Abstract: A metal chassis including a laser diode (LD) and a photodiode (PD) is held at a receiver ground RG, which is the potential of the anode or the cathode of the PD. Meanwhile, a receptacle for removing an optical fiber is held at a frame ground FG of a separate frame. Lead pins of the LD are insulated from the metal chassis. The receiver ground RG and the frame ground FG are insulated from each other by an insulative member. Since the receiver ground RG is insulated from the LD and the frame, a receiver is not easily affected by inner noise and outer noise. Accordingly, a bidirectional optical module having reduced influence of forward radiated noise, LD/PD crosstalk, and the outer noise is provided.

Abstract: According to one embodiment of the invention, a system comprising a housing including an opening to receive an optical connector, and an electromagnetic inductive (EMI) shield independent of the optical connector to cover a portion of the opening to reduce emissions of EMI radiation generated by the optical connector from the transceiver housing. According to another embodiment of the invention, a method comprising connecting an optical connecter to an optical port of a housing in an optical module, the housing comprising an opening to receive to the optical connector; and shielding a portion of an opening in the housing to reduce emissions of EMI radiation generated by the optical connector from the housing.

Abstract: An optical transceiver module is comprised of a mount substrate, a transmitting semiconductor laser, a receiving photodiode, a communicating hole, and a first filter. The mount substrate is provided so as to intersect with a predetermined axis X and has first and second principal surfaces facing each other. The transmitting semiconductor laser is mounted on the first principal surface and is configured to emit light of a first wavelength. The receiving photodiode is mounted on the predetermined axis X and on the second principal surface and is configured to receiving light of a second wavelength. The communicating hole is provided in a region of the mount substrate where the receiving photodiode is mounted, and makes the first and second principal surfaces communicate with each other.

Abstract: An optoelectronic device that employs a composite adhesive to properly position optical components within the device is disclosed. In one embodiment, an optical subassembly is disclosed, comprising a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance, wherein the spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: A bidirectional optical transceiver includes a wavelength-selecting filter, an optical fiber, a transmitting module, and a receiving module. The wavelength-selecting filter is placed on an optical axis, passes a first optical signal therethrough, and reflects a second optical signal perpendicularly to the traveling path of the second optical signal. The optical fiber has a face that is opposite to the wavelength-selecting filter and is inclined at an angle of ? with respect to a normal line perpendicular to the optical axis. The transmitting module is placed on the optical axis in opposition to the optical fiber with respect to the wavelength-selecting filter and has a light source for generating the first optical signal and outputting the generated first optical signal to the wavelength-selecting filter at an inclined angle with respect to the optical axis.

Abstract: Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals.

Abstract: The invention relates to a device and a method for optoelectronically identifying the displacement and/or position of an object. According to the method, a transmitter element emits light, which is received by at least one receiver element and the light emitted from the transmitter element is scattered by an object, wherein an optical guide is provided between the transmitter element and the receiver element. This aim of the invention is to fulfill the prerequisites for a key construction, which can be operated below a sealed surface. To achieve this, the optical guide includes light coupling means for coupling in the illumination that has been scattered by the object and previously emitted by the optical guide.

Abstract: A Fabry-Perot cavity is formed by a partially or wholly reflective surface on the free end of an integrated elongate channel or an integrated bounding wall of a chip of a wafer and a partially reflective surface on the end of the optical fiber. Such a constructed device can be utilized to detect one or more physical parameters, such as, for example, strain, through the optical fiber using an optical detection system to provide measuring accuracies of less than aboutb0.1%.

Abstract: Optical transmission components, systems, and packages where the package includes a common housing containing a laser for transmission of an optical signal, a photodetector optically coupled to the laser for monitoring the laser transmission, and a laser driver electrically coupled to the laser for providing a drive current to the laser. The optical package may be a TO-Can package, the laser may be a vertical cavity surface emitting laser (“VCSEL”), and the laser driver may be an AC modulation laser driver, where a bias current is supplied to the laser from external to the optical transmission component package. An external bias source may be used for providing a bias current to the laser. A temperature sensor located in the laser driver may be used to control operational parameters of the laser.

Abstract: An optical integrated device in which application of an excessive stress or the appearance of a crack due to thermal expansion mismatching is prevented. A first ferrule is fixed to an optical waveguide chip. An optical fiber is inserted into the first ferrule to fix the optical fiber. A package contains the optical waveguide chip and the first ferrule. An opening is made in a sidewall of the package to pull out the optical fiber to the outside. A pipe is airtightly fixed around the opening. A second ferrule is inserted into the pipe and is airtightly fixed to an end of the pipe. The optical fiber pulled out to the outside of the package through the opening is inserted into the second ferrule to fix the optical fiber.

Abstract: A fiber optics differential pressure transducer (100, 200, 300, 400) containing Bragg networks (118), said transducer being used to measure the differential pressure in a Venturi installed inside a pipe (1), through which a fluid like oil is displaced. The transducer comprises a body (110, 230, 360, 410) of different geometries and a diaphragm (2), at least one Bragg network (118) being attached on each of the surfaces of the same. The diaphragm (2) is placed parallel or transversal to the transducer's body (100, 200, 300, 400). The transducer (200) is isolated from the process fluid by flexible mechanical seals (201) which transmit the pressure up to surfaces of the diaphragm (2). The transducer (300, 400) is provided with two relief microvalves for the purpose of protecting the sensor [diaphragms (2)] in overpressure events.

Abstract: In a container assembly for a laser diode module in which a temperature control device is not incorporated in advance, a heat-insulative casing is adapted to accommodate the laser diode module. A temperature detector is accommodated in the casing. A thermal coupling member is accommodated in the casing so as to thermally couple the laser diode module and the temperature detector. A heat-conductive plate member is attached to the casing. A heat transfer element is interposed between the thermal coupling member and the plate member so as to allow heat transfer therebetween. A sealing member is disposed between the casing and the plate member so as to seal the heat transfer element. A heat transfer controller causes the heat transfer element to control the heat transfer in accordance with a temperature of the thermal coupling member which is detected by the temperature detector.

Abstract: An optical sub assembly for receiving an optical fiber transmission line for coupling to an optical device, to a receptacle for use in such a sub assembly and to a method of manufacture of such a sub assembly. The optical sub assembly preferably provides electrical isolation between a receptacle having a nose for receiving the optical fiber and a package housing an optical device. The nose houses a ferrule containing a fiber stub which may be optically aligned with an optical device housed in a package before securing the receptacle to the package. The electrical insulation is provided between the nose and the package by a sleeve extending along a middle portion of the ferrule and an insulating portion positioned between the sleeve and the nose.

Abstract: A low-profile package for housing an optoelectric device is disclosed. The low-profile package includes an insulating base having an upper surface. The optoelectric device is mounted to the upper surface of the insulating base. The low-profile package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The low-profile package further includes a substantially flat metal cover attached to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Abstract: An optical module comprises: a sub-mount 1, having four photodiodes 12 and two guide grooves 10 disposed on an optical element mounting surface 16; a fiber fixing member 2, having four V-grooves 21, four concave mirrors 22, and two guide rails 20 disposed on an optical fiber fixing surface 26; and four optical fibers 3, fixed to the fiber fixing member 2. With this optical module, the sub-mount 1 and fiber fixing member 2 are aligned and fixed by the fitting together of the guide grooves 10 and guide rails 20. A passive alignment type optical module that enables mass production and cost reduction is thus realized.

Abstract: An optical module includes: an optical plug that supports one end of an optical fiber; a receptacle unit having an optical element and a mounting surface to be abutted against the optical plug for optically coupling the optical plug and the optical element; and a holder having a leaf spring that forces the optical plug to the mounting surface of the receptacle unit, a window section for passing the optical fiber, and a fiber support section disposed at a position near the window section for affixing the optical fiber thereto, wherein the holder is engaged with the receptacle unit to connect the receptacle unit and the optical plug in one piece.

Abstract: An optical transceiver includes a chassis, a printed circuit board, a conducting strip, a cover and a gasket. The chassis has a first reference. The printed circuit board has a second reference. The conducting strip is adjacent the printed circuit board and the cover is coupled over the printed circuit board. The gasket is positioned between the conducting strip and the cover thereby capacitive coupling the first reference to the second reference.

Abstract: An optical module includes an optical connector on one end of a package for storing a carrier including an optical element, and a laminated ceramic feedthrough disposed on the other end of the package. The feedthrough includes on an outer surface an electrical terminal perpendicular to the optical axis of light incident on and exiting from the optical connector, and includes on its inner surface a chip carrier connection terminal connected to the electrical terminal. A flexible printed circuit board includes a connection pad acting as an electrical terminal at a position corresponding to the electrical terminal of the feedthrough and is fixed to the feedthrough with an anisotropic conductive adhesive.

Abstract: The invention relates to an optoelectronic arrangement which has a transmission component which emits electromagnetic radiation, a receiving component which detects a portion of the radiation emitted from the transmission component, and a transparent material which at least partially surrounds the transmission component and the receiving component and provides a boundary surface between the arrangement and the environment. In this case, a portion of the light which is emitted from the transmission component is reflected in the transparent material and/or on the boundary surface of the transparent material, and is detected by the receiving component. The invention also relates to a method for controlling the output power of a transmission component by means of a receiving component which detects a portion of the radiation which is emitted from the transmission component.

Abstract: An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.

Abstract: The invention relates to an optoelectronic arrangement having a laser component. There are provided: a cooling device of small design for cooling the laser component down to a constant temperature, a device for the direct optical detection of the emitted wavelength of the laser component, whose signal is used to control the cooling device, and a package of small design with an extent of at most 6.5 mm perpendicular to the optical axis of the laser component and in which the above named components are arranged. The invention also relates to a method for controlling the emitted wavelength of a laser component.

Abstract: The present invention is directed to hermetically sealed photonic device packages and the polymeric sealing means employed therefore for connecting one or more optical fibers to a photonic device.

Abstract: Packaging for optical components. A package for packaging multiple fiber optical components can include a bottom portion comprising at least two cavities. The cavities can include a first cavity that is sized and configured to receive a first fiber optic component, and a second cavity that is sized and configured to receive a different fiber optic component. The package can also include a lid portion. The lid can be secured in a closed position with the bottom portion. The cavity can receive a first optical component and a second optical component. The package can also include identification information integrated with at least one of the bottom portion and the lid portion for describing the package or a component held within the package.

Abstract: A laser module having a laser optically coupled with an optical fiber via a collimating lens and a focusing lens is formed. The laser is mounted in a laser housing so that its laser light output is directed toward a laser housing wall opening in a laser housing wall of the laser housing. A lens-fiber housing having a lens installed in a first end thereof and a light-receiving input end of the fiber disposed in a bore at a second end thereof is provided. The lens and input end of the fiber form a collimator. The lens-fiber housing is mounted from the outside of the laser housing to the laser housing wall to receive collimated light transmitted from inside the laser housing through the laser housing wall opening. The collimating lens is actively aligned in the laser housing, between the laser and the laser housing wall opening, to determine an aligned position. The collimating lens is secured in the laser housing at the aligned position.

Abstract: In a laser module in which laser beams emitted from semiconductor laser elements are collimated by collimator lenses, and condensed by an optical condensing system so that the laser beams converge at a light-entrance end face of an optical fiber. The semiconductor laser elements and the collimator lenses are contained in a hermetically sealed, first package which includes a front wall having a window arranged for passage of the laser beams, and a portion of the optical condensing system and the light-entrance end face are contained in a hermetically sealed, second package which is fixed to the front wall. The cross section of the second package perpendicular to the optical axis of the optical fiber at the light-entrance end face is smaller than the cross section of the first package parallel to the cross section of the second package.

Abstract: The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.

Abstract: An optoelectronic arrangement having a surface-mountable semiconductor module having at least one optoelectronic transmitting and/or receiving unit, a housing, in which the optoelectronic transmitting and/or receiving unit is arranged, and a mounting side of the housing, which, in the case of surface mounting of the semiconductor module on a printed circuit board, faces the printed circuit board. The arrangement furthermore has a cooling element, which is thermally coupled to the semiconductor module for the purpose of cooling the optoelectronic transmitting and/or receiving unit. The cooling element is arranged on a side of the housing that is remote from the mounting side.

Abstract: Reducing transmission of electromagnetic waves through a barrel portion of an optical module. A barrel for optically coupling an optical device to an optical fiber within a fiber optic cable can include a plastic portion and a metallic shielding portion for reducing transmission through the barrel. An optical device can be coupled to the plastic portion. The metallic shielding portion can be coupled to the plastic portion and surround at least a portion of the plastic portion. The metallic shielding portion can be shaped and configured so as to reduce transmission of electromagnetic radiation through the barrel.

Abstract: The active bulkhead transceiver includes a housing, an insert body, a keying cap, a first ferrule, a second ferrule, a transmitting optical subassembly, a receiving optical subassembly, an electrical connector, a substrate, a cover, and a panel nut. The housing includes seating surface, an aperture, a first thread form, and a second thread form. The panel nut has a thread form, and a seating surface. The thread form of the panel nut is complimentary to one of the thread forms of the housing so that the panel nut is removeably mountable on the housing.

Abstract: An optoelectronic module having a package encapsulating an optoelectronic device, a triplicated sleeve having a lower metal ring, an intermediate insulating ring and an upper metal cover which are coupled by press-fitting in concentric disposal, and a receptacle fitted upon the upper metal cover. The optoelectronic module does not emit noise radio waves or is not subject to external noise. The module satisfies the stipulated standard that an electric field should be less than 54 dB?V/m at a 3 meter distant measuring spot in a frequency range higher than 1 GHz.

Abstract: An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector.

Abstract: An optical module with a CAN package contains a stem and a lead. The stem has a hole penetrating the stem and an inner cylindrical surface surrounding the hole. The lead extends through the hole such that a gap exists between the lead and the inner cylindrical surface. The gap contains first and second portions which are arranged along the longitudinal direction of the hole. The first portion is filled with sealing material which is dielectric. The second portion is filled with air.

Abstract: Disclosed herein is an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver includes upper and lower housings, a holder, optical assemblies, a cover, a substrate and a grip. The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate is exposed outside the transceiver, the shield bracket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: An integrated optical device allowing for higher flexibility in designing its outer shape and securing hermetic sealing is provided, which includes a ceramic substrate mounting a light source, a covering member fixed to the substrate for covering the light source, and a resin mold package for attaching the substrate, wherein a metal joint portion on the substrate and a metal joint portion on the covering member are joined, as well as a through-hole in the substrate or in covering member is sealed with a transparent material for hermetic sealing of the light source.

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.

Abstract: An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

Abstract: An optoelectronic package includes an insulating base and an optoelectronic device mounted on the upper surface of the insulating base. A metal layer is attached to the upper surface of the insulating base, and a metal cap is attached to the metal layer to hermetically seal the metal cap to the insulating base. In one embodiment, the metal cap is projection welded to the metal layer.

Abstract: An optical transceiver is equipped with at least one coupling lens which condenses reception signal light from an optical medium and condenses transmission signal light to the optical medium, an optical plate which passes the reception signal light and reflects the transmission signal light, a light receiving element which receives the reception signal light passed through the optical plate, and a light emitting element which transmits the transmission signal light so as to be reflected by the optical plate, wherein an emission port of the transmission signal light of the light emitting element is arranged at a position to enable the transmission signal light from the light emitting element to form an image in the optical medium via the optical plate and the coupling lens, and wherein the emission port of the transmission signal light of the light emitting element is arranged in a direction that makes the incident angle formed on the optical plate by the beam center line of the transmission signal light trans

Abstract: The present invention is to provide an intelligent pluggable transceiver improving EMI tolerance with a simple mechanism. The optical transceiver of the invention includes upper and lower housings, a holder, optical assemblies, a cover, a substrate and a grip. The optical assemblies are fixed with the upper and lower housings together with the holder by interposing a conductive elastic member. Although the rear end of the substrate is exposed outside of the transceiver, the shield gasket and the ground pattern on the substrate shield the contact portion between the substrate and the upper housing, and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: The present invention provides an optical modulation element module capable of stably operating for long periods without limiting the operating conditions. An optical modulation element module comprising an optical modulation element 12, a case 11 with said optical modulation element being integrated thereto, input output fibers 13, 14 being connected to said optical modulation element and also guided to an exterior of said case, a terminal for introducing a modulating signal and a bias adjustment voltage that are to be applied to said optical modulation element, said case being hermetically sealed, is characterized in that said case 11 is made of a material having almost the same coefficient of linear expansion as the optical modulation element 12, said optical modulation element is affixed to said case by using a thermoplastic and high-elastic adhesive material 19, a linear expansion difference between each material of said case and said fiber is less than 16×10?6/° C.

Abstract: A terminal element for fiber optic communication has an elongated body defining a body axis and having a first end from which an optical fiber extends along the body axis. The body has a second end with an angled surface offset at an angle from the body axis. The fiber extends through the length of the body, and terminates at a fiber end surface flush with the angled surface. A lens element is positioned adjacent to the angled surface. The fiber may be hermetically sealed to the body at a position away from first end, and may be sealed with a flexible material at the first end.

Abstract: A fiber optic connector assembly with a fiber optic connector mounted to a fiber optic cable and including a ferrule with an end face terminating the fiber. A plug is configured to fit about and engage the ferrule of the fiber optic connector to seal the end face from contaminants. An adhesive tape is releasably attached to the connector about the plug, holding the plug to the connector. Further, a cover assembly for a fiber optic connector mounted to an end of and terminating a fiber optic cable. The cover includes an open sided box and a lid sized to engage the open side. The box and the lid define a cavity sized to fit about and receive a fiber optic connector. The cavity has an open end adapted to receive the optical fiber cable. The fiber optic connector is held within the cavity and the cable extends through the open end, with the lid engaging the open side and sealing the cavity from contaminants outside the cavity.

Abstract: An optical transmission module that can be produced more easily and uses a shorter wiring pattern connecting the driving device and the light-emitting device than the conventional light-emitting apparatus, with the driving device and the light-emitting device arranged close to each other. The light-emitting device and the light-receiving device for monitoring the backward light emitted from the light-emitting device are arranged on a main surface of the substrate. The driving device is disposed on a bottom of a concave formed between the light-emitting device and the light-receiving device so that the driving device is lower than a straight line connecting a backward light emitting point of the light-emitting device and a backward light receiving point of the light-receiving device.

Abstract: The present invention relates to a diffractive grating member and to an optical communication module. The optical communication module includes a semiconductor laser; a coupling optical system for coupling a light flux with a wavelength of ?1 emitted by the semiconductor laser to an optical fiber; and two light-receiving elements for receiving at least two light fluxes each having wavelengths ?2 and ?3 emitted from an end surface of the optical fiber. The coupling optical system has a diffractive structure, and the coupling optical system changes paths of light fluxes each having wavelengths ?1, ?2 and ?3 into relatively different directions such that the light flux with the wavelength ?1 emitted by the semiconductor laser enters into the optical fiber and each of the at least two light fluxes each having the wavelengths ?2 and ?3 enters into each of the two light-receiving elements.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: An optical element includes an optical section having at least one of an emission section and a photodetection section, a sealing member that surrounds at least a part of the optical section through an internal space, an electrode that is electrically connected to the optical section, a conductive member that is contained in the sealing member and conductively connected to the electrode, a substrate that is disposed opposite to an optical surface provided at the optical section, and a wiring that is formed on the substrate and conductively connected to the conductive member, wherein the optical surface is at least one of a plane of light emission and a plane of light incidence.

Abstract: Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.

Abstract: An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light emitting device and an optical monitor. In addition, the module includes a transparent plate with at least two reflective regions that together redirect part of the light from the light emitting device to the optical monitor.