Abstract: A system and method for operating a unipolar memory cell array including a bidirectional access diode. An example embodiment is a method including determining if the operating state of the unipolar memory cell is in a select state or a deselect state and the programming state is a read state or a write state. The method switches a column voltage switch based on the operating state and the programming state of the unipolar memory cell. The method further switches a row voltage switch based on the operating state and the programming state of the unipolar memory cell.

Abstract: Disclosed herein is a device that includes a capacitor, a pumping circuit supplying a pumping signal changed between first and second potential to a first electrode of the capacitor, and an output circuit precharging a second electrode of the capacitor to a third potential different from the first and second potentials. The second electrode of the capacitor is thereby changed from the third potential to a fourth potential higher than the third potential when the pumping signal is changed from the first potential to the second potential.

Abstract: A voltage regulator may include an input terminal for receiving an input voltage and an output terminal for providing a respective output voltage, a regulation transistor having a first conduction terminal coupled to the input terminal for receiving the input voltage, a second conduction terminal coupled to the output terminal, and a control terminal coupled to the output of a first operational amplifier. The first operational amplifier may have a non-inverting input terminal for receiving a first reference voltage, and an inverting input terminal coupled to a first terminal of a divider circuit for receiving a second reference voltage.

Abstract: Disclosed is a memory array structure, where a wordline driver selectively applies a high on-state voltage (VWLH) or a low off-state voltage (VWLL) to a wordline. VWLH has a slightly negative temperature coefficient so that it is regulated as high as the gate dielectric reliability limits allow, whereas VWLL has a substantially neutral temperature coefficient. To accomplish this, the wordline driver is coupled to one or more voltage regulation circuits. In one embodiment, the wordline driver is coupled to a single voltage regulation circuit, which incorporates a single voltage reference circuit having a single output stage that outputs multiple reference voltages. Also disclosed is a voltage reference circuit, which can be incorporated into the voltage regulation circuit of a memory array structure, as described, or, alternatively, into any other integrated circuit structure requiring voltages with different temperature coefficients. Also disclosed is a method of operating a memory array structure.

Abstract: A semiconductor memory device may include a memory cell array, a plurality of first sub word line drivers, and a plurality of second sub word line drivers. The memory cell array may comprise a plurality of sub cell arrays, a plurality of first word lines and a plurality of second word lines, wherein a loading of each of the first word lines is greater than a loading of each of the second word lines. Each of the plurality of first sub word line drivers may be connected to drive a corresponding one of the plurality of first word lines, wherein each of the first sub word line drivers has a first driving capability. Each of the plurality of second sub word line drivers may be connected to drive a corresponding one of the plurality of second word lines, wherein each of the second sub word line drivers has a second driving capability different from the first driving capability.

Abstract: A DDR SDRAM where unidirectional row logic is associated with and connected to a single memory array instead of being associated with and connected to multiple memory arrays. The unidirectional row logic is located in the outward periphery of its associated array, but is not within a throat region between two arrays. The location of the row logic allows the throat region to include more bidirectional IO circuitry and signal lines servicing two arrays, which increases the performance of the SDRAM. In addition, separate power bussing is employed for the memory arrays and IO circuitry. This prevents noise from the arrays from affecting the IO circuitry and signal lines of the throat region and vice versa.

Abstract: A semiconductor memory device includes a pad configured to receive a first write data from outside of the semiconductor memory device, and a write circuit configured to generate a plurality of second write data which are to be written in memory cells of all banks to be tested in response to a test mode signal, data strobe signals, a write enable signal, and the first write data transferred through the pad.

Abstract: An object is to increase the retention characteristics of a memory device formed using a semiconductor with a wide bandgap, such as an oxide semiconductor. A transistor including a back gate (a back gate transistor) is inserted in series at one end of a bit line so that the back gate is constantly at a sufficiently negative potential. The minimum potential of the bit line is set higher than that of a word line. When power is turned off, the bit line is cut off by the back gate transistor, ensuring prevention of outflow of charge accumulated in the bit line. At this time, the potential of a source or a drain (bit line) of a cell transistor is sufficiently higher than that of a gate of the cell transistor (0 V), so that the cell transistor is put in a sufficiently off state; thus, data can be retained.

Abstract: A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.

Abstract: Circuits, apparatuses, and methods are disclosed for oscillators. In one such example oscillator circuit, a plurality of delay stages are coupled in series. A variable delay circuit stage is coupled to the plurality of delay stages and is configured to delay a signal through the variable delay circuit stage by a variable delay. The variable delay increases responsive to a rising magnitude of a supply voltage provided to the variable delay circuit stage.

Abstract: A phase change memory (PCM) architecture and a method for writing a PCM architecture are described. In one embodiment, a PCM architecture includes a PCM array, word line driver circuits, bit line driver circuits, a source driver circuit and a voltage supply circuit. The bit line driver circuits are connected to the PCM array and the electrical ground. Other embodiments are also described.

Abstract: A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: Power management of an embedded dynamic random access memory (eDRAM) by receiving an eDRAM power state transition event and determining both the current power state of the eDRAM and the next power state of the eDRAM from the power states of: a power-on state, a power-off state, and a self-refresh state. Using the current power state and the next power state to determine whether a power state transition is required, and, in the case that a power state transition is required, transition the eDRAM to the next power state. Power management is achieved because transitioning to a power-off state or self-refresh state reduces the amount of power consumed by the eDRAM as compared to the power-on state.

Abstract: A memory system having a serial data interface and a serial data path core for receiving data from and for providing data to at least one memory bank as a serial bitstream. Each half of the memory bank is divided into upper and lower sectors. Each sector provides data in parallel to a shared two-dimensional page buffer with an integrated self column decoding circuit. A serial to parallel data converter within the memory bank couples the parallel data from either half to the serial data path core. The shared two-dimensional page buffer with the integrated self column decoding circuit minimizes circuit and chip area overhead for each bank, and the serial data path core reduces chip area. Therefore a multiple memory bank system is implemented without a significant corresponding chip area increase when compared to a single memory bank system having the same density.

Abstract: Methods and systems for time-based cell decoding for PCM memory. Generally, the higher the PCM element resistance, the longer it takes for a read output to change state. PCM memory output is determined using differentiated timings of read outputs changing state, rather than differentiated values of read outputs. In some single-bit single-ended sensing embodiments, a reference, with resistance between the resistances corresponding to a pair of adjacent logical states, is stored in multiple reference cells; a “vote” unit emits a clock signal when a majority of the reference cell read outputs transition at the vote unit. Timing units produce different binary outputs depending on whether a data read output or the clock signal changes state first at the timing unit. Time-based decoding provides advantages including improved temperature and drift resilience, improved state discrimination, improved reliability of multibit PCM, and fast and reliable sensing.

Abstract: A method for improving sub-word line response comprises generating a variable substrate bias determined by at least one user parameter. The variable substrate bias is applied to a sub-word line driver in a selected sub-block of a memory. A voltage disturbance on a sub-word line in communication with the sub-word line driver is minimized by modifying a variable substrate bias of the sub-word line driver to change a transconductance of the sub-word line driver thereby.

Abstract: A multi-level cell flash memory storage device has cells wherein different charge levels represent different information. The storage device can read stored charge from one or more cells, store a rewrite generation value for a group of a plurality of cells in a block of cells, and write to cells, wherein writing to one or more cells without an erase includes an increment of the rewrite generation value, and includes circuitry for reading from cells, including circuitry for reading the rewrite generation value. The storage device can include circuitry for reading from cells includes within the multi-level cell flash memory storage device logic for calculating a stored value of the cells using the rewrite generation value and relative levels of charge on a plurality of cells. The storage device can track hot addresses and cold addresses and perform static or dynamic wear leveling based on accumulated rewrite generation values.

Abstract: A memory device includes a substrate, and, disposed thereover, an array of vertical memory switches. In some embodiments, each switch has at least three terminals and a cross-sectional area less than 6 F2.

Abstract: A memory device includes a plurality of memory blocks configured to be refreshed in response to respective refresh signals; a command decoder configured to decode an external input command to generate an internal refresh command; a refresh control unit configured to activate a first number of refresh signals corresponding to the first number of memory blocks when the internal refresh command is activated and a first mode is set, and to activate a second number of refresh signals corresponding to the second number of memory blocks when the internal refresh command is activated and a second mode is set, the second number being smaller than the first number; and an address counter configured to change the row address transferred to the memory blocks when a predetermined one of the refresh signals is activated.

Abstract: Row activation operations within a memory component are carried out with respect to patterns of storage cells that constitute a fraction of a row and that have been predicted or predetermined to yield a succession of page hits, thus reducing activation power consumption without significantly increasing memory latency. The patterns of activated storage cells may be predicted or predetermined statically, for example, in response to user input or configuration settings that specify activation patterns to be applied in response to memory request traffic meeting various criteria, or dynamically through run-time evaluation of sequences of memory access requests.

Abstract: Command decoders are provided. The command decoder includes an input buffer configured for buffering and receiving command address signals having address information and command information at first, second, third, and fourth edges of a clock pulse signal according to a reference voltage, a latch circuit configured for latching the command address signals output from the input buffer at the first and third edges of the clock pulse signal to generate and output latched signals, a first command generator configured for decoding the latched signals output from the latch circuit at the first edge of the clock pulse signal to generate and output a first internal command, and a second command generator configured for decoding the latched signals output from the latch circuit at the third edge of the clock pulse signal to generate and output a second internal command.

Abstract: A multiple power domain circuit includes a trigger circuit, a high threshold voltage circuit electrically connected to an output terminal of the trigger circuit, and a low threshold voltage circuit electrically connected to the output terminal of the trigger circuit and an output terminal of the high threshold voltage circuit. The low threshold voltage circuit comprises a pulse generator electrically connected to the output terminal of the trigger circuit, and an inverter electrically connected to an output terminal of the pulse generator, and the output terminal of the high threshold voltage circuit.

Abstract: An operation method of a memory includes the following steps: determining the number of memory units required to update the content stored therein when the memory is performing a program operation based on the N-bit input data and accordingly generate a first determination result; and providing (N?M) number of loads to a source line decoder of the memory if the first determination result indicates that there are M number of memory units required to update the content stored therein, and thereby coupling the (N?M) number of the provided loads to a transmission path of a power supply voltage in parallel, wherein N and M are natural numbers. A memory is also provided.

Abstract: A method of operating an embedded dynamic random access memory (eDRAM). The method includes sending requests for sampling and correction between accesses of the eDRAM using an oscillator. The method further includes sending a pulse defining a time interval during which sampling and correction occurs using a control block and providing a reference level using a reference generator and comparing the reference level with a sampling of a reference voltage using a comparator. The method further includes sending a correction request using the comparator if the reference voltage requires correction and generating a correction pulse according to the correction request from the comparator and the pulse defining the time interval from the control block using a pulse generator. The method further includes adjusting the reference voltage during the correction pulse using a driver determining a logic value stored in the eDRAM based on the adjusted reference voltage.

Abstract: The present invention provides a row decoder of a semiconductor storage device that prevents an increase in a circuit area while maintaining a high operation speed. Namely, the row decoder of the semiconductor storage device includes a word line selection circuit that has voltage application MOS transistors for each of plural word lines, the voltage application MOS transistors applying a normal voltage to the word lines corresponding to memory cells selected among plural memory cells positioned at a portion where the plural word lines intersect plural bit lines in a predetermined normal operation, and applying a high voltage in a predetermined high voltage operation; and a level shift circuit that outputs the normal voltage or a ground voltage lower than the normal voltage in the normal operation, and that outputs the normal voltage or the high voltage in the high voltage operation, to the voltage application MOS transistor.

Abstract: A memory controller includes a bus driver that allows the controller to support both a semiconductor memory device supporting a low power double data rate 3 (LPDDR3) transmission method and a semiconductor memory device supporting a low power double data rate 4 (LPDDR4) transmission method.

Abstract: A semiconductor system including a semiconductor integrated circuit or a semiconductor chip, and a method of driving the semiconductor system are described. The semiconductor integrated circuit includes a plurality of semiconductor chips, at least one first chip through via suitable for penetrating through the plurality of semiconductor chips and interfacing a source ID code between the plurality of semiconductor chips, a plurality of second chip through vias suitable for penetrating through the plurality of semiconductor chips and interfacing a plurality of chip selection signals between the plurality of semiconductor chips, wherein the semiconductor chip uses one of chip selection signals as an internal chip selection signal in response to a chip ID code by selecting one of a unique ID code for the semiconductor chip and an alternative ID code for a preset semiconductor chip when the semiconductor chip fails.

Abstract: Methods, apparatuses, and integrated circuits for measuring leakage current are disclosed. In one such example method, a word line is charged to a first voltage, and a measurement node is charged to a second voltage, the second voltage being less than the first voltage. The measurement node is proportionally coupled to the word line. A voltage on the measurement node is compared with a reference voltage. A signal is generated, the signal being indicative of the comparison. Whether a leakage current of the word line is acceptable or not can be determined based on the signal.

Abstract: Disclosed herein is a device that includes a command decoder and a latency counter. The command decoder generates a first internal command in response to a first internal clock signal. The latency counter includes: a gate control signal generation unit generating output gate signals in response to a second internal clock signal; delay circuits each receiving an associated one of the output gate signals and generating an associated one of input gate signals; and a command signal latch unit fetching the first internal command in response to one of the input gate signals and outputting the first internal command in response to one of the output gate signals. Each of the delay circuit includes a first delay element that operates on a first power supply voltage and a second delay element that operates on a second power supply voltage different from the first power supply voltage.

Abstract: A semiconductor device and method of operation having reduced read time of fuse array information during boot-up operation. When fuse array information is read, only repaired fuse-set information is read such that a read time of the semiconductor memory device is reduced, resulting in an increased read margin.

Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.

Abstract: A non-volatile memory device includes a plurality of memory blocks, first block switches configured to correspond to the respective odd-numbered memory blocks of the plurality of memory blocks and couple the word lines of the odd-numbered memory blocks and first local lines, second block switches configured to correspond to the respective even-numbered memory blocks of the plurality of memory blocks and couple the word lines of the even-numbered memory blocks and second local lines, a local line switch unit configured to selectively couple the first local lines or the second local lines and global word lines, and a high voltage generator configured to supply operating voltages to the global word lines.

Abstract: A memory includes a memory array having a plurality of word lines, a plurality of latching predecoders, and word line driver logic. Each latching predecoder receives a clock signal and a plurality of address signals and latches a result of a logic function of the plurality of address signals in response to a first edge of a clock cycle of the clock signal and provides a predetermined value in response to a second edge of the first clock cycle of the clock signal, wherein, in response to the second edge, every latching decoder of the plurality of latching predecoders provides a same predetermined value. The word line driver logic selectively activates a selected word line of the plurality of word lines in response to the latched results.

Abstract: A decoder for decoding an address having a plurality of bits ranging from a first address bit a1 to a last address bit aN, each address bit being either true or false is provided that includes a pre-charge circuit adapted to pre-charge a dynamic NOR node and a dynamic OR node and then allow the pre-charged dynamic NOR node and pre-charged dynamic OR node to float; a plurality of switches coupled between the dynamic NOR node and ground, each switch corresponding uniquely to the address bits such that the switches range from a first switch corresponding to a1 to an nth switch corresponding to aN, wherein any switch corresponding to a true address bit is configured to turn on only if its corresponding address bit is false, and wherein any switch corresponding to a false address bit is configured to turn on only if its corresponding address bit is true.

Abstract: A semiconductor device includes a memory cell array having short and long sides, a row decoder, a row fuse circuit, a column decoder and a column fuse circuit. The row decoder, the row fuse circuit and the column fuse circuit are arranged along the long side of the memory cell array. The column decoder is arranged along the short side of the memory cell array.

Abstract: A method of storing data in a memory array with less than half of memory elements in any row and column in a low-resistance state. The data are arranged in a first portion of an encoding array. High-resistance values are entered in a second portion. A codeword is selected from a covering code for each row in which too many entries have low-resistance values. The selected codeword is used to reduce the number of low-resistance values in that row. A codeword is selected for each column in which too many entries have low-resistance values and the codeword is used to reduce the number of such values in that column. The process is repeated until no row and no column has too many low-resistance values. The array entries are stored in corresponding memory elements.

Abstract: Apparatuses, memory section control circuits, and methods of refreshing memory are disclosed. An example apparatus includes a plurality of memory sections and a plurality of memory section control circuits. Each memory section control circuit is coupled to a respective one of the plurality of memory sections and includes a plurality of access line drivers, each of which includes a plurality of transistors having common coupled gates. During an operation of the apparatus a first voltage is provided to the commonly coupled gates of the transistors of at least some of the access line drivers of the memory section control circuit coupled to an active memory section and a second voltage is provided to the commonly coupled gates of the transistors of the access line drivers of the memory section control circuit coupled to an inactive memory section control circuit, wherein the first voltage is greater than the second voltage.

Abstract: A semiconductor memory includes a circuit block that is configured to receive a test mode command, a first sense amplifier that is coupled to sense and amplify a state of a first memory cell when enabled, and a second sense amplifier that is coupled to sense and amplify a state of a second memory cell when enabled. In an active cycle, the circuit block generates one or more control signals in response to the test mode command that cause the second sense amplifier to be enabled a predetermined amount of time after the first sense amplifier is enabled.

Abstract: According to one embodiment, a memory cell, a word line, and a peripheral circuit are provided. In the memory cell, a ferroelectric film is provided for a gate insulating film. The word line is connected to a control gate electrode of the memory cell. In the peripheral circuit, ferroelectric films are provided for gate insulating films and the peripheral circuit is provided near the memory cell. Here, between the same conductive type transistors of the peripheral circuit, a channel impurity concentration of a transistor to which a driving voltage which drives the word line is applied is different from a channel impurity concentration of a transistor to which a voltage which is lower than the driving voltage is applied.

Abstract: A semiconductor memory device and method of operating the same is disclosed. The semiconductor memory device includes an address decoder including pass transistor groups, a memory block selector coupled in common to the pass transistor groups, and a block decoding section configured to deliver an enable signal through the block word line based on a block group address. The memory block selector is configured to deliver the enable signal to a first pass transistor group selected from the pass transistor groups in response to a block select signal to activate the first pass transistor group.

Abstract: A NAND flash memory device is disclosed. The NAND flash memory device includes a NAND flash memory array defined as a plurality of sectors. Row decoding is performed in two levels. The first level is performed that is applicable to all of the sectors. This can be used to select a block, for example. The second level is performed for a particular sector, to select a page within a block in the particular sector, for example. Read and program operations take place to the resolution of a page within a sector, while erase operation takes place to the resolution of a block within a sector.

Abstract: Example embodiments provide a semiconductor memory device that may include: a cell array arranged in pluralities of rows and columns; and a sense amplifier conducting writing and reading operations to the cell array in response to writing and reading commands in correspondence with an access time, which may be variable in period. The sense amplifier adjusts pulse widths of write-in and read-out data in accordance with a period of the access time.

Abstract: A nonvolatile semiconductor memory device comprises multiple memory strings each including a plurality of first and second groups of serially connected memory cells, and a back gate transistor serially connected between the first and second groups of memory cells, a plurality of word lines, each word line being connected to a control gate of a different memory cell in each of the memory strings, a voltage generating circuit configured to generate control voltages of different voltage levels, and a control circuit configured to control application of control voltages to the word lines and the back gate line. A control voltage applied to the back gate line may be varied depending on how far a selected word line is from the back gate line, and a control voltage applied to unselected word lines may be varied depending on how far the unselected word line is from the selected word line.

Abstract: System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption.

Abstract: A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: A method of operating a multiport memory, which has first and second sets of word lines and bit lines for accessing a memory array, uses a first port and a second port for accesses during a first phase of a master clock and a third port and a fourth port during a second phase of the master clock. Each port has its own port clock, which clocks their own row and column addresses, that is no faster than the master clock. Assuming there is demand for it, four accesses occur for each cycle of the master clock. This has the effect of being able to be sure that a given access is complete within two cycles of the port clocks and can be operated at the rate of one access per cycle of the port clock.

Abstract: A memory controller is provided. The memory controller is powered by first and second power source and includes an input/output pin, a driver circuit, a terminal resistor, and an input buffer. The driver circuit is coupled to the input/output pin and capable of providing to a writing signal to the input/output pin. The terminal resistor is coupled between the input/output pin and the first power source. The input buffer is coupled to the input/output pin and capable of receiving a reading signal from the input/output pin. No terminal resistor is coupled between the input/output pin and the second power source.

Abstract: A cross-point variable resistance nonvolatile memory device comprises: a memory cell array; a column decoder and pre-charge circuit which pre-charges a selected word line to a first voltage in a period P1 among the period P1, a period P2, and a period S that are included in this order in a read operation of a memory cell; a low decoder driver which pre-charges a selected word line to the first voltage in the periods P1 and P2 and sets the selected word line to a third voltage different from the first voltage in the period S; a feedback controlled bit line voltage clamp circuit which sets the selected bit line to a second voltage in the periods P2 and S; and a sense amplifier which determines the resistance state in a memory cell at a cross-point of the selected word line and the selected bit line in the period S.

Abstract: In this invention a hit ahead multi-level hierarchical scalable priority encoding logic and circuits are disclosed. The advantage of hierarchical priority encoding is to improve the speed and simplify the circuit implementation and make circuit design flexible and scalable. To reduce the time of waiting for previous level priority encoding result, hit signal is generated first in each level to participate next level priority encoding, and it is called Hit Ahead Priority Encoding (HAPE) encoding. The hierarchical priority encoding can be applied to the scalable architecture among the different sub-blocks and can also be applied with in one sub-block. The priority encoding and hit are processed completely parallel without correlation, and the priority encoding, hit generation, address encoding and MUX selection of the address to next level all share same structure of circuits.