Abstract: A semiconductor device includes a memory core with a plurality of memory cells, an internal voltage generator and a low power entry circuit. The low power entry circuit receives a plurality of control signals which are provided to a command decoder, and generates a low power signal indicating a low power consumption mode where a refresh operation is prohibited. The internal voltage generator includes a detector and at least one of booster circuits. The internal voltage generator, coupled to the memory core via an internal power supply line, generates a boosted internal voltage based on an external voltage and supplies the boosted internal voltage to the memory core via the internal power supply line. The internal voltage generator stops supplying the boosted internal voltage to the internal power supply line in response to the low power signal while the external voltage is supplied to the semiconductor device.

Abstract: A memory system includes a clock generation circuit, a memory device, and a controller. The memory device includes output circuits and a temperature sensor, the output circuits configured to output data at an output timing obtained based on a clock signal supplied from the clock generation circuit. The controller includes input circuits that receive the data outputted from the memory device at an input timing obtained based on a clock signal supplied from the clock generation circuit and a correction value setting circuit that adjusts the input timing based on a temperature value from the temperature sensor.

Abstract: A semiconductor device includes a clock supply circuit configured to generate an internal clock by using an external clock, an internal circuit configured to operate in synchronization with the internal clock and enter a power-down mode in response to a power-down signal, and a controller configured to control an entry of the clock supply circuit into the power-down mode in response to a locking signal, which represents that the clock supply circuit has been locked, and the power-down signal.

Abstract: A circuit includes a first node; a second node; a first PMOS transistor having a source coupled to the first node, a drain coupled to a first control transistor, and a gate driven by a first voltage; and a first NMOS transistor having a source coupled to the second node, a drain coupled to the first control transistor, and a gate driven by a second voltage. The first PMOS transistor is configured to automatically turn off based on the first voltage and a first node voltage at the first node. The first NMOS transistor is configured to automatically turn off based on the second voltage and a second node voltage at the second node. When the first PMOS transistor, the control transistor, and the first NMOS transistor are on, the first node voltage is lowered while the second voltage is raised.

Abstract: According to one disclosed embodiment, a content-addressable memory (CAM) system configured for reduced power consumption includes a sensing circuit utilized to apply a sense voltage to a matchline of the CAM system, a valid bit cell coupled to the matchline, and a power cut-off circuit configured to isolate the sense voltage from the matchline when an invalid validity state is stored in the valid bit cell, thereby reducing power consumption by the CAM system. In one embodiment, the power cut-off circuit isolates the sense voltage from the matchline by decoupling the sensing circuit from a control signal when an invalid validity state is stored in the valid bit cell.

Abstract: A power management method includes receiving a first command with first address indicating a first high power operation that is immediately executed in a first memory die, after receipt of the first command, receiving a second command with a second address indicating a second high power operation, such that an immediate execution of the second high power operation would overlap the first high power operation, and delaying execution of second high power operation through a first waiting period that ends upon completion of the first high power operation, while applying a reference voltage to a second word line of the second memory die indicated by the second address.

Abstract: Described herein are methods and apparatuses for write-assist voltage generation and power-down voltage scaling for static random access memory (SRAM) cells. According to various embodiments, an SRAM cell may include a local power supply voltage node for receiving a power supply voltage generated by a power supply voltage generator circuit, the generated power supply voltage being substantially equal to or less than a global power supply voltage provided to one or more transistors of the SRAM cell during a write-enable or power-down mode.

Abstract: Memories, clock synchronization circuits, clock synchronization controller circuits, and methods for setting a voltage controlled delay of a clock synchronization circuit and tracking and recording the control voltage are disclosed. For example, a clock synchronization controller provides an initial control voltage to the voltage controlled delay during initialization of the synchronization circuit until a phase dependent control voltage stabilizes. The stable phase dependent control voltage is substituted for the initial control voltage. Following stabilization of the phase dependent control voltage, a phase detector of the clock synchronization circuit is activated. A recovery control voltage is provided by the clock synchronization controller to the voltage controlled delay during recovery of the clock synchronization from a power-saving mode until the phase dependent control voltage stabilizes.

Abstract: An apparatus and method for isolating circuitry from one power domain from that of another power domain prior to performing a power down operation is disclosed. In one embodiment, circuitry in a first power domain is coupled to receive signals based on outputs from circuitry in a second power domain. The signals may be conveyed to the circuitry in the first power domain via passgate circuits. When powering down the circuitry of the first and second power domains, a control circuit may first deactivate the passgate circuits in order to isolate the circuitry of the first power domain from that of the second power domain. The circuitry in the second power domain may be powered off subsequent to deactivating the passgate circuits. The circuitry in the first power domain may be powered off subsequent to powering off the circuitry in the second power domain.

Abstract: Controllable arrays in a memory may be activated and deactivated independently. In one embodiment, a processor may include a memory. The memory may be a de-interleaved memory with independently selectable arrays. Based on an address bit of an address used to access data from the memory, a wordline and downstream components may be activated while another wordline and downstream components may be deactivated.

Abstract: A memory includes a shared I/O unit that is shared between multiple storage arrays provides output data from the arrays. The shared I/O includes an output latch with an integrated output clamp. The I/O unit may be configured to provide output data from the storage arrays via data output signal paths. The I/O unit includes an output latch configured to force a valid logic level on the data output signal paths in response to a power down condition.

Abstract: To provide an internal power supply circuit that supplies a power supply voltage to an internal circuit of a semiconductor device via an internal power supply wiring, the internal power supply circuit includes a plurality of power supply units connected in common to the internal power supply wiring and an internal-power-supply control circuit that selects either activation or deactivation with regard to at least a part of the power supply units.

Abstract: A memory may include a memory array, a plurality of control circuits, and a plurality of isolation circuits. The plurality of control circuits may be configured to generate control signals for the memory array. For example, the plurality of control circuits may include a plurality of word line driver circuits. The plurality of isolation circuits may be configured to receive the control signals from the plurality of control circuits and a plurality of isolation signals. A first isolation signal may correspond to the plurality of word line driver circuits and at least one second isolation signal may correspond to other ones of the plurality of control circuits. The first isolation signal and the second isolation signal may be independently controlled during memory tests to detect stuck-at faults associated with the plurality of isolation signals.

Abstract: A first module calculates a failure occurrence risk index of each data storage area address. A second module calculates a power saving index of each data storage area address. A third module calculates an access speed index per unit data volume necessary to access each data storage area address. A fourth module generates a distribution table that represents the failure occurrence risk index, the power saving index, and the access speed index for each candidate address, with respect to data to be distributed. A fifth module selects a candidate address in the distribution table such that the power saving index and the access speed index meet restricting conditions and the failure occurrence risk index is minimized, and distributes the data to the candidate address.

Abstract: A memory power supply circuit is used for providing power to a first memory module received in a first memory slot and a second memory module received in a second memory slot, and comprises a logic circuit and a switching power supply. The logic circuit comprises a first input terminal electrically connected to the first memory slot, a second input terminal electrically connected to the second memory slot, and a first signal terminal. The switching power supply comprises a first power terminal, a second power terminal, and a second signal terminal electrically connected to the first signal terminal. When the first memory slot and the second memory slot receive the first memory slot and the second memory module, the switching power supply turns on the first power terminal and the second power terminal; otherwise, the switching power supply turns off the first power terminal or the second power terminal.

Abstract: A circuit comprises a first voltage source, a second voltage source, a first switch, firsts transistors, and a control circuitry. The first switch is configured to selectively couple the first voltage source or the second voltage source to a first signal line. The first transistors are in an IO circuitry and have first bulks configured to receive the first signal line. The control circuitry is configured to receive a clock and a command signal on a command signal line, and generate a first control signal on a first control signal line to control the first switch based on the clock and the command signal.

Abstract: A sensor node is provided. The sensor node regulates the power supplied to memories of a memory unit individually and the power supplied to a transmitter and a receiver of an RF transceiver individually. Thus, the sensor node can minimize its power consumption.

Abstract: To provide a semiconductor device including a plurality of circuit blocks each of which is capable of performing power gating by setting off periods appropriate to temperatures of the respective circuit blocks. Specifically, the semiconductor device includes an arithmetic circuit, a memory circuit configured to hold data obtained by the arithmetic circuit, a power supply control switch configured to control supply of the power supply voltage to the arithmetic circuit, a temperature detection circuit configured to detect the temperature of the memory circuit and to estimate overhead from the temperature, and a controller configured to set a period during which supply of the power supply voltage is stopped in the case where a power consumption of the arithmetic circuit during the period is larger than the overhead period and to control the power supply control switch.

Abstract: The present invention relates to a semiconductor memory device having a low power consumption type column decoder and read operation method thereof. In accordance with the semiconductor memory device and read operation method thereof according to the present invention, one of a plurality of decoding units of a column decoder is selectively operated according to a logic value(s) of one of some of bits of a column address signal. It is thus possible to reduce unnecessary switching current.

Abstract: Methods, apparatus, and products are disclosed for reducing power consumption during execution of an application on a plurality of compute nodes that include: powering up, during compute node initialization, only a portion of computer memory of the compute node, including configuring an operating system for the compute node in the powered up portion of computer memory; receiving, by the operating system, an instruction to load an application for execution; allocating, by the operating system, additional portions of computer memory to the application for use during execution; powering up the additional portions of computer memory allocated for use by the application during execution; and loading, by the operating system, the application into the powered up additional portions of computer memory.

Abstract: Methods and structures for configuring an integrated circuit including repeated cells that are divided into banks having a respective power assist and a respective operational assist are provided. A method includes configuring the banks without power assist and operational assist. The method further includes selecting the power assist for a bank based on a determination that a weak cell remains in the bank after configuring the bank with the respective operational assist.

Abstract: Multi-channel semiconductor integrated circuit devices are provided including a plurality of memory devices that are independently accessible, each of the plurality of memory devices including at least one power generation unit and a control unit for controlling an operation of the at least one power generation unit, a detection unit for detecting an operation state of the plurality of memory devices, and a common control unit for commonly controlling an operation of the at least one power generation unit of the plurality of memory devices, according to the operation state of the plurality of memory devices detected by the detection unit. The control unit of each of the plurality of memory devices controls the operation of the at least one power generation unit of a corresponding one of the plurality of memory devices.

Abstract: A semiconductor memory apparatus includes a memory cell array including a plurality of chips, a control circuit configured to control an internal operation of the memory cell array, a power circuit configured to supply power to the control circuit, and a mode setting circuit configured to output a flag signal for power supply control based on a mode register set command and data received through a data input/output pad, in response to a clock enable signal.

Abstract: Apparatuses and methods of providing word line voltages are disclosed. An example apparatus includes a voltage driver and a word line driver. The voltage driver is configured to provide a word line voltage, wherein the word line voltage is a pumped supply voltage responsive to an active mode and the word line voltage is a non-zero voltage less than the pumped supply voltage during a standby mode. The word line driver is coupled to the voltage driver and is configured to drive a respective word line to the word line voltage during the active and standby modes.

Abstract: Power sources, backup power circuits, power source control circuits, data storage devices, and methods relating to controlling application of power to a node are disclosed. An example power source includes an input, backup power source, and a backup power source control circuit. The input is configured to be coupled to a primary power source and further configured to couple the primary power source to the output when the input is coupled to the primary power source. The backup power source control circuit is configured to control a current path from the backup power source to the output based at least in part on a voltage applied to the input.

Abstract: A memory comprising memory cells wherein the memory is configured to operate in a normal voltage mode and a low voltage mode. The method includes during the normal voltage mode, operating the memory cells at a first voltage across each of the memory cells. The method further includes upon transitioning from the normal voltage mode to the low voltage mode, operating the memory cells at a second voltage across each of the memory cells, wherein the second voltage is lower than the first voltage. The method further includes performing an access on a subset of the memory cells while maintaining the second voltage across the memory cells.

Abstract: Embodiments for selecting regions of memory are described. For example, in one embodiment a memory device having an array of memory cells includes an array selection block. The array selection block receives an input signal indicative of a region in the array of memory cells. The array selection block generates a selection signal to map the region to at least one physical location in the array of memory cells, based on the detection of the number of defects in that location.

Abstract: A memory structure can include a first memory block including a plurality of memory cells corresponding to a first subset of addresses of a range of addresses and a second memory block including a plurality of memory cells corresponding to a second subset of addresses of the range of addresses. The memory structure can include control circuitry coupled to the first memory block and the second memory block and configured to provide control signals to the first memory block and the second memory block. The first memory block and the second memory block can be configured to implement a reduced power mode independently of one another responsive to the control signals.

Abstract: A semiconductor device includes a first buffer element configured to buffer a first mode signal inputted from the outside of the semiconductor device, and a second buffer element configured to buffer a second mode signal inputted from the outside by being enabled in response to an output signal of the first buffer element.

Abstract: According to an embodiment, a semiconductor device includes a power supply switch and a first regulator. One end of the power supply switch is connected to an input terminal. The other end of the power supply switch is connected to an output terminal. The first regulator includes a power supply terminal connected to the one end of the power supply switch, and a voltage output terminal connected to the other end of the power supply switch. The first regulator is configured to control a voltage of the voltage output terminal to approach a target voltage based on a voltage of the power supply terminal. The target voltage is switched to a first voltage or a second voltage. The first voltage is equal to or more than the voltage of the power supply terminal. The second voltage is lower than the voltage of the power supply terminal.

Abstract: Methods and apparatuses that relate to an integrated circuit (IC) with adaptive power state management are described. The IC can be coupled with, and can control the operation of, a memory device. The IC and the memory device can be operated in multiple operational states, wherein each operational state may represent a tradeoff point between performance and power consumption. The IC may be capable of: (1) changing the operational state of the IC and/or the operational state of the memory device based on the occurrence of one or more conditions, and/or (2) changing the one or more conditions based on measuring one or more performance values associated with the IC and/or the memory device.

Abstract: A semiconductor device in accordance with an aspect of the present invention includes first and second power-supply circuits each of which generates an internal power-supply voltage by converting a voltage value of a power-supply voltage into a different voltage value, a first internal circuit that receives a supply of the internal power-supply voltage from the first power-supply circuit through a first line, a second internal circuit that receives a supply of the internal power-supply voltage from the second power-supply circuit through a second line, an inter-block line that connects the first and second lines to each other, and a control circuit that operates the first and second internal circuits in a predetermined operating cycle, and controls a length of a period during which the first and second internal circuits operate simultaneously.

Abstract: A processor includes a first virtual terminal, a second virtual terminal, circuitry coupled to the first virtual terminal for providing current to the first virtual terminal, a first regulating transistor coupled between the first virtual terminal and the second virtual terminal, a first disabling transistor coupled in parallel with the first regulating transistor for selectively disabling the first regulating transistor by directly connecting the second virtual terminal to the first virtual terminal, a second regulating transistor coupled between the second virtual terminal and a first power supply voltage terminal, and a second disabling transistor coupled in parallel with the second regulating transistor for selectively disabling the second regulating transistor by directly connecting the second virtual terminal to the first power supply voltage terminal.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: A data input buffer is changed from an inactive to an active state after the reception of instruction for a write operation effected on a memory unit. The input buffer is a differential input buffer having interface specs based on SSTL, for example, which is brought to an active state by turning on a power switch to cause a through current to flow and receives a signal therein while immediately following a small change in small-amplitude signal. Since the input buffer is brought to the active state only when the write operation's instruction for the memory unit is provided, it is rendered inactive in advance before the instruction is provided, whereby wasteful power consumption is reduced. In another aspect, power consumption is reduced by changing from the active to the inactive state in a time period from a write command issuing to a next command issuing.

Abstract: Integrated circuits with memory elements are provided. A memory element may include a storage circuit coupled to data lines through access transistors. The access transistors may have gates that are controlled by an address signal. The address signal may be asserted during read/write operations to turn on the access transistors so that read/write data can be passed through the access transistors. The voltage level to which the address signal is raised during read/write operations may be adjusted using programmable voltage biasing circuitry. A number of integrated circuits may be tested during device characterization procedures to determine the amount by which the address signal should be adjusted using the programmable voltage biasing circuit so that the memory elements in the integrated circuits satisfy design criteria.

Abstract: A memory cell with an internal supply feedback loop is provided herein. The memory cell includes a latch having two storage nodes Q and QB, and a supply node. A gating device couples the supply node of the latch to the supply voltage. The gating device is controlled by a feedback loop coming from storage node QB. Due to the aforementioned asymmetric topology, the writing of logic “1” and the writing of logic “0” are carried out differently. Contrary to standard SRAM cells, in the hold states, only the QB storage node presents a valid value of stored data. The feedback loop cuts off the supply voltage for the latch such that the latch is no longer an inverting latch. By cutting off the supply voltage at the stable hold states, while maintaining readability of the memory cell, leakage currents associated with the hold states are eliminated altogether.

Abstract: A semiconductor device includes a first amplifier circuit, a second amplifier circuit, first and second bit lines coupled to the first amplifier circuit, third and fourth bit lines coupled to the second amplifier circuit, a first equalizer circuit being coupled to the first and second bit lines, and a second equalizer circuit being coupled between the second and third bit lines. The second equalizer circuit being closer to the second amplifier circuit than the first equalizer circuit, the first equalizer circuit being closer to the first amplifier circuit than the second equalizer circuit.

Abstract: A semiconductor device comprises a first pair of signal lines and a first control circuit. The first control circuit precharges each of the first pair of signal lines to a first voltage in response to a precharge signal, and changes the voltage level of each of the first pair of signal lines to a second voltage different from the first voltage when a deep power down signal is input.

Abstract: A content search system including a CAM device having a plurality of CAM blocks and a governor logic receives a search request and compares the number of CAM blocks required to perform the requested search to a limit number, the limit number being the maximum number of CAM blocks permitted to be used in a requested search operation. If the number of CAM blocks required to perform the requested search exceeds the maximum number of CAM blocks permitted to be used in a requested search operation, then the search operation is rejected. The governing operation can be performed on each requested search, thus limiting power dissipation. The relationship between a maximum number of CAM blocks and power dissipation can be characterized, and a corresponding block limit value can be stored into a memory accessible by governor logic.

Abstract: A memory module includes: an ODT circuit on a memory device and including pull-up and pull-down resistors connected between pull-up and pull-down transistors. A data masking (DM) pad is provided in a tap region of the module board. A current leakage monitoring unit is also provided and receives a ground state signal from the DM pad and a bit configuration signal from the memory device and disables the pull-up transistors to cut off a current path between the pull-up resistors of the ODT circuit and the DM pad during a ODT enable mode.

Abstract: Provided herein is a new RF implementation. Instead of using a pre-charged High node for one or more of its evaluation nodes, it employs an evaluation (or evaluate) node that is discharged (Low) prior to evaluation and enters evaluation in a discharged state. In some embodiments, with such “normally Low” evaluation nodes, it uses pull-up stack devices, rather than pull-down devices, to charge the evaluate node during an evaluate phase if the logic so dictates.

Abstract: A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.

Abstract: A semiconductor memory device includes a bit line sense amplifier block array, upper and lower memory cell arrays and a sense amplifier controller. The bit line sense amplifier block array senses and amplifies data of a memory cell array. The upper and the lower memory cell arrays are respectively connected to upper and lower sides of the bit line sense amplifier block array and store the data in the memory cell array. The sense amplifier controller selectively connects one of the upper and lower memory cell arrays to the bit line sense amplifier block array in response to an active command, and releases the connection when a corresponding one of the upper and lower memory cell arrays are not selected but overdriven.

Abstract: A memory array can be arranged with header devices to reduce leakage. The header devices are coupled with a decoder to receive at least a first portion of a memory address indication and are coupled to receive current from a power supply. Each of header devices is adapted to provide power from the power supply to a set of the wordline drivers corresponding to a bank indicated with the first portion of the memory address indication. Each of the logic devices is coupled to receive at least a second portion of the memory address indication from a decoder. Each of the logic devices is coupled to activate the wordline drivers coupled with those of the wordlines indicated with the second portion of the memory address indication.

Abstract: In an embodiment, a power management unit (PMU) may automatically transition (in hardware) the performance states of one or more performance domains in a system. The target performance states to which the performance domains are to transition may be programmable in the PMU by software, and software may signal the PMU that a processor in the system is to enter the sleep state. The PMU may control the transition of the performance domains to the target performance states, and may cause the processor to enter the sleep state. In an embodiment, the PMU may be programmable with a second set of target performance states to which the performance domains are to transition when the processor exits the sleep state. The PMU may control the transition of the performance domains to the second targeted performance states and cause the processor to exit the sleep state.

Abstract: To provide a plurality of memory banks, each of which is divided into a plurality of segments; a bank address register that designates a memory bank that becomes a refresh target; a segment address register that designates a segment that becomes a refresh target; and a refresh control circuit that prohibits a refresh operation of the memory bank or the segment not designated by at least one of the bank address register and the segment address register. This semiconductor device is capable of designating whether to perform a refresh operation not only in a memory bank unit but also in a segment unit within the memory bank, and thus it achieves a further reduction of the power consumption.

Abstract: Method and integrated circuit for tracking for read and inverse write back of a group of thyristor-based memory cells is described. The method includes: reading the group of memory cells to obtain read data, and writing back opposite data states for the read data to the group of memory cells. The group of memory cells includes data cells and at least one check cell for check data, where the check data indicates polarity of the read data. The integrated circuit includes a grouping of memory cells of an array of memory cells including data cells and at least one check cell, and sense amplifiers. The at least one check cell is to track inversion/non-inversion status of the data cells associated therewith, and the sense amplifiers are coupled to obtain read information from the grouping and to write back data states opposite of those of the read information.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.

Abstract: A clock control device includes a set circuit for triggering an input address in response to an internal command signal to output a first address, a shift register including a plurality of flip-flops connected in series wherein some of the flip-flops perform a flip-flop operation of the first address in synchronism with an internal clock to provide a second address and the remaining flip-flops sequentially conduct a flip-flop operation of the second address in synchronism with a synchronous clock to produce an internal address, an active signal generator for outputting an active signal based on state of an active control signal indicating whether or not each bank is activated and a precharge control signal, and a clock generator for generating the synchronous clock depending on the internal clock and the active signal.