Abstract: An apparatus and method is capable of reducing instantaneously consumed current by allowing write drivers and input buffers not to be simultaneously driven in a multi-test of semiconductor chips. A multi-test apparatus includes an input unit configured to receive data for testing, wherein the data for testing is inputted from a circuit outside of the multi-test apparatus, a plurality of memory banks each including a plurality of memory cells, a plurality of write drivers, corresponding to the respective memory banks, configured to write the test data in the plurality of memory banks, and a write control unit configured to control the plurality of write drivers so that the test data is written in the memory banks in at least two time periods.

Abstract: A static RAM includes a plurality of word lines, a plurality of global bit line pairs, a plurality of static-type memory cells, a plurality of sense amplifiers, a plurality of local bit line pairs provided in correspondence with each global bit line pair, and a plurality of global switches, wherein the plurality of static-type memory cells is connected to the corresponding local bit line pair in response to a row selection signal, and at the time of read, the row selection signal is applied to the word line and after the corresponding local bit line pair is brought into a state corresponding to contents stored in the memory cell, application of the row selection signal is stopped and then the corresponding global switch is brought into a connection state and after changing the state of the global bit line pair, the corresponding sense amplifier is operated.

Abstract: Memory devices and methods are described such as those that monitor and adjust characteristics for various different portions of a given memory device. Examples of different portions include tiles, or arrays, or dies. One memory device and method described includes monitoring and adjusting characteristics of different portions of a 3D stack of memory dies. One characteristic that can be adjusted at multiple selected portions includes refresh rate.

Abstract: An access method for a DRAM is provided. A row address is partitioned into a first portion and a second portion. The first portion of the row address via an address bus and a first active command via a command bus are provided to the DRAM. The second portion of the row address via the address bus and a second active command via the command bus are provided to the DRAM after the first active command is provided. A column address via the address bus and an access command via the command bus are provided to the DRAM after the second active command is provided. The address bus is formed by a plurality of address lines, and a quantity of the address lines is smaller than the number of bits of the row address, and the access command is a read command or a write command.

Abstract: According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory units, each of the memory units including a plurality of memory cells connected in series, the plurality of memory cells being stacked, the plurality of memory units involving a first memory unit and a second memory unit; and a plurality of bit lines connected to ends of each of the memory units in the memory cell array. The first memory unit and the second memory unit are arranged in a staggered manner by the first memory unit being displaced in a row direction with respect to the second memory unit by an amount less than an arrangement pitch in a row direction of the first memory unit or the second memory unit.

Abstract: A word line driver including a control switch configured to receive a control signal, where the control switch is between a first node configured to receive an operating voltage signal and a second node configured to determine an output of the word line driver. The word line driver further includes a cross-coupled amplifier electrically connected to the second node. The word line driver further includes at least one inverter electrically connected to the cross-coupled amplifier. A semiconductor device including the word line driver and a memory array including at least one electronic fuse.

Abstract: A non-volatile memory device includes a set pulse generator configured to generate a set pulse, a reset pulse generator configured to generate a reset pulse based on the set pulse, and a write driver block configured to write second data to a second non-volatile memory cell using the reset pulse, while writing first data to a first non-volatile memory cell using the set pulse.

Abstract: A semiconductor memory device includes a cell array having a plurality of memory cells, each memory cell including a resistive element and a cell transistor between a bit line and a source line, and a source line voltage supply unit configured to supply, in a normal mode, a reference source line voltage to the source line, and in a test mode, a first source line voltage to the source line when data in a first state is recorded and a second source line voltage to the source line when data in a second state is recorded, the first source line voltage being lower than the reference source line voltage, and the second source line voltage being higher than the reference source line voltage.

Abstract: A high density, low voltage, and low-power one time programmable (OTP) memory is based on core cells with a one transistor design. A CLEAN pulse is directed to a single shunt device at the output of the column decoder so spurious charges that may have been stored in the floating nodes can be cleaned up. Such arrangement also allows for the simultaneous initialization of bit lines, data lines, and sensing lines to zero. Core area layout size is substantially reduced, and operational power requirements are exceeding low making these particularly suitable in HF and UHF RFID applications.

Abstract: According to the embodiments, a semiconductor memory device includes serially-connected cell transistors includes respective gate electrodes coupled to respective word lines, a first driver and a second driver which drive the word lines, and a connection module. The connection module electrically couples the first driver commonly to a first subset of the word lines, and electrically couples the second driver commonly to a second subset of the word lines different from the first subset of the word lines. The first and second subsets of the word lines include the same number of word lines.

Abstract: A self refresh pulse generation circuit includes a control signal generator configured to generate a control signal asserted for an initial period of a self refresh mode, and a self refresh pulse generator configured to generate a self refresh pulse having a period controlled in response to the control signal, in the self refresh mode.

Abstract: Storing data in a non-volatile latch may include applying a bias voltage to a memristor pair in electrical communication with at least one logic gate and applying a gate voltage to a transmission gate to allow an input voltage to be applied to the at least one logic gate where the input voltage is greater than the bias voltage and the input voltage determines a resistance state of the memristor pair.

Abstract: A system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete.

Abstract: A semiconductor memory device includes a pipe latch circuit configured to receive parallel input data and output serial data or set an output terminal of the pipe latch circuit at a predetermined voltage level in response to an enable signal, and a synchronization circuit configured to output an output data of the pipe latch circuit in synchronization with an internal clock.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A memory array is divided into multiple segments, each segment having one or more rows of bitcells. Each segment has control circuitry that controls whether the segment is in an active mode or a power-saving, sleep mode. The control circuitry ensures that a segment transitions from sleep mode to active mode before a row of the segment is accessed by driving a corresponding wordline high. The control circuitry also ensures that, at the end of a row access, the wordline is driven low before the corresponding segment is transitioned from active mode to sleep mode.

Abstract: A buffer circuit includes a pull-up element configured to pull-up drive a first node through which an output signal is outputted, in response to an input signal; a first voltage control element configured to reduce a voltage of the first node and set a voltage of a second node in a standby mode; and a pull-down element configured to pull-down drive the second node in response to the input signal.

Abstract: A semiconductor memory device includes a random address generation unit configured to receive a multi-bit source address and generate a multi-bit random address and a signal mixing unit configured to mix the multi-bit random address with a data, wherein the random address generation unit has a plurality of transmission lines configured to electrically connect the plurality of input terminals respectively corresponding to bits of the source address and the plurality of output terminals respectively corresponding to bits of the random address in one-to-one correspondence regardless of an order of the bits of the source address.

Abstract: A semiconductor memory device using a termination scheme in a global data line includes a global data line and a data line drive unit. The global data line transfers data between an interface region and a plurality of core regions each having a memory bank. The data line drive unit is disposed in each of the core regions, and drives the data global line in response to data in a data transfer operation. The data line drive unit sets the global data line to a termination voltage level in a termination operation.

Abstract: A semiconductor device comprises a first region and a second region. The first region includes a plurality of memory cells each of which holds respective data and a plurality of sense amplifiers that respectively amplify the data in the plurality of memory cells, based on a first voltage. The second region is provided along one side of the first region and includes a first power supply generation circuit that generates the first voltage, based on a second voltage. The second voltage being supplied to the first power supply circuit by a first power supply interconnect extends on the first region in a first direction parallel to the one side of the first region.

Abstract: A system on a chip includes a semiconductor memory, a memory control module, a non-volatile memory and a memory decoder module. The semiconductor memory has i) first memory locations, and ii) second memory locations. Each of the second memory locations is redundant to one of the first memory locations. The memory control module is configured to detect defective ones of the first memory locations. The non-volatile memory has a memory repair database. The memory repair database is configured to store information associating respective addresses of the defective ones of the first memory locations with one or more of the second memory locations. The memory decoder module is configured to, based on the information stored in the memory repair database, respectively remap the respective addresses of the defective ones of the first memory locations to the one or more of the second memory locations.

Abstract: Associative index extended (AIX) caches can be functionally implemented through a reconfigurable decoder that employs programmable line decoding. The reconfigurable decoder features scalability in the number of lines, the number of index extension bits, and the number of banks. The reconfigurable decoder can switch between pure direct mapped (DM) mode and direct mapped-associative index extended (DM-AIX) mode of operation. For banked configurations, the reconfigurable decoder provides the ability to run some banks in DM mode and some other banks in DM-AIX mode. A cache employing this reconfigurable decoder can provide a comparable level of latency as a DM cache with minimal modifications to a DM cache circuitry of an additional logic circuit on a critical signal path, while providing low power operation at low area overhead with SA cache-like miss rates. Address masking and most-recently-used-save replacement policy can be employed with a single bit overhead per line.

Abstract: A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. Comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein output data are storage data stored in a plurality of memory units of memory array processed by a program operation according to input data, and the comparison result indicates the number of different bits existing between the output data and the input data. Voltage level control unit is configured to generate a control signal according to the comparison result. Voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust the value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.

Abstract: A wordline tracking circuit and corresponding method are disclosed, and include a tracking wordline having an impedance characteristic associated therewith that models a row of memory cells in a memory device, wherein the tracking wordline has a near end that receives a wordline pulse signal having a near end rising pulse edge and a near end falling pulse edge. The tracking wordline also has a far end. A tracking cell component is coupled to the far end of the tracking wordline that receives the wordline pulse signal. Lastly, the circuit includes a tracking bitline pre-charge circuit coupled to the tracking cell that is configured to pre-charge a tracking bitline associated with the tracking cell using the near end wordline pulse signal.

Abstract: Disclosed herein is a semiconductor device that includes an access control circuit generating an internal command based on a verification result signal and an external command. The external command indicates at least one of a first command that enables the access control circuit to access a first circuit and a second command that enables the access control circuit not to access the first circuit or enables the access control circuit to maintain a current state of the first circuit. The access control circuit, when the verification result signal indicates a first logic level, generates the internal command based on the external command. The access control circuit, when the verification result signal indicates a second logic level, generates the internal command that corresponds to a second command even if the external command indicates a first command.

Abstract: A semiconductor apparatus includes a first memory die; a second memory die; and a processor configured to provide an external command, an external start address and an external end address which are associated with a read operation, to the first memory die, and provide an external command, an external start address and an external end address, which are associated with a write operation, to the second memory die, in the case where data stored in the first memory die is to be transferred to and stored in the second memory die.

Abstract: A selection operation is performed for individual memory cells. A device includes a first memory cell and a second memory cell provided in the same row as the first memory cell, each of which includes a field-effect transistor having a first gate and a second gate. The field-effect transistor controls at least data writing and data holding in the memory cell by being turned on or off. The device further includes a row selection line electrically connected to the first gates of the field-effect transistors included in the first memory cell and the second memory cell, a first column selection line electrically connected to the second gate of the field-effect transistor included in the first memory cell, and a second column selection line electrically connected to the second gate of the field-effect transistor included in the second memory cell.

Abstract: Circuits, memories, and methods for latching a write command and later provided write data including write command and write data timing circuits. One such timing circuit includes internal write command latch to latch an internal write command in response to write command latch signal. The internal write command latch releases the latched write command in response to the write command latch signal after a latency delay. The timing circuit further includes a write leveling flip-flop (FF) circuit and a write data register. One such method includes generating and latching an internal write command. The latched internal write command is released after a latency delay responsive to the memory clock signal. The internal write command is propagated over an internal write command path. Write data is captured and internal write command latched in response to a write clock signal. The captured write data is released to be written to memory.

Abstract: An integrated circuit bit line driver system includes a plurality of bit line drivers coupled to respective bit lines of an array of non-volatile memory cells. Each of the bit line drivers includes a bias transistor through which an input signal is coupled to the respective bit line. The bit line driver system includes a bias voltage circuit that generates a bias voltage that is coupled to the respective gates of the bias transistors. The bias voltage circuit initially accelerates the charging of the transistor gates, and subsequently completes charging the gates at a slower rate. The bias voltage is generated using a diode-coupled transistor having electrical characteristics the match those of the bias transistors so that the bias voltage varies with process or temperature variations of the integrated circuit in the same manner as the threshold voltage of the bias transistors vary with process or temperature variations.

Abstract: An electric fuse includes: a filament having a first conductive layer and a second conductive layer formed on the first conductive layer, wherein at least three discernible resistive states are generated in the filament by changing of a combination of a state of the first conductive layer and a state of the second conductive layer.

Abstract: To handle multiple concurrent memory requests, a dual-port six transistor (6T) SRAM bit cell is proposed. The dual-port 6T SRAM cell uses independent word lines and bit lines such that the true side and the false side of the bit cell may be accessed independently. Single-ended reads allow the memory system to handle two independent read operations concurrently. Single-ended writes are enabled by adjusting the VDD power voltage supplied to a memory cell when writes are performed such that a single word line and bit line pair can be used write either a logical “0” or logical “1” into either side of the bit cell. Thus, single-ended operation with a voltage assist allows a memory system to handle two concurrent write operations. A write buffer may be added to the memory system to prevent conflicts and thus enable concurrent read operations and write operations in a single cycle.

Abstract: A semiconductor memory apparatus includes: a first bit line of to a first memory bank; a first middle input/output line configured to be electrically connected to the first bit line; a second bit line of a second memory bank; a second middle input/output line configured to be electrically connected to the second bit line; and a shared local input/output line configured to be electrically connected to the first and second middle input/output lines. A bank selection signal controls both the electrical connection between the shared local input/output line and the first middle input/output line and the electrical connection between the shared local input/output line and the second middle input/output line.

Abstract: A resistive memory device includes a plurality of first switches that connect word lines to a ground line in response a first switch control signal and a plurality of second switches that connect a plurality of global bit lines to a plurality of local bit lines corresponding to the plurality of global bit lines in response to a second switch control signal.

Abstract: An address input circuit of a semiconductor device includes: an address latch unit configured to generate latch addresses, by latching addresses sequentially provided by an external, according to a command decoding signal, wherein latch timings of each of the addresses are adjusted differently from one another; and a command decoder configured to decode a command provided from the external and generate the command decoding signal.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: A decoder circuit with reduced leakage configured to decode an address and drive one of a number of word lines may be implemented with two-high logic gates in a pre-decode stage, a decode stage, and a word line driver stage. Such decoder circuits may include, in the word line driver stage, a number of two-high NOR gates configured to drive one of a number of word lines. In some embodiments, the two-high logic gates that share common inputs are implemented with multi-output static logic.

Abstract: A decoder control makes use of controllable transfer gates, which effectively implement selectors, to implement required timing offsets for codes that have particular structure. For instance, such timing offsets are effective for LDPC codes with block off-diagonal structure, for instance, as described in the co-pending application. In some implementations, the memory architecture is formed of cells where each cell includes not only a storage element, by also control logic that combines a select signal and the write versus read signal. By co-locating this control logic in each memory cell, control logic and its associated signal distribution is reduced, thereby reducing circuit area and power consumption.

Abstract: A memory circuit includes a bit cell that receives a word line, complementary bit lines and an array supply voltage; a word line driver coupled to the word line, the word line driver receiving one of the array supply voltage and a periphery supply voltage; and a word line suppression circuit coupled to the word line. The word line suppression circuit includes a diode and a switch coupled in series. The switch is responsive to the array supply voltage. The word line suppression circuit limits a word line voltage to a value lower than the array supply voltage such that the static noise margin (SNM) of the bit cell is increased.

Abstract: A system and method for operating a bipolar memory cell array including a bidirectional access diode. The system includes a column voltage. The column voltage switch includes column voltages and an output electrically coupled to the bidirectional access diode. The column voltages include at least one write-one column voltage and at least one write-zero column voltage. The system also includes a row voltage switch. The row voltage switch includes row voltages and an output electrically coupled to the bidirectional access diode. The row voltages include at least one write-one row voltage and at least one write-zero row voltage. The system further includes a column decoder and a row decoder electrically coupled to a select line of the column voltage switch and row voltage switch, respectively. The system includes a write driver electrically coupled to the select lines of the row and column switches.

Abstract: A semiconductor memory device is provided, including a memory cell array having a plurality of memory cells; an internal circuit having a function required in a storage operation of the memory cell array; a parameter storage unit configured to store a certain parameter and to have a storage place specified by a parameter address, the certain parameter designating an operation of the internal circuit; a command register configured to store a command instructing an operation of the internal circuit; and a converting circuit configured to adjust at least one of the parameter address and the command that differ between products or between standards to the internal circuit.

Abstract: The embodiments described herein provide memory devices. In one embodiment, a memory device includes bank control logic configured to generate a modified bank address signal and an active driver configured to provide a bank activate signal, receive an activate command signal, execute an activate command of the activate command signal at each one of a group of clock cycles, in which each one of the group of clock cycles is greater than one clock cycle, and receive the modified bank address signal, in which the modified bank address signal is high for at least a portion of each one of the group of clock cycles and the at least a portion of each one of the group of clock cycles is greater than one clock cycle.

Abstract: Decoding blocks, memories, and methods for decoding pre-decoded address information are disclosed. One such decoding block includes a first latch and voltage shift circuit configured to receive first pre-decoded address information at first voltage levels and further configured to latch the first pre-decoded address information and shift the voltage levels of the same to second voltage levels. An address decoder includes a second latch and voltage shift circuit configured to receive second pre-decoded address information at the first voltage levels and latch and shift the voltage levels of the same to the second voltage levels. The address decoder is further configured to select control gates of the memory cells of the memory based at least in part on the first and second pre-decoded address information.

Abstract: A method and apparatus for repairing digital addressable structured arrays, such as memory devices. In one example, a repair mechanism includes adding a number of redundant repair elements to the array, and coupling one or more skip units to the array ahead of the address decode unit(s). The skip unit compares a received logical address with a skip address identifying a defective element within the array, and modifies the input address based on a comparison of the input address and the skip address. The modified address is then decoded to access an element of the array.

Abstract: Integrated circuit memory devices include an array of memory cells electrically coupled to a plurality of word lines and a word line driver circuit. The word line driver circuit includes a variable-width pulse generator having a first delay unit therein. The word line driver circuit is configured to drive a selected one of the plurality of word lines with a first word line signal having a leading edge synchronized with a leading edge of a clock signal and a trailing edge synchronized with a trailing edge of the clock signal when a one-half period of the clock signal is greater than a length of delay provided by the first delay unit.

Abstract: A word-line driver includes first, second and third transistors. The first transistor includes a gate terminal driven by a first group selection signal, a first conduction terminal driven by a second sub-group selection signal and a second conduction terminal coupled to the word-line. The second transistor includes a gate terminal driven by a second group selection signal, a second conduction terminal driven by the second sub-group selection signal, and a first conduction terminal coupled to the word-line. The third transistor includes a gate terminal driven by a third the group selection signal, a first conduction terminal driven by a first sub-group selection signal, and a second conduction terminal coupled to the word-line.

Abstract: A memory includes a plurality of latching predecoders, each including a first transistor coupled between a power supply voltage and a latch and having a control electrode coupled to a clock signal; a second transistor coupled to the first transistor and having a control electrode coupled to a first address bit signal; a third transistor coupled to the second transistor and having a control electrode coupled to a second address bit signal; a fourth transistor coupled to the third transistor and having a control electrode coupled to a delayed and inverted version of the clock signal; a fifth transistor coupled between the fourth transistor and ground and having a control electrode coupled to the clock signal; and an output which provides a predecode value during a first portion of a clock cycle of the clock signal and a predetermined logic level during a second portion of the clock cycle.

Abstract: A semiconductor device includes a virtual power supplier, a driving signal generator and a load driver. The virtual power supplier boosts a driving voltage to generate a virtual voltage. The driving signal generator generates a driving signal based on the virtual voltage, such that the driving signal has a voltage level that is reinforced as compared with a voltage level of the driving voltage. The load driver drives a load based on the driving voltage and the driving signal.

Abstract: Disclosed herein is a semiconductor device that includes a command receiver receiving the command signal to generate a first internal command signal, and a latency control circuit activating a second internal chip select signal after elapse of first cycles of a clock signal since a first internal chip select signal is activated. The latency control circuit activates a second control signal when the chip select signal is maintained in an inactive state during second cycles of the clock signal that is larger than the first cycles. The command receiver is activated based on a first control signal. The first control signal is activated in response to the first internal chip select signal. The first control signal is deactivated in response to the second control signal.

Abstract: Applying an adapted block isolation method to serial-connected memory components may mitigate the effects of leakage current in serial-connected non-volatile memory devices. Responsive to determining that a given memory component is not an intended destination of a command, a plurality of core components of the given memory component may be placed in a low power consumption mode, while maintaining input/output components in an active operational mode. Conveniently, aspects of the disclosed system reduce off current without adding many logic blocks into the memory devices.

Abstract: Memory apparatus including a byte-bank organized in N rows and 8 columns, having a capacity of log2(N) bytes, a log2(N) bit address bus operative to address the byte-bank, an address offset bus operative to generate offsets (e.g., one-bit offsets) to bits of the byte-bank with an address conversion operator, and an adder in operative communication with the address offset bus and the log2(N) bit address bus, the adder operative to add addresses of the byte-bank with the offset generated by the address conversion operator and output a result to the log2(N) bit address. A random access memory array may include a plurality of the byte-banks.