Abstract: There are provided high power laser connectors and couplers and methods that are capable of providing high laser power without the need for active cooling to remote, harsh and difficult to access locations and under difficult and harsh conditions and to manage and mitigate the adverse effects of back reflections.

Abstract: The invention relates to a hermetic feedthrough of an optical fiber into a package for an optical module, that includes a package ferrule hermetically attached to the package or integral therewith, a fiber ferrule hermetically sealed around the optical fiber, and a compression sleeve hermetically sealed around the package ferrule. The compression sleeve is hermetically sealed to the fiber ferrule or integral therewith, and wherein a coefficient of thermal expansion (CTE) of the compression sleeve is greater than a CTE of the package ferrule so that a joint between the compression sleeve and the package ferrule is under compressive stress.

Abstract: Disclosed is a high speed flex circuit electronic interface in combination with a sealed optical connectorization approach for optical coupling. In a preferred embodiment, at a front end of the connector a wedge seal ring or “press ring” is pressed into the end of a slide tube, both of which are, in a preferred embodiment, made of metal such as stainless steel. The wedge end shape of the press ring in this preferred embodiment allows it to be easily pushed into the inside diameter of the slide tube, expanding the slide tube to create a radial surface seal maintained by the hoop stress developed in the slide tube initiated by the press ring, thereby creating a hermetic seal on a cylindrical portion of the flange assembly connector. A flex-circuit sealed back-end of the connector uses, in a preferred embodiment, polymer to polymer or polymer to metal bonding to create a hermetic seal on the back end.

Abstract: In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22).

Abstract: An optical transceiver has a projection covering member that can suppress EMI noise radiated from a pig-tail part. An elastic covering member covers a projection which includes an optical coupler of an optical sub assembly. The covering member is made of a conductive elastic material having a predetermined resistivity. At least a part of an outer circumference surface of the elastic covering member comes into intimate contact with an outer periphery of a conductive opening part of a case for the optical transceiver while an inner circumference surface of the elastic covering member comes into intimate contact with the projection.

Abstract: A shielding structure for optical sub-assembly for transceivers includes a housing and a movable board. The housing has a bottom board, a front end board upward extending from a front end of the bottom board and two sideboards upward extending from a left side and a right side of the bottom board. The movable cover includes a plate main body. The plate main body has a connection end connected with the front end board of the housing and a press end opposite to the connection end. The movable cover further includes two sideboards downward extending from a left side and a right side of the plate main body. When installing the optical sub-assembly for transceivers into the shielding structure, the press end of the movable cover is pressed down until the movable cover is engaged with the housing in a closed state so as to avoid electromagnetic interference.

Abstract: A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.

Abstract: A shield cover is provided with urging components that urge a light guide in the direction in which the light guide is inserted into a receptacle body to prevent the light guide from making contact with a light emitting element and a light receiving element when a receptacle body mates with a shield cover. Even if the light guide does not completely mate with the receptacle body, the urging components make contact with the light guide before the light guide makes contact with the light emitting element and the light receiving element so that an urging force by the urging components make the light guide completely mate with the receptacle body.

Abstract: A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA.

Abstract: The pulse light source according to the present invention comprises: a seed pulse generator 1 for outputting an input pulse 10 as a seed pulse; a pulse amplifier 2; and a dispersion compensator 3 for dispersion compensating a light pulse output from the pulse amplifier 2. Moreover, the pulse amplifier 2 comprises a normal dispersion medium (DCF 4) and an amplification medium (EDF 5) that are multistage-connected alternately, for changing the input pulse 10 to a light pulse having a linear chirp and outputting the light pulse. Furthermore, an absolute value of the dispersion of the DCF 4 becomes to be larger than the absolute value of the dispersion of the EDF 5.

Abstract: Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Abstract: A pluggable optical transceiver module set includes an optical signal male connector with an elastic flake with an opening thereon, and an optical signal female connector with a bump, a holding rod and a driven element. When the optical signal male connector is plugged into the optical signal female connector, the bump is fastened in the opening, and the optical signal male connector is disconnected from the optical signal female connector when the holding rod is moved to rotate the driven element to press the elastic flake and release the bump from the opening.

Abstract: A packaging system having a housing for providing a hermetically sealed interior space for receiving and supporting optoelectronic components. The housing has at least one section of wall comprising a layer of liquid crystal polymer (LCP). At least one hermetically sealed electrical port is formed in the LCP wall section over a predetermined area and comprises a layer of metal adhered to and overlying the predetermined area on the of the LCP wall section. An electrode passes through the metal from the exterior of the system to the interior space to provide an electrical communication path between the optoelectronic components and the exterior of said packaging system. A solder joint is formed between the electrode and the layer of metal to provide a hermetic connection between the layer of metal and the electrode to assure that the hermeticity of the housing remains unchanged with the electrical port present.

Abstract: An optical fiber seal includes: an annular layer bonded to an outer glass layer of a length of an optical fiber; and a glass sealing layer bonded to an outer surface of the annular layer and configured to withstand conditions in a downhole environment, the glass sealing layer configured to hermetically seal the length of the optical fiber.

Abstract: A cable attachment system is disclosed for attaching a fiber optic connector to a fiber optic cable. In particular, strength members of the fiber optic cable are crimped between a crimp sleeve and a cable anchor, and the cable anchor is anchored to the fiber optic connector. An end of the crimp sleeve is adapted to receive an end of a jacket of the fiber optic cable. An end of the cable anchor includes a nipple adapted for insertion into the end of the jacket. An end portion of the jacket is crimped between an intermediate portion of the crimp sleeve and the nipple of the cable anchor. A support portion of the crimp sleeve, positioned between the end and the intermediate portion of crimp sleeve, supports a transitioning portion of the jacket beyond the end of the cable anchor.

Abstract: A fiber optic connector release mechanism for releasing a transceiver module in a cage permanently mounted on a PCB is disclosed. The release mechanism includes a bail rotating a U-shaped flange through a two stage travel path to urge the bail forward in a slide path on the transceiver module. The release mechanism includes a boss disposed on one of the bail and the arm assembly and a dimple disposed on another of the bail and the arm assembly to secure the bail in a locked position. As the bail moves forward from the locked position, wedge elements at the end of arms extending rearward may contact locking tabs on the cage, forcing the locking tabs outward. As the locking tabs are forced outward, the shoulders of the transceiver module are released, and the transceiver module is free to slide out of the cage.

Abstract: A method for providing an improved interconnection between an optical fiber and an optical package is described. The method includes inserting an end of the fiber through a feed through tube and into a main body of the optical package, a portion of the fiber proximate the end being metalized, attaching the metalized portion of the fiber within the main body of the optical package, a portion of the metalized fiber remaining within the feed through tube, inserting a stopping device into the feed through tube, melting solder within the feed through tube, in an area between the stopping device and the main body of the optical device, the area containing metalized fiber, compressing the melted solder using the stopping device, removing the stopping device from the feed through tube after the solder has solidified, and attaching a jacket associated with the optical fiber within the feed through tube.

Abstract: A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Abstract: A fiber optic connector release mechanism is disclosed. The mechanism may be used to release a transceiver module housed in a cage that is permanently mounted on a printed circuit board. The release mechanism may include a cam mounted bail that rotates a U-shaped flange through a two stage travel path to urge the bail forward in a slide path on the transceiver module. As the bail begins to move forward, wedge elements at the end of a pair of slide arms extending rearward from the bail may contact locking tabs on the cage, forcing the locking tabs outward. As the locking tabs are forced outward, the shoulders of the transceiver module are released, and the transceiver module is free to slide out of the cage as the operator pulls on the bail.

Abstract: Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.

Abstract: An optical module that implements with a tri-plexer assembly is disclosed. The tri-plexer module comprises a bi-directional module for transmitting digital input and output signals and an analogue optical assembly for receiving analog optical signals. The bi-directional module installs both a light-emitting device and a light-receiving device in a signal package. The analogue optical assembly is assembled such that the optical axis thereof makes a substantially right angle with the optical axis of the bi-directional module. The signal ground of the module is common to the analogue module and to a section for receiving the digital data; while, the chassis ground or the frame ground in the module is isolated from the signal ground.

Abstract: A plug part for an optical waveguide (8), comprising an essentially cylindrical housing (10), at least one inlet opening (17) and at least one outlet opening (18) for a cooling medium, and a cooling collar (12) which is disposed inside the housing (10) and cools an optical waveguide (8) located in the housing (10) at least along one section (b) of the length thereof. The disclosed plug part includes a protective glass (14), across at least almost the entire internal surface of which the cooling medium flows, is provided at one end of the housing, the front of the optical waveguide (8) also being impinged upon by the cooling medium. An embodiment of a plug part for an optical waveguide (8) includes an inserted tube element (19) which divides a cooling medium flow that circulates through housing (10) into a first and a second individual flow channel (KS1, KS2).

Abstract: Provided are an optical receptacle capable of manufacturing an optical module thereby, while suppressing a manufacturing cost, preventing a quality degradation, and suppressing a quantity of returning light by reflection. In the optical receptacle, a recess for receiving a lens and a lens support and a through-hole penetrating from a bottom of the recess toward an exterior are formed, and the recess is formed so that an inner peripheral surface of the recess is fixed to a desired position with respect to an outer peripheral surface of the lens support, in a case where the lens and the lens support are received in the recess such that an optical axis of the lens and an optical axis of the optical fiber to be inserted into the through hole are deviated from each other.

Abstract: An optical device includes: a multilayer structure substrate on which plural insulating layers are stacked and a wiring pattern is formed between layers; a recessed part for exposing the wiring pattern between the layers by cutting off a part of the multilayer structure substrate; an optical element mounted within the recessed part in electric conduction to the wiring pattern exposed by the recessed part; and an optical waveguide member forming an optical path for the optical element and guiding light along a surface of the multilayer structure substrate.

Abstract: An off-axis misalignment compensating fiber optic cable plug is provided. The plug has a cable interface to engage a fiber optic core end, where the fiber optic core has a cross-sectional area. The plug also includes a lens having a first surface to transceive an optical signal with a jack. The first surface has a cross-sectional area at least 30 times as large as the core cross-sectional area. The lens has a second surface to transceive optical signals with the fiber optic line core end. In one aspect, the lens has an axis and the lens first surface is convex with a radius of curvature capable of receiving an optical signal beam with a beam axis of up to ±2 degrees off from the lens axis. Even 2 degrees off-axis, the lens is able to focus the beam on the fiber optic line core end.

Abstract: An optic connector jack is provided with a punch-down fiber optic cable termination. The jack is made up of a housing with a connector mating interface, for connection to a plug connector, and a cradle for receiving a fiber optic cable. The cradle has at least one U-shaped punch-down blade for securing each fiber optic cable with respect to the housing. A crimping plate overlies the cradle and mates to the housing for securing each fiber optic cable in the cradle. The U-shaped punch-down blade has an open top portion, a closed bottom portion, and an inside diameter about equal to a fiber optic cable diameter. The U-shaped punch-down blade has an interior blade edge, the interior blade edge securing a fiber optic cable by slicing into at least a part of the fiber optic cable circumference. In one aspect, the jack includes a lens for each fiber optic cable.

Abstract: A fiber optic cable is provided with a cable section including at least one length of fiber optic line having a first end and a second end. A first and second plug each have a mechanical body shaped to selectively engage and disengage a jack housing. Each plug has a microlens with a planar surface to engage the fiber optic line end and a convex surface to transceive light in a first collimated beam with a jack optical interface. The fiber optic cable ends are formed in a focal plane of a corresponding plug microlens.

Abstract: An optical-electrical processing jack is provided. The optical processing jack includes an optical jack with a jack housing having walls and an orifice for mechanically and optically engaging an optical plug housing. A signal bridge, with a bridge element, transceives optical signals between the optical plug and a backcap processing module. The backcap processing module includes a backcap housing with walls, attached to the jack housing and an optical element. The optical element has an optical interface to transceive an optical signal via the signal bridge, and convert optical signals and electrical signals transceived via an electrical interface. In one aspect, the bridge element is a lens with a first surface to transceive an optical signal with the optical plug, and a second surface to transceive the optical signal with the optical element optical interface. For example, the optical element is a photodiode or laser source.

Abstract: Fiber optic cable jacks and plugs are provided. In one aspect, a cable is made from at least one length of fiber optic line having a first end and a second end. A first plug includes a one-piece mechanical body with a cable interface to engage the fiber optic line first end, and a microlens to transceive light with the cable interface. The first plug is shaped to engage a first jack housing. A second plug includes a one-piece mechanical body with a cable interface to engage the fiber optic line second end, and a microlens to transceive light with the cable interface. The second plug is shaped to engage a second jack housing. The mechanical bodies have inner walls that form an air gap cavity interposed between the microlens convex surface and an engaging jack optical interface.

Abstract: An optical subassembly (OSA) with a newly arranged optical device is disclosed. The OSA provides a ceramic package that installs a semiconductor optical device, a joint portion welded to a lid of the ceramic package, and an optical coupling portion that receives an external optical fiber. In the OSA, the seal ring put between the top of the multi-layered ceramic package and the lid is isolated from the optical device; accordingly, the lid, the joint portion and the optical coupling portion are electrically isolated from the semiconductor optical device even when the OSA is installed in an optical apparatus such as an optical transceiver.

Abstract: An opto-electronic module connector system is mountable on a system substrate, such as a printed circuit board, in a variety of configurations or orientations and includes an electromagnetic interference (EMI)-shielding enclosure, a connector assembly, and a socket. The connector assembly includes a connector body, a connector printed circuit board, a substantially planar contact holder, electrical contact fingers mounted on the contact holder, and an opto-electronic module. When the EMI-shielding enclosure and socket are mounted on the system substrate, a user can readily insert the connector assembly into the EMI-shielding enclosure and plug it into the socket. A user can likewise readily remove the connector assembly from the EMI-shielding enclosure and socket for maintenance, cleaning, repair or other purposes.

Abstract: An object of the present invention is to provide a technique making it possible to easily manufacture a multi-channel optical module in which optical elements are air-sealed. In the optical module, a package 111 with optical elements mounted thereon is sealed with a transparent plate 109. Above a sealing window of the package, a lens plate 105 having holes 104 or grooves 201 and engagement pins 101 are engaged and optically aligned with each other.

Abstract: An enclosure system for receiving a cable includes an enclosure having an inner chamber and an open position exposing the inner chamber and a closed position covering the inner chamber. A cable receiving port in a wall of the enclosure extends along a longitudinal axis from outside of the enclosure into the inner chamber. The cable receiving port is configured to receive a cable therein when the cable is advanced axially into the port without rotation of the cable when the enclosure is in the closed position. A mating member is associated with the cable receiving port that limits rotation of the cable when the cable is advanced axially into the port. An axial retention member is associated with the cable receiving port that limits axial movement of the cable out of the port when the cable is advanced axially into the port to a lock position.

Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating.

Abstract: A hermetically packaged integrated optical circuit includes an integrated optical circuit and a hermetically sealed container, which defines a volume. The integrated optical circuit is secured within the volume. The hermetically packaged integrated optical circuit further includes a fill gas comprising oxygen disposed within the volume of the hermetically sealed container.

Abstract: In one aspect, the invention described herein provides an enclosure for containing telecommunication lines and/or telecommunication line splices therein. In one embodiment, the enclosure comprises a housing wherein the housing is removeably securable to the base. The base includes an edge wall extending from the bottom plate of the base. A sealing member is disposed on an outer surface of the edge wall. The housing includes an outer side wall and an inner lip spaced apart from the outer side wall. When the housing is secured to the base, the edge wall of the base is inserted between the outer side wall and the inner lip.

Abstract: An optical fiber feedthrough assembly includes a glass plug disposed in a recess of a feedthrough housing. The glass plug may define a large-diameter, cane-based, waveguide sealed within the recess in the housing and providing optical communication through the housing. Sealing occurs with respect to the housing at or around the glass plug of an optical waveguide element passing through the housing by braze sealing to the glass plug and/or embedding the glass plug in a polymer bonded with the plug to form a molded body that is sealed in the housing by, for example, compression mounting of the molded body or providing a sealing element around the molded body.

Abstract: A transceiver module includes a receptacle assembly that isolates the signal ground potential at which an opto-electronic subsystem operates from the chassis ground potential at which the transceiver module housing is maintained, while also helping maintain optical alignment of the system elements. The receptacle assembly can include a receptacle made of metal, a coupling made of metal, and a connector made of a dielectric material. The connector is interposed between the receptacle and the coupling to electrically isolate the signal ground potential of the opto-electronic subsystem from the chassis ground potential of the housing and receptacle. As the metal receptacle is mounted in an opening of the housing, it helps shield the housing against EMI.

Abstract: An optical transceiver with an enhanced productivity is disclosed. The optical transceiver of the invention includes a plurality of OSAs, an optical component of an optical multiplexer or an optical de-multiplexer, and inner fibers connecting the OSAs with the optical component. The optical transceiver further includes a gasket to shield the inside of the housing and put the inner fibers therein to guide them.

Abstract: In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.

Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support

Abstract: In an optical module including a module main body 10, an optical device housed in the module main body 10, and an optical fiber 21 having an end placed in the module main body 10 and optically coupled to the optical device, the end of the optical fiber 21 is held between a semi-cylindrical part 31d of a shield cover 31 that covers the module main body 10 and a semi-cylindrical part 32c of a presser plate 32.

Abstract: A protective socket is provided for use with a parallel optical transceiver module. When the parallel optical transceiver module is seated within a receptacle of the protective socket, the side walls and bottom that define the receptacle of the protective socket protect the internal components of the parallel optical transceiver module from dirt, dust, gases, and other airborne matter.

Abstract: An athermal AWG module 10 comprises: an AWG 11 having waveguides partially divided to separate a chip, separated chips being connected by a compensation plate 33 to achieve temperature-independence; an athermal AWG chip 12 having a substrate and the AWG 11 formed on the substrate; a package 13 having an opening 14 and accommodating the athermal AWG chip 12; and a cover for blocking the opening 14. The athermal AWG chip 12 is fully covered with a gelled refractive index matching agent 16 that is matched in refractive index to the waveguides of the AWG 11. As the gelled refractive index matching agent 16 is excellent in water resistance and hardly passes water, the adhesive agent for fixing the compensation plate 33 to the surfaces of the separated two chips is prevented from being deteriorated due to ingress of water, thereby enhancing the reliability.

Abstract: A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

Abstract: An optoelectronic module for converting and coupling an information-containing electrical signal with an optical fiber including a housing having an electrical input for coupling with an external electrical cable or information system device and for transmitting and receiving information-containing electrical signals over such input, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and receiving an optical signal; an electro-optical subassembly coupled to the information containing electrical signal and converting it to and/or from a modulated optical signal corresponding to the electrical signal; and an electromagnetic shield including (i) a latchable top cover; (ii) an O-ring metallic seal surrounding the optical ports; and (iii) a spring-clip finger shaped sleeve circumferentially surrounding the optical ports.

Abstract: An optical receptacle that enhances the optical coupling tolerance is disclosed. The optical receptacle of the invention provides, in stead of the coupling fiber installed in a conventional optical receptacle, a glass member with a diameter substantially equal to the diameter of the external fiber. The glass member, which is held by the support, provides a convex surface that abuts against the top of the external ferrule and another surface inclined with the optical axis to prevent the light reflected thereat from returning the optical device. The glass member has a substantially homogeneous distribution in the refractive index thereof; accordingly, the fluctuation in the optical coupling with the external ferrule may be reduced.

Abstract: An inventive hermetically sealed leaded package for in-line fiber optic devices, such as an optical fiber tap, is described. The package advantageously employs electrical feedthroughs that are compatible with batch processing of micromachined silicon wafers.

Abstract: A high temperature optoelectronic device package includes a substrate, an optoelectronic die situated on an upper surface of the substrate, a seal surrounding the optoelectronic die and situated on the upper surface of the substrate and a housing disposed on the seal having a ferrule-seating portion. The housing is disposed on the seal such that a fiber optic center of the ferrule-seating portion is aligned with an active portion of the optoelectronic die. The optoelectronic die is in operative communication with electronic traces of the substrate.

Abstract: A connector includes a connector body, a cover movably attached to the connector body, and a limiting mechanism retaining the cover to the connector body. The connector has a mating port for receiving a mating connector, a tongue with a number of contacts exposed to the mating port, and an optical module forwardly exposed to a rear side of the mating port. The cover has a base to cover a front end of the mating port, and an insertion portion extending into the mating port to cover the contacts along an up to down direction and the optical module along a front to back direction. The limiting mechanism can prevent the cover from detaching from the connector body when the cover is pulled out of the mating port.