Abstract: A method and a device is provided for implementing a mode register to transmit additional activate information to a memory device. Additional activate information may be transmitted to the memory device without increasing the tRCD time, or increasing the command/address (CA) bus pins, or adding additional circuit area, thereby reducing the impact on the performance of the memory device.

Abstract: A memory device includes a clock input configured to receive a clock from a host device. The memory device also includes a command input configured to receive command and address bits from the host device. The memory device further includes multiple die stacked in a three-dimensional stack. A first die of the plurality of die includes a first plurality of memory cells and first local control circuitry. The first local circuitry includes division circuitry configured to receive the clock from the clock input, generate a divided clock having a lower frequency than that of the clock, and generate multiple clocks from the divided clock with each of the multiple clocks having a lower frequency than the divided clock. The memory device also includes one or more transmitters configured to transmit the multiple clocks using inter-die interconnects between the multiple die.

Abstract: Disclosed herein are systems, methods and devices for controlling output of a storage device during read operations. The method comprises: measuring a length of a temporal gap between first and second consecutive read bursts from a storage device, the first and second read burst are in response to first and second read commands received by the storage device, respectively; generating a state code according to the length, wherein the state code has a first value when the length is zero, a second value when the length is equal to or shorter than a threshold time length but is non-zero, and a third value when the length is greater than the threshold time length; and controlling output of the storage device according to the state code.

Abstract: A memory device includes an array of memory cells arranged in sub-blocks. Memory cells of a sub-block are coupled to a pillar of the array and are associated with multiple wordlines. To perform a read operation, control logic coupled with the array performs operations including: tracking a length of time that a selected wordline takes to reach a pass voltage before being able to read data from a memory cell associated with the selected wordline; in response to the length of time satisfying a first threshold criterion, causing a first delay time to pass before reading the data; and in response to the length of time satisfying a second threshold criterion that is longer than the first threshold criterion, causing a second delay time to pass before reading the data, the second delay time being longer than the first delay time.

Abstract: A memory device includes a memory array, a first latch and a first logic element. The memory array is configured to operate according to a first global write signal. The first latch is configured to generate a first latch write data based on a clock signal. The first logic element is configured to generate the first global write signal based on the clock signal and the first latch write data.

Abstract: A data receiving circuit includes: a first amplification module configured to receive a data signal and a reference signal, compare the data signal and the reference signal in response to a first sampling clock signal, and output a first voltage signal and a second voltage signal; a decision feedback control module configured to generate a second sampling clock signal in response to the enable signal; a decision feedback equalization module configured to, when the enable signal is in a first level value interval, perform decision feedback equalization in response to the second sampling clock signal and stop performing the decision feedback equalization when the enable signal is in a second level value interval; and a second amplification module configured to process the first voltage signal and the second voltage signal and output the first output signal and the second output signal.

Abstract: Methods, systems, and devices for dynamic random access memory speed bin compatibility are described. For instance, a device (e.g., a memory device, a host device) may combine a first parameter with a second parameter to generate a third parameter, where the first parameter may be associated with a duration for a clock that is coupled with a memory array to perform a clock cycle and the second parameter may be associated with a timing constraint associated with initiating an access operation for the memory array. The device may determine a latency of a column address strobe based on the third parameter relative to (e.g., satisfying) a threshold value and may access one or more memory cells of the memory array based on the latency of the column address strobe.

Abstract: A signal sampling circuit and a semiconductor memory device are provided. The signal sampling circuit includes a signal input circuit, configured to determine a to-be-processed command signal and a to-be-processed chip select signal; a mode selection circuit, configured to determine a target mode clock signal and a target mode chip select signal according to the mode selection signal; a first clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a first chip select clock signal; a second clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a second chip select clock signal; and a command decoding circuit, configured to determine a target command signal.

Abstract: A semiconductor system includes a first semiconductor device configured to output a clock and pattern data, configured to receive a strobe signal and output data, and configured to adjust a duty ratio of the strobe signal by comparing odd data and even data that are generated from the output data and the pattern data, in synchronization with the strobe signal and a second semiconductor device configured to store the pattern data in synchronization with the clock, configured to output the clock as the strobe signal by adjusting a duty ratio of the clock, and configured to output the stored pattern data as the output data.

Abstract: A semiconductor device includes a substrate including a first memory cell, a second memory cell adjacent to the first memory cell in a first direction, and a comparator circuit adjacent to the first and second memory cells in a second direction intersecting the first direction; a true bit line and a complementary bit line electrically connected to the first and second memory cells and extending in the first direction from a first wiring layer on the substrate; a first power supply wiring on the first wiring layer, extending in the first direction between the true bit line and the complementary bit line and electrically connected to the first and second memory cells; first and second word lines extending in the second direction from a second wiring layer on the substrate different from the first wiring layer; first word line pads on the first wiring layer and electrically connecting the first memory cell to the first word line; second word line pads on the first wiring layer and electrically connecting the sec

Abstract: A memory sub-system including a memory device, wherein the memory device includes a circuit, operatively coupled to an array data bus of a memory array, and control logic, operatively coupled with the circuit, to perform operations including: deserializing a serial data stream in a first time domain to generate at least one of a set of rising data portions or a set of falling data portions; and synchronizing the at least one of the set of rising data portions or the set of falling data portions in a second time domain using at least one of a set of rising edge clock signals or a set of falling edge clock signals generated by a ring counter portion.

Abstract: A memory device includes a command interface configured to receive write commands from a host device. The memory device also includes an input buffer configured to buffer data from the host device. Additionally, the memory device includes a state machine configured to receive a command into a first partition of the state machine and to enable a data strobe (DQS) input buffer in response to the indication. The state machine is also configured to maintain the enablement of the DQS input buffer while the command traverses the state machine. Furthermore, the state machine is configured to disable the DQS input buffer after a set duration of time.

Abstract: An exemplary semiconductor device includes an internal clock circuit configured to intermittently enable and disable a clock signal while in a Maximum Power Savings Mode. The duty cycle of the enablement and disablement of the clock signal may be based on susceptibility to negative-bias temperature instability of a component of the semiconductor device. The clock signal may be enabled and disabled via a synchronizer.

Abstract: A command/address sequence associated with a read/write operation for a memory device utilizes various existing command/address clock signals in a novel way that obviates the need to utilize the I/O bus. As such, the command/address sequence can be performed in parallel with the DIN/DOUT operations, thereby removing the performance bottleneck that would otherwise be caused by the command and address sequencing. The command/address sequence encodes bit information on first and second enable signals and utilizes rising or falling edges of a clock signal to latch the encoded bit information, which can then be decoded to determine corresponding command and address codes. A chip select sequence is also disclosed that enables a memory chip configuration to be employed in which each chip in a package shares a common connection to a controller but does not require hard-coded pins for performing chip select.

Abstract: An in-memory-computing method for a memory device includes: storing weight values in cascaded computing cells each including first and second computing memory cells, wherein the first computing memory cells are cascaded in series into a first computing memory cell string and the second computing memory cells are cascaded in series into a second computing memory cell string: receiving input values by the first and the second computing memory cell strings; performing a first logic operation on the input values and the weight values by the first computing memory cell string to generate a first logic operation result, and performing a second logic operation on the input values and the weight values by the second computing memory cell string to generate a second logic operation result: and performing a third logic operation on the first and the second logic operation results to generate an output logic operation result.

Abstract: A memory device in which reliability of a clock signal is improved is provided. The memory device comprises a data module including a clock signal generator configured to receive an internal clock signal from a buffer, and to generate a first internal clock signal, a second internal clock signal, a third internal clock signal, and a fourth internal clock signal having different phases, on the basis of the internal clock signal, and a first data signal generator configured to generate a first data signal on the basis of first data and the first internal clock signal, generate a second data signal on the basis of second data and the second internal clock signal, generate a third data signal on the basis of third data and the third internal clock signal, and generate a fourth data signal on the basis of fourth data and the fourth internal clock signal.

Abstract: A clock system and a memory are disclosed. The clock system includes a system on chip (SoC) configured to generate a first oscillation signal, a second oscillation signal, a third oscillation signal and a fourth oscillation signal of a same frequency and amplitude. Further, the clock system includes a memory chip configured to output a data signal based on signal edges of the first oscillation signal, the second oscillation signal, the third oscillation signal and the fourth oscillation signal, and output a command/address signal based on the signal edges of the first oscillation signal and the third oscillation signal. The signal edges are rising edges or falling edges.

Abstract: Systems and methods disclosed herein provide for selectively activating or deactivating one or more memory of a memory array, such that related data path logic of deactivated memory dies neither detects nor processes control signals or data signals for data operations. Examples of the systems and methods provided herein operate to detect a first enable signal at a memory die and detect a first data signal on input/output (I/O) receivers of the memory die. Responsive to detecting at least the first enable signal, a bit value encoded in the first data signal is latched to obtain a first bit pattern. A second bit pattern is obtained, and, based on a comparison of the first bit pattern to the second bit pattern, the I/O receivers of the memory die are activated.

Abstract: A semiconductor memory device includes a quadrature error correction circuit, a clock generation circuit and a data input/output (I/O) buffer. The quadrature error correction circuit performs a locking operation to generate a first corrected clock signal and a second corrected clock signal by adjusting a skew and a duty error of a first through fourth clock signals generated based on a data clock signal and performs a relocking operation to lock the second corrected clock signal to the first corrected clock signal in response to a relock signal. The clock generation circuit generates an output clock signal and a strobe signal based on the first corrected clock signal and the second corrected clock signal. The data I/O buffer generates a data signal by sampling data from a memory cell array based on the output clock signal and transmits the data signal and the strobe signal to a memory controller.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices are described, in which clock trees can be separately optimized to provide a coarse alignment between a clock signal and a command/address signal (and/or a chip select signal or other control signal), and/or in which individual memory devices can be isolated for fine-tuning of device-specific alignment between a clock signal and a command/address signal (and/or a chip select signal or other control signal). Moreover, individual memory devices can be isolated for fine-tuning of device-specific equalization of a command/address signal (and/or a chip select signal or other control signal).

Abstract: Methods, systems, and devices for configurable memory die capacitance are described. A memory device may include a capacitive component, which may include one or more capacitors and associated switching components. The capacitive component may be coupled with an input/output (I/O) pad and an associated input buffer, and the one or more capacitors of the capacitive component may be selectively couplable with the I/O pad via the switching components. Switching components may be activated individually, in coordination, or not at all, such that one, multiple, or none of the capacitors may be coupled with the I/O pad. The capacitive component, I/O pad, and input buffer may be included in a same die of the memory device. In some cases, a configuration of the capacitive component may be based on signaling received from a host device.

Abstract: A data path architecture and corresponding method of operation are disclosed that permit a first-in-first out (FIFO) buffer to immediately flush data—including potentially invalid initial byte(s)—upon receipt of a high-speed clock signal, and according to which, a delay difference between a data path clock signal and a high-speed clock signal is compensated for at a controller side by, for example, adjusting RE latency to discard/ignore the initially invalid bytes rather than by modifying FIFO depth or varying a number of delay stages in the high-speed clock signal path in order to satisfy the FIFO depth. Because FIFO depth is not used to absorb the clock signal delay difference, there is no need to modify the architecture (e.g., change the depth of a FIFO) to accommodate variation in the clock signal delay difference across different products/product generations, thereby providing high scalability.

Abstract: A signal generation circuit includes: a clock module, configured to generate a clock signal based on a flag signal; a control module, configured to generate a control signal according to number of transitions of the clock signal within a fixed time; and a generation module, respectively connected to the clock module and the control module, and configured to receive the clock signal, the control signal, and the flag signal, and to generate a target signal. When the flag signal changes from a first level to a second level, the target signal changes from a third level to a fourth level. After being maintained at the fourth level for a target duration, the target signal changes from the fourth level to the third level. The generation module is further configured to determine the target duration according to the clock signal and the control signal.

Abstract: A memory device includes a memory bank with a memory cell connected to a local bit line and a word line. A first local data latch is connected to the local bit line and has an enable terminal configured to receive a first local clock signal. A word line latch is configured to latch a word line select signal, and has an enable terminal configured to receive a second local clock signal. A first global data latch is connected to the first local data latch by a global bit line, and the first global data latch has an enable terminal configured to receive a global clock signal. A global address latch is connected to the word line latch and has an enable terminal configured to receive the global clock signal. A bank select latch is configured to latch a bank select signal, and has an enable terminal configured to receive the second local clock signal.

Abstract: Systems and methods are provided for controlling a sleep operation for a memory array. A memory system may include a memory array with a memory cell and a word line driver, the memory array receiving a word line clock signal that enables and disables memory read and write operations of the memory cell. The memory array may further including a switching circuit coupled between the word line driver and a power source, the switching circuit being controlled by a local word line sleep signal to turn power to the word line driver on and off. A latch circuit may generate the local word line sleep signal in response to a delayed clock signal and one or more power management control signals. The word line clock signal and the delayed clock signal may both being generated as a function of a memory clock signal.

Abstract: A memory device includes a plurality of memory cells; a word line, connected to one of the plurality of memory cells, that is configured to provide a first WL pulse having a rising edge and a falling edge that define a pulse width of the first WL pulse; a first tracking WL, formed adjacent to the memory cells, that is configured to provide, via being physically or operatively coupled to a bit line (BL) configured to write a logic state to the memory cell, a second WL pulse having a rising edge with a decreased slope; and a first tracking BL, configured to emulate the BL, that is coupled to the first tracking WL such that the pulse width of the first WL pulse is increased based on the decreased slope of the rising edge of the second WL pulse.

Abstract: A system and method for efficiently generating clock signals are described. In various implementations, an integrated circuit includes multiple clock frequency dividers both at its I/O boundaries and across its die. A clock frequency divider utilizes a first clock divider and a second clock divider that receive input clock signals with an initial phase difference between them. The first clock divider and the second clock divider generate output clock signals that have frequencies that are a fraction of the frequencies of the received input clock signals. The second clock divider uses a combined multiplexer and flip-flop (combined mux-flop) circuit. The combined mux-flop circuit receives a reset signal that is asserted asynchronously with respect to an input clock signal received by the second clock divider. The second clock divider generates an output clock signal that has the initial phase difference with an output clock signal of the first clock divider.

Abstract: The disclosure relates to a method for enabling the secure functions of a chipset (1) and especially the encryption of the content of the secure memory (7) when the device goes into low power mode. The content of the secure memory (7) may be encrypted and stored in an external memory (20) during low power mode of the chipset (1).

Abstract: Methods, systems, and devices for dynamic random access memory speed bin compatibility are described. For instance, a device (e.g., a memory device, a host device) may combine a first parameter with a second parameter to generate a third parameter, where the first parameter may be associated with a duration for a clock that is coupled with a memory array to perform a clock cycle and the second parameter may be associated with a timing constraint associated with initiating an access operation for the memory array. The device may determine a latency of a column address strobe based on the third parameter relative to (e.g., satisfying) a threshold value and may access one or more memory cells of the memory array based on the latency of the column address strobe.

Abstract: A latch circuit includes a latch clock generator configured to generate a latched clock signal based on a clock signal and a first enable signal, and an input latch coupled to the latch clock generator to receive the latched clock signal. The input latch is configured to generate a latched output signal based on the latched clock signal and an input signal. In response to the first enable signal having a disabling logic level, the latch clock generator is configured to set a logic level of the latched clock signal to a corresponding disabling logic level, regardless of the clock signal. The latch clock generator includes a first inverter configured to generate an inverted signal of the first enable signal, and a NAND gate coupled to the first inverter to receive the inverted signal of the first enable signal. The NAND gate is configured to generate the latched clock signal based on the clock signal and the inverted signal of the first enable signal.

Abstract: A memory device includes a command interface configured to receive a two-cycle command from a host device via multiple command address bits. The memory device also includes a command decoder configured to decode a first portion of the multiple command address bits in a first cycle of the two-cycle command. The command decoder includes mask circuitry. The mask circuitry includes mask generation circuitry configured to generate a mask signal. The mask circuitry also includes multiplexer circuitry configured to apply the mask signal to block the command decoder from decoding a second portion of the multiple command address bits in a second cycle of the two-cycle command.

Abstract: A memory subsystem architecture that includes two register clock driver (RCD) devices to increase a number of output drivers for signaling memories of the memory subsystem is described herein. In a two RCD device implementation, first and second RCD devices may contemporaneously provide first subchannel C/A information and second subchannel C/A information, respectively, to respective first and second group of memories of the memory subsystem responsive to a common clock signal. Because each of the first and second RCD devices operate responsive to the common clock signal, operation of the first and second RCD devices may be synchronized such that all subchannel driver circuits drive respective subchannel C/A information contemporaneously.

Abstract: Methods, systems, and devices for memory device access techniques are described. Memory systems may be enabled to allow device-controlled access to a portion of volatile memory at a host system. By enabling the memory system to access volatile memory at the host system, the memory system may perform access operations which may reduce a quantity of messages exchanged between the memory system to the host system. The host system may allocate a list of memory resources in volatile memory associated with a first access command. The host system may allocate the same memory resources for a second access command. By allocating the same memory resources, the memory device may transmit a Ready To Transfer (RTT) message for multiple access commands, rather than for each command. In some cases, reducing the quantity of RTT messages may reduce latency and improve performance at the memory system.

Abstract: A switch activation system including a charge pump, a load monitor, and a switch driver. The charge pump drives a negative voltage node to a predetermined negative voltage level. The load monitor monitors the charge pump and to assert a break done signal after the charge pump begins driving the negative voltage back to the predetermined negative voltage level after being increased. The switch driver turns on a first electronic switch in response to assertion of a corresponding activation signal and assertion of the break done signal. The break done signal is asserted only after electronic switches being turned off are fully turned off to avoid conflict. The charge pump operates at a frequency based on a difference between a voltage level of the negative voltage node and the predetermined negative voltage level to drive the negative voltage node back to its predetermined level within a predetermined period of time.

Abstract: A first-in-first-out (FIFO) storage structure within an integrated-circuit component is loaded with qualification values corresponding to respective pairs of edges expected within a timing strobe signal transmitted to the integrated-circuit component. The qualification values are sequentially output from the FIFO storage structure during respective cycles of the timing strobe signal and a gate signal is either asserted or deasserted during the respective cycles of the timing strobe signal according to the qualification values output from the FIFO storage structure.

Abstract: A circuit is provided. The circuit includes a first die that includes a memory array, and the memory array includes a plurality of memory cells, a sensing element coupled to the plurality of memory cells, and a first plurality of conductive pads coupled to the sensing element. The circuit also includes a second die that includes an address decoder associated with the memory array of the first die and a second plurality of conductive pads coupled to the address decoder. The first die is coupled to the second die by an interposer. The address decoder of the second die is coupled to the sensing element of the first die. A first voltage swing of the first die is larger than a second voltage swing of the second die.

Abstract: A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.

Abstract: A signal processing circuit includes a delay locked loop (DLL) circuit, a data output path circuit, and a first phase detector circuit. The DLL circuit is arranged to receive a memory clock signal, and generate a DLL output signal according to the memory clock signal and a DLL feedback signal. The data output path circuit is coupled to the DLL circuit, and is arranged to generate a DQS signal according to the DLL output signal. The first phase detector circuit is coupled to the data output path circuit, and is arranged to receive the memory clock signal and the DQS signal, and detect a phase difference between the memory clock signal and the DQS signal to generate a first phase detection result.

Abstract: A memory controller for accessing a memory, comprises a holding circuit which holds a plurality of read or write access requests from a bus master, a read/write control circuit which selects one of the access requests in the holding circuit and issues a read command or a write command; and an active control circuit which selects the access request held in the holding circuit and issues an active command, wherein the active control circuit includes a generation circuit that generates number of activated read commands and number of activated write commands, and a selection circuit that, when the number of activated read commands is not less a threshold, issues the active command of an read access, and when the number of activated write commands is not less than the threshold, issues the active command of a write access.

Abstract: An apparatus includes an in-memory compute circuit that includes a memory circuit configured to generate a set of products by combining received input values with respective weight values stored in rows of the memory circuit, and to combine the set of products to generate an accumulated output value. The in-memory compute circuit may further include a control circuit and a plurality of routing circuits, including a first routing circuit coupled to a first set of rows of the memory circuit. The control circuit may be configured to cause the first routing circuit to route groups of input values to different ones of the first set of rows over a plurality of clock cycles, and the memory circuit to generate, on a clock cycle following the plurality of clock cycles, a particular accumulated output value that is computed based on the routed groups of input values.

Abstract: A clock signal processing circuit includes a clock buffer configured to generate a pair of second clock signals with opposite phases after receiving a pair of first clock signals with opposite phases and configured to fix the second clock signals to determined levels according to a control signal until toggling of the first clock signals begins.

Abstract: The present technology relates to a page buffer and a semiconductor memory device including the same. The page buffer includes a bit line selector configured to connect a bit line of a memory cell array to a sensing node, a precharger configured to precharge a potential of the sensing node to a first level, and a latch component configured to sense data by detecting a time at which the potential of the sensing node is decreased from the first level to a second level.

Abstract: An integrated circuit includes a drivability control circuit and a data output circuit. The drivability control circuit is configured to generate a drivability control signal based on data patterns of a plurality of pieces of data. The data output circuit is configured to control drivability, which is reflected to each of the plurality of pieces of data, based on the drivability control signal.

Abstract: A data writing control device includes a control signal generator, a data strobe enable signal generator and a data strobe index generator. The control signal generator receives a write command, a preamble setting value and a latency setting value, and generates an internal write pulse and preamble information according to the write command, the preamble setting value and the latency setting value. The data strobe enable signal generator is coupled to the control signal generator and generates a data strobe pipeline enable signal according to the internal write pulse and the preamble setting value. The data strobe index generator is coupled to the data strobe enable signal generator, and generates a plurality of data strobe indexes according to the data strobe pipeline enable signal and the preamble information.

Abstract: A reference voltage training circuit may include: a normal buffer configured to generate a first received signal by receiving one of differential signals based on the other; a calibration signal generation circuit configured to generate a second received signal by receiving the one of the differential signals according to a reference voltage, and generate reference voltage calibration signals by comparing the phase of the second received signal to the phase of the first received signal; and a reference voltage generation circuit configured to calibrate the level of the reference voltage according to the reference voltage calibration signals.

Abstract: A method of operating a memory device including row pins and column pins includes receiving a first active command through the row pins during 1.5 cycles of a clock signal, receiving a first read command or a first write command through the column pins during 1 cycle of the clock signal, receiving a first precharge command through the row pins during a 0.5 cycle of the clock signal corresponding to a rising edge of the clock signal, receiving a second active command through the row pins during the 1.5 cycles of the clock signal, receiving a second read command or a second write command through the column pins during the 1 cycle of the clock signal, and receiving a second precharge command through the row pins during the 0.5 cycle of the clock signal corresponding to a falling edge of the clock signal.

Abstract: A semiconductor memory device includes an interface semiconductor die, at least one memory semiconductor die, and through-silicon vias connecting the interface semiconductor die and the memory semiconductor die. The interface semiconductor die includes command pins to receive command signals transferred from a memory controller and an interface command decoder to decode the command signals. The memory semiconductor die includes a memory integrated circuit configured to store data and a memory command decoder to decode the command signals transferred from the interface semiconductor die. The interface semiconductor die does not include a clock enable pin to receive a clock enable signal from the memory controller. The interface and memory command decoders generate interface and memory clock enable signals to control clock supply with respect to the interface and memory semiconductor dies based on a power mode command transferred through the plurality of command pins from the memory controller.

Abstract: A memory device including a memory array operatively coupled to an array data bus and a deserializer circuit operatively coupled with the array data bus. The deserializer circuit includes a first ring counter including a first set of flip-flops to sequentially output a set of rising edge clock signals based on a reference clock input and a second ring counter portion including a second set of flip-flop circuits to sequentially output a set of falling edge clock signals based on the reference clock input. A rising data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a rising data portion from a respective latch circuit in response to a rising edge clock signal. A falling data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a falling data portion from a respective latch circuit in response to a falling edge clock signal.

Abstract: The disclosure relates to a method for enabling the secure functions of a chipset (1) and especially the encryption of the content of the secure memory (7) when the device goes into low power mode. The content of the secure memory (7) may be encrypted and stored in an external memory (20) during low power mode of the chipset (1).

Abstract: A memory device and a glitch prevention method thereof are provided. The memory device includes a data strobe signal input circuitry, a transfer signal generating circuitry, a data alignment circuitry, and a blocking circuitry. The data strobe signal input circuitry is configured to input a data strobe signal. The transfer signal generating circuitry is configured to generate a transfer signal with pulses in synchronization with rising edges or falling edges of the data strobe signal in response to a transfer command. The data alignment circuitry is configured to align a data signal to be transferred in response to the generated transfer signal. The blocking circuitry is configured to block an input of the data strobe signal over a postamble timing of the data strobe signal according to a number of bursts counted in each time of data transfer.