Abstract: A device for assembling orders of food from prepared food items having multiple sides on different sides of the device is disclosed. Also disclosed is a system including the device and a method of assembling orders of food. Each side has a plurality of side receptacles accessible to a worker at the side. Adjacent to the sides is a holding area for holding prepared food items. Preferably the heated holding area has a central portion that is heated.

Abstract: A heat radiating plate storage tray has a plate main body, and a plurality of first projection portions provided on a first surface of the plate main body. A heat radiating plate having a rectangular recessed portion on a surface thereof is capable of being mounted on the first surface of the plate main body, a top face of the first projection portion supports a bottom face of the recessed portion of the heat radiating plate, and a height of the first projection portion is larger than a depth of the recessed portion of the heat radiating plate.

Abstract: Multi-zone, solar cell diffusion furnaces having a plurality of radiant element (SiC) or/and high intensity IR lamp heated process zones, including baffle, ramp-up, firing, soaking and cooling zone(s). The transport of solar cell wafers, e.g., silicon, selenium, germanium or gallium-based solar cell wafers, through the furnace is implemented by use of an ultra low-mass, wafer transport system comprising laterally spaced shielded metal bands or chains carrying non-rotating alumina tubes suspended on wires between them. The wafers rest on raised circumferential standoffs spaced laterally along the alumina tubes, which reduces contamination. The bands or chains are driven synchronously at ultra-low tension by a pin drive roller or sprocket at either the inlet or outlet end of the furnace, with appropriate tensioning systems disposed in the return path. The high intensity IR flux rapidly photo-radiation conditions the wafers so that diffusion occurs >3× faster than conventional high-mass thermal furnaces.

Abstract: A frame supporting a containment chamber, the containment chamber is preferably configured to enclose and confine a process chamber. A heat source module is disposed between the containment chamber and the process chamber, while a collar communicates with the process chamber and is secured to the process chamber. Preferably, a heat source door is in fluidic communication with the process chamber, and includes at least a top hat section secured to a main body portion, an over center latch secured to the top hat section and interacting with the collar, the over center latch mitigates an inadvertent opening of the process chamber, and a lamp feed-through is preferably secured to the main body portion and supports a heat source device.

Abstract: A heating apparatus including a filament arranged in a vacuum heating vessel comprises a base plate arranged in the vacuum heating vessel to fix the filament at a predetermined position with respect to a conductive heater forming one surface of the vacuum heating vessel. The base plate comprises a plate body having a carbon fiber.

Abstract: A heating apparatus contains a chamber that has a space for placing a work piece, a filament lamp that has an arc tube, and a sealing portion provided at an end of the arc tube. The heating apparatus further contains a glass tube extending through the chamber. A cooling fluid is introduced into the glass tube. An end of the glass tube extends to an outside of the chamber. A sealing member seals the glass tube and the chamber. The filament lamp is arranged inside the glass tube.

Abstract: A materials processing system comprises a thermal processing chamber including a heating source, a first noncontacting thermal measurement device positioned to measure temperature on a first area of the material being processed, and, a second noncontacting thermal measurement device positioned to measure temperature on a second area of the material being processed, the first device being relatively more sensitive to changes in surface emissivity than the second device. By comparing the outputs of the two devices, emissivity changes can be detected and used as a proxy for some physical change in the workpiece and thereby determine when the desired process has been completed. The system may be used to develop a process recipe, or it may be part of a system for real-time process control based on emissivity changes. Applicable processes include heating, annealing, dopant activation, silicide formation, carburization, nitridation, sintering, oxidation, vapor deposition, metallization, and plating.

Abstract: There is provided a heat processing furnace capable of quickly increasing and decreasing a temperature, while achieving improvement in durability. A heat processing furnace 2 comprises: a processing vessel 3 for accommodating an object to be processed w and performing thereto a heat process; and a cylindrical heater 5 disposed to surround an outer circumference of the processing vessel 3, for heating the object to be processed w. The heater 5 includes a cylindrical heat insulating member 16, and heating resistors 18 arranged along an inner circumferential surface of the heat insulating member 16. Each of the heating resistors 18 is formed of a strip-shaped member that is bent into a waveform having peak portions and trough portions. Pin members 20 are arranged in the heat insulating member 16 at suitable intervals therebetween, the pin members 20 holding the heating resistor 18 such that the heating resistor 18 is movable in a radial direction of the heater.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: There is provided a method for heating a part within a processing chamber of a semiconductor manufacturing apparatus having a substrate in the processing chamber and performing a process on the substrate. The heating method includes generating heating lights which is generated by a heating light source provided outside the processing chamber and has a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part, and heating the second part in the processing chamber by passing the heating lights through the first part in the processing chamber and irradiating the heating lights to the second part in the processing chamber.

Abstract: A heat treating device including a treatment room for accommodating therein a substrate, a plurality of light sources, which is disposed above the treatment room, for irradiating the substrate, a first reflector, whose inner surface is a reflective surface of a dome shape, for reflecting and directing a part of light emitted from each light source to the substrate, and a plurality of second reflectors, each of which is provided for each light source, for reflecting and focusing light emitted from each light source and directing it to the substrate. The reflective surface of each of the second reflectors is a part of a spheroidal surface or a curved surface approximate to it surrounding a first focal point in such a manner that the first focal point is formed at a position near each light source and a second focal point is formed on a side of the substrate.

Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.

Abstract: The present invention provides a vertical heat treatment boat that has at least four or more support portions per processing target substrate to be supported, the support portions horizontally supporting the processing target substrate, support auxiliary members on which the processing target substrate is mounted being detachably attached to the four or more support portions, respectively, wherein flatness obtained from all surfaces of the respective support auxiliary members on which the processing target substrate is mounted is adjusted by adjusting thicknesses of the support auxiliary members or interposing spacers between the support portions and the support auxiliary members in accordance with respective shapes of the four or more support portions.

Abstract: A method of adjusting the heat transfer properties within a processing chamber is presented. Chamber properties may be determined and adjusted by adjusting the thermal mass of an edge ring disposed in the processing chamber.

Abstract: Embodiments of the present invention provide apparatus and method for reducing noises in temperature measurement during thermal processing. One embodiment of the present invention provides a chamber for processing a substrate comprising a chamber enclosure defining a processing volume, an energy source configured to direct radiant energy toward the processing volume, a spectral device configured to treat the radiant energy directed from the energy source towards the processing volume, a substrate support disposed in the processing volume and configured to support the substrate during processing, and a sensor assembly configured to measure temperature of the substrate being processed by sensing radiation from the substrate within a selected spectrum.

Abstract: A system for heat treating a metal product has an annealing zone having a first preselected atmosphere condition, a cooling zone having a second preselected atmosphere condition different than the first preselected atmosphere condition, and a blueing zone having a third preselected atmosphere condition different than the first and second preselected atmosphere conditions. A graphical user interface allows an operator select one of the zones for displaying processing information pertaining to the selected zone. The processing information includes a computed ratio of gaseous hydrogen H2 (g) to water vapor H2O (g) for the respective preselected atmosphere condition. The graphical user interface allows an operator to control the respective preselected atmosphere based, at least in part, upon the computed ratio.

Abstract: The decoy system, notably for terrestrial mines or improvised explosive devices, includes: a means of producing heat energy including an air or water boiler, a means of emitting radiation in the infrared spectrum including a chamber that is fed with fluid by the production means, the chamber being provided with internal fins able to promote a build-up of heat energy inside said chamber, at least one detection means for determining the temperature of the chamber or the temperature of the fluid between the production means and the emission means, and a control unit able to control the operation of the heat energy production means at least according to the determined temperature.

Abstract: A food warming cabinet keeps food warm and on display in serving trays using infrared heaters instead of hot water. The infrared heaters are located below the trays and direct IR at the trays. In an alternate embodiment, the IR heaters can also conduct heat into the trays. Using IR instead of water saves energy because it shortens warm-up time. Using IR also eliminates contaminated water and enables separate and individual temperature control of each tray. Tray temperature is maintained under computer control using contact or optical/IR temperature sensors.

Abstract: A thermal processing chamber with a dielectric barrier discharge (DBD) lamp assembly and a method for using the same are provided. In one embodiment, a thermal processing chamber includes a chamber body and a dielectric barrier discharge lamp assembly. The dielectric barrier discharge lamp assembly further comprises a first electrode, a second electrode and a dielectric barrier. The dielectric barrier discharge lamp assembly is positioned between the first electrode and the second electrode. The dielectric barrier defines a discharge space between the dielectric barrier and the second electrode. A circuit arrangement is coupled to the first and second electrodes, and is adapted to operate the dielectric barrier discharge lamp assembly.

Abstract: This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.

Abstract: In a heat treatment apparatus, a reflector is provided to cover a plurality of flash lamps arranged in an array for emitting a flash of light, and a cooling box is provided over the reflector. The cooling box has a buffer space incorporated therein, and a plurality of jet openings in communication with the buffer space are formed through a bottom surface of the cooling box and the reflector. The plurality of jet openings are positioned just over gaps between the plurality of flash lamps in the lamp array. Nitrogen gas ejected from the plurality of jet openings passes through the gaps between adjacent ones of the flash lamps in the lamp array, and is then blown against a lamp light radiation window. The flash lamps are effectively cooled down by the direct cooling using the nitrogen gas and the decrease in temperature of the lamp light radiation window.

Abstract: A method and apparatus for oxidizing materials used in semiconductor integrated circuits, for example, for oxidizing silicon to form a dielectric gate. An ozonator is capable of producing a stream of least 70% ozone. The ozone passes into an RTP chamber through a water-cooled injector projecting into the chamber. Other gases such as hydrogen to increase oxidation rate, diluent gas such as nitrogen or O2, enter the chamber through another inlet. The chamber is maintained at a low pressure below 20 Torr and the substrate is advantageously maintained at a temperature less than 800° C. Alternatively, the oxidation may be performed in an LPCVD chamber including a pedestal heater and a showerhead gas injector in opposition to the pedestal.

Abstract: The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.

Abstract: In a heat treatment apparatus, a holding part moves upwardly to receive a semiconductor wafer transported into a chamber and placed on support pins. The semiconductor wafer held in close proximity to a light-transmittable plate by the holding part is preheated by a hot plate, and is then flash-heated by a flash of light emitted from flash lamps. Thereafter, the holding part moves downwardly to transfer the semiconductor wafer to the support pins, and the semiconductor wafer is transported out of the chamber. Then, a new semiconductor wafer is transported into the chamber. The holding part is adapted to perform such a series of operations of moving upwardly and downwardly also when in a standby condition pending the transport of the first semiconductor wafer in a lot into the chamber.

Abstract: An apparatus for controlling the temperature of a warm bore of a superconducting magnet in a magnetic resonance imaging (MRI) includes a plurality of warm bore thermal sensors positioned on a surface of the warm bore and a plurality of heater elements positioned on the surface of the warm bore. A heater element thermal sensor is coupled to each of the plurality of heater elements and configured to monitor the temperature of the corresponding heater element. A controller is coupled to the plurality of warm bore thermal sensors and the plurality of heater element thermal sensors. The controller is configured to control each of the plurality of heater elements to maintain a predetermined temperature of the warm bore.

Abstract: A furnace for conditioning preforms with several heating chambers rotating in a circle for heating one preform each with infrared radiation, and having holding devices for holding the preforms during heating, so that a section of the preform to be conditioned is essentially arranged in the heating chamber, and a section not to be conditioned is arranged outside the heating chamber. Accordingly, the section to be conditioned can be heated in a controlled and effective manner, and the section not to be conditioned can be protected from undesired heating.

Abstract: The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A conveyor oven having an oven chamber with a single opening by which a food product enters and exits on a conveyor belt that is reversibly driven to convey the food product in and out of the oven chamber in a reciprocating manner. Also, the food is conveyed to a cooking position in an oscillating range within the oven chamber and then moved back and forth in the cooking range in an oscillatory manner within the oscillating range so as to prevent burning that would otherwise occur if left stationary.

Abstract: Provided herein are assemblies that, when coupled to an object, are capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. Applications include various integrated circuit fabrication processes that use such external sources to expose wafers to radiation. In certain embodiments, the assemblies include a pedestal for supporting the wafer or other object. In certain embodiments, the assemblies include a calibrated heat resistance that allows heat be conducted away from the pedestal and wafer to maintain the desired set-point temperature. In certain embodiments, the pedestal may have one or more protrusions used to dissipate or transfer heat from the pedestal to a heat sink. Also, in certain embodiments, the pedestal surface is configured to have a spectral reflectivity of desired values in such way as to reflect the wavelengths that are emitted by an external radiant heat source.

Abstract: A thermal processing apparatus (1) comprises a chamber body (6), a holding part (7) for holding a substrate (9) inside the chamber body (6), a light emitting part (5) for heating the substrate (9) through light irradiation and a light measuring part (2) for measuring light energy. The light measuring part (2) comprises a calorimeter (24) disposed outside the chamber body (6), a light guide structure (20) for guiding the light inside the chamber body (6) to the calorimeter (24) and a calculation part (25) for performing computations on the basis of an output of the calorimeter (24). In the thermal processing apparatus (1), by measuring the light from the light emitting part (5) by the calorimeter (24), it is possible to measure the energy of light emitted from the light emitting part (5) during thermal processing inside chamber body (6) and obtain a surface temperature of the substrate (9) by the calculation part (25).

Abstract: A broiler assembly for a cooking appliance, the cooking appliance having an oven cavity and the broiler assembly is disposed within the oven cavity. The broiler assembly includes a reflector having first and second sides, side retainers coupled to a respective one of the first and second sides, and at least one carbon emitter heating element mounted to the side retainers. The at least one carbon emitter heating element includes a carbon filament disposed within a lamp.

Abstract: The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.

Abstract: There are provided a manufacturing apparatus and a manufacturing method for manufacturing a substrate having a dielectric film, including a heat treatment apparatus that subjects a substrate on which a raw material containing composite oxide is applied, to heat treatment and crystallization in an atmosphere containing oxygen in a volume ratio of 20% or above under pressure of an atmospheric pressure or above. The manufacturing apparatus may manufacture a substrate having a ferroelectric film used as an optical control device. The heat treatment apparatus may include: a chamber that keeps, in the atmosphere, the substrate on which the raw material is applied; and a pressure adjusting section that adjusts a pressure of the atmosphere in the chamber to a predetermined value for a predetermined time period during heat treatment.

Abstract: A materials processing system comprises a thermal processing chamber including a heating source, a first noncontacting thermal measurement device positioned to measure temperature on a first area of the material being processed, and, a second noncontacting thermal measurement device positioned to measure temperature on a second area of the material being processed, the first device being relatively more sensitive to changes in surface emissivity than the second device. By comparing the outputs of the two devices, emissivity changes can be detected and used as a proxy for some physical change in the workpiece and thereby determine when the desired process has been completed. The system may be used to develop a process recipe, or it may be part of a system for real-time process control based on emissivity changes. Applicable processes include heating, annealing, dopant activation, silicide formation, carburization, nitridation, sintering, oxidation, vapor deposition, metallization, and plating.

Abstract: An oven is provided for re-baking welding consumables in an efficient and improved heat distribution manner. The oven includes a first chamber having a plurality of first chamber vents positioned on at least one sidewall of the first chamber and a heating source in a second chamber, the second chamber being in fluid communication with the first chamber, and one or more third chambers situated on a sidewall of the first chamber, wherein heat energy from the heating source flows through the third chamber into the first chamber, and wherein the heat energy from the heating source is substantially and evenly distributed inside the first chamber.

Abstract: An apparatus for making generally flat dough based products includes a supply station having at least two hoppers for holding different ingredients and respective valve mechanisms disposed below outlets of the hoppers and being operable to control the quantities of ingredients separately dispensed from the hoppers, a mixing bowl disposed below the hoppers in a position to receive the different ingredients in the predetermined quantities wherein the mixing bowl is adapted to open for releasing a dough based product prepared therein toward a conveyor, and a heating station having first and second heating zones arranged along the conveyor between entry and exit ends thereof and being operable to produce infra-red and electric resistance heating respectively in the first and second heating zones so as to cap and cook the prepared dough based product by the time the product is moved by the conveyor to its exit end.

Abstract: An apparatus of thermal processing is provided. A heating lamp and a reflector are disposed over a wafer and the heat flux distribution on the wafer generated by the individual heating lamp is measured and adjusted. A set of heating lamps formed by heating lamps is disposed over the wafer. The heating lamps are in concentric rings and arranged as an axi-symmetric array. The relative position between the set of heating lamps and the wafer is adjusted so that the wafer center is at the position with local mean heat flux from lamps between the most inner lamp subset and its adjacent lamp subset. Followed by adjusting the heating powers, either or both of the wafer and the set of heating lamps are rotated respect to the center of the wafer, so as to improve uniformity of the heat flux distribution on the heated object.

Abstract: A method of forming a device is presented. The method includes providing a wafer having an active surface and dividing the wafer into a plurality of portions. The wafer is selectively processed by localized heating of a first of the plurality of portions. The wafer is then repeatedly selectively processed by localized heating of a next of the plurality of portions until all plurality of portions have been selectively processed.

Abstract: A system for heating a medical fluid includes a container including a fluid path including an inlet side and an outlet side. A broadband infrared radiation source including a power supply is coupled to a broadband emitter for emitting infrared radiation. The broadband emitter provides a focal location within the fluid path to heat the medical fluid to generate a heated medical fluid. A flow turbulence enhancing structure mixes the heated medical fluid to reduce temperature gradients therein. A fluid detector senses a presence of the medical fluid in the fluid path and generates a fluid sensing signal. A controller is coupled to receive the fluid sensing signal and has an output coupled to the power supply for controlling a power output of the power supply based on the fluid sensing signal indicating a presence of the medical fluid in the container.

Abstract: A rapid thermal processing apparatus comprises a processing chamber which subjects a semiconductor substrate to rapid thermal processing. A substrate support part is arranged in the processing chamber and supports the substrate. A lamp part optically irradiates the substrate supported by the substrate support part and heats the substrate. A thermo sensor is provided to measure a temperature of the substrate. A temperature computing part computes the temperature of the substrate based on an output signal of the thermo sensor. A control part controls an irradiation intensity of the lamp part according to the temperature computed by the temperature computing part. In this apparatus, the control part is provided to correct a control parameter of the irradiation intensity of the lamp part based on a measured reflectivity of a surface of the substrate.

Abstract: A rotary furnace (1) for the heat treatment of solids includes at least one rotary tube into which the solids are introduced and a first heater outside of the rotary tube that makes it possible to conduct a portion of the heat treatment in the absence of oxygen. A second heater for heating feedstock to improve heat treatment is formed by a second heating element (4, 4?, 4?) positioned above the feedstock when the furnace rotates and at least one deflector panel that surrounds the heating element (4, 4?, 4?) is provided on the side opposite to the feedstock (2) and arranged inside of the rotary tube. The rotary furnace is used to roast solid biomass.

Abstract: A filament lamp comprising a bulb which has a hermetically sealed portion on at least one end and multiple filament assemblies, each filament assembly comprising a coiled filament and connected leads to supply power to that filament, the filament assemblies being sequentially arranged in the axial direction of the bulb, the leads of each filament assembly being electrically connected to respective multiple conductive parts set in the sealed portions, and power being independently suppliable to each of the filaments. A respective one of the coiled filaments is located in a respective first quadrant formed by intersecting planes that are perpendicular to each other and that are tangent to an outer coil diameter of the respective coiled filament. The leads are positioned in quadrants other than the quadrant in which the coiled filament is located. A light irradiation type heat treatment apparatus uses a plurality of such filament lamps.

Abstract: A cooker and a controlling method for the same are provided. A carbon heater has a wavelength bandwidth of 1.5˜2.5 ?m where a radiant energy is maximum, and the carbon heater provides the radiant energy into a cavity in order to heat food disposed therein.

Abstract: Provided are a lamp and a heating device which are capable of effectively preventing a seal portion from being overheated with a simple structure. A lamp includes: a tube portion in which a filament including a coil portion is contained; a seal portion filled with a metal foil connected to an end of the filament; and an overheat preventing portion covering a part of an outer surface of the tube portion.

Abstract: A system for direct injection of selected thermal-infrared (IR) wavelength radiation or energy into food items for a wide range of processing purposes is provided. These purposes may include heating, raising or maintaining the temperature of the food articles. The system is especially applicable to operations that require or benefit from the ability to irradiate at specifically selected wavelengths or to pulse or inject the radiation. The system is particularly advantageous when functioning at higher speeds and in a non-contact environment with the target.

Abstract: To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing. The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 ?m to 1,000 ?m. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.

Abstract: An infra-red heater assembly takes on the conditions that afflict buildings: bed bugs, termites, other insects, molds, bacteria, and the like, and their resulting odors, and other contaminants. The assembly includes a portable electric infra-red emitting panel system with vertically stacked panels that distribute heat energy to the entire height of a wall. Removable panel covers over the infra-red heating elements protect them from damage during transport and when opened, act as deflectors, to direct, the radiant energy, widthwise, to restrict the line of site energy transferred to a wall. The heating panels are regulated by room air and wall temperature sensors to prevent structural damage and fire during usage of the invention. The infra-red heater may be pivotally mounted within its supporting structure so as to direct heat in various angular directions within the building being treated.

Abstract: The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.

Abstract: A radiant heating unit is selectively operated to move radiant heating panels to regulate heating of a continuous web of media as the web moves along a media pathway in an imaging device. The radiant heating panels in a radiant heating unit may be moved to any one of a plurality of positions between and including a fully open position and a retracted position in the housing. A panel driver is operated to move the radiant heating panels to one of the positions in the plurality of positions in response to a variable view factor signal.