Abstract: A light-diffusing safety cap for use with a light cable that couples an endoscope to a high intensity light source. The light-diffusing safety cap can be detachably or releasably coupled, in lieu of the endoscope, to the light cable, such that when the high intensity light source emits a high intensity light and the endoscope is not connected to the light cable, the light-diffusing safety cap reduces the intensity of the high intensity light emitted to the environment and provides an indication that the high intensity light source is activated when the endoscope is not connected to the light cable.

Abstract: A package comprises a substrate (101, 401) with a longitudinal direction and a lateral direction perpendicular thereto. The substrate (101, 401) has a recess (103, 403) formed in a first surface (102, 402) and the recess (103, 403) extends in the longitudinal direction of the substrate (101, 401), said recess (103, 403) having an inner surface. The inner surface of the recess (103, 403) comprises at least a first set of conductive areas. The first set comprises at least a first area (106, 406) and a second area (107, 407) being provided with a conductive layer, said first area (106, 406) and said second area (107, 407) being mutually spaced in the lateral direction. The package additionally comprises a cap (151, 251, 351, 451.) with a first surface (152, 252, 352, 452) for mounting on top of said first surface (102, 402) of said substrate (101, 401), the cap (151, 251, 351, 451) and the recess (103, 403) of the substrate (101, 401) defining an elongated channel in the longitudinal direction.

Abstract: The invention relates to a hermetic feedthrough of an optical fiber into a package for an optical module, that includes a package ferrule hermetically attached to the package or integral therewith, a fiber ferrule hermetically sealed around the optical fiber, and a compression sleeve hermetically sealed around the package ferrule. The compression sleeve is hermetically sealed to the fiber ferrule or integral therewith, and wherein a coefficient of thermal expansion (CTE) of the compression sleeve is greater than a CTE of the package ferrule so that a joint between the compression sleeve and the package ferrule is under compressive stress.

Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Abstract: A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Abstract: An optical transceiver provides a TOSA, a ROSA, a base member, a circuit board and a shield member. The shield member is formed by cutting and bending a metal sheet without welding or soldering. The shield member includes a center partition and a pair of sides, which forms two spaces each receiving the TOSA or the ROSA. The center partition has a V-shaped cross section which is able to be inserted into a cut of the circuit board so as to shield the ROSA from the TOSA. The shield member provides a frame ground by being in the bottom of the center partition in contact with the base member and also in contact with the cover.

Abstract: A system for fiber optic packaging includes a first substrate and a first deformable pad coupled to the first substrate. The first deformable pad is characterized by a thermal conductivity greater than 1 W/mK. The system also includes a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad. The system further includes a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.

Abstract: A strain-relief assembly for a field-installable fiber optic connector is disclosed, wherein the assembly includes a ferrule holder, an intermediate sleeve, and a crimp sleeve. The ferrule holder back section holds a buffered section of a fiber optic cable, while the ferrule holder front end holds a ferrule and a splice assembly. A stub fiber is held within the ferrule and the splice assembly so as to interface with a section of field optical fiber protruding from the buffered section. The intermediate sleeve engages and generally surrounds a portion of the ferrule holder back section and thus surrounds a portion of the buffered layer. An intermediate sleeve handler may be used to handle the intermediate sleeve and attached the intermediate sleeve to the ferrule holder back section. Stress-relief strands from the fiber optic cable are flared around the outer surface of the intermediate sleeve. A crimp sleeve is placed over the intermediate sleeve to hold the ends of the stress-relief strands in place.

Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.

Abstract: There is provided a connecting system including a connecting apparatus that includes (i) a signal transfer path that transfers one of an electrical signal and an optical signal and (ii) a connecting device that connects the signal transfer path to a connection target component in such a manner that a signal is capable of being transferred therebetween, and a connected apparatus that includes the connection target component to be connected to the signal transfer path. Here, the connecting device includes a moving portion that has therein a sealed space. The moving portion moves an end portion of the signal transfer path closer to the connection target component so that the end portion of the signal transfer path is connected to the connection target component in response to an increase in a pressure within the moving portion, and moves the end portion away from the connection target component in response to a decrease in the pressure within the moving portion.

Abstract: An optical module 10 has a laser light source 20, optical branching means 24 for receiving laser light from the laser light source 20, making a part of the laser light pass through the optical branching means and branching a remaining part of the laser light; a photodetecting portion 30P receiving the remaining part of the laser light branched from the optical branching means 24 and a package 11 holding therein the laser light source 20, the optical branching means 24 and the photodetecting portion 30P, the package 11 having stray light reducing means 200, 201 and 202 provided therein to reduce stray light generated inside the package.

Abstract: For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Abstract: An optical module includes: a plurality of leads arranged in at least two lines, at least portions of the plurality of the leads being mounted on a circuit board; an optical semiconductor for emitting or receiving an optical signal; and a circuit portion connected to the optical semiconductor, for transmitting a pair of differential signals to or receiving a pair of differential signals from the circuit board through a pair of differential signal leads among the plurality of the leads. The pair of the differential signal leads are provided adjacent and in parallel to each other in one of the at least two lines.

Abstract: The invention relates to a circuit arrangement with an electronic circuit on a printed circuit board and an electrically screening housing surrounding the circuit board, wherein there are on said circuit board a HF plug-and-socket connector connected to the electronic circuit with an outer conductor part and an inner conductor part, wherein the HF plug-and-socket connector penetrates through an opening in the housing. The outer conductor part of the HF plug-and-socket connector is electrically isolated from the housing, and wherein a tunnel-like screening sleeve surrounds the outer conductor part both axially and circumferentially at least partially, the sleeve being connected electrically to the housing and capacitively to the outer conductor part of the HF plug-and-socket connector.

Abstract: An optical device for monitoring a rotatable shaft is disclosed. The optical device has an optical waveguide arranged on the rotatable shaft and an optical sensor. The optical device further has a transmitting unit transmit the light signal, a transfer device to transmit the light signal between the transmitting unit and the optical waveguide and an evaluation unit for determining a physical variable from a light signal coming from the optical sensor and transferred by the transfer device, the evaluation unit being associated with the transmitting unit. The transfer device has an optical ‘multimode’ waveguide associated with a coupling device, the waveguide being associated with the transmitting unit and a further optical ‘multimode’ waveguide, with an associated coupling device associated with the optical waveguide and arranged on the rotatable shaft eccentrically to its axis.

Abstract: A sensor apparatus for sensing parameters of an object may include at least one optical fiber, one or more attaching members and a tensioner. The one or more attaching members may be coupled to the optical fiber and may attach the one optical fiber to an object. The tensioner may be coupled to the optical fiber and may secure the one or more optical fiber against a surface of an object.

Abstract: An optical module with a sleeve assembly is disclosed. The sleeve assembly, which receives a ferrule secured in an end of the optical connector and is primarily made of resin material, provides a buried member made of a material, typically meal, having a polygonal cross section, a linear thermal expansion coefficient less than that of the resin material and a Young's Modulus greater than that of the resin material. The bore of the sleeve assembly has a deformed circular shape with a first diameter less than the outer diameter of the ferrule.

Abstract: An optical element including a transmitting surface section and at least one reflective surface section integrally formed on a main body of the optical element. The transmitting surface section refracts incident light emitted from a predetermined light-emitting position and transmits the light. The reflective surface section reflects the incident light emitted from the light-emitting position such that the light returns to a position differing from the light-emitting position. An optical axis of the transmitting surface section and an optical axis of the reflective surface section are out of alignment such as to be mutually parallel or mutually tilted.

Abstract: An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.

Abstract: Fiber optic assemblies are disclosed that include a protecting material that encapsulates a portion of a fiber optic connector for protecting the same in the field until needed by the craft. In one embodiment, the fiber optic assembly includes a protective barrier such as a tape, foil, or the like disposed about the fiber optic connector. In other embodiments, the fiber optic assembly includes structure for removing the protecting material such as a ripcord or a notch in the protecting material. Additionally, the protecting material may include carbon black for providing UV protection.

Abstract: In an optical transceiver module, the bottom surface of the lid is temporarily attached to the top surface of the submount assembly in a pre-alignment position prior to performing the solder flowing process in order to prevent the lid from shifting position during the solder flowing process. The solder flowing process is then performed to melt the solder. When the solder melts, the surface tension of the melted solder pulls the lid into its ultimate, or permanent, aligned position. The solder is then cooled, causing it to harden, thereby securing the lid to the submount assembly in its ultimate, permanently aligned position. The hardened solder between the top surface of the submount assembly and the bottom surface of the lid forms a hermetic seal that encloses components on the transmit side of the transceiver module in a hermetically-sealed environment.

Abstract: An adapter with a dust shutter also provides eye protection and an even seal around the connector opening. The adapter includes a main body, a cover, and a resilient member to bias the cover in a closed position. The adapter also includes a flexible member to assist in sealing the adapter. The resilient member contacts the cover in a center portion and the cover floats relative to the main body to ensure a good seal.

Abstract: The invention relates to a data transmission cable (10; 20), in particular for motor vehicles, at at least one of whose ends a plastics housing (14; 24) is arranged, said housing having mechanical dimensions in its interface region (30; 32) which conform to the FAKRA standardisation scheme. The data transmission cable (10; 20) has an optical waveguide, wherein a holding member (40) is provided in the plastics housing (14; 24), said holding member being configured for holding an optical imaging element (42) and for connecting the optical imaging element (42) to the optical waveguide.

Abstract: An optical connector defining a receiving space for receiving a corresponding plug includes an insulative housing, an optical module mounted to the insulative housing, and a protecting mechanism assembled into the receiving space. The insulative housing has a front surface at a rear side of the receiving space. The optical module has a light receiving element located behind the front surface and forwardly exposed to the receiving space. The protecting mechanism has a door lying in a vertical plane in front of the front surface to shield the light receiving element along an insertion direction when the plug is not inserted into the receiving space, and moving downwardly out of the receiving space to unveil said light receiving element in said insertion direction when the plug is inserted into the receiving space.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: An electromagnetic interference (EMI) shielding and/or grounding gasket generally includes one or more sides and slots along the one or more sides. Finger elements are defined by the slots. The finger elements include contact portions for electrically contacting at least one electrically conductive surface adjacent to a mounting surface when the gasket is mounted thereto with its one or more sides disposed about and in electrical contact with the mounting surface. The gasket may thus be operable for establishing an electrically conductive pathway between the electrically-conductive surface and the mounting surface.

Abstract: An optical connector defining a receiving space for receiving a corresponding plug includes an insulative housing, an optical module mounted to the insulative housing, a rotary door retained at a rear side of the receiving space and a slider engaging with the door. The optical module has a light receiving element forwardly exposed to the receiving space and shielded by the door. The slide can drive the door moving along an inserting direction, and rotating along an anticlockwise direction at the same time to make the light receiving element of the optical module be exposed to the receiving space when the plug is inserted into the receiving space and pushes the slider backwardly.

Abstract: An optical connector in which a seal member is difficult to be damaged during assembly. A seal member-accommodating portion that accommodates the seal member in a compressed state is formed as an intermediate portion of a through hole of a housing. When an insertion member is inserted into the through hole, an insertion portion of the insertion member presses the seal member into the seal member-accommodating portion.

Abstract: A beam coupler assembly for a fiber laser is disclosed. The assembly includes a housing having a sidewall with an interior surface, an exterior surface, a first end and a second end. A first seal extending from the interior surface of the tubular housing and dividing the housing into a first section and a second section is also provided. The first section and second section are environmentally isolated from one another. However, the first seal is substantially optically neutral. An input collimator unit received within the first end of the sidewall of the housing and into the first section and is releasably coupled thereto. An output collimator unit received within the second end of the sidewall of the housing and into the second section and is also releasably coupled thereto.

Abstract: A fiber optic sensor for detecting acceleration or displacement includes a fiber optic probe with a multimode transmitting optical fiber, a multimode receiving optical fiber and a edge reflector spaced apart from the fiber probe. The reflector moves in a transverse direction substantially normal to the longitudinal axis of the fiber optic probe, so the amount of light received by the receiving fiber indicates a relative acceleration or a relative displacement of the reflective surface with respect to the fiber probe in the transverse direction of motion of the edge of the reflector. The reflector can be mounted on a cantilever beam. The sensor can have one transmitting fiber, two receiving fiber, and a reflector with two edges, each edge partially covering one of the receiving fibers. A triaxial sensor system has at least two two-fiber sensors.

Abstract: The present disclosure is generally directed to a fiber optic adapter assembly for mating fiber optic connectors. The fiber optic adapter includes a body, an alignment cap, and a shutter door. The alignment cap and the body together define a space with the shutter door pivotally disposed in the space for inhibiting debris from entering through the opening and into the body. The shutter door is configured to pivot inwardly when contacted by a fiber optic connector being inserted through the at least one opening and into the body. Additionally, the shutter door includes at least one standoff and at least one latch, wherein the latch is configured to engage and assist in retaining a fiber optic connector that is inserted into the fiber optic adapter assembly.

Abstract: In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.

Abstract: Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.

Abstract: An optical module, including: an optical transmission line holding member having an optical semiconductor element mounting surface, an electrical interconnection layer formed on the mounting surface, and an optical transmission line guide hole with an opening on the mounting surface; an optical transmission line inserted into the guide hole; an optical semiconductor element, mounted on the mounting surface, having an electrode and a light-receiving or light-emitting area on a surface facing the mounting surface; an electrical connection portion which electrically connects the electrode and the interconnection layer, formed between the semiconductor element and the mounting surface; a first resin filling a space around the connection portion between the semiconductor element and the mounting surface; and a second resin filling a gap between the optical transmission line and the semiconductor element, with a property different from that of the first resin, and a method of manufacturing the module.

Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.

Abstract: A bi-directional optical subassembly (BOSA) is disclosed. The BOSA of the present invention provides first and second optical devices, a WDM filter and the body that is configured to secure two optical devices and to install the WDM filter. The body has a cylindrical shape with a large bore, a small bore and a joint bore connecting two bores. The WDM filter is attached to the tapered surface of the joint bore.

Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.

Abstract: In accordance with at least one embodiment of the present invention, a manufacturing system includes a factory system and a field system. The factory system includes a first mount configured to receive, support, and precisely locate a removable line replaceable unit (LRU) having one or more components at a first factory LRU station within the factory system. The received LRU components are capable of adjustment to configure proper operation of the received LRU within the factory system. The field system corresponds to the factory system and includes a second mount configured to receive, support, and precisely locate an LRU removed from the factory system at a first field LRU station corresponding to the first factory LRU station. The removed and received LRU is configured for proper operation within the field system without adjustment of the one or more LRU components.

Abstract: An optical device includes at least one optical fiber cable receiving area for receiving at least one optical fiber cable, the receiving area being sized to receive a covering for covering at least a portion of the transition area, and at least one optical fiber cable transition portion disposed at the receiving area, the optical fiber cable transition portion being responsive to and supporting the covering when pressure from the covering is applied to the transition area and the covering and said transition area together form a buffer zone associated with at least a portion of the cable receiving area. Methods include providing a multi-port optical connection terminal having a stub cable port; connecting a stub cable assembly including a stub cable to the stub cable port; and forming a sloped buffer zone between the stub cable port and the stub cable to relieve stress in the stub cable.

Abstract: Double mold opto-coupler and method for manufacture. A first subassembly is formed that includes a light detector. The first subassembly is molded with a first mold material to form a molded first subassembly. A light source is attached to the molded first sub-assembly to form a second sub-assembly. The second sub-assembly is molded with a second mold material to form a final assembly with predetermined dimensions.

Abstract: A sub-mount for mounting optical components includes a recess for mounting whose side wall is tapered. A light transmission and reception module includes the sub-mount for mounting optical component. The sub-mount is manufactured by forming a master mold of the sub-mount formed with projections and recesses including the recess for mounting of the sub-mount, applying liquid silicone rubber to the mater mold, curing the liquid silicone rubber to produce a mold for duplication, filling the curable material into the mold for duplication, curing the curable material, and separating the cured curable material from the mold for duplication.

Abstract: An optical fiber connector (100) includes a first insulative housing (1), a door (2) assembled in the first housing and an elastic piece (3) with one end retained in the first housing and the other end elastically abutting against the door. The first housing defines a top face (10), a front face (11) connecting with the top face and a pair of sidewalls (13). The first housing further defines a receiving cavity (111) opening through the front face thereof, and each sidewall defines a recess (112) opening through the top face and the inner surface of the receiving cavity near an opening of the receiving cavity. The door is movably assembled at the opening of the receiving cavity and defines a pair of shafts (22) received in the recesses. Each recess integrally defines a protrusion (113) over the shaft therein, so as to prevent the shafts from breaking off the recesses.

Abstract: An optical module includes a fiber array, a laser diode array, a photodiode array and a micro-lens array. The fiber array includes optical fibers which are divided to a transmitter group and a receiver group. The laser diode array includes laser diodes which are grouped in a transmitter group. The photodiode array includes photodiodes which are divided to a monitor group and a receiver group. The laser diode array is provided between the fiber array and the photodiode array. The optical fibers of the transmitter group are optically aligned with the laser diodes of the transmitter group, respectively. The micro-lens array is provided between the laser diode array and the photodiode array, and optically aligns the laser diodes of the transmitter group and the optical fibers of the receiver group with the photodiodes of the monitor group and the photodiodes of the receiver group, respectively.

Abstract: A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.

Abstract: A fiber access terminal includes a drop cable side and a distribution cable side. The sides are separated by a frame to which a variety of cable management and cable connections components may be mounted. Optical fibers are routed from drop and distribution cables through a plurality of routing paths to splice trays for connection to other optical fibers. The terminal includes a base and a dome cover mounted to the base defining an enclosed interior. Passageways between the base and the dome cover are closed by removable covers to limit moisture and animals from accessing an interior of the dome cover. A tether connects the removable covers to the frame. The removable covers include one or more break out regions configured for being removed to receive one or more cables.

Abstract: An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Abstract: An optical port apparatus includes a housing having oppositely disposed first and second housing surfaces and a housing body extending therebetween. A housing aperture extends about a central axis of the housing body. A groove surrounds the housing aperture. The groove extends partially through the housing body and has a bottom groove surface spaced from the second housing surface by a groove side wall. A shelf is located between the groove and the housing aperture. A gasket is located in the groove adjacent the bottom groove surface. The gasket surrounds the housing aperture. A window is located across the housing aperture in contact with the shelf. An elastomeric adhesive is located in the groove between the groove side wall and at least one of the window and the gasket. A bezel is fastened to the second housing surface adjacent the groove.

Abstract: A hermetically sealing member with an optical transmission means transmits an optical signal economically and practically between the inside and the outside of a shielding member covering a printed-circuit board while sustaining the hermetically sealed state certainly. An optoelectronic device and an optical transmission method are also provided. A hermetically sealing member with an optical transmission means includes a gasket body fixed between a printed-circuit board and a sealing face of a shielding member, and a tape fiber formed integrally with the gasket body.

Abstract: A plastic optical fiber connector includes an optical fiber connector having a plate body formed therein. On the plate body, a focusing hole is formed, the focusing hole having a holding portion extending outwardly from a side thereof. With provision of the plate body, two reception spaces are formed in the optical fiber connector, with one of which having a seat body on which an optical transceiver is provided therein, wherein a transceiver terminal of the optical transceiver is bonded to the focusing hole on the plate body. Further, a wire seat is sleeved within the optical fiber connector so that the holding portion is allowed to be placed into an optical fiber guiding hole of the wire seat.

Abstract: A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.