Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.

Abstract: Diaphragms of a plurality of capacitor microphone units are arranged in the same plane and the capacitor microphone units are connected in series to make an output from an impedance converter connected to one capacitor microphone unit drives a ground side of another capacitor microphone unit connected to the impedance converter.

Abstract: A head of a condenser microphone includes: a condenser microphone unit; a housing supporting the condenser microphone unit; a first circuit board arranged adjacent to the condenser microphone unit in the housing; a second circuit board arranged remote from the condenser microphone unit and separated from the first circuit board in the housing; and a magnetic sheet arranged between and separated from the first circuit board and the second circuit board in the housing, the first circuit board including a circuit for processing an audio signal from the condenser microphone unit; the second circuit board including a DC-DC converter circuit unit for generating a polarization voltage to be applied to the condenser microphone unit.

Abstract: A miniature microphone is provided.

Abstract: A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.

Abstract: A miniature microphone, comprising a diaphragm, supported for displacement in response to acoustic waves, from which a plurality of projections extend; a plurality of projections extending from a surface; a body, supporting the surface to maintain the plurality of projections from the diaphragm and the plurality of projections from the surface in close proximity; and an electromagnetic sensor adapted to sense an electromagnetic interaction between the plurality of projections from the diaphragm and the plurality of projections from the surface and produce an electrical signal in response thereto. The interaction may be detected substantially without inducing a force which tends to substantially displace the diaphragm, since the electrostatic force is substantially parallel to the diaphragm surface.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Abstract: A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a membrane material, in a sound transducing region and an edge region of the membrane. The counter electrode is made of counter electrode material, and includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. The plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.

Abstract: Apparatus, methods and computer program products are provided to produce tactile feedback from sound. The apparatus is a sound cavity apparatus for a portable communication device and includes: at least one loudspeaker; and at least one cavity. At least one surface of the at least one cavity is configured to vibrate. The sound cavity apparatus is attached to the portable communication device and the sound cavity apparatus is configured to transmit vibration to the portable communication device.

Abstract: A silicon based capacitive microphone includes a printed circuit board, a shell mounted on the printed circuit board and forming a receiving space together with the printed board, a chamber support located on top of the printed circuit board and received in the receiving space, a transducer unit and a controlling chip respectively mounted on the chamber support, wherein the chamber support forms a first chamber together with the printed board, the chamber support includes an opening, the transducer unit is provided with a second chamber and covers the opening, the second chamber communicates with the first chamber via the opening.

Abstract: There is provided a capacitor microphone comprising a capacitor transducer (KW), a high frequency bridge (HFB) coupled to the capacitor transducer (KW), a high frequency coil (HFS) coupled to the high frequency bridge (HFB), an HF transformer (HFT), a synchronous demodulator (SD), a low frequency output (NFA) and a high frequency stabilizer unit (SE). The high frequency stabilizer unit (SE) is coupled between the synchronous demodulator (SD) and the low frequency output (NFA) and serves to stabilize the HF voltage.

Abstract: A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes.

Abstract: A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.

Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

Abstract: A system and method for sensing acoustic sounds is provided having at least one directional sensor, each directional sensor including at least two compliant membranes for moving in reaction to an excitation acoustic signal and at least one compliant bridge. Each bridge is coupled to at least a respective first and second membrane of the at least two membranes for moving in response to movement of the membranes it is coupled to for causing movement of the first membrane to be related to movement of the second membrane when either of the first and second membranes moves in response to excitation by the excitation signal. The directional sensor is controllably rotated to locate a source of the excitation signal, including determining a turning angle based on a linear relationship between the directionality information and sound source position described in experimentally calibrated data.

Abstract: The present invention relates to a DC bias voltage circuit comprising a DC bias voltage generator adapted to supply a first DC voltage. A low-pass filter has an input operatively coupled to the first DC voltage to produce a second DC voltage at a low-pass filter output. The low-pass filter comprises an adjustable switched capacitor resistor setting a cut-off frequency of the low-pass filter and a controller is adapted to controlling a resistance of the adjustable switched capacitor resistor.

Abstract: An apparatus for generating electric energy comprises a vibration plate, a supporting board, at least one side-wall unit and at least one piezoelectric substrate having a first- and a second end surfaces covered with a first- and a second electrodes, respectively. They all together form at least one cavity resonator. If a sound pressure from the outside arrives at the vibration plate, an acoustic vibration is excited in the vibration plate, and thereby a resonance vibration is induced in the cavity resonator. In this time, the piezoelectric substrate responds collectively to the resonance vibration. Thus, a resonance energy occurred in the cavity resonator is converted into an electric energy, which is delivered through the first- and second electrodes.

Abstract: A condenser microphone includes a cylindrical microphone case having a condenser microphone unit therein; a microphone connector having an insulating base, one ground pin and two signal pins are embedded in the microphone connector; and a cylindrical connector sleeve fitted in the microphone case and accommodating the microphone connector therein, in which the connector sleeve has a concave-convex part on the outer peripheral surface thereof, the concave-convex part is in contact with the inner peripheral surface of the microphone case at a plurality of points after the connector sleeve is fixed into the end of the microphone case by fixing means, and thereby the connector sleeve is electrically conducted with the microphone case.

Abstract: A MEMS microphone has a stationary portion with a backplate having a plurality of apertures, and a diaphragm spaced from the backplate and having an outer periphery. As a condenser microphone, the diaphragm and backplate form a variable capacitor. The microphone also has a post extending between, and substantially permanently connected with, both the backplate and the diaphragm, and a set of springs securing the diaphragm to at least one of the post and the stationary portion. The post is positioned to be radially inward of the outer periphery of the diaphragm.

Abstract: A capacitive micromachined ultrasonic transducer (CMUT) includes a structured membrane which possesses improved frequency response characteristics. Some embodiments provide CMUTs which include a substrate, a first electrode, a second movable electrode, and a structured membrane. The movable second electrode is spaced apart from the first electrode and is coupled to the structured membrane. The structured membrane is shaped to possess a selected resonant frequency or an optimized frequency response. The structured membrane can include a plate and a beam coupled to the plate such that the resonant frequency of the structured membrane is greater than the resonant frequency of the plate. Furthermore, the ratio of the resonant frequency of the structured membrane over the mass of the structured membrane can be greater than the ratio of the resonant frequency of the plate over the mass of the plate. In some embodiments, the CMUT is an embedded spring ESCMUT.

Abstract: A microphone system includes a microphone and a control device external to the microphone. The microphone includes at least two capacitor capsules or one dual-sided capsule. The control device is capable of varying the polar pattern of the microphone over a two-conductor shielded cable or wirelessly. The microphone system may include an anti-rotational positioning mount for the microphone.

Abstract: There is provided a condenser microphone including a microphone capsule having a diaphragm and a capsule mounting, and a sound guide unit for guiding sound. The sound guide unit is provided at at least one side of the capsule mounting.

Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

Abstract: A microphone system including an audio sensor with a first electrode and a second electrode. A voltage source is coupled to the first electrode and the second electrode. A high-impedance bias network is coupled between the voltage source and the first electrode of the audio sensor. Additional electronics operate based on a state of the first electrode of the electromechanical device. A feedback system is configured to maintain an electrical potential across the high-impedance bias network at approximately zero volts. Maintaining the electrical potential across the high-impedance bias network at approximately zero volts reduces the tendency of electrostatic pull-in occurring.

Abstract: A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.

Abstract: Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.

Abstract: To provide a condenser microphone having a removable head unit on the microphone body, wherein the head unit can be attached and detached to and from the microphone body through one connection at a low impedance. A second pin 22h and a third pin 22c of a microphone body 20, which has a 3-pole output connector, is connected with current regulative diodes D2 and D3 as a feed circuit for the drain D of the FET Q1. A first AC coupling electrolytic capacitor C3 is connected to one of the current regulative diodes, D2, and a series circuit of a second AC coupling electrolytic capacitor C4 and a resistive element R3 is connected between the anode of the other current regulative diode D3 and a ground line L3. The resistive element R3 has substantially the same impedance as an output impedance of the transistor Q2.

Abstract: A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.

Abstract: A microphone system has a package with an interior, a MEMS microphone within the package interior and forming a backvolume between it and the package interior, and a MEMS valve coupled with at least one input aperture in the package. The package defines at least one input aperture (e.g., the prior noted aperture) for receiving an acoustic signal, and the MEMS microphone is mechanically coupled to at least a portion of one input aperture. The valve has a valve opening generally circumscribed by a valve seat. The valve is considered as having an open mode for permitting acoustic signal access into the package interior through the valve opening, and a closed mode for substantially preventing acoustic signal access into the package interior through the valve opening. The valve has a movable member configured to contact the valve seat when in the closed mode. This movable member is configured to move between the open mode and the closed mode in a direction that is generally perpendicular to the valve seat.

Abstract: A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance.

Abstract: A MEMS microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate.

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract: A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.

Abstract: The output connector for a condenser microphone has a circuit board mounted with a capacitor element and a shield cover having a first through hole, a second through hole, and a third through hole and covering the whole surface of the circuit board arranged in a state in which a first pin, a second pin, and a third pin are inserted through the first through hole, the second through hole, and the third through hole respectively, and the shield cover has a non-conducting magnetic sheet having a first insertion hole, a second insertion hole, and a third insertion hole through which the first pin, the second pin, and the third pin are also inserted respectively, on at least one of an outer surface and an inner surface of the shield cover.

Abstract: Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.

Abstract: An electret condenser microphoneelectret condenser microphone includes a capsule, diaphragm ring with attached diaphragm, back electrode plate having an electret-dielectric-film-coated surface facing the diaphragm, insulating spacer with space between the back electrode plate and the diaphragm, impedance converter, flexible printed circuit board in which a hollow cylinder, a flange projecting radially from an edge of the hollow cylinder on one end face facing the back electrode plate, and a rear plate blocking the other end face of the hollow cylinder are integrally formed, in which the impedance converter is placed on a surface of the rear plate facing the back electrode plate, and gate ring electrically connecting the back electrode plate to wiring on the flexible printed circuit board. An edge on an open side of the capsule bends inwardly to fit against the flange of the flexible printed circuit board.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract: A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided.

Abstract: A plurality of structures of condenser microphones is fabricated in a single condenser microphone array chip. The condenser microphone array chip includes a substrate having a plurality of openings serving as air cavities, a first insulating layer formed in the outer periphery of the openings, a first electrode layer stretched over each of the openings, a second insulating layer formed above the first electrode layer in the outer periphery of the openings, a second electrode layer formed above the second insulating layer relative to the first electrode layer via an air gap therebetween. The structures are connected via a plurality of bridges and separated via a plurality of channels therebetween. The channels circumvent the bridges so that at least the second insulating layer is partially removed from the channels. The bridges are formed using the second electrode layer serving as wiring for electrically connecting the structures of condenser microphones.

Abstract: An electret capacitor microphone with one-piece vocal cavity component includes: a shell, a vibration element and a circuit board which is used to envelop the shell containing cavity and connect with the shell; the first vocal cavity is formed between the vibration element and the inner surface of the top of the shell; voice holes are connected with the first vocal cavity; wherein, one-piece vocal component that lies between the vibration element and circuit board is installed in the shell. The one-piece vocal cavity component is formed by an annular sidewall and a cavity board formed in one-piece on the annular sidewall. A through-hole is formed on the cavity board and inner concave at lower end of an annular sidewall. The second vocal cavity is formed between the annular sidewall and the cavity board. An external surface of the annular sidewall is coated with an insulating material layer.

Abstract: There is provided a capacitive electro-acoustic transducer comprising an active diaphragm (20) and a first and a second diaphragm carrier (60). The active diaphragm (20) is accommodated between the first and second diaphragm carriers (60). The first and second diaphragm carriers (60) each have a respective flat electrode (30). The diaphragm carrier and the electrode are connected together in such a way that the diaphragm carrier projects beyond the electrode by a predetermined amount.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.

Abstract: Proximity sensor, particularly for usage in an electronic mobile device, comprising at least one acoustic transducer adapted for receiving acoustic signals at least in parts of the frequency range of human audible sound and emitting and/or receiving ultrasonic signals for proximity estimation. The acoustic transducer preferably is a Micro-Electro-Mechanical-Systems (MEMS) microphone. Further, a method in an electronic device comprising an acoustic transducer is provided comprising the steps of generating at least one electric signal in the frequency range of ultrasonic sound, emitting at least one ultrasonic signal by means of the acoustic transducer; receiving at least one ultrasonic signal by means of the acoustic transducer; deducing from the at least one emitted ultrasonic signal and the at least one received ultrasonic signal at least the delay between emission of the emitted ultrasonic signal and reception of the corresponding ultrasonic signal.

Abstract: An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.

Abstract: A MEMS microphone with a built-in textile material protecting screen comprises a microphone body having an opening thereat is arranged a textile material protecting screen which is built-in in the microphone body, during the production phase of the MEMS device called “packaging”.

Abstract: There is provided a condenser microphone in which even if strong electromagnetic waves are applied from a cellular phone or the like, the balance between a filter circuit for a No. 2 pin on the hot side and a filter circuit for a No. 3 pin on the cold side is maintained. The condenser microphone includes a printed wiring board 200 housed in a microphone casing and a three-pin type output connector, and is configured so that a No. 1 pin of the output connector is connected directly to the microphone casing and is connected to a ground electrode of the printed wiring board 200 via a high-frequency choke coil IL; on the printed wiring board, a first filter circuit 401 connected to the No. 2 pin on the hot side and a second filter circuit 501 connected to the No.