Abstract: A semiconductor memory device that may include output drivers, each of which varies a data swing width in response to a correction code, and one or more data swing width control portions. Each of the data swing width control portions may correspond to an output driver, may vary the correction code according to a data swing width of the corresponding output driver to change the data swing width to a correction swing width, and then varies the correction code again to the extent that data of the corresponding output driver are normally transmitted, which may reduce the data swing width.

Abstract: A semiconductor storage device is provided which enables use of an overdrive method at low voltage and for a small device area. The semiconductor device includes: memory cells; sense amplifiers, each having P-channel and N-channel MOS transistors and amplifying a signal read from a memory cell; a first power supply line connected to a source terminal of the P-channel MOS transistor provided in each of the sense amplifiers; a second power supply line which supplies an overdrive voltage to the sense amplifiers at a potential higher than a write potential of the memory cell; a third power supply line connected to an external power supply, a connection element which connects and disconnects the first power supply line and the second power supply line; a capacitance element connected to the second power supply line; and a resistance element inserted between the second power supply line and the third power supply line.

Abstract: Memory devices and methods are provided for reducing simultaneous switching output noise and power supply noise during burst data write and refresh operations. An embodiment of a memory device according to the present invention includes a first power domain coupled to some of the components of the memory device and a second power domain coupled to different components of the memory device. One or more distributed power domain coupling circuits may be coupled to the first and second power domains. The power domain coupling circuit includes a controller configured to generate an enable signal responsive to control signals, data signals, or any combination thereof. The power domain coupling circuit also includes coupling circuitry coupled to the first and second power domains and coupled to the controller. The coupling circuitry is configured to couple the first and second power domains together responsive to the enable signal.

Abstract: A semiconductor device may include, but is not limited to, a first signal line, a second signal line, and a first shield line. The first signal line is supplied with a first signal. The first signal is smaller in amplitude than a potential difference between a power potential and a reference potential. The second signal line is disposed in a first side of the first signal line. The second signal line is supplied with a second signal. The second signal is smaller in amplitude than the potential difference. The first shield line is disposed in a second side of the first signal line. The second side is opposite to the first side. The first shield line reduces a coupling noise that is applied to the first shield line from the second side.

Abstract: A voltage regulator connected to a memory cell is configured by identifying at least a first and a second operation regions of the cell and associating the first and second operation regions with respective first and second operation conditions of the memory cell. An operative condition of the memory cell involved in a programming operation is detected, and at least a configuration signal of the regulator according to said detected operative condition is generated, this configuration signal taking a first and a second value associated with the first and second operation conditions.

Abstract: One embodiment includes a plurality of word lines, a plurality of bit lines intersecting with the plurality of word lines, a plurality of memory cells formed at intersections of and connected to the plurality of word lines and the plurality of bit lines. Each of the plurality of memory cells may be a floating body cell. A bit line selecting circuit may be configured to selectively connect each of the plurality of bit lines to an output bit line. The embodiment may further include plurality of sense amplifiers, where the plurality of sense amplifiers is greater than one and less than the plurality of bit lines in number. A sense amplifier switching structure may be configured to selectively connect each of the plurality of sense amplifiers to the output bit line.

Abstract: A sense amplifier overdriving circuit includes a first voltage driver which supplies an internal voltage from an internal voltage terminal to a sense amplifier in response to a first enabling signal, a logic unit which logically operates a block select signal for selection of a cell block and a second enabling signal enabled for a predetermined time after enabling of the first enabling signal, and outputs the resultant signal, and a second voltage driver which supplies an external voltage to the internal voltage terminal in response to the signal output from the logic unit.

Abstract: A phase change memory device includes a semiconductor substrate having a plurality of bar-type active areas. A plurality of word lines are arranged in a direction perpendicular to the active areas on the semiconductor substrate, and a first pair of the word lines connected to each other at each first end thereof is arranged alternately with a second pair of the word lines connected to each other at each second end thereof opposite to the first end. Source areas and drain areas are formed in the active areas. Common source areas are each connected to the source areas. A plurality of lower electrodes are connected to the respective drain areas. Phase change layers make contact with every two diagonally adjoining lower electrodes. Upper electrodes are formed on the phase change layers, and bit lines are arranged in a direction of the active areas and are connected to the upper electrodes.

Abstract: A bridge defect detecting method performed in a semiconductor memory device that includes a plurality of memory cells arranged at intersections between a plurality of word lines and a plurality of bit lines and a plurality of sense amplifiers connected to the bit lines, includes the operations of: enabling a first sense amplifier and a second sense amplifier; keeping the first sense amplifier in an enabled state and disabling the second sense amplifier; enabling the second sense amplifier, and detecting a bridge defect between the first memory cell and the second memory cell by reading data from a first memory cell of a first bit line connected to the first sense amplifier and a second memory cell of a second bit line connected to the second sense amplifier.

Abstract: A semiconductor memory device, having a 6F2 open bit line structure, connects each bit line of a bit line pair to a respective bit line of a neighboring bit line pair for a precharge operation so that a layout size of the semiconductor memory device decreases. Plural first precharge units each precharge one bit line of a first bit line pair and one bit line of a second bit line pair in response to a bit line equalizing signal. Plural sense amplifiers each sense a data bit supplied to a respective one of the first and second bit line pairs and amplify sensed data.

Abstract: In a multi-port register file of a storage unit within a processor, an improved bitcell design for storing a data bit is disclosed. The bitcell comprises a first set of read bitlines having a first load and a second set of read bitlines having a second load, in which the second load is substantially equal to the first load. The bitcell also comprises a signal driving circuit having a first node and a second node. The first node is connected to the first set of read bitlines and the second node is connected to the second set of read bitlines.

Abstract: Embodiments of the present invention provide channel estimation for multi-level memories using pilot signals. A memory apparatus includes a memory block comprising a plurality of memory cells and adapted to operate with at least two levels of signals for writing data into and reading data from the memory cells. At least two memory cells are employed as reference cells to output a plurality of pilot signals. The memory apparatus also includes a channel block operatively coupled to the memory block, and adapted to facilitate the writing and reading of data into and from the memory cells. The channel block is also adapted to receive the pilot signals and determine one or more disturbance parameters based at least in part on the pilot signals and to compensate the read back signals based at least in part on the determined one or more disturbance parameters during said reading of data from the memory cells. Other embodiments may be described and claimed.

Abstract: An integrated circuitry operable in a normal and test mode has a processing circuit, an output circuit associated with the processing circuit and a storage with a plurality of memory cells. The output circuit is formed to process in normal mode an output signal of the processing circuit and to provide a processed output signal to an output terminal. The output circuit further provides in test mode a test signal as processed output signal based on a drive signal which may be supplied externally or from the processing circuit. The storage receives in test mode the test signal and performs an evaluation of a memory property of at least one memory cell of the plurality of memory cells based on the test signal, and, in response to this evaluation, to output an evaluation signal indicating the memory property of the at least one cell of the plurality of memory cells.

Abstract: In a sensing method, accuracy of sensing operations, such as read or verify, in a memory device is improved by avoiding fluctuations in a sense amp supply voltage which can occur when different sense amps are strobed at different times. First and second sets of sense amps perform a sensing operation on respective storage elements, such as in an all bit line configuration. The first set of sense amps is strobed at a first time point. In response, a sensed analog level is converted to digital data. The A/D conversion relies on the sense amp supply voltage being accurate. To avoid a fluctuation in the sense amp supply voltage, a bypass path allows the storage elements associated with the first set of sense amps to continue to draw power from the sense amp supply voltage. The second set of sense amps is strobed at a later, second time point.

Abstract: A semiconductor memory device includes a pair of local input/output (IO) lines, a global IO line, a local driver configured to pull up/down voltage levels of the first and second local IO lines in response to input data, a global driver configured to pull up/down a voltage level of the global IO line in response to input data, and a data IO control block configured to transport output data from the local IO lines to the global driver and input data from the global IO line to the local driver.

Abstract: A static random access memory (“SRAM”) has a plurality of SRAM cells connected to a word line. A static noise margin (“SNM”) detector controls a pull-down transistor that selectively couples the word line to a ground path. The SNM detector is configured to produce a first output signal in response to a SNM event that couples the word line to the ground path, and otherwise produces a second output signal that de-couples the word line from the ground path.

Abstract: Some embodiments include a first circuit to receive input signals and to drive signals at first circuit output nodes, and a second circuit to receive at least a portion of current passing through the first circuit output nodes and to generate output signals at second circuit output nodes, the second circuit including a pair of transistors coupled to the second circuit output nodes with gates of the pair of transistors to receive different signals to affect a value of a voltage difference between the output signals, the different signals being different from the output signals. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: The present invention detects a sense amplifier having an unbalanced characteristic. In a test method for a semiconductor memory device for detecting a sense amplifier having an unbalanced characteristic, an intermediate potential having different H and L levels from normal operation is restored in a first memory cell of a first bit line connected to a test target sense amplifier, charge quantity when the capacitance of the capacitor is small is virtually stored in the first memory cell, then the data of the first memory cell is read, and a malfunction of the sense amplifier is checked based on the presence of an error of read data.

Abstract: A word driver supplies a high level voltage to a word line when a memory cell is accessed and supplies low level voltage which is a negative voltage to the word line when the memory cell isn't accessed. A precharge circuit lowers a precharge voltage-supplying capacity to a bit line at least during a standby period when the memory cell is not accessed. A substrate voltage of an nMOS transistor with source or drain connected to the bit line is set to the low level voltage or lower of the word line. Therefore, when the word line and the bit line fails short and the voltage of the bit line changes to the low level voltage of the word line during the standby period, a substrate current can be prevented from flowing between the source of the nMOS transistor and a substrate or the drain and the substrate.

Abstract: An operation voltage is provided to a memory system. The operation voltage provided to the memory system is adjusted during transient events of the memory system.

Abstract: A NOR flash memory is disclosed including a memory cell, sense amplifier output driver, and control circuit. A sense period for a sense operation performed by the sense amplifier is made synchronous with a clock signal so as to avoid power supply or ground signal noise generated by operation of the output driver.

Abstract: An apparatus for removing crosstalk in a semiconductor memory device includes pads for receiving externally provided signals, transmission lines for delivering the signals received by each of the pads to corresponding elements in the apparatus, and capacitors, coupled between adjacent ones of the lines, for adjusting the transmission delay of the signals depending on a signal transmission mode between the adjacent lines.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: The present invention is generally directed to a DRAM cell design with folded digitline sense amplifier. In one illustrative embodiment, a memory array having a plurality of memory cells having an effective size of 6 F2 is disclosed which has a plurality of dual bit active areas, each of the active areas having a substantially longitudinal axis, and a plurality of digitlines on a 3 F-pitch arranged in a folded digitline architecture, wherein the active areas are positioned such that the longitudinal axis of the active areas is oriented at an angle with respect to a centerline of the digitlines.

Abstract: Radiation hardening, detection and protection design methods are disclosed. An example write drive circuit is disclosed having radiation hardened analog circuitry. A passive transistor is provided to generate a radiation photo-current to offset any net radiation photo-current of the operational circuitry. Using this technique, a radiation hardened reference-mirror control circuit provides a switched write current for setting the logical state of MRAM bits during a radiation event, for instance. A radiation detector and radiation hardened logic gates are further provided for inhibiting the write current when a radiation level is above a predetermined level.

Abstract: A semiconductor memory device includes a sense amplifier for the FBC, a first node and a second node can be disconnected from each other by a first isolation transistor. A third node and a fourth node can be disconnected from each other by a second isolation transistor. The first node is connected to the first memory cell. The third node is connected to the second memory cell. A first amplification transistor and a second amplification transistor are connected between the first node and the third node. A third amplification transistor and a fourth amplification transistor are connected between the second node and the fourth node. This enables to parallelly execute read data transfer to the data lines and precharge to prepare for the next read operation.

Abstract: In a non-volatile memory (NVM) device having a controller and a non-volatile memory array controlled by the controller a voltage supervisor circuit monitors an output of a voltage supply powering the NVM device. The voltage supervisor circuit may be part of the NVM device or coupled to it. The voltage supervisor circuit is configured to assert a “low-voltage” signal responsive to detecting the output of the voltage supply powering the NVM device dropping below a predetermined value. The controller is configured to write data into the memory array while the “low-voltage” signal is deasserted and to suspend writing data while the “low-voltage” signal is asserted. In response to assertion of the “low-voltage” signal, the controller completes a write cycle/program operation, if pending, and prevents any additional write cycles/program operation(s) during assertion of the “low-voltage” signal.

Abstract: A semiconductor memory device includes transistors that supply a higher write potential and a lower write potential to a sense amplifier, respectively, an overdrive transistor that supplies an overdrive potential to the sense amplifier, and a control circuit that changes a gate-source voltage of the overdrive transistor step by step. By raising a potential of one of paired bit lines to the overdrive potential not suddenly but step by step, an influence of a potential increase on the other bit line via a parasitic capacity is lessened and a malfunction caused by data inversion is prevented.

Abstract: In one embodiment, a memory block includes one or more bit lines that each include two or more cells. Each cell in each bit line has a distance from a sense amplifier coupled to the bit line, and each of one or more of the cells in each of one or more of the bit lines has a delay particularly set according to the distance of the cell from the sense amplifier coupled to the bit line.

Abstract: Disclosed is a nonvolatile memory device using a variable resistive element, and a data read circuit for use in variable resistive memory devices. More specifically, embodiments of the invention provide a data read circuit with one or more decoupling units to remove noise from one or more corresponding control signals. For instance, embodiments of the invention remove noise from a clamping control signal, a read bias control signal, and/or precharge signal. The disclosed decoupling units may be used alone or in any combination. Embodiments of the invention are beneficial because they can increase sensing margin and improve the reliability of read operations in memory devices with variable resistive elements.

Abstract: A method and apparatus for reducing soft errors in which the method includes: assigning a plurality of nodes within a storage circuit to a predetermined state; evaluating a plurality of signals coupled to the storage circuit, where evaluating the plurality of signals enables a first node to change from its predetermined state; and actively maintaining a second node in its predetermined state, where actively maintaining the predetermined state reduces the storage circuit's susceptibility to soft errors.

Abstract: A semiconductor memory device and a semiconductor memory system. The semiconductor memory device includes channels configured to transmit signals from a transmitter to a receiver, and a crosstalk compensator. The crosstalk compensator may be connected between the channels to compensate for crosstalk. The crosstalk compensator may comprise a capacitor connected in parallel between the channels, and a switching unit connected between the capacitor and one of the channels. The switching unit may control connections or disconnections between the capacitor and the channel. Therefore, the semiconductor memory device and the semiconductor memory system compensate for crosstalk occurring between transmitted signals that are out of phase with each other.

Abstract: Methods and apparatus are disclosed, such as those involving a solid state memory device. One such method includes selecting a plurality of memory cells in a memory array. States of a plurality of data bits stored in the selected plurality of memory cells are determined. In determining the states of the plurality of data bits, a portion of the plurality of data bits are sensed faster than others. The plurality of data bits are sequentially provided as an output. In one embodiment, the portion of the plurality of data bits includes the first bit of the sequential output of the memory device.

Abstract: A semiconductor device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells provided at the intersections of the plurality of word lines and the plurality of bit lines and each of that includes a MIS transistor and a memory element, a decoder circuit for selecting a plurality of word lines, and a sense-amplifier circuit for determining information that is read from any of the plurality of memory cells to any of the plurality of bit lines, wherein a twist connector for switching the wiring order of the plurality of word lines is provided and level-stabilizing circuits, for supplying the potential level of a non-selected state to the plurality of word lines in the non-selected state are arranged in the area below the twist connector.

Abstract: By reducing a cumulative number of drivers changing values during a transition, the cumulative current change may be reduced, along with the simultaneous switching noise effects. Also, a reduced cumulative current change can also reduce voltage fluctuations in ground and/or power planes of a chip, thereby minimizing potential improper logic functions due to voltage dips or spikes. In one implementation, the method includes reading values of a first state of a first set of bits of a first word and obtaining a projected value of a second state of each of the first set of bits. If the first switching noise cumulative effect can be reduced by changing the projected values of the second state of the first set of bits, an alternate set of values having at least one value differing from the projected values of the second state is determined to reduce the first switching noise cumulative effect.

Abstract: A memory cell for storing a charge that gives rise to a cell voltage representing a bit value, the memory cell being capable of having the cell voltage boosted to a boost value at a time following reading of the stored charge. The memory cell includes a first capacitor connected between a first node and ground. A second capacitor is connected between a second node and ground, and a first switch is connected between the first node and the second node. A second switch and a third capacitor are connected in series between the first node and the second node, with a terminal of the second switch being connected to the first node, the common connection node of the second switch and the third capacitor comprising a third node. A third switch is connected between the third node and ground. In operation, in a first storage phase the first and third switches are closed and the second switch is open.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: The present invention discloses a circuit providing a power for a sense amplifier that stabilizes a power voltage supplied to the sense amplifier by compensating a noise generated in the power voltage when the sense amplifier operates with an selectively generated decoupling noise. The circuit providing a power for a sense amplifier includes a sense amplifying circuit sensing and amplifying data loaded on a bit line with a first power. A power supplying unit provides the first power to the sense amplifying circuit. A decoupling unit generates a decoupling noise with a second power and provides the decoupling noise to the first power voltage. The decoupling noise is maintained for a period including a time point of an operation of the sense amplifying circuit and a predetermined time thereafter.

Abstract: A circuit for removing noise from an input signal includes a falling edge signal delaying circuit configured to output a first delay output signal generated by delaying a falling edge of a first output signal for a preset time; a falling edge sensing circuit configured to sense the falling edge of the first output signal, and generate a pulse signal in accordance with the sense; a flip-flop configured to output the first delay output signal in accordance with an input clock signal; and a first logic operation circuit configured to perform a logic operation on an output signal of the flip-flop and the first output signal delayed for the preset time, thereby generating a second output signal.

Abstract: A memory circuit with relatively high reading speed and relatively low switching noise is provided. The memory circuit includes an output buffer device having a first input receiving a data signal having a first voltage level, a second input receiving a pre-set voltage having a second voltage level and an output outputting the data signal, and a pre-set circuit constructed by a pair of MOSFETs and providing the pre-set voltage to the second input before the output buffer device receives the data signal. The pre-set circuit receives a control signal activating the pair of MOSFETs at the same time, and when the output buffer device receives the data signal, a voltage level of the second input is swung from the second level to the first voltage level.

Abstract: Methods and apparatus for setting various terminations of a memory chip. The memory chip includes a terminal, a termination circuit that can be connected to the terminal in order to terminate the terminal with a settable resistance value, a control command port for receiving a control command signal, and a control circuit that is connected to the termination circuit in order to set a resistance value as a function of a received control command signal.

Abstract: A circuit, method, and computer readable medium for on-chip measuring of noise margins in a memory device memory device are disclosed. The on-chip method includes electrically coupling at least a first circuit to a memory cell. A voltage divider is electrically coupled to at least a first voltage and a second voltage. A multiplexer circuit is electrically coupled to the voltage divider. The multiplexer selects one of the first voltage and second voltage for producing a test voltage. A selecting line is electrically coupled to a force\measure network. A comparator is coupled to the force\measure network. The force-measure network supplies the test voltage to the comparator and a measured voltage to the comparator for determining when the measured voltage exceeds the test voltage.

Abstract: A multiple-port SRAM cell includes a latch having a first node and a second node for retaining a value and its complement, respectively. The cell has a write port separate from a read port for parallel operation. A number of transistors are used to connect the first and second nodes to a number of bit lines, such as a read port bit line, a read port complementary bit line, a read/write port bit line, and a read/write port complementary bit line. In a layout view of the multiple-port SRAM cell, the read port bit line, read port complementary bit line, read/write port bit line and read/write port complementary bit line are separated by at least one supply voltage line, one or more complementary supply voltage lines, and one or more word line landing pads.

Abstract: A sense amplifier includes: NMOS transistors, drains thereof being coupled to output nodes, gates thereof being coupled to the output nodes, sources thereof being coupled in common to the ground potential node; PMOS transistors, drains thereof being coupled to the drains of the NMOS transistors, sources thereof being coupled to the input nodes; PMOS transistors, drains thereof being coupled to the input nodes, gates thereof being coupled to the output nodes, sources thereof being coupled to the power supply node via a current source device; and NMOS transistors disposed between the output nodes and the ground potential node to be turned on before sensing; and an equalizing transistor disposed between the output nodes.

Abstract: A dynamic random access memory (DRAM) is provided that has separate array and peripheral power busing to isolate array noise from peripheral circuits such as delay lock loops during row activations and read/write memory operations. A switch connects the array power bus to another separate power bus for a limited period of time during a DRAM refresh cycle to provide additional current to the DRAM arrays. The switch disconnects the array power bus from the other power bus preferably before the end of the refresh cycle.

Abstract: A memory device includes a receiver to receive an input data signal and to create an output signal corresponding to the present received data signal and a voltage representative of a signal sampled earlier in time.

Abstract: A memory device and a method of reading the same includes a phase change element having a data state associated therewith that features maintaining the consistency of the data state of the phase change element in the presence of a read current. The memory circuit includes a sense amplifier that defines a sensing node. Circuitry selectively places the bit line in data communication with the sensing node, defining a selected bit line. A current source produces a read current, and a switch selectively applies the read current to the sensing node. Logic is in electrical communication with the sensing node to control the total energy to which the phase change material is subjected in the presence of the read current so that the data state remains consistent.

Abstract: A static random access memory (SRAM) cell includes a first load device, a first pull-down transistor, and a switch-box coupled between the first load device and the first pull-down transistor. The switch-box is configured to receive a switch control signal to turn off a first connection between the first load device and the first pull-down transistor during read operations of the SRAM cell and to turn on the first connection during write operations.

Abstract: In example embodiments, methods are provided for reducing bit line leakage current. In an example embodiment, an unselected program word line is biased to a bias voltage. The unselected program word line is connected to a memory cell and the memory cell includes a plurality of transistors. In another example embodiment, an unselected memory cell is biased to a negative bias voltage during read operations.

Abstract: The memory circuit comprises: a single or a plurality of reading-out port(s); a single or a plurality of writing port(s); a crosstalk-glitch suppressor circuit for suppressing crosstalk glitch between internal signal lines of each of the ports; and a control device for controlling capacity of the crosstalk-glitch suppressor circuit.