Abstract: An object is highly precisely moved by an industrial robot to an end position by the following steps, which are repeated until the end position is reached within a specified tolerance: Recording a three-dimensional image by means of a 3-D image recording device. Determining the present position of the object in the spatial coordinate system from the position of the 3-D image recording device the angular orientation of the 3-D image recording device detected by an angle measuring unit, the three-dimensional image, and the knowledge of features on the object. Calculating the position difference between the present position of the object and the end position. Calculating a new target position of the industrial robot while taking into consideration the compensation value from the present position of the industrial robot and a value linked to the position difference. Moving the industrial robot to the new target position.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Abstract: The application relates to a method of inspecting an object and an inspection apparatus. The object has a plurality of features and the method includes the step of identifying a current primary feature on the object. Once the current primary feature has been selected, one or more additional features are selected, each of the one or more additional features selected having at least one common attribute with the current primary feature. The method also includes the step of capturing an image of the selected features on an image capture module.

Abstract: In one embodiment, a semiconductor target for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate is disclosed. The target comprises at least a plurality of first structures that are invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures and a plurality of second structures that are invariant for a plurality of second rotation angles with respect to a second COS of the second structures. The first rotation angles differ from the second rotation angles, and first structures and second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate.

Abstract: An alignment system for aligning a wafer when lithographically fabricating LEDs having an LED wavelength ?LED is disclosed. The system includes the wafer. The wafer has a roughened alignment mark with a root-mean-square (RMS) surface roughness ?S. The system has a lens configured to superimpose an image of the reticle alignment mark with an image of the roughened alignment mark. The roughened alignment marked image is formed with alignment light having a wavelength ?A that is in the range from about 2?S to about 8?S. An image sensor detects the superimposed image. An image processing unit processes the detected superimposed image to measure an alignment offset between the wafer and the reticle.

Abstract: In a genome sequencing system and methodology, a protocol is provided to achieve precise alignment and accurate registration of an image of a planar array of nanoballs subject to optical analysis. Precise alignment correcting for fractional offsets is achieved by correcting for errors in subperiod x-y offset, scale and rotation by use of minimization techniques and Moiré averaging. In Moiré averaging, magnification is intentionally set so that the pixel period of the imaging element is a noninteger multiple of the site period. Accurate registration is achieved by providing for pre-defined pseudo-random sets of sites, herein deletion or reserved sites, where nanoballs are prevented from attachment to the substrate so that the sites of the array can be used in a pattern matching scheme as registration markers for absolute location identification.

Abstract: A method for inspecting surfaces including acquiring a surface image from a surface of a component; providing an image registration for the surface image; inspecting the component in response to the image registration to produce an input data set; creating an output data set in response to the input data set utilizing a fuzzy logic algorithm; and identifying a surface feature in response to the surface image and the output data set where acquiring the surface image further includes generating a radiation media; directing the radiation media at the component; detecting a responding radiation media in response to the directed radiation media and the component; creating the surface image in response to detecting the responding radiation media; and adjusting the generation of the radiation media in response to the surface image and a standard image.

Abstract: An image taking system including: (a) a lighting device capable of changing a light emission time to various time length values; (b) an image taking device configured to take an image of a subject portion while light is being emitted by the lighting device; (c) a subject-portion moving device configured to move the subject portion relative to the image taking device, and capable of changing a movement velocity of the subject portion relative to the image taking device, to various velocity values; and (d) a control device configured, during movement of the subject portion by the subject-portion moving device, to cause the lighting device to emit the light for one of the time length values as the light emission time and to cause the image taking device to take the image, and is configured to control the movement velocity, such that an amount of the movement of the subject portion for the above-described one of the time length values is not larger than a predetermined movement amount.

Abstract: A method of identifying individual silicon substrates, and particularly solar cells, is disclosed. Every solar cell possesses a unique set of optical properties. The method identifies these properties and stores them in a database, where they can be associated to a particular solar cell. Unlike conventional tracking techniques, the present method requires no dedicated space on the surface of the silicon substrate. This method allows substrates to be tracked through the manufacturing process, as well as throughout the life of the substrate.

Abstract: A method of determining a coordinate transform between a first image and a second image, said method comprising the steps of: determining a rate of change of pixel values for locations on the first image to identify candidate alignment patches in the first image; specifying subsets of patches from the set of candidate alignment patches based on an error metric, selecting a subset of candidate alignment patches from said plurality of subsets of candidate alignment patches based upon a predetermined criterion; estimating, for each patch in the selected subset, a shift between the patch and a corresponding patch in the second image, the location of the corresponding patch in the second image being determined from the location of the patch in the first image; and determining the coordinate transform between the first image and second image based on the estimated shifts.

Abstract: The high magnification, high resolution and real-time property of an SEM image are realized when the electrical characteristics of an inspection object are measured, without affecting the electrical characteristics of the inspection object. A high-quality, high-magnification first image including an image of a target position in the inspection object on a sample is acquired. Next, a low-quality, low-magnification second image including the image of the target position in the inspection object on the sample and probe images is acquired. Next, data on the first image is built into the second image to generate an image for coarse-access observation which is the same in magnification as the second image. The generation of the image for coarse-access observation is repeated until a probe comes close to the target position in the inspection object.

Abstract: A method of performing inspection alignment point selection for semiconductor devices includes importing, with a computer device, one or more semiconductor design files corresponding to an area of a semiconductor die; aligning a design taken from the one or more semiconductor design files with an image taken from a die of a semiconductor wafer; and selecting an alignment point and recording a portion of the design file corresponding to the alignment point as a master reference image.

Abstract: A mask overlay method, and a mask and a semiconductor device using the same are disclosed. According to the disclosed mask overlay technique, test marks and front layer overlay marks corresponding to a plurality of overlay mark designs are generated in a first layer of a semiconductor device. The test patterns generating the test marks each include a first sub pattern and a second sub pattern. Note that the first sub pattern has the same design as a front layer overlay pattern (which generates the front layer overlay mark corresponding thereto). Based on the test marks, performances of the plurality of overlay mark designs are graded. The front layer overlay mark corresponding to the overlay mark design having the best performance is regarded as an overlay reference for a mask of a second layer of the semiconductor device.

Abstract: An alignment unit control apparatus according to the present invention includes: an imaging section configured to control cameras to image a plurality of regions on a surface of a substrate to generate a plurality of images; a region detecting section configured to select a detection region from the plurality of regions based on the plurality of images; and an aligning section configured to align the substrate based on an alignment image obtained by imaging a mark of the substrate in the detection region by one of the plurality of cameras. For this reason, the alignment unit control apparatus does not need to have another mechanism for the purpose of positioning the mark for alignment in the field of vision of the camera, and can more easily be manufactured, and a region of an alignment mark can be detected more easily.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.

Abstract: An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.

Abstract: Systems, methods and computer program products for computerized evaluation of a semiconductor wafer fabrication process are described. An exemplary method comprises receiving an SEM image of a printed semiconductor wafer area and a reference image reflecting a circuit design pattern, enhancing the SEM image to produce a feature image, and comparing the feature image to the reference image to determine whether the positions of the images are the same. Based upon this analysis, evaluation of the fabrication process used to print the circuit on the SEM image can be conducted in an efficient and uniform manner.

Abstract: A method for comparator based quantization acceleration for an encoding process. The method includes computing coefficients for a discrete cosine transform encoding operation and determining a quantization step for use with a quantization operation for each of the coefficients. The method further includes determining each of the coefficients that are less than or equal to one half the quantization step by using a comparator configured in accordance with the quantization step. For the coefficients that are less than or equal to one half the quantization step, a quantized output value is transmitted to the encoding process. For the coefficients that are greater than one half the quantization step, the quantized output value is determined by executing multiplication logic to compute the quantized output value and transmit the computed quantized output value to the encoding process.

Abstract: A computer-readable recording medium has stored therein an image processing program for causing a computer to execute a process including identifying, on a taken image of a jig having a plurality of first color regions and a plurality of second color regions different in color from the first color regions, the first color regions, comparing each of the identified first color regions with a predetermined convex shape and retracting each of the first color regions until it is determined that each of the first color regions has a similarity in shape to the predetermined convex shape, and determining a feature point of the jig on the image on the basis of a positional relationship of a plurality of first retracted regions on the image, the first retracted regions being obtained from the first color regions as a result of retraction at the retracting.

Abstract: A mask inspection apparatus includes irradiation means for irradiating a sample with an electron beam, electron detection means for detecting a quantity of electrons generated from the sample having a pattern formed thereon by the irradiation with the electron beam, image processing means for generating image data of the pattern on the basis of the quantity of the electrons, and control means for creating a line profile and a differential profile of the pattern formed on the sample on the basis of the quantity of the electrons detected by the electron detection means. The control means detects a rising edge and a falling edge of the pattern on the basis of the differential profile, and then generates mask data of a multi-level structure on the basis of data of the edges and the image data created by the image processing means.

Abstract: Systems, articles of manufacture, and methods for template matching at least one template image and an image to be searched using a plurality of template matchers at at least one alignment shift.

Abstract: Method for validating a single waveform or series of waveforms that are intended for evaluating signals within an automated testing environment. Test signal data is supplied by an external source. The method creates a golden template from a known, good instance of the waveform under test and algorithmically applies it to other waveforms under test to determine compliance. In the application to video waveforms, timing parameters, deflection parameters and image content parameters are simultaneously tested resulting in efficient concrete and tangible results. Instead of providing the known, good instance of the waveform under test to a processor that implements the method, descriptive parameters of the known, good instance of the waveform may be provided to the processor that calculates data points of the expected video waveforms and then determines rules for the waveform based on the calculated data points.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: A method for performing color registration on template media having template markings thereon comprises sensing the template media using a sensor to obtain first image data; printing a test pattern on the template media; sensing the template media along with the test pattern printed thereon using the sensor to obtain second image data; determining an output image data of the test pattern from the first image data, the second image data, and an estimated image data of the template media with the test pattern printed thereon; determining process direction and cross-process direction misregistrations from the output image data; and adjusting printheads based on the process direction and the cross-process direction misregistrations to provide adjusted color registration on subsequent template media. The estimated image data is representative of light scatter from the test pattern and light absorption by the test pattern.

Abstract: A line scan imager is used to determine the motion of a subject. Each line of image data from the line scan imager is compared with a reference image. The location of a matching line in the reference image reveals the displacement of the subject. The current subject displacement can be determined based on each line of image data. The resulting displacement information can be used to correctly place other optical beams on the subject. The method can be applied to tracking the human eye to facilitate measurement, imaging, or treatment with a beam of optical radiation.

Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.

Abstract: A gesture detection device detects a gesture of a user, which is a movement which is carried out by a hand or by both hands of the user on an existing example of the work piece, or on an image of an existing example of the work piece. An identification device identifies the gesture as a predefined gesture, which represents a symbol. A selection device selects a measurement result in dependence on the identified gesture. The measurement result can then be displayed or marked.

Abstract: In a pose estimation for estimating the pose of an object of pose estimation with respect to a reference surface that serves as a reference for estimating a pose, a data processing device: extracts pose parameters from a binarized image; identifies a combination of pose parameters for which the number of cross surfaces of parameter surfaces that accord with surface parameter formulas, which are numerical formulas for expressing a reference surface, is a maximum; finds a slope weighting for each of cross pixels, which are pixels on each candidate surface and which are pixels within a prescribed range, that is identified based on the angles of the tangent plane at the cross pixel and based on planes formed by each of the axes of parameter space; and identifies the significant candidate surface for which a number, which is the sum of slope weightings, is a maximum, as the actual surface that is the reference surface that actually exists in the image.

Abstract: It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.

Abstract: A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.

Abstract: A method of using stereo vision to interface with a computer is provided. The method includes capturing a stereo image, and processing the stereo image to determine position information of an object in the stereo image. The object is controlled by a user. The method also includes communicating the position information to the computer to allow the user to interact with a computer application.

Abstract: An apparatus for the detection of a geometrical position of plastics material containers, for example, plastics material pre-forms, having a base member and a thread region may include an image-recording device, which records a locally resolved image of the plastics material container. The image-recording device is arranged in such a way that it observes the plastics material container substantially along its longitudinal direction. The apparatus includes an illumination device, which illuminates at least one region of the plastics material container observed by the image-recording device, and an evaluation device, which on the basis of an image recorded by the image-recording device determines a rotary setting of the plastics material container with respect to its longitudinal direction.

Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

Abstract: A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.

Abstract: A correlation image detection method is provided that co-registers sonar images by finding peaks in correlation images. To obtain the peaks, the mean of the absolute values of the correlation coefficients in the correlation image is found and the Rayleigh parameter is determined from the mean. Based on the Rayleigh parameter, an appropriate threshold can be determined using a desired probability of false detection. The threshold can be chosen such that the probability of a single false detection over the expected life of the mission for which correlation detection is being performed is extremely low. The peak value in the image is determined and a correlation is considered detected when the peak value is greater than the product of the threshold and the Rayleigh parameter. If a detection occurs, the correlation image detector returns the transformation that co-registers the two images.

Abstract: Provided is an apparatus that includes an overlay mark. The overlay mark includes a first portion that includes a plurality of first features. Each of the first features have a first dimension measured in a first direction and a second dimension measured in a second direction that is approximately perpendicular to the first direction. The second dimension is greater than the first dimension. The overlay mark also includes a second portion that includes a plurality of second features. Each of the second features have a third dimension measured in the first direction and a fourth dimension measured in the second direction. The fourth dimension is less than the third dimension. At least one of the second features is partially surrounded by the plurality of first features in both the first and second directions.

Abstract: An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.

Abstract: A de-skew method of an image forming apparatus is provided which includes reading an image on a print medium fed through an automatic document feeder (ADF); detecting a leading edge of the print medium and calculating a skew angle of the read image; comparing the calculated skew angle to a first threshold and determining whether to perform a de-skew operation; and setting skew compensation levels based on the calculated skew angle and performing different de-skew operations according to the set skew compensation levels to output a de-skewed image when the absolute value of the calculated skew angle is equal to or greater than the first threshold.

Abstract: A light irradiation apparatus capable of irradiating, while a component having a first side is held on the first side by a holding body of a component mounting apparatus, light onto a reflective plate to irradiate reflected light from the reflective plate from the first side of the component, the light irradiation apparatus including: a plurality of first light-emitting devices; a supporting body configured to support the plurality of first light-emitting devices such that optical-axis directions of the plurality of first light-emitting devices match; and a light guide body configured to guide light emitted from the plurality of first light-emitting devices to the reflective plate so that the reflected light is detected by a detector from a second side of the component on the other side of the first side.

Abstract: According to an aspect of an embodiment, a method of detecting boundary line information contained in image information comprising a plurality of pixels in either one of first and second states, comprising: detecting a first group of pixels in the first state disposed continuously in said image information to determine first line information and detecting a second group of pixels in the first state disposed adjacently with each other and surrounded by pixels in the second state to determine edge information based on the contour of the second group of pixels; and determining the boundary line information on the basis of the information of the relation of relative position of the line information and the edge information and the size of the first and second group of pixels.

Abstract: A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.

Abstract: An apparatus is provided for guiding a vehicle onto a service lift having a pair of runways for receiving the wheels of the vehicle. In one embodiment, a machine vision wheel alignment system including an image sensor, a processor, and a display provides a visual display of the vehicle and the runways to guide an operator of the vehicle to drive the vehicle wheels onto the runways. In other embodiments, a pair of runway targets and a vehicle target are viewed by a pair of image sensors of a machine vision wheel alignment system. Image signals from the image sensors are processed to determine respective positions of the runways and to monitor a position of the vehicle relative to the runways, and a visual reference is displayed to guide an operator of the vehicle.

Abstract: A method, system and a computer program product for evaluating contact elements, the method includes: acquiring images of multiple groups of contact elements, wherein each group of contact element was expected to be contacted during a test by the same group of probes so as to form multiple probe marks; and evaluating at least one characteristic of a first contact element in response to a comparison between a number of potential probe marks that appear in the image of a first contact element and a number of potential probe marks that appear in an image of a second contact element.

Abstract: An intra-oral imaging apparatus having an illumination field generator that forms an illumination beam having a contour fringe projection pattern when receiving light from a first light source and having a substantially uniform illumination field when receiving light from a second light source. A polarizer in the path of the illumination beam has a first polarization transmission axis. A projection lens directs the polarized illumination beam toward a tooth surface and an imaging lens directs at least a portion of the light from the tooth surface along a detection path. A polarization-selective element disposed along the detection path has a second polarization transmission axis. At least one detector obtains image data from the light provided through the polarization-selective element. A control logic processor responds to programmed instructions for alternately energizing the first and second light sources in a sequence and obtaining both contour fringe projection data and color image data.

Abstract: According to one embodiment, an alignment method includes setting a local area from an alignment target area, the local area being an execution target area of local alignment to be performed with precision equal to or higher than required alignment precision; performing the local alignment between a pattern image of an examination target and a reference pattern image of an examination reference, in the local area, to obtain a shift amount that is a result of local alignment; and shifting a whole of the reference pattern image by using the shift amount.

Abstract: A method of determining a focus parameter for aligning a water in an exposure tool within a measurement tolerance required for the exposure tool, the exposure tool using a lens system for alignment. A test chart is provided having a sharp auto-correlation associated with the wafer. An image of the test chart is captured using a lens pupil mask having at least two phase ramps that are non-parallel. The captured image of the test charge is auto-correlated to determine the position of the test chart relative to a focal position of the lens system. The focus parameter for alignment of the wafer is determined using the determined position of the test chart, whereby the focus parameter is determined within the measurement tolerance required by the exposure tool.

Abstract: When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.

Abstract: Disclosed is an alignment system comprising: an upper reflector to couple to an end effecter and a camera kit to couple to a fixture. The camera kit includes: a plurality of light sources; a camera; and a lower reflector including a camera opening and a plurality of light source openings. The lower reflector may be approximately parallel to the fixture. The camera may be positioned beneath the camera opening and may capture light images reflected from both the lower reflector and the upper reflector from the plurality of light sources. An image processor is coupled to the camera, wherein image data associated with the captured light images is transmitted from the camera to the image processor. The image processor is used to determine an adjustment value based upon the image data to tilt the end effecter such that the end effecter is moved to be approximately parallel to the fixture.

Abstract: An image of a mask pattern is overlaid on an image of a mask blank annotated with the center location and dimensions of each measured mask defect. Design clips centered at the measured defects are generated with lateral dimensions less than allowable movement of the mask pattern over the mask blank. Each design clip is converted into a binary image including pixels corresponding to defect-activating regions and pixels corresponding to defect-hiding regions. Each pixel region representing the defect-activating region is expanded by laterally biasing peripheries by one half of the lateral extent of the defect located within the corresponding design clip. Biased design clips are logically compiled pixel by pixel to determine an optimal pattern shift vector representing the amount of pattern shift.