Abstract: A photoelectric conversion module includes a circuit board; a photoelectric conversion element mounted on a first main surface of the circuit board; and an optical lens provided in an optical path between an end surface of an optical fiber and the photoelectric conversion element, wherein a part of the optical lens is inserted in a recessed portion formed in the first main surface of the circuit board.

Abstract: The present disclosure is generally directed to an optical transceiver that includes a multi-channel on-board ROSA arrangement that includes an optical demultiplexer, e.g., an arrayed waveguide grating (AWG) and an array of photodiodes disposed on a same substrate. The array of photodiodes may be optically aligned with an output port of the optical demultiplexer and be configured to detect channel wavelengths and output a proportional electrical signal to an amplification circuit, e.g., a transimpedance amplifier. Each of the photodiodes can include an integrated lens configured to increase the alignment tolerance between the demultiplexer and the light sensitive region such that relatively imprecise bonding techniques, e.g., die bonding, may be utilized while still maintaining nominal optical power.

Abstract: Disclosed herein are a photonic integrated circuit (PIC) including an edge coupler (EC) and method thereof. In some embodiments, the EC is optically coupled to a first waveguide at an inner end of the EC. In some embodiments, the PIC is in contact with an optical fiber at an outer end of the EC. The EC may include a plurality of waveguide cores located on a plurality of waveguide layers. The waveguide cores of the plurality of waveguide cores are located apart from each other and configured to adapt a mode size of a beam of light between a larger mode size at the outer end of the EC and a smaller mode size at the inner end of the EC.

Abstract: An optical waveguide is formed on a support member. A second cladding layer is formed on a surface of a first cladding layer so as to cover a core layer. An opening is opened at the second cladding layer-side, penetrates the second cladding layer and the core layer, and closed at the first cladding layer-side. The opening has a first surface and a second surface ranging from the opened side to the closed side. In a vertical section taken along a longitudinal direction of the core layer, a first angle between a perpendicular line drawn from an opening end of the first surface to the surface of the first cladding layer and the first surface, and a second angle between a perpendicular line drawn from an opening end of the second surface to the surface of the first cladding layer and the second surface are all acute angles.

Abstract: A lighting device includes a first light source unit having a first light source row made up of a plurality of light sources, and a first light source board, onto which the light sources making up the first light source row are mounted, a second light source unit having a second light source row made up of a plurality of light sources, and a second light source board, onto which the light sources making up the second light source row are mounted, and a light guide plate having a plate-like shape and having a first light-incident face where light emitted from the light sources is incident, and a second light-incident face disposed on an opposite side from the first light-incident face where light emitted from the light sources is incident.

Abstract: Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.

Abstract: Devices, systems, and methods for providing wireless personal area networks (PANs) and local area networks (LANs) using visible and near-visible optical spectrum. Various constructions and material selections are provided herein. According to one embodiment, a light-emitting diode (LED) includes a substrate, a carrier confinement (CC) region positioned over the substrate, and an active region position over the CC region. The CC region includes a first CC layer comprising aluminum gallium nitride and a second CC layer position over the first CC layer. The second CC layer also includes aluminum gallium nitride. The active region is configured to have a transient response time of less than 500 picoseconds (ps).

Abstract: An optical waveguide mounting substrate includes a wiring substrate, and an optical waveguide mounted on the wiring substrate with an adhesive layer being interposed therebetween. The optical waveguide includes a first cladding layer, a core layer formed on a surface of the first cladding layer facing toward the wiring substrate, and a second cladding layer formed on the surface of the first cladding layer facing toward the wiring substrate so as to cover a periphery of the core layer. An opening is opened on the second cladding layer-side, penetrating the second cladding layer and the core layer, and closed on the first cladding layer-side, and a metal film is provided on an end face of the core layer in the opening. The second cladding layer faces the wiring substrate via the adhesive layer. A part of the adhesive layer is filled in the opening.

Abstract: A method for manufacturing a waveguide aperture to block stray light from a facet of an integrated optical device include obtaining a wafer with one or more integrated optical devices formed thereon and with a cleaved facet; positioning a mask in front of the cleaved facet, thereby masking at least a portion of the waveguide aperture of at least one the one or more integrated optical devices; and applying a light-blocking coating to the cleaved facet with the mask masking the portion of each of the one or more integrated optical devices.

Abstract: A mini light emitting diode (LED) backlight and a method of manufacturing the same are disclosed. The mini LED backlight includes a backboard and a plurality of rectangular light boards provided with a plurality of mini LEDs arranged in an array, and the plurality of light boards are arranged in an array and spliced on the backboard. A seam is provided between two of the light boards adjacent to each other, and the backboard is provided with a plurality of grooves corresponding to the seams, and the plurality of seams and the plurality of grooves are filled with a cured adhesive. The method of manufacturing the corresponding mini LED backlight is further provided. The mini LED backlight and the method of manufacturing the same are capable of effectively improving the problem about dark lines between the light boards of the mini LED backlight.

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

Abstract: Example methods, devices, and systems for optical transmission are disclosed. An example method can comprise coupling a plurality of optical filters to a substrate. The method can comprise coupling a polymeric waveguide to the plurality of optical filters. The polymeric waveguide can be configured to guide a free space optical signal along the polymeric waveguide and communicate, via the plurality of optical filters, one or more components of the free optical space signal to an integrated chip.

Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.

Abstract: A multi-channel receiver optical sub assembly module for a fiber Bragg grating sensor according to an embodiment of the present invention includes a housing, a connection socket, an optical bench, a thermoelectric cooler, an arrayed waveguide grating chip, a photodiode array disposed on the optical bench and including a plurality of photodiode chips connected to the optical channels of the arrayed waveguide grating chip, and a printed circuit board which is connected to the other side of the housing while passing through the other side of the housing, of which a portion of a body is disposed on the optical bench, and which is connected to the photodiode array.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.

Abstract: Cable/line systems and related methods are provided. The cable/line systems include at least one central cable and an optical waveguide surrounding the cable. The optical waveguide includes an inner cladding, a core, and an outer cladding. Scattering structures are dispersed within the optical waveguide. The optical waveguide is configured to scatter light by way of the scattering structures away from the core to emit radial lighting along the length of the optical waveguide. The spectrum and/or luminance of the emitted light is controlled according to properties of the cable/line.

Abstract: A light source device includes a sub-mount, a semiconductor laser element flip chip mounted on the sub-mount, and a planar lightwave circuit (PLC) which is an optical member having a waveguide disposed on a substrate. The semiconductor laser element and the waveguide are arranged such that a light-emitting point of the semiconductor laser element and a core of the waveguide are substantially aligned. A light-reflecting surface is provided such that light emitted from the semiconductor laser element and propagating along a propagating direction in the planar lightwave circuit is reflected at the light-reflecting surface in a direction substantially normal to the propagating direction. A portion of the substrate of the planar lightwave circuit is removed at least in a predetermined range from an end opposite to a light incident surface of the planar lightwave circuit.

Abstract: Examples are disclosed that relate to producing a viewable image using a plurality of individually-addressable vertical cavity surface emitting lasers (VCSELs) arranged into an array. In one example, a display system comprises a light source comprising a plurality of VCSELs arranged into an array comprising one or more first color rows of VCSELs configured to produce a first color, one or more second color rows of VCSELs configured to produce a second color, and one or more third color rows of VCSELs configured to produce a third color. Each VCSEL in a given row has a coordinate that is staggered relative to a coordinate of each of the VCSELs in one or more rows adjacent to the given row. The display system also comprises a scanning system to direct light from at least a portion of the plurality of VCSELs to produce a viewable image.

Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.

Abstract: A fiber optic element of a fiber scanning system includes a motion actuator having longitudinal side members, an internal orifice, a first support region, a central region, and a second support region. The fiber optic element also includes a first fiber optic cable passing through the internal orifice and having a first fiber joint as well as a second fiber optic cable passing through the internal orifice. The second fiber optic cable has a second fiber joint disposed in the central region and spliced to the first fiber joint, a second coupling region, a light delivery region, and a light emission tip. The light delivery region is characterized by a first diameter and the light emission tip is characterized by a second diameter less than the first diameter.

Abstract: A multi-beam optical phased array on a single planar waveguide layer or a small number of planar waveguide layers enables building an optical sensor that performs much like a significantly larger telescope. Imaging systems use planar waveguides created using micro-lithographic techniques. These imagers are variants of “phased arrays,” common and familiar from microwave radar applications. However, there are significant differences when these same concepts are applied to visible and infrared light.

Abstract: An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.

Abstract: A mobile terminal including a display panel; a front window provided on a front surface of the display panel; and a plurality of micro-holes in the front window arranged in an array pattern and spaced a preset distance apart from an outer edge area of the front window.

Abstract: A photonic interconnect switch is formed by first and second linear optical waveguides that cross to form an intersection. First and second redirecting photonic ring resonators are coupled together in an intermediate optical coupling zone and are controllable with an electrical signal. The first ring resonator is coupled to the first optical waveguide in a first optical coupling zone. The second ring resonator is coupled to the second optical waveguide in a second optical coupling zone.

Abstract: An electromagnetic (EM) energy conversion and measurement system and related methods are provided for converting a first EM energy (e.g., infrared) to a second EM energy (e.g., visible light) having at least a different wavelength or frequency than the first EM energy then using a detector to detect or measure the second EM energy. An array of conversion and detector assemblies each include a first section and a second section. Exemplary first sections can include at least one optical grade substrate formed with a first material (e.g., germanium) having a first index of refraction that refracts a first EM energy so as to change a frequency and propagation time of the first EM energy to produce a second EM energy. Exemplary second sections include an EM energy detector having an index of refraction that is the same as the first material.

Abstract: An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Abstract: A ridge waveguide (10) according to the present invention includes a ridge part (11), the ridge part (11) being in contact with both a side (14) in a long-side direction and a side (15) in a short-side direction in a cross-sectional shape of the ridge waveguide. Further, an array antenna apparatus according to the present invention includes a feeder circuit formed by a ridge waveguide (10) including a ridge part (11), the ridge part (11) being in contact with both a side (14) in a long-side direction and a side (15) in a short-side direction in a cross-sectional shape of the ridge waveguide. In this way, it is possible to provide a ridge waveguide that can be easily manufactured.

Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chipand to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.

Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.

Abstract: A method for fabricating a light receiving device includes: preparing a first substrate product which includes a semiconductor region having a common semiconductor layer, a first semiconductor laminate for a photodiode, a second semiconductor laminate for a waveguide, and a butt-joint between the first semiconductor laminate and the second semiconductor laminate, the first laminate and the second semiconductor laminate being disposed on the common semiconductor layer; etching the first substrate product with a first mask to form a second substrate product having a photodiode mesa structure produced from the first semiconductor laminate and a preliminary mesa structure produced from the second semiconductor laminate; etching the second substrate product with the first mask and a second mask, formed on the photodiode mesa structure; to produce a waveguide mesa structure from the preliminary mesa structure, and the waveguide mesa structure having a height larger than that of the preliminary mesa structure.

Abstract: Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.

Abstract: Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

Abstract: An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.

Abstract: An optical module including a source assembly is disclosed. The source assembly provides a semiconductor optical device, a wiring substrate, and a bridge substrate. The semiconductor optical device includes an electrode and a pad that receives a driving signal therethrough. The wiring substrate, which is arranged side by side with respect to the semiconductor optical device, provides a signal line and a ground line surrounding the signal line. The bridge substrate includes a signal line and a ground line surrounding the signal line. A feature of the optical module is that the bridge substrate is placed on the semiconductor optical device and the wiring substrate such that a transmission line thereof faces the semiconductor optical device and the wiring substrate, and one end of the signal line thereof is connected with the pad of the semiconductor optical device through a post, and another end of the signal line thereof is connected with an end of the signal line in the wiring substrate through another post.

Abstract: A VCSEL transmitter includes a first VCSEL terminal disposed on a substrate and a second VCSEL terminal adjacent thereto. The transmitter also includes a first diffraction element within a first optical path of the first VCSEL terminal which receives and changes a first direction of a first light transmission having a low-order Laguerre Gaussian mode emitted from the first VCSEL terminal. The transmitter further includes a second diffraction element within a second optical path of the second VCSEL terminal which receives the second light transmission and converts the received light into a high-order Laguerre Gaussian mode. The transmitter also includes a mode combiner to direct the first light transmission into a lens which directs the light into a multi-mode optical fiber.

Abstract: An optical signal transferring apparatus, an electronic apparatus, and a source device, and methods of operating the same include a signal transfer unit including one or more signal lines transferring a signal between a first apparatus and a second apparatus and one or more power lines transferring power between the first apparatus and the second apparatus; and a first connector connected to the first apparatus, and a second connector connected to the second apparatus, wherein the signal transfer unit is configured to transfer an optical signal to the second apparatus in response to a power-on input of the first apparatus and transfer, to the first apparatus, power and data which are received from the second apparatus in response to detection of the transferred optical signal, respectively, via the one or more power lines and the one or more signal lines.

Abstract: This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.

Abstract: A backlight unit for a three-dimensional (3D) image display includes a light guiding plate configured to guide light; a light source configured to emit the light to the light guiding plate; and a diffraction grating structure provided on a surface of the light guiding plate, the diffraction grating structure configured to diffract the light emitted from the surface of the light guiding plate, and including diffracting gratings having different heights.

Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Abstract: Embodiments provide for a photonic platform, comprising: a silicon component; a III-V component; and a bonding layer contacting the silicon component on one side and the III-V component on the opposite side; wherein the silicon component comprises: a silicon substrate; a dielectric, contacting the silicon substrate on one face and the bonding layer on the opposite face; a silicon cores disposed in the dielectric; and wherein the III-V component comprises: a III-V cladding; a III-V contact, having a first side that contacts the bonding layer; and an active region, disposed on the III-V contact and separating the III-V contact from the III-V cladding, wherein the active region is located relative to the silicon cores to define an optical path that includes the active region and the silicon cores.

Abstract: A method for manufacturing a semiconductor device comprises forming a bottom source/drain region on a semiconductor substrate, forming a channel region extending vertically from the bottom source/drain region, growing a top source/drain region from an upper portion of the channel region, and growing a gate region from a lower portion of the channel region under the upper portion, wherein the gate region is on more than one side of the channel region.

Abstract: Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

Abstract: An optical metrology device produces light in a spectral range for measurement of a sample using a tunable Quantum Cascade Laser (QCL). The optical metrology device includes a second channel that is used to diagnose when the tunable QCL is in failure mode, e.g., when it is not producing all wavelengths in the plurality of different wavelength ranges. The second channel includes at least one optical flat that is transmissive to the light produced by the QCL and is separate from the tunable QCL. The optical flat is switchably placed in a beam path of the light produced by the tunable QCL and light transmitted through the optical flat is received by a detector. Using output signals from the detector, a failure mode of the tunable QCL may be determined.

Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) die including: a semiconductor substrate; active circuitry on the semiconductor substrate; an inter-level dielectric (ILD) over the semiconductor substrate and the active circuitry; a photonic element extending from the active circuitry on the semiconductor substrate; and a guard ring on the semiconductor substrate and within the ILD, the guard ring surrounding the active circuitry, the guard ring including: a conductive body, and a conductive bridge element extending over the photonic element.

Abstract: An optical axis adjustment method for an integrated optical module includes: measuring output currents by changing a wavelength of a light beam incident on a package; detecting, with first and second light receiving elements, light beams resulted from demultiplexing the incident light beam with first and second filters; detecting center wavelengths of a first light beam and a second light beam based on a change in the output currents in response to a change in the wavelength of the incident light beam; comparing the center wavelengths of the first light beam and the second light beam with design transmission wavelengths of the first filter and the second filter, and defining respective differences as a first wavelength deviation and a second wavelength deviation; and adjusting a position of the optical demultiplexer to make a total sum of the first wavelength deviation and the second wavelength deviation small.

Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.