Sealed From Environment Patents (Class 385/94)
  • Patent number: 7693377
    Abstract: An optical fiber module includes an optical fiber that transmits a light and a holding unit that holds the optical fiber in a state in which the optical fiber is stretched in its longitudinal direction to change optical characteristics of the optical fiber.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: April 6, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masanori Takahashi, Jiro Hiroishi, Masateru Tadakuma, Takeshi Yagi
  • Publication number: 20100080514
    Abstract: A telecommunications cable includes a distribution cable, a tether that branches from the distribution cable, and a tether retention block affixed to the distribution cable. The tether retention block includes a first portion and a second portion that is configured to cooperate with the first portion to secure a tether buffer tube and a strength member of the tether. Each of the first and second portions defines at least a first half-channel configured to cooperate with the first half-channel of the other portion to receive the strength member of the tether.
    Type: Application
    Filed: November 4, 2009
    Publication date: April 1, 2010
    Applicant: ADC Telecommunications, Inc.
    Inventors: Yu Lu, Keith Millea, Jeff Gniadek
  • Publication number: 20100054665
    Abstract: The present disclosure is generally directed to a fiber optic adapter assembly for mating fiber optic connectors. The fiber optic adapter includes a body, an alignment cap, and a shutter door. The alignment cap and the body together define a space with the shutter door pivotally disposed in the space for inhibiting debris from entering through the opening and into the body. The shutter door is configured to pivot inwardly when contacted by a fiber optic connector being inserted through the at least one opening and into the body. Additionally, the shutter door includes at least one standoff and at least one latch, wherein the latch is configured to engage and assist in retaining a fiber optic connector that is inserted into the fiber optic adapter assembly.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 4, 2010
    Inventors: Ashley W. Jones, Daniel Leyva, JR., Michael de Jong, Peter T. Travis
  • Publication number: 20100054674
    Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.
    Type: Application
    Filed: August 3, 2009
    Publication date: March 4, 2010
    Inventors: John J. Fisher, Carl Gaebe
  • Patent number: 7665904
    Abstract: An optical transceiver includes a housing formed to be inserted into or extracted from a cage in a host device, a movable lock member for preventing the housing from being extracted from the cage, where the cage includes a lock hole for preventing the housing from being extracted from the cage when the movable lock member is placed into the lock hole, and an integration parts.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: February 23, 2010
    Assignee: Hitachi Cable, Ltd.
    Inventor: Juhyun Yu
  • Patent number: 7665908
    Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: February 23, 2010
    Assignee: Finisar Corporation
    Inventors: Stephen T. Nelson, Donald A. Ice, Darin James Douma
  • Patent number: 7661889
    Abstract: The present invention provides an apparatus for multiplexing a plurality of light waves with different wavelengths. The apparatus includes a laser sub-assembly, a multiplexer sub-assembly, and a receptacle sub-assembly. The laser sub-assembly includes a plurality of lasers for radiating a plurality of light waves of different wavelengths. The plurality of light waves are multiplexed in the multiplexer sub-assembly. The multiplexed light waves are coupled to an optical fiber by the receptacle sub-assembly.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: February 16, 2010
    Assignee: Beam Express Inc
    Inventors: Lijun Zhu, Jignesh H. Shah, Hairo Hu, Yaogeng Ding, Joseph Vanniasinkam
  • Patent number: 7654753
    Abstract: Various embodiments of optical subassemblies, and arrangements and methods for manufacturing same, for an electro-optical assembly are disclosed. One embodiment comprises an optical subassembly for an electro-optical assembly. The optical subassembly comprises a printed circuit board, an optical semiconductor device, and an optical element. The printed circuit board has a first surface, a second surface, and an aperture therethrough. The optical semiconductor device is attached to the first surface with an active region exposed to the aperture. The optical element is attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: February 2, 2010
    Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
    Inventors: Tom Sheau Tung Wong, Adrianus J. P. van Haasteren, Tze Wei Lim
  • Patent number: 7651280
    Abstract: A coupling for bringing a first conduit in communication with a second conduit. Each of the conduits comprises an end to be coupled and each of the conduits is adapted for conducting a medium. The coupling has a housing and at least one aperture in said housing. The housing is adapted for introducing said first and second conduits into the housing. Furthermore, the coupling comprises a recess in the housing. The recess is adapted for partly receiving the ends of the first and second conduits. The coupling has a seal adapted for sealing the first and second conduits within the recess.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: January 26, 2010
    Assignee: Agilent Technologies, Inc.
    Inventors: Jochen Mueller, Karsten Kraiczek, Bertram Beigel
  • Patent number: 7635227
    Abstract: An exemplary embodiment provides for a cable connection apparatus wherein a connector is mounted on a disk drive chassis, or a sub-assembly attachable to a chassis, such that a cable that connects to the connector will do so along an axis parallel to the chassis or subassembly that the connector is coupled to as opposed to a more typical perpendicular coupling. As a result, the cable will not stick straight out from the back of the drive and the drive footprint is also reduced.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: December 22, 2009
    Assignee: Quantum Corporation
    Inventors: Patrick McCormack, Robert Ralph Heinze
  • Publication number: 20090310923
    Abstract: A fiber optic connector assembly includes a fiber optic connector mounted to a fiber optic cable having a ferrule with an end face terminating an optical fiber. The fiber optic cable is terminated with the fiber optic connector in a clean environment protected against airborne contaminants. A seal is placed about the ferrule within the clean environment to protect the polished end face of the ferrule including the end of the optical fiber against airborne contaminants. The seal is removable to make a fiber optic communications linkage without cleaning the end face of the optical ferrule.
    Type: Application
    Filed: August 26, 2009
    Publication date: December 17, 2009
    Applicant: ADC TELECOMMUNICATIONS, INC.
    Inventors: Jeffrey S. Hovland, Marlon E. Holmquist
  • Patent number: 7628547
    Abstract: An optical module includes: a light source; a variable transmissivity member that is disposed on a light path of light emitted from the light source with a spacing from the light source, the variable transmissivity member having transmissivity that increases as temperature rises; and an optical fiber that receives light that has been transmitted through the variable transmissivity member.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: December 8, 2009
    Assignee: Seiko Epson Corporation
    Inventor: Akira Miyamae
  • Patent number: 7625133
    Abstract: A method of assembling an optical device comprising an optical ferrule (1) is provided, according to which said one optical ferrule (1) is secured to a first substrate (3) so as to form an optical subassembly (13); the method further comprises providing a second substrate (9) comprising a main surface (9a) and at least one groove (9b) extending from said main surface to a predefined depth and securing said optical subassembly (13) to said second substrate (9) in such a way that said at least one optical ferrule (1) is at least partially received into said at least one groove (9b). There is further provided an optical device assembled according to this method.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: December 1, 2009
    Inventor: Andrea Pizzarulli
  • Patent number: 7625136
    Abstract: An optical module includes a light source, a variable transmittance member disposed on a light path of output light from the light source distant from the light source, and a coupling section for coupling the output light from the light source via the variable transmittance member, wherein coupling efficiency as a ratio between intensity of the light from the light source and intensity of light to be coupled to the coupling section rises in conjunction with a rise in temperature.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: December 1, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Akira Miyamae, Kimio Nagasaka
  • Patent number: 7618199
    Abstract: An optical transceiver disposed within a cage includes a main body, a handle and a sliding element. The handle is coupled with the main body. The sliding element is secured to the handle and has an arm which is slidably disposed in a track of the main body. When the handle is rotated, the sliding element slides along the track.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: November 17, 2009
    Assignee: Delta Electronics, Inc.
    Inventors: Yung-Yuan Cheng, Chiung-Hung Wang, Chih-Hsiao Chen
  • Patent number: 7618200
    Abstract: A photoelectric coupling assembly and manufacturing method thereof enabling a three dimensional electrical wiring pattern is provided. The assembly includes a photoelectric conversion unit equipped with a photoelectric conversion element and a molded article. The molded article has a hole configured and arranged to have an optical fiber inserted there-through such that a distal end of the fiber faces an active layer of the conversion element, a front surface on which the conversion unit is mounted, and a side surface being contiguous to the front surface. The lead being insert molded into the molded article has a first surface being exposed at the front surface and electrically connected to the conversion element, a second surface being exposed at the side surface, and an engaging portion having a width increasing in a direction away from the front surface. At least a portion of the engaging portion is contained inside the resin forming the molded article.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: November 17, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Wataru Sakurai, Kazuhito Saito
  • Patent number: 7614797
    Abstract: The present disclosure relates to a backward compatibility converter including a converter housing having a first end positioned opposite from a second end. The first end of the converter housing includes an end wall defining a first opening. The second end of the converter housing defines a second opening. The converter housing defines an internal passage that extends through the converter housing from the first opening to the second opening. The first end of the converter housing includes two paddles that project outwardly from the end wall. The paddles are positioned at opposite sides of the first opening and include inner surfaces that oppose each other. The converter housing defines internal threads located within the internal passage. The backward compatibility converter also includes a coupling nut rotatably mounted about an exterior of the converter housing adjacent the second end of the converter housing.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: November 10, 2009
    Assignee: ADC Telecommunications, Inc.
    Inventors: Yu Lu, Randy Reagan
  • Patent number: 7605049
    Abstract: A transistor that forms an integrated circuit, a photo detector and a micromirror are mounted on the same semiconductor substrate in an optical semiconductor device of the present invention, which has an antireflection film that is formed on the photo detector, a first insulating film which is formed on the antireflection film and in which an opening is created in the state where the antireflection film is exposed, and an etching stopping film which is formed on the first insulating film and which has been left in the periphery around the opening in the first insulating film on the antireflection film and in the periphery around the portion above the micromirror.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: October 20, 2009
    Assignee: Panasonic Corporation
    Inventors: Masaki Taniguchi, Hisatada Yasukawa, Takaki Iwai, Ryoichi Ito
  • Publication number: 20090251697
    Abstract: Embodiments are directed to laser emitter modules and methods and devices for making the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are convenient and cost effective to assemble and provide for active alignment of optical elements of the module.
    Type: Application
    Filed: December 17, 2008
    Publication date: October 8, 2009
    Inventors: Serge Cutillas, Daming Liu, Sang-Ki Park, John Kelly Johnson, Edmund Wolak
  • Patent number: 7597488
    Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: October 6, 2009
    Assignee: Nuvotronics LLC
    Inventor: John J. Fisher
  • Patent number: 7588375
    Abstract: A fiber optic connector assembly includes a fiber optic connector mounted to a fiber optic cable having a ferrule with an end face terminating an optical fiber. The fiber optic cable is terminated with the fiber optic connector in a clean environment protected against airborne contaminants. A seal is placed about the ferrule within the clean environment to protect the polished end face of the ferrule including the end of the optical fiber against airborne contaminants. The seal is removable to make a fiber optic communications linkage without cleaning the end face of the optical ferrule.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: September 15, 2009
    Assignee: ADC Telecommunications, Inc.
    Inventors: Jeffrey S. Hovland, Marlon E. Holmquist
  • Patent number: 7572069
    Abstract: In at least one example, an optical component includes a central optical surface proximate an optical axis, a peripheral portion extending radially from the central optical surface, and a stepped portion between the central optical surface and the peripheral portion. The stepped portion may be formed to raise the central optical surface above the peripheral portion.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: August 11, 2009
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Songyang Li
  • Patent number: 7572068
    Abstract: A laser module includes: a chassis having a light-output window from which one or more laser beams are outputted; a hermetically sealed package which is fixed to the chassis; one or more semiconductor laser elements which are arranged in the hermetically sealed package, and emit the one or more laser beams; a transparent member which is arranged to cover the light-output window; an optical fiber which has a light-entrance end face, and is arranged outside the chassis so that the light-entrance end face is in contact with the transparent member; and an optical condensing system which is arranged inside the chassis, and makes the one or more laser beams pass through the transparent member and be condensed on the light-entrance end face. The transparent member and the optical fiber are detachably attached to the chassis.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: August 11, 2009
    Assignee: FUJIFILM Corporation
    Inventors: Kazuhiko Nagano, Shinichiro Sonoda, Masami Hatori, Hideo Miura, Shinichi Shimotsu
  • Patent number: 7572071
    Abstract: A cable assembly (1) includes an insulative housing (2) having a base portion (21) and a tongue portion (22), said tongue portion (22) defining a number of cavities (222) recessed inwardly from one of an upper or a bottom surfaces of the tongue portion; a number of lenses (5) retained in the cavities (222) and connected to corresponding optical fiber (103); and a plurality of contacts (3, 4) mounted to the insulated housing (2), each of the contacts having a mating portion (32, 42) disposed about the other surface of the tongue portion (22) and a tail portion (36, 46) rearward extending beyond the base portion (21) for electrically connecting with a corresponding wire.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 11, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Jerry Wu
  • Patent number: 7572070
    Abstract: The present invention is an optical device achieving miniaturization, functional integration, and cost reduction, and comprises an optical element chip, an optical fiber assembly comprised of an optical fiber, a first ferrule, and a second ferrule, a package containing and enveloping the optical element chip and having an opening for introducing the optical fiber assembly, and a support pipe mounted on an extension of the opening to support an introductory part of the optical fiber into the package together with the second ferrule constituting the optical fiber assembly to be introduced into the package and to hermetically seal the package, wherein the second ferrule is fixed inside the support pipe, one end thereof protrudes toward an inner part of the package, and another end substantially protrudes at a tip part of the support pipe by a length required for the airtight fixing.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: August 11, 2009
    Assignee: Fujitsu Limited
    Inventor: Seimi Sasaki
  • Patent number: 7570853
    Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: August 4, 2009
    Assignee: Linden Photonics, Inc.
    Inventors: Amaresh Mahapatra, Robert J. Mansfield
  • Patent number: 7559705
    Abstract: A receiver optical amplifier assembly (ROSA) is disclosed that provides for greater tolerances in alignment. The ROSA includes a multimode fiber stub to receive a light beam from a single mode optical fiber. The light beam from the multimode fiber stub is focused by a lens system onto the active area of an optical detector chip. The multimode fiber stub acts as a GRIN lens and allows for optimization of the spot size on the active area. Additionally, in some embodiments the return loss characteristics of the ROSA can be greatly improved by including an angled surface on the multimode fiber stub and moving the active area of the optical detector chip off-axis to compensate.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: July 14, 2009
    Assignee: Opnext, Inc.
    Inventors: Joseph Indhiran Vanniasinkam, Lijun Zhu
  • Patent number: 7559703
    Abstract: An optical module includes a fiber array, a laser diode array, a photodiode array and a micro-lens array. The fiber array includes optical fibers which are divided to a transmitter group and a receiver group. The laser diode array includes laser diodes which are grouped in a transmitter group. The photodiode array includes photodiodes which are divided to a monitor group and a receiver group. The laser diode array is provided between the fiber array and the photodiode array. The optical fibers of the transmitter group are optically aligned with the laser diodes of the transmitter group, respectively. The micro-lens array is provided between the laser diode array and the photodiode array, and optically aligns the laser diodes of the transmitter group and the optical fibers of the receiver group with the photodiodes of the monitor group and the photodiodes of the receiver group, respectively.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: July 14, 2009
    Assignee: Ibiden Co., Ltd.
    Inventors: Takemasa Tamanuki, Chris Keller
  • Publication number: 20090162018
    Abstract: A hermetically sealing member with an optical transmission means transmits an optical signal economically and practically between the inside and the outside of a shielding member covering a printed-circuit board while sustaining the hermetically sealed state certainly. An optoelectronic device and an optical transmission method are also provided. A hermetically sealing member (1) with an optical transmission means includes a gasket body fixed between a printed-circuit board and a sealing face of a shielding member, and a tape fiber formed integrally with the gasket body.
    Type: Application
    Filed: September 28, 2006
    Publication date: June 25, 2009
    Inventors: Yusuke Hayase, Atsushi Ono, Toshiyuki Okayasu
  • Patent number: 7543999
    Abstract: An optical module comprising an opto-electronic component, a lens and a mirror that is hermetically sealed by a micro housing containing a lid and a base is disclosed. The optical module may be assembled onto a moveable holder for aligning an optical beam into an optical assembly having an optical waveguide.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: June 9, 2009
    Assignee: Hymite A/S
    Inventors: Marcus Winter, Ralf Hauffe, Arnd Kilian
  • Patent number: 7537397
    Abstract: An optical-isolation apparatus of an optical-fiber connector is mainly applied in the optical transmission apparatus and the optical receiving module of the optical-fiber connector to isolate the optical transmission apparatus and the optical receiving module to prevent optical and electrical influences therebetween. Two electrically-conductive shells respectively cover the optical transmission apparatus and the optical receiving module of the optical-fiber connector. The front end of the electrically-conductive shell is set with an opening, and a pin is extended out from the electrical-conducting shell at the bottom portion. By the aforementioned composition of devices, the optical-isolation apparatus of the optical-fiber connector is formed.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: May 26, 2009
    Assignee: Comoss Electric Co., Ltd.
    Inventor: Eden Tsai
  • Patent number: 7510338
    Abstract: An optical transmitting/receiving apparatus capable of suppressing electrical crosstalk and magnetic crosstalk, includes: a laser diode/photo diode (LD/PD) integrated module that terminates a single-core bidirectional optical fiber; a circuit board electrically connected to a lead pin led out of the LD/PD integrated module; and a plastic case that accommodates the circuit board. At least a part of the plastic case abuts against the LD/PD integrated module, and impedance of the plastic case is controlled by mixing a conductive filler into the plastic case.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: March 31, 2009
    Assignee: Fujitsu Limited
    Inventors: Shin-ichi Sakuramoto, Masakazu Horishita, Kazuya Sasaki, Masaki Kunii, Tetsuya Yamada
  • Patent number: 7507035
    Abstract: The present invention provides a new arrangement of the stem and the cap resistance-welded to the stem, in which the deformation induced by the welding in a portion adjacent to the projection does not cause the failure for the assembly of the module. The cap and the stem of the present module provided first and second portions. The diameter of the second portion is greater than that of the first portion such that, even the welding deforms the first portions of the cap and the stem; the deformed portion is inside of respective second portions.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: March 24, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Hiroyuki Yabe
  • Patent number: 7500793
    Abstract: A glass-to-meal seal for use in high temperature and high pressure environments is described. The glass-to-metal seals includes an optical fiber having a metallized portion, the metallized portion having an outer dimension; an object having a high strength, corrosion-resistant alloy, the object having an outer surface and an inner surface defining a bore, the bore having a dimension larger than the outer dimension of the metallized portion of the optical fiber; and a hardened solder material disposed between the metallized portion of the optical fiber and the inner surface of the bore, such that a hermetic seal is provided between the metallized portion of the optical fiber and the inner surface of the bore; wherein the solder includes a substance having a melting temperature greater than about 250° C.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: March 10, 2009
    Assignee: Greene, Tweed of Delaware, Inc.
    Inventors: Pragna Subhash Patel, Trung D. Nguyen, Charles Pence Burke, George Frank DeNardo, Jr.
  • Patent number: 7490999
    Abstract: Methods and structures for reducing the moisture penetration in an optical device such as an isolator, collimator, filters, circulators, and the like. Methods can include placing an optical cover over the opening(s) of the housing of the optical device. The optical cover can be bonded by epoxy or metallic seal. A moisture prevention coating can be placed over the seal line between the optical cover and the housing to further enhance moisture prevention.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: February 17, 2009
    Assignee: Finisar Corporation
    Inventors: William Freeman, Ming Shi, Hongjin Jiang
  • Patent number: 7491000
    Abstract: A base structure for a light emitting device includes a supporting device for supporting a light emitting element, a connection device for being electrically connected to the light emitting element, and a filler member. The supporting device includes a metallic material. The connection device surrounds the supporting device and includes a metallic material. The filler member fills a gap separating the supporting device from the connection device.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: February 17, 2009
    Assignee: Kyocera Corporation
    Inventors: Nobuyuki Takehashi, Mitsugu Uraya, Masakazu Yasui, Kousuke Katabe, Yuuki Mori, Daisuke Sakumoto
  • Patent number: 7488116
    Abstract: It is often desirable to efficiently couple laser foci that are dimensionally large to dimensionally small optical fibers. A fiber fused in a lower refractive index fiber is disclosed. The fiber/ferrule construct is characterized by having no taper of the fiber in the ferrule and a negative lens shape at a fiber/ferrule face. This construct enable the coupling of imparting rays that fall outside of the fiber core into the transmission path of the fiber. Where the laser systems are integrated in a manner that precludes altering the focusing optic, such as in surgical laser systems, or where the laser's beam focal properties are such that reducing the focal spot diameter is impractical for fiber coupling, modification of the optical fiber input geometry offers a means of customizing the laser-to-fiber interface for applications involving different fiber diameters.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: February 10, 2009
    Inventor: Griffin Steve
  • Patent number: 7484897
    Abstract: There is provided an optical module for coupling with a fiber optic cable through an optical connector, including a module body connectable with a plug of the optical connector by a dedicated guide pin, with a side surface of the module body being opposed to a mating surface of the connector plug at which an end face of the fiber optic cable is exposed, and an optical element mounted to the module body and having an optical axis brought into alignment with an optical axis of the fiber optic cable upon fitting of the guide pin into the module body and the connector plug.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: February 3, 2009
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Masaki Ono, Toshikatsu Takada, Toshifumi Kojima, Takeshi Ohno, Susumu Wakamatsu, Toshikazu Horio, Ayako Kawamura
  • Patent number: 7484900
    Abstract: The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: February 3, 2009
    Assignee: Avanex Corporation
    Inventors: Roberto Galeotti, Luigi Gobbi, Mario Bonazzoli
  • Patent number: 7476038
    Abstract: An optical device module includes an optical device, a soaking unit fixed to one surface of the optical device, a heating/cooling unit fixed to one surface of the soaking unit, a heat-insulating unit fixed to one surface of the heating/cooling unit, and a package that houses the optical device, the soaking unit, the heating/cooling unit, and the heat-insulating unit and to which the heat-insulating unit is fixed. The heating/cooling unit heats the optical device using self-generated heat or cools the optical device via the soaking unit.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: January 13, 2009
    Assignee: Fujitsu Limited
    Inventors: Yoichi Oikawa, Hirofumi Aota, Kazuaki Akimoto, Hideyuki Miyata, Yumi Nakazawa, legal representative, Tadao Nakazawa
  • Patent number: 7476041
    Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: January 13, 2009
    Assignees: Commissariat a l'Energie Atomique, Intexys
    Inventors: Christophe Kopp, Stephane Bernabe
  • Patent number: 7474814
    Abstract: A light-emitting element (2) and a light-receiving element (3) are mounted, spaced from each other, on a main body (1a) of a flexible board (1). These elements (2, 3) are encapsulated in a light-permeable light-emitting side molded resin section (6a, 6b) and a light-permeable light-receiving side molded resin section (6c, 6d), respectively. Positions of the light-emitting element (2) and light-receiving element (3) and orientations of a light-emitting surface of the light-emitting element (2) and a light-receiving surface of the light-receiving element (3) are freely settable owing to flexibility of the flexible board (1). A communication IC (4) is mounted on the flexible board (1) and between the elements (2, 3) and encapsulated in an IC side molded resin section (6e, 6f). An extended portion (1b) extends from a midsection of the main body (1a) of the flexible board (1) and has an external connection terminal (11) at its tip.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: January 6, 2009
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kazuhito Nagura
  • Patent number: 7473039
    Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: January 6, 2009
    Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
    Inventors: Robert H. Yi, Brenton A. Baugh, James H. Williams
  • Patent number: 7467897
    Abstract: An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light emitting device and an optical monitor. In addition, the module includes a transparent plate with at least two reflective regions that together redirect part of the light from the light emitting device to the optical monitor.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: December 23, 2008
    Assignee: Hymite A/S
    Inventors: Ralf Hauffe, Arnd Kilian
  • Patent number: 7465106
    Abstract: An optical receptacle includes: a fiber stub having a ferrule and an optical fiber in a through-hole of the ferrule; a holder to which an rear end of the fiber stub is fixed; and a sleeve for holding a plug ferrule in front of the fiber stub; wherein a grip ring is provided on an outer side face in which the fiber stub and the sleeve are overlapped to each other, whereby attaining the shortened optical receptacle, and improving connection loss due to tilting of the plug ferrule, and obtaining good repeatability of the connection loss.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: December 16, 2008
    Assignee: Kyocera Corporation
    Inventors: Hiroki Ito, Tsuyoshi Tanaka, Toshiyuki Matsumoto
  • Publication number: 20080298753
    Abstract: Optical waveguide connector for use mainly in water with a socket part (100) having at least one first waveguide contact placed in a channel of socket part (100) and a plug part with at least one second waveguide contact placed in a channel of the plug part, the plug part channel being sealed with a piston displaceable counter to the force of a spring, the socket part (100) has a pivotably constructed cap (140) sealing the interface surface of the waveguide contact and which in the unplugged state covers the waveguide contact interface surface, and the plug part has a path receiving the displaceable, spring-loaded piston and which in at least one section is inclined to the axis of the at least one plug part waveguide contact and during the plugging process the cap (140) of socket part (100) displaces the spring-loaded piston, frees the waveguide contact of socket part (100) and frees the waveguide contact in the plug part channel and is guided through the path.
    Type: Application
    Filed: November 22, 2005
    Publication date: December 4, 2008
    Applicant: GISMA STECKVERBINDER GMBH
    Inventors: Manfred Maletzky, Oliver Hirsch
  • Patent number: 7452140
    Abstract: A method and structures for protectively enclosing and sealing optoelectronic modules having emitter or detector diode arrays aligned with optical fiber facets in optoelectronic transmitters and receivers. A non-hermetic enclosure provides mechanical protection of the components during alignment and assembly of the module. A substantially hermetic enclosure provides additional protection of optoelectronic components against airborne contaminants or moisture. The protective enclosures physically encompass the diode array chip with its delicate wire bonds and also provide a liquid containment dam for easier application of resin for protective encapsulation of the diode array chip. Dual resin encapsulation may include a first resin layer chosen for transparency and a harder setting covering layer. These protective variants can be implemented in different combinations offering varying degrees of protection of the optical components.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: November 18, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Masataka Ito, Toshi K. Uchida
  • Patent number: 7440647
    Abstract: An integrated fiber optic assembly includes some of the active components that are otherwise found in a typical transceiver. For example, a transmitter optical assembly includes a laser source, a laser driver, and a component for administering diagnostic data. A receiver optical assembly includes a photo-diode an optical converter, such as a transimpedance amplifier, and a processing control that can administer, for example diagnostic data associated with the receiver optical assembly. A combination optical assembly includes a photo-diode and a laser source, as well as many of the active components for driving, operating, or administering the laser source. In part since the active components can be placed in close proximity to each other, electrical impedance is reduced that would otherwise be present in a typical transceiver and optical subassembly.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: October 21, 2008
    Assignee: Finisar Corporation
    Inventor: Lucy G. Hosking
  • Patent number: 7438484
    Abstract: An electrical connector includes an entry slot, first and second transmitter electrical pins, and first and second receiver electrical pins. The first and second transmitter electrical pins and the first and second receiver electrical pins are provided on the entry slot. The entry slot accepts a multi form-factor pluggable transceiver which has first and second optical transmitter channels and first and second optical receiver channels. The first transmitter electrical pins are electrically connected to first transmitter electrical pads of the first optical transmitter channel. The second transmitter electrical pins are electrically connected to second transmitter electrical pads of the second optical transmitter channel. The first receiver electrical pins are electrically connected to first receiver electrical pads of the first optical receiver channel. The second receiver electrical pins are electrically connected to second receiver electrical pads of the second optical receiver channel.
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: October 21, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Takemasa Tamanuki, Chris Keller
  • Patent number: 7431516
    Abstract: Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: October 7, 2008
    Assignee: National Semiconductor Corporation
    Inventors: William Paul Mazotti, Jia Liu, Luu Thanh Nguyen, Haryanto Chandra, Peter Deane, Todd Thyes, Brian Huss, John Rukavina, Glenn Woodhouse