Abstract: Described embodiments are directed to line drivers, such as those for providing reduced gate induced drain leakage in a memory array. Corresponding methods of operation of line drivers are also disclosed.

Abstract: A memory has memory cells in a matrix; a first selection unit selecting any of first signal lines in the memory cells, in response to an access request; a second selection unit selecting any of second signal lines in the memory cells, after the first selection unit starts operating; a first voltage generation unit generating a first power supply voltage supplied to the first selection unit; a second voltage generation unit generating a second power supply voltage supplied to the second selection unit, when a start-up signal is active; a switch short-circuiting first and second power supply lines, when a short-circuit signal is active; and a power supply voltage control unit which activates the start-up signal in response to the access request, activates the short-circuit signal after a predetermined time elapses since activation of the start-up signal, deactivates the short-circuit signal and the start-up signal after completion of access operations.

Abstract: A system and method to manage leakage of a complementary metal-oxide-semiconductor (CMOS) read transistor in a memory cell. In a particular embodiment, a memory cell is disclosed that includes a storage element and a complementary metal-oxide-semiconductor (CMOS) read transistor. The CMOS read transistor includes a first terminal coupled to a read word line, a second terminal coupled to a read bit line, and a third terminal coupled to the storage element. During a non-read operating time, the read word line and the read bit line are both maintained at substantially the same voltage level. During a read operation, the read word line is maintained at a particular voltage level until after a voltage representing data stored at the storage element is sensed by the CMOS read transistor.

Abstract: A solution is provided to flexibly choose a combination of flash memory devices to reduce the overall cost of the flash memory devices or increase the overall utilization of the flash memory devices, while satisfying the capacity requirements for the flash memory devices in a system design, wherein a decoding unit is used for determining which flash memory devices will be accessed and re-mapping incoming serial addressing bits, for accessing one flash memory device, into an outgoing serial addressing bits for accessing another flash memory device.

Abstract: A system is provided for use with a DRAM, a DQS signal provider, a clock signal provider, a DQS line and a clock line. The DQS line can provide the DQS signal from the DQS signal provider to the DRAM. The clock line can provide the clock signal from the clock signal provider to the DRAM. The system includes a clock delay determining portion, a DQS delay determining portion, and adjustment portion and a controlling portion. The clock delay determining portion can determine a clock delay. The DQS delay determining portion can determine a DQS delay. The adjustment portion can generate an adjustment value based on the clock delay and the DQS delay. The controlling portion can instruct the DQS signal provider to adjust a time of providing a second DQS signal based on the adjustment value, wherein the clock delay is less than the DQS delay.

Abstract: Memory subsystems and methods, such as those involving a memory cell array formed over a semiconductor material of a first type, such as p-type substrate. In at least one such subsystem, all of the transistors used to selectively access cells within the array are transistors of a second type, such as n-type transistors. Local word line drivers are coupled to respective word lines extending through the array. Each local word line drivers includes at least one transistor. However, all of the transistors in the local word line drivers are of the second type. A well of semiconductor material of the second type, is also formed in the material of the first type, and a plurality of global word line drivers are formed using the well. Other subsystems and methods are disclosed.

Abstract: A device includes a command decoder that is configured to output, in a normal operation mode, a precharge signal in response to a first type transition edge of a synchronous signal, and an active signal in response to a next first type transition edge that is next to the first type transition edge. The command decoder is configured to output, in a test mode, the precharge signal in response to a second type transition edge of the synchronous signal, and the active signal in response to a next first type transition edge that is next to the second type transition edge.

Abstract: A memory device includes a word line driver circuit, a write voltage generator for providing a write voltage to the word line driver during a write operation to memory cells coupled to the word line driver circuit, and a write bias generator including an output node for providing a write bias voltage that is different from the write voltage to the word line driver circuit during a write operation to memory cells coupled to the word line driver circuit. The write bias voltage is used to reduce current drawn by the word line driver circuit from the write voltage generator during a write operation to memory cells coupled to the word line driver circuit.

Abstract: A semiconductor memory has a memory cell array having a plurality of real word lines, a plurality of redundant word lines, a plurality of bit lines crossing with the real and redundant word lines, a plurality of memory cells provided at crossing section of the real and redundant word lines and the bit lines, and a row selection circuit for selecting the real word line or the redundant word line in accordance with a row address being supplied. The row selection circuit selects the real word line or the redundant word line at an ordinary operation, and multi-selects the redundant word lines at a first test mode.

Abstract: The present disclosure relates to the fabrication of non-volatile memory devices. In at least one embodiment, a single transistor may be used to drive each address line, either a wordline or a bitline. Both an inhibit voltage and a selection voltage may be driven through these single transistor devices, which may be achieved with the introduction of odd and even designations for the address lines. In one operating embodiment, a selected address line may be driven to a selection voltage, and the address lines of the odd or even designation which is the same as the selected address line are allowed to float. The address lines of the odd or even designation with is different from the selected address lines are driven to an inhibit voltage, wherein adjacent floating address lines may act as shielding lines to the selected address line.

Abstract: An integrated circuit includes: a memory controller configured to determine whether a memory cell included in a semiconductor memory device is defective or not and extract a fail address having positional information of the defective memory cell, in a test mode; and a fail address storage unit configured to store the fail address.

Abstract: A memory system includes first memory cells and second memory cells. Each of the first memory cells includes first and second pass gates including NMOS transistors. Each of the second memory cells include first and second pass gates including PMOS transistors. The first memory cells are pre-charged by one polarity of a voltage supply. The second memory cells are pre-charged by an opposite polarity of the voltage supply.

Abstract: A circuit usable as a word line driver includes a driver that switches in response to a voltage on a control node, and a circuit supplying a voltage to the control node. The circuit that applies a voltage to control node provides a first static current tending to pull the control node up to a first source voltage, and provides a fighting current pulse in response to a signal selecting the driver to pull the control node down to a second source voltage, overcoming the first static current. In addition, a circuit provides a pull-up boost current on a transition of the signal selecting the driver that turns off the fighting current, and applies a boosting current pulse to the control node to assist pulling the control node quickly to the first source voltage.

Abstract: Systems and methods for selectively boosting word-line (WL) voltage in a memory cell array. The method relies several embodiments to minimize energy costs associated with WL boost scheme. One embodiment generates a transient voltage boost rather than supply a DC voltage boost. The transient boost generation may be controlled on a cycle basis and can be disabled when the array is not accessed. Another embodiment allows the system to generate the transient voltage boost locally, near a WL driver and only during the cycles when it is needed. Localized boost voltage generation reduces the load capacitance that needs to be boosted to higher voltage. Another embodiment efficiently distributes the transient boost to the WL drivers.

Abstract: A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. The comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data. The voltage level control unit is configured to generate a control signal according to the comparison result. The voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust the value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.

Abstract: A semiconductor memory device having a read word line, a write word line and a sub-word driver operable to select the read word line using a main word signal and an inverse read block signal. The sub-word line selects the write word line using the main word signal and an inverse write block signal. The sub-word driver has a first inverter circuit using the main word signal as an input and outputting the read word line. The sub-word driver has a first transistor having a drain, a source, and a gate connected to the read word line, a low potential power source, and the inverse write block signal, respectively, and a second transistor having a drain, a source, and a gate connected to a power source terminal of the first inverter circuit, a power source, and the inverse write block signal, respectively, and can select the write word line.

Abstract: A semiconductor memory device has a memory cell array, a first transistor of a first conductivity type, a second transistor of a second conductivity type and a third transistor of the first conductivity type. A source or drain of the first transistor is connected to each of word lines. A drain of the second transistor is connected to a gate of the first transistor. A source of the third transistor is connected to the gate of the first transistor. The gates of the second transistor and the third transistor are not connected, a source of the second transistor is not connected to a drain of the third transistor, and the gate of the second transistor and the drain of the third transistor have different voltage levels corresponding to opposite logic levels each other.

Abstract: A setting information storage circuit includes first decoders configured to generate first input enable signals, respectively, in response to selection codes and a first set signal, first register sets configured to correspond to the first decoders, respectively, and to receive setting data when first input enable signals generated from the first decoders corresponding to the first register sets, respectively, are enabled, and store the received setting data, a second decoders configured to generate a second input enable signals, respectively, in response to the selection codes and a second set signal, and a second register sets configured to correspond to the second decoders, respectively, and to receive the setting data when second input enable signals generated from the second decoders corresponding to the second register sets, respectively, are enabled, and store the received setting data.

Abstract: Memory die, stacks of memory dies, memory devices and methods, such as those to construct and operate such die, stacks and/or memory devices are provided. One such memory die includes an identification configured to be selectively coupled to an external select connection node depending on how the die is arranged in a stack. The identification circuit can determine an identification of its respective memory die responsive to how, if coupled, the identification circuit is coupled to the external select connection node.

Abstract: Block-row decoders, memory block-row decoders, memories, methods for deselecting a decoder of a memory and methods of selecting a block of memory are disclosed. An example memory block-row decoder includes a plurality of block-row decoders, each of the block-row decoders having a decoder switch tree. Each block-row decoder is configured to bias a block select switch of the decoder switch tree with a first voltage while the block-row decoder is deselected and further configured to bias decoders switches of the decoder switch tree that are coupled to the block select switch with a second voltage while the block-row decoder is deselected, the second voltage less than the first voltage. An example method of deselecting a decoder of a memory includes providing decoder signals having different voltages to decoder switches from at least two different levels of a decoder switch tree while the decoder is deselected.

Abstract: A system for using selectable-delay bipolar logic circuitry within the address decoder of a MOS-based memory includes a MOS-based memory, which includes an array of a plurality of memory cells configured to store data; an address decoder including bipolar logic circuitry, where the address decoder is configured to accept a word including a plurality of bits and access the array of memory cells using the word; where the bipolar logic circuitry includes a plurality of bipolar transistor devices, where at least one bipolar transistor device has an adjustable gate bias and is configured to accept an input, wherein the gate bias is adjusted based on the input, where the gate bias determines a selectable gate delay.

Abstract: Systems, methods, and apparatus, including computer program products, for providing termination resistance in a memory module are provided. An apparatus is provided that includes a plurality of memory circuits; an interface circuit operable to communicate with the plurality of memory circuits and to communicate with a memory controller; and a transmission line electrically coupling the interface circuit to a memory controller, wherein the interface circuit is operable to terminate the transmission line with a single termination resistance that is selected based on a plurality of resistance-setting commands received from the memory controller.

Abstract: A semiconductor apparatus may comprise: a first chip ID generation unit configured to receive an enable signal through a first through-silicon via and a clock signal through a second through-silicon via and generate a first chip ID signal and a delayed enable signal; a second chip ID generation unit configured to receive the delayed enable signal through a third through-silicon via from the first chip ID generation unit and the clock signal and generate a second chip ID signal; a first chip selection signal generation unit configured to receive the first chip ID signal and a main ID signal and generate a first chip selection signal; and a second chip selection signal generation unit configured to receive the second chip ID signal and the main ID signal and generate a second chip selection signal.

Abstract: Yield loss from peripheral circuit failure while screening memory arrays for aging effects is prevented by operating the peripheral circuitry at nominal operating voltages during the screening for aging effects. An integrated circuit including one or more memory bit cells, includes circuitry to change the voltage applied to the supply rails of bit cells and the voltage applied to the word-line drivers relative to each other in order to facilitate improved screening for read and write margins. In normal operation the supply rails for word-line drivers and bit cells are nominally the same. In a write margin test mode the voltage on the supply rail of word-line drivers is lower than the voltage on the supply rail of the bit cells. In a read margin test mode the voltage on the supply rail of word-line drivers is higher than the voltage on the supply rail of the bit cells.

Abstract: A clock signal generation apparatus for generating a reference clock signal for outputting data in synchronization with an external clock signal from a semiconductor memory device, including: a clock signal generation unit for receiving an internal clock signal to generate the reference clock signal according to a control signal; and a control unit for generating the control signal based on a read command, a write command and an external address.

Abstract: In a method of reading a nonvolatile memory device, the method comprising, a reading operation of reading data of a selected memory cell; and a read retry operation of performing one or more read operations by changing a non-selection read voltage applied to non-selected memory cells until the read operation succeeds, when it is detected that an error has occurred in the operation of reading data.

Abstract: Row and/or column electrode lines for a memory device are staggered such that gaps are formed between terminated lines. Vertical interconnection to central points along adjacent lines that are not terminated are made in the gap, and vertical interconnection through can additionally be made through the gap without contacting the lines of that level.

Abstract: For multi-level interconnect metallization, each metal level maintains a parallel line arrangement within a region, and the lines of each adjacent metal level are orthogonal or otherwise cross with one another. Vertical shunting among levels for routing in different directions employs short paddles that stay within the parallel scheme, and multiple paddles within a region at the same metal level can be co-linear. Parallel lines in the same metal level can be rotated with respect to one another in adjacent regions, for example to better interface with driver circuitry with orthogonal orientations in the different regions.

Abstract: A nonvolatile memory device includes a plurality of memory blocks vertically arranged, first and second row decoder groups configured to couple first and second local global word lines and the word lines of upper memory blocks among the plurality of memory blocks, third and fourth row decoder groups configured to couple third and fourth local global word lines and the word lines of lower memory blocks among the plurality of memory blocks, a first local decoder switch configured to couple a plurality of global lines and the first or second local global word lines, a second local decoder switch configured to couple the plurality of global lines and the third or fourth local global word lines, and a high voltage generator configured to supply operating voltages to the plurality of global word lines.

Abstract: A semiconductor memory device includes a plurality of wordlines and a driver configured to, when an wordline of the plurality of wordlines is activated by an active command, drive at least one non-activated wordline neighboring the activated wordline and remaining non-activated wordlines with different wordline driving voltage levels during a period of time that the activated wordline is driven to a high voltage level.

Abstract: A semiconductor apparatus includes a normal data line, an auxiliary data line and a data line selection unit. The normal data line is connected with a data selection unit. The auxiliary data line is connected with the data selection unit. The data line selection unit outputs data to one of the normal data line and the auxiliary data line in response to a command signal.

Abstract: A non-volatile storage system is disclosed that includes a plurality of blocks of non-volatile storage elements, a plurality of word lines connected to the blocks of non-volatile storage elements such that each word line is connected to adjacent blocks of non-volatile storage elements, a plurality of bit lines connected to the blocks of non-volatile storage elements, multiple sets of word lines drivers such that each set of word line drivers is positioned between two adjacent blocks for driving word lines connected to the two adjacent blocks, global data lines, local data lines in selective communication with the bit lines, one or more selection circuits that selectively connect the global data lines to selected local data lines and connect unselected local data lines to one or more unselected bit line signals and control circuitry in communication with the one or more selection circuits and the global data lines.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: A state set module arranges states of a memory cell in a first and a second sequence in a first and a second state set, respectively. The memory cell stores first and second bits when programmed to a state. When the states in the first and second state sets are accessed respectively in the first and the second sequence, the first and second bits of the states in the first and second state sets exhibit different number of logical transitions. A write module receives first and second sets of bits to be written as the first and second bits in a plurality of memory cells, and selects states from the first and second state sets in an alternating pattern to write the first and second sets of bits as the first and second bits in the plurality of memory cells.

Abstract: A memory includes an array of memory cells that form rows and columns. The rows include memory cell pairs. The memory cells may include two cross-coupled inverters and two pass-devices that couple to alternate sides of the cross-coupled inverters. For a read operation, a wordline drive circuit selects one memory cell of the pair, the selected memory cell being an addressed memory cell while the remaining cell is an unaddressed memory cell. In response to a wordline enable signal, a pass gate in the addressed memory cell couples the addressed memory cell via a complement bitline to an evaluation gate that resolves the data from the read operation. During the read operation, the unaddressed memory cell couples via another pass gate to a true bitline that terminates without an evaluation gate to conserve energy.

Abstract: Disclosed herein is a semiconductor device comprising local bit lines, a global bit line, local switch control lines, main switch control lines, hierarchical switches controlling electrical connections between the local bit lines and the global bit line in response to potentials of the local switch control lines, local switch drivers driving the local switch control lines in response to potentials of the main switch control lines, and main switch drivers selectively activating the main switch control lines.

Abstract: A method of performing write operations in a memory device including a plurality of bank is performed. Each bank includes two or more sub-banks including at least a first sub-bank and a second sub-bank. The method comprises: performing a first row cycle for writing to a first word line of the first sub-bank, the first row cycle including a plurality of first sub-periods, each sub-period for performing a particular action; and performing a second row cycle for writing to a first word line of the second sub-bank, the second row cycle including a plurality of second sub-periods of the same type as the plurality of first sub-periods. The first row cycle overlaps with the second row cycle, and a first type sub-period of the first sub-periods overlaps with a second type sub-period of the second sub-periods, the first type and second type being different types.

Abstract: Various embodiments of a semiconductor apparatus are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a memory block chip and a signal input/output chip. The memory block chip is configured to control a data access size according to specifications. The signal input/output chip is configured to transmit input data from an external device to the memory block chip or transmit output data from the memory block chip to an external device and process the input data or the output data by selectively enabling a clock phase control unit and a signal processing unit according to the specifications.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded it to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: A hot electron (BBHE) is generated close to a drain by tunneling between bands, and it data writing is performed by injecting the hot electron into a charge storage layer. When Vg is a gate voltage, Vsub is a cell well voltage, Vs is a source voltage and Vd is a drain voltage, a relation of Vg>Vsub>Vs>Vd is satisfied, Vg?Vd is a value of a potential difference required for generating a tunnel current between the bands or higher, and Vsub?Vd is substantially equivalent to a barrier potential of the tunnel insulating film or higher.

Abstract: Such a device is disclosed that includes a first semiconductor chip including a plurality of first terminals, a plurality of second terminals, and a first circuit coupled between the first and second terminals and configured to control combinations of the first terminals to be electrically connected to the second terminals, and a second semiconductor chip including a plurality of third terminals coupled respectively to the second terminals, an internal circuit, and a second circuit coupled between the third terminals and the internal circuit and configured to activate the internal circuit when a combination of signals appearing at the third terminals indicates a chip selection.

Abstract: Apparatus and methods for driving a signal are disclosed. An example apparatus includes a pre-driver circuit and a driver circuit. The pre-driver circuit includes a step-down transistor and the driver circuit includes a pull-down transistor configured to be coupled to a reference voltage. In a first mode, the step-down transistor is configured to reduce a voltage provided to the pull-down transistor to less than a supply voltage, and in a second mode, the step-down transistor configured to provide the voltage of the supply voltage to the pull-down transistor. The pre-driver circuit of the example signal driver circuit may further include a step-up transistor configured to increase a voltage provided to a pull-up transistor of the driver circuit to greater than the reference voltage, and in the second mode, the step-up transistor configured to provide the voltage of the reference voltage to the pull-up transistor.

Abstract: A semiconductor storage apparatus stores management information comprising, for each block of a nonvolatile semiconductor memory, information denoting at least one of a recent programming time, which is a time at which data is recently programmed to a block, and a recent erase time, which is a time at which an erase process is recently carried out with respect to a block. The semiconductor storage apparatus (b1) controls a timing at which data is programmed to a block based on at least one of the recent programming time and the recent erase time of this block, and/or (b2) controls a timing at which an erase process is carried out with respect to a block based on the recent programming time of this block.

Abstract: A programmable current-limited voltage buffer. The programmable current-limited voltage buffer includes at least one current-bias circuit, an inverter, a write-current set control circuit, and an adaptive current limiter. The inverter is coupled to the current-bias circuit and a reference-voltage source, and is configured to couple a row line to either the current-bias circuit, or the reference-voltage source, in response to an input signal. The adaptive current limiter is coupled to the current-bias circuit and to the write-current set control circuit, and is configured to limit current flowing through the memory element in a write operation. An integrated circuit device is also provided, along with a method for current limiting a memory element during switching in an array of memory elements.

Abstract: Apparatuses, memory section control circuits, and methods of refreshing memory are disclosed. An example apparatus includes a plurality of memory sections and a plurality of memory section control circuits. Each memory section control circuit is coupled to a respective one of the plurality of memory sections and includes a plurality of access line drivers, each of which includes a plurality of transistors having common coupled gates. During an operation of the apparatus a first voltage is provided to the commonly coupled gates of the transistors of at least some of the access line drivers of the memory section control circuit coupled to an active memory section an and a second voltage is provided to the commonly coupled gates of the transistors of the access line drivers of the memory section control circuit coupled to an inactive memory section control circuit, wherein the first voltage is greater than the second voltage.

Abstract: Provided is a semiconductor device capable of effectively testing whether memory cells and a memory cell array are defective. The semiconductor device may include a memory cell array having a plurality of memory cells and an external test pad connected to an internal test pad. A test voltage may be applied to the plurality of word lines connected to the plurality of memory cells via the external test pad and the internal test pad in a test mode, wherein the test voltage disables the plurality of word lines.

Abstract: A semiconductor memory device includes a plurality of memory cell data holding transistors provided in each block; a row decoder including transfer transistors, a voltage controller and a block selector in each block, the transfer transistors electrically connected to respective of the memory cell transistors, the voltage controller connected to gates of the respective transfer transistors and transferring a desired voltage to the gates of the respective transfer transistors, the block selector electrically connected to gates of the respective transfer transistors and configured to select blocks. A voltage generator generates the voltage to be supplied to the transfer transistors; and a controller controls the row decoder and the voltage generator circuit.

Abstract: Systems and methods are described herein that reduce the read latency of a cache by separating read and write column select signals that cause the cache to initiate certain read and write operations, respectively.

Abstract: A method and circuit for implementing delay correction in static random access memory (SRAM), and a design structure on which the subject circuit resides are provided. The SRAM circuit includes a precharge enable signal coupled between precharge near and precharge far signals and wordline near and wordline far signals of the SRAM. A precharge pull down device is coupled between the precharge far signal and ground and is controlled responsive to the precharge enable signal to decrease a time delay of the falling transition of the precharge far signal. A respective word line pull up device is coupled between a respective wordline far signal and a voltage supply rail and is controlled responsive to the precharge enable signal to increase wordline voltage level upon a rising transition of the wordline far signal.

Abstract: A semiconductor device includes a delay buffer, and a pipeline control circuit. The pipeline control circuit controls the delay buffer to hold read data from outputting to a read/write bus for each of banks based on a read command to the each bank while the pipeline control circuit controlling the delay buffer to output write data to the read/write bus, when a next command to the each bank is a write command for the write data. The read/write bus is common to the banks.