Abstract: An exposure apparatus may include a first moving mechanism moving by driving a first drive source a first photomask; a second moving mechanism moving by driving a second drive source a second photomask; an imaging means for imaging a first alignment mark formed on the first photomask and a substrate side mark formed on the substrate and imaging a second alignment mark formed on the first photomask and a third alignment mark formed on the second photomask; and a control unit, wherein the control unit controls the first drive source so that alignment between the first alignment mark and the substrate side mark is performed based on results of imaging these marks, and the control unit controls the second drive source so that alignment between the second alignment mark and the third alignment mark is performed based on results of imaging these marks.

Abstract: Systems, methods, and computer media for determining the angle of a target object with respect to a device are provided herein. Target object information captured at approximately the same time by at least two cameras can be received. The target object information can comprise images or distances from the target object to the corresponding camera. An angle between the target object and the device can be determined based on the target object information. When the target object information includes images, the angle can be determined based on a correlation between two images. When the target object information includes distances from the target object to the corresponding camera, the angle can be calculated geometrically.

Abstract: A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a component by irradiating light to the component obliquely from below, and a second illuminating device, when the component adsorbed by the adsorbing nozzle and located in the imaging field of vision is a through hole component, only illuminate the downwards extending parts of the component by irradiating light at an irradiation angle closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating device to the component are included. That the component is illuminated by the first illuminating devices and that the component is illuminated by the second illuminating devices are switched based on whether the component is a surface mounted component or a through hole component.

Abstract: An information processing apparatus compares a first device model information of the information processing apparatus with second device model information stored in a nonvolatile memory unit being externally connected to the information processing apparatus, and compares first device identification information of the information processing apparatus with second device identification information stored into the nonvolatile memory unit based on detection of a boot-up. When the device model information comparison process is determined to be identical and when the device identification information comparison process is determined to be non-identical, the information processing apparatus reads out second BIOS setup value stored in the nonvolatile memory unit and replaces with the first BIOS setup value stored in the BIOS information memory unit.

Abstract: A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surface 5 of an object 3 at an object plane 15 relative to the camera and within the field of view of the camera and at least one surface portion 41 carrying a multitude of retroreflectors 95 disposed at a greater ?d distance from the camera than the object plane and within the field of view of the camera.

Abstract: In order to provide a computer program, an image processing device, and a pattern matching method that perform pattern matching at a high level of accuracy without relying on edge deformation, contrast fluctuations, etc., in one embodiment, the disclosed pattern matching method and device perform pattern matching over an image using a template produced on the basis of the below mentioned design data. The pattern matching method and device determine the characteristic quantities of the image for an inner region and/or an outer region that are divided by a line that defines the contour of a pattern, and determine positions at which said characteristic quantities satisfy predetermined conditions to be matching positions, matching position candidates, or erroneous matching positions.

Abstract: Performing sequencing of a polynucleotide. A first image of microparticles that are distributed in a random fashion on a substrate may be received. Each of the microparticles may include a plurality of similar oligonucleotides of the polynucleotide. A second image of the microparticles may be received. A plurality of first subportions of the first image may be determined. Each subportion may include a respective plurality of microparticles distributed in a random fashion. The second image may be analyzed to identify a plurality of second subportions in the second image. Each of the plurality of second subportions may correspond to a respective one of the plurality of first subportions. A plurality of the microparticles may be matched from the first and second images based on said analyzing. At least a portion of the sequence of nucleotides of the polynucleotide may be determined based on said matching.

Abstract: An improved position control means for robotic handling systems; particularly, a sensing system and method for precisely determining the center point of a substrate, such as a semiconductor wafer, relative to a destination point by using a set of multi pixel imaging sensors incorporated into the wafer carrying end effector of the robotic handling system.

Abstract: Disclosed herein is a framework for facilitating symmetry-based visualization. In accordance with one aspect of the framework, one or more medical images are received. The medical images include first and second regions, wherein the first region is substantially symmetric to the second region. A transformation is performed on at least the second region to generate a transformed second region. The transformed second region is registered with the first region to generate an aligned second region. The aligned second region and the first region are then alternately displayed to assist anomaly detection.

Abstract: A method and an apparatus are disclosed for detecting a structure to be applied to a substrate, such as an adhesive bead or a sealant track, with one or more optical acquisition apparatuses. The images from the optical acquisition apparatuses are combined to form a plan view such that a representation of the optical acquisition devices is output in a common image. The optical acquisition devices have, as a center, an application device for applying the structure to the substrate.

Abstract: A computer readable storage medium is provided, storing a computer-executable program for causing a computer to determine at least one of mask pattern and exposure condition of an exposure apparatus having an illumination optical system for illuminating a mask with light from a light source and a projection optical system for projecting the mask pattern onto a substrate. The program causes the computer to perform calculation of an image of a pattern on an object plane of the projection optical system using information about lateral shift of an image caused by the exposure apparatus, and determination of at least one of the exposure condition and the mask pattern based on a calculation result.

Abstract: A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

Abstract: In one aspect, in general, a measurement system includes a projector for illuminating a pattern on a surface of the object, at least two imaging devices for obtaining images of a portion of an object, wherein at least some of the images include representations of one or more illuminated reference markers, an instrument for identifying a predetermined feature of the object, and a computing device for determining first position information associated with the illuminated reference markers represented in the images, determining second position information associated with the instrument, and based on the first position information and the second position information, assigning a predetermined coordinate system of the object to the object.

Abstract: A method for a system to generate a recipe for performing wafer alignment, includes: generating first and second alignment data sets, the first alignment data set including image information regarding a first site on a wafer and coordinates of characteristic points at the first site, and the second alignment data set including image information regarding a second site different than the first site on the wafer and coordinates of characteristic points at the second site; and saving the generated first and second alignment data sets as a recipe for wafer alignment; wherein the generating of the first alignment data set includes: selecting, as the first site, a site including a characteristic pattern on the wafer; determining first and second characteristic points at the selected site; and recording coordinates of the determined first and second characteristic points.

Abstract: A wafer-slip detection apparatus used in association with a chemical mechanical polishing (CMP) apparatus may include an imaging device that generates images corresponding to at least an area of a rotation table of the CMP apparatus, and an image processing unit coupled to the imaging device for receiving and processing the generated images during a CMP process. The image processing unit includes a reference image that is compared with each of the generated images for detecting a wafer presence within the at least an area of the rotation table, whereby the detected wafer presence is indicative of a wafer-slip event.

Abstract: A method for determining the proper placement of an absorbent article on an undergarment is provided. The method includes receiving a still or video image of the absorbent article in the undergarment, determining a central axis, a longitudinal axis, and a central point for the undergarment, the absorbent article, and the stains. The distance between the absorbent article longitudinal axis and the stain longitudinal axis is determined. The distance between the absorbent article central axis and the stain central axis is determined. The absorbent article is adjusted on the undergarment according to the distances determined between the stain axis and the absorbent article axis so that the center point of the stain is less than about 20 mm from the center point of the absorbent article.

Abstract: A method for evaluating bandgap distributions of nanowires is provided. First, a plurality of nanowires located on a surface of a substrate is provided. Second, a metal electrode on the surface and electrically connected to the plurality of nanowires is provided. Third, a SEM image is taken on the plurality of nanowires and the metal electrode. Fourth, the bandgap distributions of the plurality of nanowires are evaluated through the SEM image.

Abstract: A method of using stereo vision to interface with a computer is provided. The method includes capturing a stereo image, and processing the stereo image to determine position information of an object in the stereo image. The object is controlled by a user. The method also includes communicating the position information to the computer to allow the user to interact with a computer application.

Abstract: An image processing system includes: an image acquiring unit that acquires a plurality of pieces of image data of an imaging target; a preprocessing device that performs specified preprocessing on the plurality of pieces of image data acquired by the image acquiring unit; and a control device that has a post-processing unit for extracting image data to be measured from the plurality of pieces of image data processed by the preprocessing device and performing a measurement process according to a measurement item by using the extracted image data, holds the preprocessing device to communicate with each other, and outputs a measurement result acquired by the measurement process performed by the post-processing unit.

Abstract: A pattern matching method for a scanning electron microscope comprises a step of performing pattern matching of only an upper layer pattern between an image (101) in which a pattern consisting of plural layers is represented and a template (104) in which the upper layer pattern of the plural layer pattern is selectively represented, thereby identifying the position of the pattern consisting of the plural layers. Then, information about the upper layer pattern is subtracted from the image (101), thus extracting shape information (108) about the lower layer pattern. Consequently, stable positioning or selective information extraction on a certain layer is enabled regardless of the state of the depths of a pattern formed in three dimensions or of the charge state of a sample.

Abstract: A system uses range and Doppler velocity measurements from a lidar system and images from a video system to estimate a six degree-of-freedom trajectory (6DOF) of a target. The 6DOF transformation parameters are used to transform multiple images to the frame time of a selected image, thus obtaining multiple images at the same frame time. These multiple images may be used to increase a resolution of the image at each frame time, obtaining the collection of the superresolution images.

Abstract: A machine vision inspection system comprises an optical portion providing an image of a field of view of a workpiece which may be a magnified image. A first camera and a second camera provide first and second images of a shared or common field of view of the workpiece and are arranged such that the orientation of the common field of view imaged in the first camera is rotated relative to the orientation of the common field of view imaged in the second camera. Signal processing provides an edge measurement of an edge feature within the common field of view and determines which of the first and second images is used as a basis for the edge measurement based on whether their respective edge orientation (with respect to the pixel array of each camera) differs from the pixel array orientation of their associated camera by an orientation difference threshold amount.

Abstract: Methods are presented for improved detection of persistent or systematic defects induced during the manufacture of a product. In particular, the methods are directed to the detection of defects induced systematically in the manufacture of photovoltaic cells and modules. Images acquired from a number of samples are combined, enhancing the systematic defects and suppressing random features such as variations in material quality. Once a systematic defect is identified, steps can be taken to locate and rectify its cause.

Abstract: Inputs of a plurality of images constituting a group of images of items regarded as non-defective items are accepted and stored, and a defect threshold for detecting a defective portion of an inspection object and a determination threshold for making a non-defective/defective determination are set based on the plurality of stored images. A defective item image which is an image of an item determined as a defective item is previously stored and when an input of an image newly acquired by capturing an inspection object is accepted, non-defective item learning processing is performed by use of a plurality of stored images including the image whose input has been accepted, to at least reset the defect threshold. A defective portion is re-detected based on the reset defect threshold, to determine whether or not the stored defective item image is an image of a defective item based on the set determination threshold.

Abstract: The present invention relates to the acquisition of tilted series images of a minute sample in a short time. The present invention relates to: measuring in advance the relation between an amount of focus shift and a degree of coincidence at the time of acquiring tilted series images; calculating backwards a focus shift from the degree of coincidence on the basis of this relation; correcting the focus shift by controlling a stage, an objective lens, and the like; and thus acquiring the tilted series images. In addition, the present invention relates to: acquiring a reference image in advance at the time of photographing the tilted series images; obtaining the correlation between an acquired image and the reference image; and performing, if the degree of coincidence is equal to or smaller than a set value, processing such as the transmission of a warning message and the stop of an image acquisition sequence.

Abstract: A method of measuring an overlay of an object is provided. In the method, first information of a first structure may be obtained. A preliminary structure may be formed on the first structure. Second information of the preliminary structure may be obtained. The first information and the second information may be processed to obtain virtual information of a second structure that would be formed on the first structure if a process is performed on the preliminary structure. A virtual overlay between the first structure and the second structure may be measured using the virtual information.

Abstract: A method for inspecting overlay shift defect during semiconductor manufacturing is disclosed herein and includes a step for providing a charged particle microscopic image of a sample, a step for identifying an inspection pattern measure in the charged particle microscopic image, a step for averaging the charged particle microscopic image by using the inspection pattern measure to form an averaged inspection pattern measure, a step for estimating an average width from the averaged inspection pattern measure, and a step for comparing the average width with a predefined threshold value to determine the presence of the overlay shift defect.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.

Abstract: There is provided a method comprising: examining the location of one or more feature(s) of the one or more component(s) of a circuit arrangement to determine the displacement of the location of said one or more associated communication contact(s) with respect to a designed location for the communication contact(s), and providing corrective communication path layout data of said circuit arrangement based upon the said displacement(s).

Abstract: An alignment system for permanently marking a workpiece with a marking device includes a camera, a display operatively connected to the camera and configured to generate an image as a function of camera input, a template having a marking area designation located in relation to the display such that the image is displayed against the marking area designation, and an adjustment table configured to allow controllable repositioning of the workpiece relative to the marking device.

Abstract: A method for positioning electronic devices into compartments of an input medium is disclosed. At least one electronic device is packable in a single compartment of the input medium. Known positions on an upper side of the input medium are imaged by an inspection device. Actual position data of the compartments of the input medium are calculated on the basis of images of the known positions, given target position data of the known positions, and given target position data of the compartments of the input medium. A pick and place device for the electronic devices is controlled on the basis of the calculated actual position data of the compartments of the input medium. A method for determining the actual positions of compartments of an output medium is disclosed with analogous steps, whereby the electronic devices are picked-up from compartments of the input medium, transferred to compartments of the output medium, and placed into the compartments of the output medium.

Abstract: An image evaluation device includes: a partial area extracting section extracting plural partial areas from an original image; an extracted image generating section generating an extracted image corresponding to each of the partial areas and having pixels whose pixel values correspond to a gradient of pixel values in the image; an autocorrelation calculating section calculating plural autocorrelation coefficients for each extracted images; a representative coefficient value calculating section calculating a representative coefficient value for each of the autocorrelation coefficients among the partial areas; and a checking section checking the quality of the image based on a distribution of the representative coefficient values.

Abstract: A failure analysis apparatus 1A is provided with a voltage applying unit 14 for applying a bias voltage to a semiconductor device S, an imaging device 18 for acquiring an image, and an image processing unit 30 for performing image processing, and the imaging device 18 acquires a plurality of analysis images each including a thermal image in a voltage applied state and a plurality of background images in a voltage non-applied state. The image processing unit 30 includes an imaging position calculating section 32 for calculating an imaging position of each of the analysis images and the background images, an image classifying section 33 for classifying the analysis images and the background images into N image groups based on a region division unit prepared for the imaging position, and a difference image generating section 34 for generating difference images between the analysis images and the background images individually for N image groups.

Abstract: According to the pattern shape determining method of the embodiment, a first reference position of a pattern shape is set on a first pattern and a second reference position of a pattern shape is set on a second pattern. Moreover, an allowable dimensional difference between the first pattern and the second pattern is set to a value corresponding to a distance from the first reference position. Then, it is determined whether the second pattern has a pattern shape identical with the first pattern, based on whether a dimensional difference between the first pattern and the second pattern is within a range of an allowable dimensional difference set at a position at which the dimensional difference is calculated.

Abstract: An image comprising varying illumination is selected. Instances of a repeating pattern in the image is determined. Illumination values for pixels at locations within instances of the repeating pattern are calculated responsive to pixel intensities of pixels at corresponding locations in other instances of the repeating pattern. The varying illumination is removed form the image responsive to the illumination values.

Abstract: A method is disclosed for correcting errors introduced by optical distortions or aberrations in the measured values of coordinates of targets of an array of targets, like for example structures on a wafer or a photolithography mask. The array of targets is placed into a field of view of an imaging system via which the coordinates are to be measured. The array of targets is placed at different relative positions with respect to the field of view, and for each relative position the coordinates of the targets relative to the array of targets are determined by measurements. From the results of these measurements an alignment function, giving a correction for optical errors as a function of the position in the field of view, is derived. The measured coordinates are corrected by the alignment function. The corrected coordinates can be used to identify registration errors of a mask writer.

Abstract: A platelike workpiece having an alignment mark formed on the front side thereof and adapted to be recognized by an imaging unit included in an alignment apparatus for performing alignment. The platelike workpiece includes a plurality of direction indicating marks formed at given intervals so as to surround the alignment mark. Each of the direction indicating marks is pointed toward the alignment mark. The space of the direction indicating marks is set so that at least two of the plural direction indicating marks fall in the visual field of the imaging unit in viewing the platelike workpiece from the imaging unit.

Abstract: A target space ratio of a monitor pattern on a substrate for inspection is determined to be different from a ratio of 1:1. A range of space ratios in a library is determined to include the target space ratio and not include a space ratio of 1:1. The monitor pattern is formed on a film to be processed by performing predetermined processes on the substrate for inspection. Sizes of the monitor pattern are measured. The sizes of the monitor pattern are converted into sizes of a pattern of the film to be processed having a space ratio of 1:1, and processing conditions of the predetermined processes are compensated for based on the sizes of the converted pattern of the film to be processed. After that, the predetermined processes are performed on a wafer under the compensated conditions to form a pattern having a space ratio of 1:1 on the film to be processed.

Abstract: A method of discriminating a region and a method of measuring a three dimensional shape are disclosed. The method includes irradiating light onto a substrate having a measurement target formed thereon to capture an image by receiving light reflected by the substrate, setting up an object region in which the measurement target is disposed and a ground region corresponding to a remaining region in an inspection region of the image, irradiating a grating patterned light onto the substrate having the measurement target formed thereon to capture a patterned image by receiving the grating patterned light reflected by the substrate, and obtaining height of each position in the inspection region by using the patterned image to establish a ground height with respect to the measurement target with a height of the ground region.

Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.

Abstract: A technique for determining a set of calibration parameters for use in a model of a photo-lithographic process is described. In this calibration technique, images of a test pattern that was produced using the photo-lithographic process are used to determine corresponding sets of calibration parameters. These images are associated with at least three different focal planes in an optical system, such as a photo-lithographic system that implements the photo-lithographic process. Moreover, an interpolation function is determined using the sets of calibration parameters. This interpolation function can be used to determine calibration parameters at an arbitrary focal plane in the photo-lithographic system for use in simulations of the photolithographic process, where the set of calibration parameters are used in a set of transmission cross coefficients in the model of the photo-lithographic process.

Abstract: In a method for aligning a part of a product (moving object) with a reference object, triangle data of the moving object is acquired, and feature elements of the moving object is fitted according to the triangle data. Feature elements of the reference object which match the feature elements of the moving object are determined, and the moving object is moved from a position of a center point of the feature elements of the moving object to a position of a center point of the matched feature elements of the reference object. A moving-and-rotating matrix of the moving object is obtained according to Quasi-Newton methods, and the moving object and the reference object are aligned by moving and rotating the moving object according to the moving-and-rotating matrix.

Abstract: A method of determining overlay error in semiconductor device fabrication includes receiving an image of an overlay mark formed on a substrate. The received image is separated into a first image and a second image, where the first image includes representations of features formed on a first layer of the substrate and the second image includes representations of the features formed on a second layer of the substrate. A quality indicator is determined for the first image and a quality indicator is determined for the second image. In an embodiment, the quality indicators include asymmetry indexes.

Abstract: Systems, including apparatus and methods, for obtaining and/or correcting images, particularly from atmospheric and/or other distortions. These corrections may involve, among others, collecting two or more sets of image data corresponding to images of the same scene in different wavelength regimes, and using correlations between wavelength and expected distortion to distinguish apparent image motion due to distortion from apparent image motion due to object or scene motion. These systems may be useful in any suitable imaging context, including navigation, targeting, search and rescue, law enforcement, commercial video cameras and/or surveillance, among others.

Abstract: A method of measuring creep strain in a gas turbine engine component, where at least a portion of the component has a material disposed thereon, and where the material has a plurality of markings providing a visually distinct pattern. The method may include capturing an image of at least a portion of the markings after an operational period of the gas turbine engine, and determining creep strain information of the component. The creep strain information may be determined by correlating the image captured after the operational period to an image captured before the operational period.

Abstract: Three-dimensional (3-D) spatial image data may be received that is associated with at least one arm motion of an actor based on free-form movements of at least one hand of the actor, based on natural gesture motions of the at least one hand. A plurality of sequential 3-D spatial representations that each include 3-D spatial map data corresponding to a 3-D posture and position of the hand at sequential instances of time during the free-form movements may be determined, based on the received 3-D spatial image data. An integrated 3-D model may be generated, via a spatial object processor, based on incrementally integrating the 3-D spatial map data included in the determined sequential 3-D spatial representations and comparing a threshold time value with model time values indicating numbers of instances of time spent by the hand occupying a plurality of 3-D spatial regions during the free-form movements.

Abstract: A method to determine a fiducial point for holographic data storage is disclosed, which utilizes a gray-level frame to sequentially retrieve a regional image used as a retrieved image with the size equal to that of the frame from a received gray-level image. The gray-level frame is compared with each retrieved image to obtain a plurality of values and construct a 2D proto-matrix. The 2D proto-matrix is transformed into a 2D matrix via letting the values smaller than 0 be 0. The 2D matrix and a retrieving matrix, which has a dimensionality equal to or smaller than that of the frame, are used to obtain an anchor matrix. A greatest value in the central region of the 2D matrix is found to function as an anchor value according to the anchor matrix, thereby find a fiducial point in the gray-level image.

Abstract: A computerized method of creating an irregular-shaped table of cells comprises detecting one or more cells of a table to be removed, removing each detected cell from the table and creating a table object representing the resultant irregular-shaped table.

Abstract: The present disclosure relates to acquiring image data of a subject with an imaging system that has been calibrated. The imaging system can include an ultrasound imaging system that collects one of more images based on a plane of image acquisition. The plane of image acquisition can be calibrated to a tracking device associated with the ultrasound transducer.