Abstract: In a first sensing state in which a first current flows in a forward direction with respect to a pn junction of a first semiconductor element and a second current of a different magnitude from the first current flows in a forward direction with respect to a pn junction of a second semiconductor element, a difference between a forward direction voltage of the pn junction of the first semiconductor element and a forward direction voltage of the pn junction of the second semiconductor element is converted into a digital value by a computer and acquired as a first digital value.

Abstract: A storage device is provided which includes a nonvolatile memory and a temperature sensor. The temperature sensor is configured to detect a temperature of the storage device. The temperature sensor is configured to output temperature information. The storage device includes a memory controller. The memory controller is configured to access the nonvolatile memory in response to a request of an external host device. The memory controller is configured to obtain the temperature information from the temperature sensor according to a first period in a first mode. The temperature sensor is configured to obtain the temperature information from the temperature sensor according to a second period in a second mode. The second period is shorter than the first period.

Abstract: On the fly switching from one memory device refresh rate to another is provided. Control logic associated with the memory device detects a condition to switch from a currently-applied refresh rate to a different refresh rate. In response to the condition, the refresh rate is dynamically switched. The switching does not require a change of a mode register. Thus, a refresh rate for the memory device can be dynamically changed on the fly.

Abstract: Dynamic monitoring of current draw by a memory device or memory subsystem can enable a power management system to adjust a memory access performance parameter based on monitored power usage. The system can generate a power usage characterization for the memory device and/or memory subsystem based on monitoring current draw for a known pattern, and then subsequently use the power usage characterization to determine how to adjust the memory access performance parameter.

Abstract: A data retention reliability screen of integrated circuits including ferroelectric random access memory (FRAM) arrays. Sampled groups of cells in the FRAM array are tested at various reference voltage levels, after programming to a high polarization capacitance data state and a relaxation time at an elevated temperature. Fail bit counts of the sample groups at the various reference voltage levels are used to derive a test reference voltage, against which all of the FRAM cells in the integrated circuit are then tested after preconditioning (i.e., programming) and another relaxation interval at the elevated temperature, to determine those cells in the integrated circuit that are vulnerable to long-term data retention failure.

Abstract: Systems, methods and/or devices are used to adjust a read property for a memory portion of non-volatile memory. In one aspect, in response to receiving a program request, the device: detects a first temperature of the memory portion; and stores first temperature data corresponding to the detected first temperature. In response to receiving a read request, the device performs an adjustment determination, including: detecting a second temperature of the memory portion of the non-volatile memory, retrieving the stored first temperature data, and determining, in accordance with the detected second temperature and the retrieved first temperature data, whether to perform the read using an adjusted read property. In accordance with a determination to perform the read using the adjusted read property, the device performs a read on the memory portion using the adjusted read property.

Abstract: A data recorder for permanently storing pre-event data may include a read-write memory with a plurality of bit cells in the read-write memory. Each bit cell may have a bit state of a high value or a low value. A fusible structure in the data recorder may include a morphable element associated with each bit cell. A temperature-triggered module may thermally couple to the ambient environment and may electrically couple to each morphable element. The temperature-triggered module may be further configured to determine if a parameter of the ambient environment exceeds a predetermined threshold, and if so may then transmit a burn signal to the fusible structure so that each morphable element permanently secures the bit state for each bit cell.

Abstract: A semiconductor memory device includes a memory circuit including a plurality of memory cells and a refresh control circuit. The refresh control circuit is configured to determine a number of times to perform a target row refresh (TRR) in response to a mode register set (MRS) code signal, wherein the MRS code signal is generated in response to a temperature change, and the refresh control circuit is configured to maintain a refresh cycle of at least two of the memory cells for a period of time when the refresh cycle is changed due to the temperature change.

Abstract: A storage system and method for adaptive thermal throttling are disclosed. In one embodiment, a method for adaptive thermal throttling is provided that is performed in a storage system having a memory. This method comprises determining if a temperature of the storage system is above a threshold temperature; and in response to determining that the temperature of the storage system is above the threshold temperature: reducing performance of the storage system in an iterative manner until the temperature of the storage system is within a temperature envelope around the threshold temperature; and storing, in the memory, a value indicating what the performance of the storage system was reduced to in order to get the temperature within the temperature envelope. Other embodiments are possible, and each of the embodiments can be used alone or together in combination.

Abstract: A storage system and method for adaptive thermal throttling are disclosed. In one embodiment, a method for adaptive thermal throttling is provided that is performed in a storage system having a memory. This method comprises determining if a temperature of the storage system is above a threshold temperature; and in response to determining that the temperature of the storage system is above the threshold temperature: reducing performance of the storage system in an iterative manner until the temperature of the storage system is within a temperature envelope around the threshold temperature; and storing, in the memory, a value indicating what the performance of the storage system was reduced to in order to get the temperature within the temperature envelope. Other embodiments are possible, and each of the embodiments can be used alone or together in combination.

Abstract: Provided is a method of refreshing a memory device by controlling a self-refresh cycle according to temperature. In the method, first self-refresh and second self-refresh are performed according to inner temperature of the memory device and a self-refresh cycle is controlled such that an all-bank-refresh (ABR) operation is not performed simultaneously with the start of the second self-refresh. The ABR operation is performed at the start of third self-refresh when the sum of a section of the first self-refresh in which the ABR operation is not performed and a section of the second self-refresh in which the ABR operation is not performed corresponds to a self-refresh cycle.

Abstract: A semiconductor device includes a decoded signal generation circuit suitable for executing a counting operation to generate a decoded signal in response to an oscillation signal during a refresh section, a refresh pulse generation circuit suitable for generating a refresh pulse for executing a refresh operation in response to the decoded signal and a temperature code, and a reset pulse generation circuit suitable for generating a reset pulse initializing the decoded signal in response to the refresh pulse.

Abstract: A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs first to (M+1)th command/address signals (wherein, “M” denotes a natural number which is equal to or greater than two) and receives a detection signal to detect a normality/abnormality of a temperature sensor. The second semiconductor device enters a test mode in response to the (M+1)th command/address signal and compare first to Nth sensing codes (wherein, “N” denotes a natural number which is equal to or greater than two) generated by the temperature sensor with the first to Mth command/address signals to generate the detection signal. The second semiconductor device also executes a refresh operation in response to a refresh signal including a plurality of pulses whose cycle time is controlled by the first to Mth command/address signals.

Abstract: Methods of managing data of a storage device responsive to temperature can include measuring a temperature of the storage device, changing a duration of a refresh interval of the buffer memory responsive to the measured temperatures, changing a number of refresh bursts during the refresh interval responsive to the measured temperature, and refreshing data of the buffer memory based on the refresh interval and the number of the refresh bursts that are changed responsive to temperature.

Abstract: A semiconductor device may be provided. The semiconductor device may include a stop signal generation circuit configured to compare an operation offset signal with an operation temperature code signal to generate a stop signal. The semiconductor device may include a temperature signal output circuit configured to generate an output temperature signal from a sensed temperature signal in synchronization with an operation clock signal which is generated based on the stop signal. The semiconductor4 device may include a temperature code processing circuit configured to receive a temperature difference code signal corresponding to the output temperature signal to generate the operation temperature code signal in synchronization with the operation clock signal.

Abstract: A semiconductor apparatus with a plurality of slices electrically coupled through through electrodes. Any one slice of the plurality of slices may be configured to generate a refresh cycle signal in response to a refresh command, and transmit the refresh cycle signal to the other slices through the through electrodes. The other slices may be configured to perform refresh operations in synchronization with the refresh cycle signal.

Abstract: A method includes, responsive to a power-up event at a data storage device that includes a memory, reading a flag stored at the data storage device and determining that the flag has a first value indicating that a reflow operation has not previously been detected at the memory. The method also includes, in response to determining that the flag has the first value, performing reflow detection at the memory. The method further includes, in response to the reflow detection indicating that the reflow operation has occurred, setting the flag to a second value.

Abstract: A self clocking comparator for clocking a charge pump providing a high voltage output including multiple gain stages and a reset circuit. The gain stages are configured to assert the compare voltage at a first voltage level in a default state when the sense voltage is greater than the reference voltage, and to assert the compare voltage to a second voltage level in a reset state when the sense voltage falls below the reference voltage. The reset circuit resets, or otherwise forces, the gain stages back to the default state in response to the compare voltage transitioning to the second voltage level. The compare voltage oscillates while the sense voltage is less than the reference voltage at a frequency based on a magnitude of a difference between the sense voltage and the reference voltage up to a predetermined maximum frequency level.

Abstract: A nonvolatile memory device is writable to a high resistance state and a low resistance state. The nonvolatile memory device may be heated to at least a threshold temperature, based on application of an alternating current (AC) signal, and may be written based on application of a voltage bias.

Abstract: An internal voltage generation circuit may include a temperature information generation unit configured to generate a temperature code having a code value corresponding to a temperature. The temperature information generation unit may include a process variation information generation unit configured to generate a process code having a code value corresponding to a process variation. The temperature information generation unit may include a code combination unit configured to generate a combination code in response to a ratio control signal, the temperature code, and the process code. The temperature information generation unit may include an internal voltage generation unit configured to generate an internal voltage having a voltage level corresponding to a code value of the combination code.

Abstract: A stacked semiconductor package includes a package substrate, an interposer mounted on the package substrate, a plurality of semiconductor chips stacked on the interposer, and a control unit provided in the interposer, that stores in advance data to be written in the plurality of semiconductor chips, and that outputs the data stored in advance according a test mode signal.

Abstract: A semiconductor memory device includes: a memory unit including a first memory sub region including a first memory cell and a second memory sub region including a second memory cell; a temperature information obtaining unit that obtains temperature information; a temperature estimation unit that estimates a first temperature of the first memory sub region and a second temperature of the second memory sub region based on the temperature information; a first sub region control unit that controls the first memory sub region based on the first temperature; and a second sub region control unit that controls the second memory sub region based on the second temperature.

Abstract: Disclosed is a method generating a compensated operating voltage, such as a read voltage, in a non-volatile memory device, and a related non-volatile memory device. The operating voltage is compensated in response to one or more memory cell conditions such as temperature variation, programmed data state or physical location of a selected memory cell, page information for selected memory cell, or the location of a selected word line.

Abstract: For aging-aware routing, an aging module calculates an aging score for links and routers in a Network-on-Chip for a previous epoch. A routing module dynamically routes a flow through the links and the routers to satisfy routing criteria including a least total aging score for the links and the routers of the flow.

Abstract: A data transmitting method for a memory storage apparatus is provided. The method includes: initially setting a first threshold and a first accumulated value; and updating the first threshold by using the first threshold plus the first accumulated value at intervals of a first predetermined time. The method also includes when a detected temperature of the memory storage apparatus is greater than or equal to a temperature threshold, determining whether a size of received writing data is greater than or equal to the first threshold; and if no, writing the writing data into a rewritable non-volatile memory module and then updating the first threshold by using the first threshold minus the size of the writing data; and if yes, not writing the writing data into the rewritable non-volatile memory module. Accordingly, the method can effectively prevent overheat of system during operations of the memory storage apparatus.

Abstract: A data storage device includes a nonvolatile memory device; and a controller electrically coupled with the nonvolatile memory device, and configured to control an operation of the nonvolatile memory device, wherein the controller is configured to change a frequency of an internal clock and a level of an internal voltage, according to whether data is being transmitted through a channel.

Abstract: A semiconductor memory apparatus and a temperature control method thereof are provided. The semiconductor memory apparatus includes a temperature adjustment unit suitable for adjusting a temperature of a memory cell, and a temperature control unit suitable for sensing a temperature of the temperature adjustment unit, comparing a sensed temperature with a reference temperature range, and controlling the temperature adjustment unit to adjust the temperature thereof within the reference temperature range based on a comparison result.

Abstract: Memory devices, memory device operational methods, and memory device implementation methods are described. According to one arrangement, a memory device includes memory circuitry configured to store data in a plurality of different data states, temperature sensor circuitry configured to sense a temperature of the memory device and to generate an initial temperature output which is indicative of the temperature of the memory device, and conversion circuitry coupled with the temperature sensor circuitry and configured to convert the initial temperature output into a converted temperature output which is indicative of the temperature of the memory device at a selected one of a plurality of possible different temperature resolutions, and wherein the converted temperature output is utilized by the memory circuitry to implement at least one operation with respect to storage of the data.

Abstract: Switching current in Spin-Transfer Torque Memory (STTM) can be decreased. A magnetic memory cell is driven with a first pulse on a write line of the memory cell to heat the cell. The cell is then driven with a second pulse on the write line to set the state of the cell.

Abstract: A temperature data coding unit 100 increases the data resolution in a high temperature range and reduces the data resolution in a low temperature range, and makes the data length of the temperature data a fixed length. When carrying out numerical estimation of the fixed length code value in terms of a 2's complement numerical code value, the temperature data coding unit 100 generates coded data that increases with an increase of the pre-coded temperature data in terms of the 2's complement numerical code value.

Abstract: A memory device includes a cell array and a common source line compensation circuit. The cell array includes a plurality of normal cell units connected between a plurality of bit lines and one common source line, respectively. The common source line compensation circuit supplies a plurality of compensation write currents to the common source line to compensate for a plurality of write currents concurrently input into or output from the common source line through the normal cell units.

Abstract: Methods for operating a semiconductor memory array including dynamically adjusting control line voltages (e.g., unselected word line or unselected bit line voltages) based on one or more array conditions associated with the semiconductor memory array are described. The one or more array conditions may include a temperature associated with the semiconductor memory array or a particular number of write cycles associated with the semiconductor memory array. In some embodiments, an intermediate voltage is generated based on the one or more array conditions and applied to the unselected word lines and the unselected bit lines of the semiconductor memory array. The one or more intermediate voltages may be generated such that a first voltage difference across unselected memory cells sharing a selected word line is different from a second voltage difference across other unselected memory cells sharing a selected bit line based on the one or more array conditions.

Abstract: A semiconductor device having a circuit that selectively adjusts an impedance of an output buffer. A calibration operation can be performed automatically without issuing a calibration command from a controller. Because a calibration operation to a memory is performed in response to an auto refresh command having been issued for a predetermined number of times, a periodic calibration operation can be secured, and a read operation or a write operation is not requested from a controller during a calibration operation. A start-up circuit activates the calibration circuit when a refresh counter indicates a predetermined value, and prohibits a refresh operation in response to the auto refresh command when the calibration circuit is activated. A temperature detecting circuit may be used to change the frequency of performing a calibration operation.

Abstract: Disclosed is a nonvolatile memory device which includes a memory cell connected to a bit line and a word line; a page buffer electrically connected to the bit line and sensing data stored in the memory cell; and a control logic controlling the page buffer to vary a develop time of the bit line or a sensing node connected to the bit line according to a current temperature during a read operation.

Abstract: Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential.

Abstract: Circuitry and method for detecting occurrence of a reflow process to an embedded storage device are disclosed. A temperature sensing device includes a resistor, a temperature sensor, and a comparator. The first terminal of the resistor is coupled to a voltage source, and the second terminal of the resistor is coupled to both the first terminal of the temperature sensor and the first input of the comparator. The second terminal of the temperature sensor is grounded and the second input of the comparator is coupled to a reference voltage. The resistance state of the temperature sensor changes from a first resistance state to a second resistance state when the temperature surrounding the temperature sensor reaches a threshold. The comparator generates an output based on the resistance changes of the temperature sensor. The generated output may indicate whether a reflow process has occurred to the embedded storage device.

Abstract: A semiconductor memory device includes a memory cell array, a refresh control circuit, an address counter and an address converter. The memory cell array includes a plurality of memory cells. The refresh control circuit is configured to receive a refresh command and output m refresh control signals during one refresh cycle for refreshing all the memory cells of the semiconductor memory device. The address counter is configured to generate counting signals for refreshing memory cells in response to the m refresh control signals. The address converter is configured to receive the counting signals and output refresh addresses by converting the counting signals in response to a cycle select signal. The address converter is configured to output refresh addresses such that the number of m refresh control signals during one refresh cycle is variable.

Abstract: A semiconductor system includes a controller and a semiconductor device. The controller outputs offset signals whose level combination is controlled according to temperature code signals including information on an internal temperature. The semiconductor device generates the temperature code signals according to a level combination of the offset signals. Further, the semiconductor device controls a refresh cycle time determined by the level combination of the offset signals.

Abstract: A semiconductor memory device configured to apply a temperature-compensated word line voltage to a word line during a data read operation includes a memory cell array including a plurality of word lines, a plurality of non-volatile memory cells connected to the word lines, and a word line voltage application unit configured to apply a temperature-compensated read voltage to a selected word line and to apply a temperature-compensated pass voltage to at least one unselected word line during a read operation.

Abstract: The present disclosure concerns a method for writing to a self-referenced MRAM cell comprising a magnetic tunnel junction comprising: a storage layer including a first ferromagnetic layer having a first storage magnetization, a second ferromagnetic layer having a second storage magnetization, and a non-magnetic coupling layer separating the first and second ferromagnetic layers; a sense layer having a free sense magnetization; and a tunnel barrier layer included between the sense and storage layers; the first and second ferromagnetic layers being arranged such that a dipolar coupling between the storage) and the sense layers is substantially null; the method comprising: switching the second ferromagnetic magnetization by passing a spin-polarized current in the magnetic tunnel junction; wherein the spin-polarized current is polarized when passing in the sense layer, in accordance with the direction of the sense magnetization. The MRAM cell can be written with low power consumption.

Abstract: The invention relates to a method comprising measuring the temperature of at least one location of a non-volatile memory; determining if said temperature measurement indicates that the data retention time of data stored at said at least one location is reduced below a threshold; and re-writing said data to said non-volatile memory in response to a positive determination.

Abstract: The semiconductor device includes a temperature sensor controlled so that temperature measurement is made once at each of a plurality of different reference temperatures at an interval of a preset number of times of refresh operations and a plurality of latch circuits holding the results of temperature measurement. A refresh period is set from outputs of the latch circuits inclusive of the result of temperature measurement carried out last time for each of a plurality of different reference temperatures. After start of measurement, temperature measurements are repeated every wait time corresponding to circulation of the refresh operations. The refresh period is set such that the high-temperature side results of temperature measurement are prioritized.

Abstract: A nonvolatile memory system includes a memory controller chip with at least one temperature sensor that is individually calibrated, at a single temperature, after the nonvolatile memory system is assembled, so that the calibration data is stored outside the memory controller chip, in a nonvolatile memory chip, thus obviating the need for components to store calibration data in the memory controller chip.

Abstract: A flash memory device includes a memory cell array, a temperature sensing unit, and a control unit. The memory cell array is configured to store a plurality of pieces of configuration data corresponding to respective temperature levels of the flash memory device, the pieces of configuration data indicative of respective operation parameter values of the flash memory device. The temperature sensing unit is configured to measure an ambient temperature of the flash memory device and to generate temperature level data. The a control unit is configured to receive the temperature level data from the temperature sensing unit, to read a piece of configuration data corresponding to the temperature level data from among the plurality of pieces of configuration data stored in the memory cell array, and to set operation parameters of the flash memory device according to an operation parameter value indicated by the read piece of configuration data.

Abstract: Two or more workload indicators affecting a memory cell of a resistance-based, non-volatile memory are measured. The two or more workload indicators are applied to a transfer function that predicts a resistance shift and/or resistance noise variance in response to the two or more workload indicators. A result of the transfer function is applied to shift and/or determine a threshold resistance used for at least one of a program operation and a read operation affecting the memory cell. An error rate of the memory cell is reduced as a result.

Abstract: A semiconductor apparatus may include a plurality of through-semiconductor chip lines which pass through a plurality of stacked semiconductor chips. An uppermost semiconductor chip among the plurality of stacked semiconductor chips is configured to transfer its internal information signal to an assigned corresponding through-semiconductor chip line, and at least one semiconductor chip other than the uppermost semiconductor chip is configured to logically combine respective internal information signals transferred through through-semiconductor chip lines and their internal information signals and sequentially transfer resultant signals to assigned corresponding through-semiconductor chip lines. The at least one semiconductor chip other than the uppermost semiconductor chip logically combines the internal information signals transferred through the through-semiconductor chip lines from adjoining semiconductor chips and its internal information signals.

Abstract: A semiconductor memory apparatus includes: a plurality of memory blocks; and a plurality of temperature sensors disposed adjacent to the respective memory blocks and configured to output a plurality of preliminary temperature sensing signals whose voltage levels are controlled in response to temperature change. A preliminary temperature sensing signal indicating the highest temperature among the plurality of preliminary temperature sensing signals is detected and used as a temperature sensing signal.

Abstract: A method of erasing a non-volatile memory (NVM) array includes determining a first number based on a temperature of the NVM array. Erase pulses of the first number are applied to the NVM array. A first verify of the NVM is performed for a first time after commencing the applying after the first number has been reached.

Abstract: Systems, methods, and devices are disclosed, including an electronic device that includes a first data location, a quantizing circuit, and a reference current source, all coupled to an electrical conductor. The reference current source may include a current mirror with a side coupled to the electrical conductor and a second data location coupled to another side of the current mirror.

Abstract: A method of executing wear leveling in a flash memory device includes determining whether a current temperature is in a normal operating temperature range of the flash memory device, and reprogramming data associated with data blocks to another location in a flash memory array when the current temperature is in the normal operating temperature range of the flash memory device, wherein the data is programmed in a temperature out of the normal operating temperature range of the flash memory device.