Abstract: Various embodiments may generally be directed to a variable resistance data storage device and a method of managing the device. A data storage device may have at least a controller configured to re-characterize at least one variable resistance memory cell in response to an identified variance from a predetermined resistance threshold.

Abstract: A method and an apparatus are provided. The apparatus is a hardware module that controls a power mode of a plurality of modules. The apparatus receives an indication of a desired operational frequency. Based on the received indication, the apparatus determines to switch from a first power mode associated with a first set of modules to a second power mode corresponding to the desired operational frequency and associated with a second set of modules. The apparatus enables modules in the second set of modules that are unassociated with the first power mode, stops traffic through the plurality of modules upon expiration of a time period after enabling the modules in the second set of modules that are unassociated with the first power mode, routes traffic through the second set of modules, and disables modules in the first set of modules that are unassociated with the second power mode.

Abstract: Disclosed embodiments may include an apparatus having a segment wordline enable coupled to logic to selectively disable ones of a number of segment wordline drivers. The logic may partition a page of the apparatus to reduce power consumed through activation of the disabled ones of the number of segment wordlines. Other embodiments may be disclosed.

Abstract: A semiconductor integrated circuit includes a plurality of first non-volatile registers including a retention circuit that retains volatile data and one or more non-volatile elements capable of retaining non-volatile data, and a second non-volatile register that retains a load enable bit that decides in which one of the plurality of first non-volatile registers data is loaded. The semiconductor integrated circuit also includes a non-volatile register control circuit that, when supply power is delivered from outside, loads to the retention circuit data retained by the non-volatile element(s) contained in the first non-volatile register specified by the load enable bit loaded from the second non-volatile register (FIG. 1).

Abstract: A semiconductor device includes plural memory cells each having a first inverter and a second inverter, with an input of the first inverter being coupled to an output of the second inverter and an input of the second inverter being coupled to an output of the first inverter. The first and second inverters have drive transistors supplied with a source voltage where the source voltage is raised in response to a level shift of a control signal supplied to a switch of a control circuit. The control circuit further includes a resistance element in parallel with a MOS transistor connected as a diode.

Abstract: An apparatus including a memory module and power converter and method of operating the same. In one embodiment, the apparatus includes a memory module, located on a circuit board, configured to operate from a first voltage and a second voltage being a multiple of the first voltage. The apparatus also includes a power converter employing a switched-capacitor power train, located on the circuit board, configured to provide the second voltage for the memory module from the first voltage.

Abstract: A semiconductor device includes a power-on reset circuit configured to receive a power voltage and generate a power-on reset signal varying with a voltage level of the power voltage, an internal circuit configured to be initialized and operated in response to the power-on reset signal and generate a hold signal based on an operation mode of the internal circuit, and a reset protection circuit configured to deactivate the power-on reset circuit in response to the hold signal and provide a replacement signal for replacing the power-on reset signal to the internal circuit when the power-on reset circuit is deactivated.

Abstract: A semiconductor device comprises a first pair of signal lines and a first control circuit. The first control circuit precharges each of the first pair of signal lines to a first voltage in response to a precharge signal, and changes the voltage level of each of the first pair of signal lines to a second voltage different from the first voltage when a deep power down signal is input.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: To increase a storage capacity of a memory module per unit area, and to provide a memory module with low power consumption, a transistor formed using an oxide semiconductor film, a silicon carbide film, a gallium nitride film, or the like, which is highly purified and has a wide band gap of 2.5 eV or higher is used for a DRAM, so that a retention period of potentials in a capacitor can be extended. Further, a memory cell has n capacitors with different capacitances and the n capacitors are each connected to a corresponding one of n data lines, so that a variety of the storage capacitances can be obtained and multilevel data can be stored. The capacitors may be stacked for reducing the area of the memory cell.

Abstract: The invention is an electronic device including a ferroelectric random access memory (FRAM), a first supply voltage domain, a second supply voltage domain and a low drop output voltage regulator (LDO) receive a first supply voltage of the first supply voltage domain and providing a second supply voltage of the second supply voltage domain. The second supply voltage domain supplies the FRAM. The LDO switches between a first state providing and maintaining the second supply voltage of the second supply voltage domain and a second state providing a high impedance output to the second supply voltage domain. The electronic device switches the LDO from the first state to the second state in response to a failure of the first supply voltage domain.

Abstract: The present disclosure includes apparatuses and methods for power consumption control. A number of embodiments include determining power consumption information for each phase in a combination of phases of a command, and authorizing execution of at least one of the phases in the combination based, at least partially, on the power consumption information determined for the at least one of the phases.

Abstract: According to one disclosed embodiment, a content-addressable memory (CAM) system configured for reduced power consumption includes a sensing circuit utilized to apply a sense voltage to a matchline of the CAM system, a valid bit cell coupled to the matchline, and a power cut-off circuit configured to isolate the sense voltage from the matchline when an invalid validity state is stored in the valid bit cell, thereby reducing power consumption by the CAM system. In one embodiment, the power cut-off circuit isolates the sense voltage from the matchline by decoupling the sensing circuit from a control signal when an invalid validity state is stored in the valid bit cell.

Abstract: A semiconductor memory device includes a standby voltage providing unit. The standby voltage providing unit is configured to receive an external voltage, primarily clamp and secondarily clamp a predetermined voltage, and provide the predetermined voltage as an internal voltage, during a standby mode.

Abstract: A method of reducing leakage current in a memory circuit is disclosed (FIG. 8A). The method includes connecting a first supply voltage terminal (VDD) to a bulk terminal of a transistor in an active mode of operation. The method further includes detecting a low power mode (SLEEP) of operation of the transistor and disconnecting the first supply voltage terminal from the bulk terminal in response to the step of detecting.

Abstract: An integrated circuit may have a clock input pin coupled to a buffer (24). The buffer may supply a clock signal (28) to an integrated circuit chip such as the memory. To conserve power, the buffer is powered down. When ready for use, the buffer is quickly powered back up. In one embodiment, in response to a predetermined number of toggles of the clock signal, the buffer is automatically powered up.

Abstract: Systems and method for reducing leakage currents and power consumption in a memory array comprising memory cells, such as 8T SRAM cells. The memory array includes logic for dynamically placing a group of memory cells in the memory array in a reduced power state during sleep mode or inactive states of the group of memory cells, such that leakage parts are effectively eliminated. The memory array further includes logic for dynamically enabling a selected group of the memory cells during read or write access operations on the selected memory cells, wherein corresponding read or write bitlines are precharged before and after the respective rear or write operations.

Abstract: A semiconductor memory circuit includes: a plurality of memory regions; a plurality of driving units configured to be enabled in response to a plurality of enable signals, respectively, and generate a predetermined voltage used for operations of the plurality of memory regions; and an enable control unit configured to count a control pulse and activate one or more enable signals among the plurality of enable signals.

Abstract: A storage device according to an embodiment includes first and second non-volatile semiconductor memories. In addition, the storage device includes first controller that controls the first non-volatile memory to cause the first non-volatile memory to perform processes. In addition, the storage device includes second controller that controls the second non-volatile memory to cause the second non-volatile memory to perform processes. The storage device further includes a signal line which is connected to the first controller and the second controller and through which a token is transmitted between the first controller and the second controller. The first controller is capable of controlling the first non-volatile memory while holding the token and the second controller is capable of controlling the second non-volatile memory while holding the token.

Abstract: A memory includes a word line having a word line voltage, a charge pump coupled to the word line, and a dynamic feedback control circuit coupled to the charge pump. The dynamic feedback control circuit is capable of changing a clock frequency of a clock signal supplied the charge pump from a first non-zero value to a second non-zero value depending on the difference between the word line voltage and a target threshold voltage.

Abstract: A memory array comprises a plurality of memory cells arranged in a plurality of rows and a plurality of columns. A column of the plurality of columns includes a first voltage circuit coupled to internal first nodes of memory cells in the one of the plurality of columns and a second voltage circuit coupled to internal second nodes of the memory cells in the one of the plurality of columns. The first voltage circuit is configured to provide one of a first supply voltage and a second supply voltage lower than the first supply voltage to the internal first nodes. The second voltage circuit is configured to provide one of a first reference voltage and a second reference voltage higher than the first reference voltage to the internal second nodes.

Abstract: Disclosed embodiments may include an apparatus having a segment wordline enable coupled to logic to selectively disable ones of a number of segment wordline drivers. The logic may partition a page of the apparatus to reduce power consumed through activation of the disabled ones of the number of segment wordlines. Other embodiments may be disclosed.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: A method of reducing leakage current in a memory circuit is disclosed (FIG. 8A). The method includes connecting a first supply voltage terminal (VDD) to a bulk terminal of a transistor in an active mode of operation. The method further includes detecting a low power mode (SLEEP) of operation of the transistor and disconnecting the first supply voltage terminal from the bulk terminal in response to the step of detecting.

Abstract: A memory circuit including at least one memory array and at least one sleep transistor connected to the at least one memory array and connected to a first power line for providing a first power voltage. The memory circuit further includes at least one diode-connected transistor directly connected to the at least one memory array and directly connected to the first power line and a back-bias circuit electrically coupled with a bulk of the at least one diode-connected transistor.

Abstract: Power sources, backup power circuits, power source control circuits, data storage devices, and methods relating to controlling application of power to a node are disclosed. An example power source includes an input, backup power source, and a backup power source control circuit. The input is configured to be coupled to a primary power source and further configured to couple the primary power source to the output when the input is coupled to the primary power source. The backup power source control circuit is configured to control a current path from the backup power source to the output based at least in part on a voltage applied to the input.

Abstract: A DLL system in a memory device with wide frequency application includes: a clock receiver that generates a clock for the DLL system; a delay line, coupled to the clock receiver, for receiving the generated clock and delaying the clock according to a received power supply; a power regulator, for generating the power supply to the DLL delay line according to a bias; a control logic, coupled to the clock receiver, for generating a plurality of logic signals respectively corresponding to a plurality of frequency ranges of the clock; and a bias generator, coupled between the control logic and the power regulator, for providing the bias to the power regulator, wherein the value of the bias is according to a logic signal output by the control logic.

Abstract: Disclosed herein is a semiconductor device comprising a global bit line, a first local bit line coupled to normal memory cells, a second local bit line coupled to redundant memory cells first and second hierarchical switches, a precharge circuit precharging the global bit line, a redundancy determination circuit determining whether or not an accessed address matches a defective address, and a control circuit. In a standby state, the global bit line and the second local bit line are precharged through the second hierarchical switch. In an active state, the first local bit line is precharged through the first hierarchical switch, subsequently when the redundancy determination circuit determines that the addresses do not match, the second hierarchical switch is inactivated to access the normal memory cells, and when the redundancy determination circuit determines that the addresses match each other, the first hierarchical switch is inactivated to access the redundant memory cells.

Abstract: A method and apparatus for memory power and/or area reduction. An array of memory cells may be scanned to detect faulty memory cells, if any, in the array. A supply voltage Vmem applied to the array of memory cells may be controlled based on a result of the scan, and based on a sensitivity coefficient of one, or more, of the array of memory cells. The sensitivity coefficient may indicate an impact that the one, or more, of the array of memory cells being faulty may have on the performance of a device that reads and writes data to the memory array. Additionally or alternatively, the physical dimensions of the memory cells may be determined based on the sensitivity coefficient(s) and/or based on a number of faulty memory cells that can be tolerated in the array of memory cells.

Abstract: A method and circuit for implementing faster-cycle-time and lower-energy write operations for Synchronous Dynamic Random Access Memory (SDRAM), and a design structure on which the subject circuit resides are provided. A first RAS (row address strobe) to CAS (column address strobe) command delay (tRCD) is provided to the SDRAM for a read operation. A second delay tRCD is provided for a write operation that is substantially shorter than the first delay tRCD for the read operation.

Abstract: The present disclosure concerns a self-referenced MRAM element, comprising a magnetic tunnel junction having a magnetoresistance, comprising: a storage layer having a storage magnetization that is pinned along a first direction when the magnetic tunnel junction is at a low temperature threshold; a sense layer having a sense magnetization; and a tunnel barrier layer included between the storage layer and the sense layer; and an aligning device arranged for providing the sense magnetization with a magnetic anisotropy along a second direction that is substantially perpendicular to the first direction such that the sense magnetization is adjusted about the second direction; the aligning device being further arranged such that, when a first read magnetic field is provided, a resistance variation range of the magnetic tunnel junction is at least about 20% of the magnetoresistance. The self-referenced MRAM cell can be read with an increased reliability and has reducing power consumption.

Abstract: A content addressable memory (CAM) device has an array including a plurality of CAM rows that are partitioned into row segments, wherein a respective row includes a first row segment including a number of first CAM cells coupled to a first match line segment, a second row segment including a number of second CAM cells coupled to a second match line segment, and a circuit to selectively pre-charge the first match line segment in response to a value indicating whether data stored in the first row segment of the respective row is the same as data stored in the first row segment of another row. Power consumption can be reduced during compare operations in which the first row segment of another row that stores the same data as the first row segment of the respective row is not enabled.

Abstract: A method and apparatus for reducing current consumption by employing a memory refresh operation is provided. The method employs a refresh operation in an apparatus including a memory in which a partial refresh operation is performed. The method includes classifying data loaded in the memory into first data and second data, dividing the memory into a first area and a second area when an attempt to access the first data is not detected during a preset time, separately arranging the first data and the second data in the first area and the second area, respectively, performing a refresh operation in the second area at a preset time in order to retain data, and loading the first data into the memory when the attempt to access the first data is detected.

Abstract: Embodiments of the present invention are directed to a memory subsystem comprising a memory controller, multiple memory modules interconnected with the memory controller by one or more communications media, each memory module comprising a substrate to which multiple memory chips are mounted and electronically connected to the communications media, and a power-supply signal routed to two or more voltage regulators within the memory subsystem from a system power supply, the voltage regulators outputting two or more internal power signals, each power signal providing a different, regulated voltage, which are routed to each of the memory chips. Another embodiment of the present invention is directed to a memory module comprising a substrate to which multiple memory chips are mounted and two or more voltage regulators mounted to, or fabricated within, the substrate.

Abstract: A controlling method of a connector, the connector, and a memory storage device are provided. The controlling method includes following steps. A first clock signal generated by a first oscillator in the connector is obtained. A second clock signal generated by a second oscillator in the connector is obtained. A frequency shift of the first oscillator is smaller than a frequency shift of the second oscillator. A detection window information corresponding to the second clock signal is corrected according to the first clock signal and the second clock signal. The first oscillator is turned off. A signal stream including a first signal is received. A detection window is generated according to the corrected detection window information and the second clock signal, and whether the first signal is a burst signal is determined according to the detection window. Thereby, the power consumption of the connector is reduced.

Abstract: A memory device can perform a first operation mode in which a discrete level is supplied to cause the memory cell to retain a logical level, and prevent unnecessary power consumption due to an operation of a power source which is unnecessary in the first operation mode. The memory device includes: a first power source for supplying a first potential level; a second power source for supplying a second potential level, a third power source for supplying a potential higher than a highest potential of discrete levels; and a fourth power source for supplying a potential lower than a lowest potential of the discrete levels, the first and second potential levels being used to supply the discrete levels, when the first operation is carried out, VDD, VSS, and GVDD being caused to be in operation and the fourth power source being stopped from being in operation.

Abstract: An internal voltage generating circuit includes a divided voltage generator configured to generate a divided voltage by dividing a feedback internal voltage level at a division ratio corresponding to an operation mode control signal, a voltage detector configured to detect a level of the divided voltage based on a reference voltage level, an internal voltage generator configured to receive a supply voltage as power source and generate the internal voltage in response to an output signal of the voltage detector, and an under-driving unit configured to under-drive an internal voltage terminal to a supply voltage in an under-driving operation region that is determined in response to the operation mode control signal.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A data storage device is disclosed comprising a non-volatile memory and control circuitry comprising an interface operable to receive a supply voltage, and a capacitor. An operating voltage regulator converts the supply voltage into an operating voltage used to operate the non-volatile memory. The supply voltage is used to charge the capacitor to a capacitor voltage higher than the supply voltage, and during a power failure, a backup voltage regulator converts the capacitor voltage into a backup voltage substantially equal to the supply voltage. The operating voltage regulator converts the backup voltage into the operating voltage used to operate the non-volatile memory.

Abstract: A driver of a semiconductor memory device and driving method thereof is disclosed, which relates to a technology for reducing consumption of a leakage current not required for a driver circuit of a semiconductor memory device. The driver of the semiconductor memory device includes a drive controller configured to selectively provide a first voltage and a second voltage, that have different levels in response to a power-down signal, to a first node; an input driver configured to selectively output a voltage received from the first node in response to a decoding signal; and an output driver configured to be driven in response to an output voltage of the input driver.

Abstract: Embodiments are described for a method for regulating sleep mode of a plurality of sub-banks in an SRAM array by isolating all of the sub-banks from a regulator upon access to at least one sub-bank that causes the accessed sub-bank to go to an operating voltage, and isolating the accessed sub-bank from non accessed sub-banks, while maintaining a sleep voltage on a load memory array and each of the sub-banks through the regulator; comparing a voltage on the non accessed sub-banks to a voltage output of the regulator; and providing a sleep voltage level to all of the sub-banks through the regulator when the voltage on the non accessed sub-banks is less than the sleep voltage.

Abstract: Disclosed are a flash memory device and flash memory programming method that equalizes a wear-level. The flash memory device includes a memory cell array, an inversion determining unit to generate a programming page through inverting or not inverting a data page based on a number of ‘1’s and ‘0’s in the data page, a programming unit to store the generated programming page in the memory cell array; and a data verifying unit to read the programming page stored in the memory cell array, to restore the data page from the programming page according to whether an error exists in the read programming page, and to output the restored data page, and thereby can equalize a wear-level of a memory cell.

Abstract: A method of managing the charge stored by a series arrangement of capacitor stages, each stage including a single capacitor or a plurality of capacitors in parallel, involves supplying each capacitor stage with charge current via a common charging terminal; separately measuring a stored potential of each capacitor stage in the series arrangement; selectively removing a controlled amount of charge from each of the capacitor stages individually) while the series arrangement is receiving the charge current from the common charging terminal; and maintaining each capacitor stage at a substantially equal stored potential.

Abstract: A memory has memory cells in a matrix; a first selection unit selecting any of first signal lines in the memory cells, in response to an access request; a second selection unit selecting any of second signal lines in the memory cells, after the first selection unit starts operating; a first voltage generation unit generating a first power supply voltage supplied to the first selection unit; a second voltage generation unit generating a second power supply voltage supplied to the second selection unit, when a start-up signal is active; a switch short-circuiting first and second power supply lines, when a short-circuit signal is active; and a power supply voltage control unit which activates the start-up signal in response to the access request, activates the short-circuit signal after a predetermined time elapses since activation of the start-up signal, deactivates the short-circuit signal and the start-up signal after completion of access operations.

Abstract: Some embodiments include a voltage generator to generate a voltage to apply to a line used to access a memory cell of a memory device in which the voltage is applied to the line when the memory cell is not being accessed, and a power controller to cause the voltage to change during a time interval after a refresh operation of the memory device. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: In a low-power signaling system, an integrated circuit device includes an open loop-clock distribution circuit and a transmit circuit that cooperate to enable high-speed transmission of information-bearing symbols unaccompanied by source-synchronous timing references. The open-loop clock distribution circuit generates a transmit clock signal in response to an externally-supplied clock signal, and the transmit circuit outputs a sequence of symbols onto an external signal line in response to transitions of the transmit clock signal. Each of the symbols is valid at the output of the transmit circuit for a symbol time and a phase offset between the transmit clock signal and the externally-supplied clock signal is permitted to drift by at least the symbol time.

Abstract: In an electronic device with a serial ATA interface, upon detection of the issue or reception of a preset command, a confirmation device, such as a CPU, confirms the completion of execution of the command. Upon confirming the completion of execution of the command, a controller, which may also be the CPU, controls shifting of the serial ATA interface to a power saving mode.

Abstract: A voice data and RF integrated circuit (IC) includes a memory module that stores a least one application as a plurality of operational instructions, the at least one application having a plurality of power modes that each correspond to one of a plurality of use characteristics. A processing module executes the plurality of operational instructions and that determines a selected one of the plurality of power modes based on current use characteristics of the at least one application, and generates a power mode signal based on the selected one of the plurality of power modes. An on-chip power management circuit receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal.

Abstract: A storage array and a method of operating the same are disclosed. A storage array includes a number of clocked storage circuits arranged in rows and columns. The storage array is subdivided into a number of grids each including a subset of clocked storage circuits and also includes a number of clock gating circuits, each of which is coupled to provide a clock signal to the clocked storage circuits of a corresponding subset. During an access of the storage array (i.e. a read or a write), one of the clock gating circuits is configured to provide the clock signal to the clocked storage circuits of its correspondingly coupled subset. The remaining clock gating circuits are configured to inhibit the clock signal from being provided to the flop circuits of their respectively coupled subsets.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.