Abstract: A reliable flat speaker unit and a speaker device with the same are provided herein. A conductive electrode of a vibrating membrane of the speaker unit is disposed on both utmost sides of the speaker unit to isolate the speaker unit from environmental moisture, which can significantly improve the reliance of the speaker device. A barrier layer can optionally be disposed on the external side of the conductive electrode to further isolating the speaker unit from moisture, which can improve the reliance and the lifetime of the speaker device. In an embodiment, at least a getter is disposed inside the flat speaker unit to absorb moisture therein. The speaker unit at least includes a electret vibrating membrane with a conductive electrode, a plurality of supporting members, and a electrode structure with a plurality of holes.

Abstract: There is provided a condenser microphone that has improved portability and that can be realized at low costs.

Abstract: There is provided a condenser microphone of a type such that a microphone cable is directly drawn into a microphone casing, in which the electromagnetic shieldability of a microphone cable draw-in portion can be enhanced, and the microphone cable can be fixed easily.

Abstract: A capacitive electro-acoustic transducer includes a pair of input terminals, a pair of output terminals, an electrode plate, and a diaphragm. The pair of input terminals receives an audio signal, and the pair of output terminals outputs the audio signal, wherein at least one terminal of these terminals is a conductive magnet. The electrode plate has a first end and a second end electrically connected to a first input terminal of the pair of input terminals and a first output terminal of the pair of output terminals, respectively. The diaphragm is disposed on one side of the electrode plate and has a third end and a fourth end electrically connected to a second input terminal of the pair of input terminals and a second output terminal of the pair of output terminals, respectively.

Abstract: A vibrating electrode plate that senses a sound pressure faces a counter electrode plate to constitute a capacitance type acoustic sensor. In the counter electrode plate, acoustic perforations are opened in order to pass vibration, and plural projections are provided on a surface facing the vibrating electrode plate. An interval between the projections is decreased in a region where the vibrating electrode plate has high flexibility to easily generate local sticking with the counter electrode plate. The interval between the projections is increased in a region where the vibrating electrode plate has low flexibility to hardly generate local sticking with the counter electrode plate. The projections thus arranged prevent firm fixing of the vibrating electrode plate to the counter electrode plate and interruption of vibration of the vibrating electrode plate.

Abstract: A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.

Abstract: A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.

Abstract: An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.

Abstract: A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, a number of dielectric layers stacked on the substrate, a MEMS diaphragm, a number of supporting rings and a protective layer. The MEMS diaphragm is disposed between two adjacent dielectric layers. A first chamber is between the MEMS diaphragm and the substrate. The supporting rings are disposed in some dielectric layers and stacked with each other. An inner diameter of the lower supporting ring is greater than that of the upper supporting ring. The protective layer is disposed on the upmost supporting ring and covers the MEMS diaphragm. A second chamber is between the MEMS diaphragm and the protective layer. The protective layer defines a number of first through holes for exposing the MEMS diaphragm. The wafer level package of MEMS microphone has an advantage of low cost.

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

Abstract: The adsorption stability with respect to a fixed pole is increased while the low frequency response of a diaphragm is improved especially in an electret condenser microphone. In a diaphragm 11 for a condenser microphone, which is formed of a thermoplastic resin film having a metal film on one surface thereof, a first irregularity pattern 12 consisting of rough irregularities 12a having a long period and a second irregularity pattern 13 consisting of fine irregularities 13a having a short period are formed over the whole region of the diaphragm 11.

Abstract: A microelectromechanical system microphone package structure includes a base plate and a plurality of chips is provided. The plurality of chips are disposed on the base plate, wherein an active area of each of the chips is disposed with a microelectromechanical system microphone structure, each of the active areas comprises a normal line, and the normal lines of the chips are unparallel and nonorthogonal to each other.

Abstract: A microphone is formed to have a diaphragm that is configured to improve signal to noise ratio. To that end, the microphone has a backplate having a hole therethrough, and a diaphragm movably coupled with the backplate. The diaphragm has a bottom surface (facing the backplate) with a convex portion aligned with the hole in the backplate.

Abstract: A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.

Abstract: Measures for improving the acoustic properties of a microphone component produced in sacrificial layer technology. The micromechanical microphone structure of such a component is implemented in a layered structure, and includes at least one diaphragm, which is deflectable by sound pressure and which is implemented in a diaphragm layer, and a stationary acoustically permeable counterelement for the diaphragm which is implemented in a thick functional layer above the diaphragm layer and which is provided with through openings for introducing sound. The through openings for introducing sound are situated above the middle region of the diaphragm, while perforation openings which are largely acoustically passive are provided in the counterelement, above the edge region of the diaphragm.

Abstract: A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.

Abstract: This invention relates to a miniature silicon capacitive microphone having a perforated backplate supported on a substrate, a shallowly corrugated and perforated diaphragm that is suspended above said backplate and said suspended shallowly corrugated and perforated diaphragm is fully clamped and anchored on the said substrate at the edge of said diaphragm. Said perforated backplate is isolated electrically from said substrate by a layer of dielectric material. Said suspended shallowly corrugated diaphragm has a plurality of perforation holes to allow the passage of slow varying ambient pressure, and to equalize the barometric pressure in and out of the back cavity.

Abstract: The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

Abstract: Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.

Abstract: An electret condenser includes a fixed film 110 including a conductive film 118 to be an upper electrode, a vibrating film 112 including a lower electrode 104 and a silicon oxide film 105 to be an electret film, and a silicon oxide film 108 provided between the fixed film 110 and the vibrating film 112 and including an air gap 109. Respective parts of the fixed film 110 and the vibrating film 112 exposed in the air gap 109 are formed of silicon nitride films 106 and 114.

Abstract: A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.

Abstract: An acoustic sensing element has a substrate that includes a back chamber, a vibration electrode plate that is provided in a surface of the substrate while being opposite an upper surface opening of the back chamber, and a fixed electrode plate that is provided opposite the vibration electrode plate, an acoustic hole being made in the fixed electrode plate. The acoustic sensing element outputs an electric signal based on an electrostatic capacitance change generated between the vibration electrode plate and the fixed electrode plate by a displacement of the vibration electrode plate. A lower surface of the back chamber is closed into a pouched shape by the substrate.

Abstract: A condenser microphone includes multiple condenser microphone units. Each unit includes an impedance converter. The condenser microphone units are connected in series such that outputs of the impedance converter in one of the condenser microphone units drive another of the condenser microphone units. A polarization voltage is accumulated to a DC voltage supplied from a DC voltage supply through a voltage adjuster to be applied to one of a diaphragm and a fixed electrode, and a voltage applied to the one of the diaphragm and the fixed electrode is adjusted by the voltage adjuster.

Abstract: An integrated circuit configured to provide a microphone output signal, comprising: a preamplifier coupled to receive an input signal, generated by either a first microphone member or a second microphone member, where one of the members is movable relative to the other microphone member; a voltage pump to output a pumped voltage; and a low-pass filter coupled to filter the pumped voltage from the voltage pump and to provide a bias voltage to either microphone member.

Abstract: Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.

Abstract: To stably obtain high acoustic resistance required for pressure equalization in a non-directional condenser microphone unit. A diaphragm 8 whose circumferential edge is attached to a diaphragm holder 4 and a fixed electrode 6 made of a metal material and arranged to face the diaphragm at a predetermined interval through an electrically insulating spacer 5 are provided, and the rear space of the above-mentioned diaphragm is closed to constitute the non-directional condenser microphone unit. A blind groove 16a is formed by an etching process at a portion which is in contact with the spacer 5 and in the fixed electrode 6 so that the rear space between the diaphragm and the fixed electrode may communicate with the outside, and a communication part formed between the groove 16a and the spacer 5 may be used as acoustic resistance for pressure equalization.

Abstract: A MEMS microphone has a cover, a base and a MEMS chip. The cover has a contact voice receiving unit which is disposed on the base, and a space is formed between the cover and the base. The MEMS chip is disposed in the space and electrically connected to the base and the contact voice receiving unit. The MEMS microphone enhances the quality of voice transmission by reducing interferences from ambient noises.

Abstract: A compound membrane (100) for an acoustic device (200), the compound membrane (100) comprising a first layer (101) and a second layer (102), wherein a value of Young's modulus of the second layer (102) does not vary more than essentially 30% in a temperature range between essentially ?20° C. and essentially +85° C.

Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

Abstract: A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

Abstract: A method of forming a miniature, surface micromachined, differential microphone, comprising depositing a sacrificial layer on a surface of a silicon wafer; depositing a diaphragm material on a surface of the sacrificial layer; etching the diaphragm material layer to isolate a diaphragm; and removing a portion of the sacrificial layer beneath the defined diaphragm. A diaphragm formed in the diaphragm material layer is supported by a hinge and otherwise isolated from a remaining portion of the diaphragm material layer by a slit adjacent a perimeter of the diaphragm. An enclosed back volume beneath the diaphragm has a depth defined by a thickness of the sacrificial layer, and communicates with an external region via the slit. A transducer may be provided for producing an electrical signal responsive to a displacement of the diaphragm.

Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.

Abstract: Electro-acoustic converters each include a diaphragm, and a fixed electrode apart from the diaphragm for a certain distance and facing the diaphragm. The electro-acoustic converters are anteroposteriorly disposed on the same axis in a single casing, and are electrically connected in series. The front and rear converters each include impedance converters, and are serially connected with each other together with the impedance converters.

Abstract: The electroacoustic transducer according to the invention has at least one diaphragm and at least one counterelectrode. In that case the diaphragm and/or the counterelectrode each have at least two electrically mutually insulated segments. In that arrangement the segments are so adapted that different electric signals are supplied or that different electric signals are delivered in response to exposure to sound of the sound transducer.

Abstract: The invention relates to a condenser microphone element (10) with an electrically conducting transducer membrane (15) having an acoustically active area (20) that is arranged to receive sound waves and to vibrate in response to said sound waves, wherein the membrane (15) is arranged in parallel with and at a distance from a back plate (60), which is formed from a non conductive base (61), which is provided with a conductive layer (65). The conductive layer has an active area (66) that is arranged opposite the acoustically active area (20) of the membrane (15) and has a shape that faces said acoustically active area (20), and is delimited by an area where no conductive layer is provided. The invention further relates to a microphone and to a method of producing the microphone element (10).

Abstract: A microphone-capsule includes a vibrator implemented by a conductor having a flat vibration surface, a dielectric-polarization plate that is defined by a flat first principal surface facing the vibration surface of the vibrating plate and a second principal surface facing parallel to the first principal surface and in which polarization directions are aligned, a back electrode joined to the second principal surface of the dielectric-polarization plate, and an induced-charge measuring unit configured to measure the charges induced between the vibrating plate and the back electrode, in association with the displacement of the vibration surface. The induced-charge measuring unit includes an amplifier connected to the back electrode and an output circuit connected to the amplifier.

Abstract: A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a supporting member connected to the substrate, and a diaphragm isolated to the supporting member. The supporting member has a periphery portion and a plurality of stationary electrodes extending from the periphery portion to a center of the supporting member. The diaphragm has a vibrating member and a sustaining member connected to the vibrating member and the vibrating member defines a plurality of movable electrodes protruding from a periphery of the vibrating member. Each of the movable electrodes is located between two adjacent stationary electrodes and each of the stationary electrodes is located between two adjacent two movable electrodes.

Abstract: A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

Abstract: The present invention provides a MEMS device, be implemented on many MEMS device, such as MEMS microphone, MEMS speaker, MEMS accelerometer, MEMS gyroscope. The MEMS device includes a substrate. A dielectric structural layer is disposed over the substrate, wherein the dielectric structural layer has an opening to expose the substrate. A diaphragm layer is disposed over the dielectric structural layer, wherein the diaphragm layer covers the opening of the dielectric structural layer to form a chamber. A conductive electrode structure is adapted in the diaphragm layer and the substrate to store nonvolatile charges.

Abstract: To provide a condenser microphone having a removable head unit on the microphone body, wherein the head unit can be attached and detached to and from the microphone body through one connection at a low impedance. A second pin 22h and a third pin 22c of a microphone body 20, which has a 3-pole output connector, is connected with current regulative diodes D2 and D3 as a feed circuit for the drain D of the FET Q1. A first AC coupling electrolytic capacitor C3 is connected to one of the current regulative diodes, D2, and a series circuit of a second AC coupling electrolytic capacitor C4 and a resistive element R3 is connected between the anode of the other current regulative diode D3 and a ground line L3. The resistive element R3 has substantially the same impedance as an output impedance of the transistor Q2.

Abstract: A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a backplate connected to the substrate, a diaphragm facing to the backplate, and an anchor supporting the diaphragm. A first gap is formed between the diaphragm and the backplate. A groove is arranged on the anchor and the diaphragm partially covers the groove. The diaphragm and the groove forms a second gap communicating with the first gap.

Abstract: There is provided a condenser microphone unit in which the shield of a shielding member that covers a front acoustic terminal from the inside of a unit case is assured to prevent noise caused by electromagnetic waves radiated especially from a cellular phone from being generated. In a condenser microphone unit including a metallic cylindrical unit case 10 having a front acoustic terminal 11 on one end side; an electrostatic acousto-electric converter 20 housed in the unit case 10; and a shielding member 30 disposed between the acousto-electric converter 20 and the front acoustic terminal 11 to cover the front acoustic terminal 11 from the inside of the unit case 10, as the shielding member 30, there is used a shielding plate 32 consisting of a metallic porous plate integrally having a plurality of locking pieces 33, which dig into the inner wall surface of the unit case 10 on account of elastic deformation, in the peripheral edge part thereof.

Abstract: Provided is a method of manufacturing a capacitive electromechanical transducer, including: forming a lower electrode layer on a substrate; forming a sacrificial layer on the lower electrode layer; forming by application a resist layer on the sacrificial layer to form a cavity pattern; forming an insulating layer above regions including a region that contains the resist layer used to form the cavity pattern, and then removing a part of the insulating layer that is formed above the resist layer along with the resist layer, thereby leaving the insulating layer in the other regions than the region where the cavity pattern has been formed; forming a vibrating film above the region where the cavity pattern has been formed and the regions where the insulating layer remains; and removing the sacrificial layer to form a cavity.

Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.

Abstract: A micromechanical microphone device includes a membrane that is mounted in an elastically deflectable manner above a substrate and that has at least one gate electrode. The device further includes a source region and a drain region provided in or on the substrate with a channel region therebetween. The channel region is at least partly covered by the gate electrode and is spaced apart from the gate electrode by a gap. The membrane is deflectable under the influence of sound in such a way that the gap is variable.

Abstract: A miniature electret microphone includes a housing, a back plate/diaphragm assembly, an integrated circuit and a filter circuit. The housing for the microphone includes a sound inlet port. The back plate/diaphragm assembly is disposed within the housing and the assembly has an output responsive to sound pressure incident on the diaphragm. The integrated circuit includes a floating ground substrate and a p-n junction disposed within the housing coupled to the output. The filter circuit is formed within the integrated circuit, the filter circuit including a capacitor formed by the p-n junction.

Abstract: There is provided a unidirectional condenser microphone unit in which the shield performance of a rear acoustic terminal is assured by simple assembling work without an increase in cost.

Abstract: A microphone unit includes a substrate. The substrate includes a first face formed with a first recess, a second face opposite to the first face, and a through hole communicating the second face to a bottom part of the first recess. A diaphragm unit includes a diaphragm, and at least a part of which is disposed in the first recess so that the diaphragm opposes the through hole.

Abstract: A head of a condenser microphone includes: a condenser microphone unit; a housing supporting the condenser microphone unit; a first circuit board arranged adjacent to the condenser microphone unit in the housing; a second circuit board arranged remote from the condenser microphone unit and separated from the first circuit board in the housing; and a magnetic sheet arranged between and separated from the first circuit board and the second circuit board in the housing, the first circuit board including a circuit for processing an audio signal from the condenser microphone unit; the second circuit board including a DC-DC converter circuit unit for generating a polarization voltage to be applied to the condenser microphone unit.