sufficient to offset a remnant charge on the non-conductive electrode interfaces after the removal of the access pulse.

Abstract: A data bus inversion (DBI) circuit includes at least one DBI block configured to invert an input data signal based on the logic state of input data bits. The DBI block includes a comparison deciding unit configured to generate, in a first mode, a comparison signal based on the number of changed bits by comparing respective bit signals of the input data signal and a previous input data signal. The comparison deciding unit generates an inversion control signal which controls whether the input data will be inverted or not. In a second mode, the comparison deciding unit generates an inversion control signal based on the predominant logic state of the input data signal bits. A data converting unit is configured to invert the input data signal in response to the inversion control signal. Method embodiments are also disclosed.

Abstract: In a multi-port register file of a storage unit within a processor, an improved bitcell design for storing a data bit is disclosed. The bitcell comprises a first set of read bitlines having a first load and a second set of read bitlines having a second load, in which the second load is substantially equal to the first load. The bitcell also comprises a signal driving circuit having a first node and a second node. The first node is connected to the first set of read bitlines and the second node is connected to the second set of read bitlines.

Abstract: A semiconductor memory device has first and second sense nodes which are provided corresponding to first and second bit lines, and a sense amplifier which is connected to the first and second sense nodes and senses data read out from a memory cell, wherein the sense amplifier includes an initial sense circuit which increases a potential difference between the first and second sense nodes in a first period after beginning sense operation, and a latch circuit which increases and holds the potential difference between the first and second sense nodes in a second period after the first period, wherein the initial sense circuit includes first and second transistors of first conductive type, third and fourth transistors of first conductive type, and fifth and sixth transistors of first conductive type, wherein the latch circuit includes seventh and eighth transistors of first conductive type, and ninth and tenth transistors of second conductive type.

Abstract: A dynamic random access memory (DRAM) is provided that has separate array and peripheral power busing to isolate array noise from peripheral circuits such as delay lock loops during row activations and read/write memory operations. A switch connects the array power bus to another separate power bus for a limited period of time during a DRAM refresh cycle to provide additional current to the DRAM arrays. The switch disconnects the array power bus from the other power bus preferably before the end of the refresh cycle.

Abstract: A compact dynamic random access memory (DRAM) cell and highly efficient methods for using the DRAM cell are disclosed. The DRAM cell provides reading, writing, and storage of a data bit on an ASIC chip. The DRAM cell includes a first transistor acting as a pass gate and having a first source node, a first gate node, and a first drain node. The DRAM cell also includes a second transistor acting as a storage device and having a second drain node that is electrically connected to the first drain node to form a storage node. The second transistor also includes a second source node and a second gate node. The second source node is electrically floating, thus increasing the effective storage capacitance of the storage node.

Abstract: A dynamic RAM incorporates a plurality of dynamic memory cells, each of which comprises a MOSFET having a gate set as a select terminal, one source and drain set as input/output terminals, and the other source and drain connected to storage nodes of a capacitor, a plurality of word lines respectively connected to the select terminals of the plurality of dynamic memory cells, a plurality of complementary bit line pairs respectively connected to the input/output terminals of the plurality of dynamic memory cells, and a sense amplifier array comprising a plurality of latch circuits which respectively amplify differences in voltage between the complementary bit line pairs placed so as to extend in directions opposite to each other from each pair of input/output terminals. Power supply lines are provided in mesh form inclusive of a portion above word drivers.

Abstract: In one embodiment, a memory block includes one or more bit lines that each include two or more cells. Each cell in each bit line has a distance from a sense amplifier coupled to the bit line, and each of one or more of the cells in each of one or more of the bit lines has a delay particularly set according to the distance of the cell from the sense amplifier coupled to the bit line.

Abstract: A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in dynamic memory bank count and page size mode. The integrated circuit memory device includes a first and second row of storage cells coupled to a row of sense amplifiers including a first and second plurality of sense amplifiers. During the first mode of operation, a first plurality of data is transferred from the first plurality of storage cells to the row of sense amplifiers. During the second mode of operation, a second plurality of data is transferred from the first row of storage cells to the first plurality of sense amplifiers and a third plurality of data is transferred from the second row of storage cells to the second plurality of sense amplifiers. The second and third plurality of data is accessible simultaneously from the memory device interface during the second mode of operation.

Abstract: Parasitic capacitances formed between bit lines to which signals are to be read out of memory cells and a signal transmission line arranged above them are to be reduced. Second complementary global bit lines for transmitting data read out of memory cells MC via complementary bit lines are arranged above a memory cell array. Each second global bit line is so arranged that a triangle having as its vertexes the center of the section of one of the complementary bit lines, that of the section of the other and that of the section of the second global bit line arranged directly above these complementary bit lines be an isosceles triangle.

Abstract: The present invention provides a sense circuit for DRAM memory cell to cover the events that a sense time becomes remarkably longer when a power source voltage is lowered, a sense time under the low voltage condition becomes shorter when temperature rises and a sense time changes to a large extent for fluctuation of processes. The present invention provides the following typical effects. A switch means is provided between the bit line BL and local bit line LBL connected to the memory cells for isolation and coupling of these bit lines. The bit line BL is precharged to the voltage of VDL/2, while the local bit line LBL is precharged to the voltage of VDL. The VDL is the maximum amplitude voltage of the bit line BL. A sense amplifier SA comprises a first circuit including a differential MOS pair having the gate connected to the bit line BL and a second circuit connected to the local bit line LBL for full amplitude amplification and for holding the data.

Abstract: A technique for reducing the bitline leakage current while maintaining a level of performance characteristics of low threshold voltage transistors in deep submicron CMOS technology incorporates a reference voltage generator circuit in combination with bias transistor MBIAS. The output of a static logic gate is connected to the input terminal of the pull-down devices. The reduction in leakage current through pull-down devices whenever a read operation is not performed contributes to a significant reduction in overall leakage current in the circuit.