Abstract: Methods and apparatus for preconditioning a lithium niobate or lithium tantalate crystal. At least a portion of a surface of the crystal is covered with a condensed material including one or more active chemicals. The crystal is heated in a non-oxidizing environment above an activating temperature at which the active chemicals contribute to reducing the crystal beneath the covered surface portion. The crystal is cooled from above the activating temperature to below a quenching temperature at which the active chemicals become essentially inactive for reducing the crystal.

Abstract: A disc is produced using a method of and an apparatus for forming a transparent layer on a disc substrate. The method for forming the transparent layer on the disc substrate includes covering an axial hole formed at a center of the disc substrate with a cover element by inserting a protrusion of the cover element in the axial hole of the disc substrate so that a resin does not leak through the axial hole, dispensing the resin toward the center of the disc substrate from an upper side of the disc substrate, and removing the cover element. A more uniform transparent layer can be obtained throughout the disc substrate.

Abstract: Disclosed is a process to rapidly spin-apply an AR coating system to a backside of a prescription lens. The AR coating system comprises a polyurethane primer layer, a siloxane thermally cured scratch resistant coating layer, a two-layer sol-gel AR coating, and a hydrophobic layer. The process comprising steps of spin-applying each of the layers provides a quick way to furnish a prescription lens that is AR coated on both sides.

Abstract: A process including: providing a cylindrical substrate rotating about the long axis; applying at least one coating layer with a direct writing applicator on the outer surface of the rotating substrate; and curing the resulting coated layer or layers. The use of a direct writing applicator provides precision in the dispensing of organic photoconductor coating layers with respect to line width and line thickness.

Abstract: A microlens is affixed in the far field of an optical fiber to spatially transform a beam either entering or exiting the fiber. In a first embodiment, a droplet of photo polymer is placed on the end of an optical fiber and the fiber is spun to create an artificial gravity. The droplet is cured by UV radiation during the spinning. In a second embodiment, nanoparticles are mixed into the droplet to increase the refractive index of the photo polymer. A third embodiment employs artificial gravity to attach a microsphere to the end of the optical fiber. A fourth embodiment chemically treats the surface of the microsphere so that the requirement of artificial gravity is either reduced or eliminated. In a fifth embodiment the droplet is cured under equlibrium or nonequilibrium conditions to obtain different final shapes for the lenslet. A sixth embodiment discloses fabrication of microlens arrays.

Abstract: An applying method for an adhesive according to an embodiment includes the following steps. First, gas is exhausted from a first exhaust pipe, so as to eliminate a part of the gas in a closed container. Next, the gas continues to be exhausted from the first exhaust pipe, so as to have the adhesive in the transmission pipeline become bubbled, and also to convey the bubbled adhesive to reach the supply vent. Later, gas is exhausted from the second exhaust pipe and continues to be exhausted from the first exhaust pipe, so as to greatly exhaust the gas in the closed container, and also to increase bubbling in the adhesive. Subsequently, the gas continues to be exhausted from the second exhaust pipe and ceases to be exhausted from the first exhaust pipe, so as to cause the adhesive to reach a gasified state. Also the gasified adhesive is supplied to the closed container from the supply vent, so that the gasified adhesive can adhere to and coat above the SiO2 layer.

Abstract: A method of coating a medical device, such as a stent is provided.

Abstract: A liquid material is applied by spin coating it onto a first main surface of a flat plate to form a coating of the liquid material thereon. The flat plate includes a second main surface which is opposite to the first main surface and a hole which passes through the flat plate. The application of the liquid material is carried out using an inner guide member, which is placed in the hole, and the spin coating is carried out while the flat plate is placed on a stage such that the inner guide member is placed generally adjacent to an inner peripheral side surface of the flat plate and an upper surface of the inner guide member and the first main surface are located at generally the same level. Thereby, a coating is obtained which extends on the upper surface of the inner guide member and the first main surface of the flat plate.

Abstract: A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11a; and (b) cutting a portion of the plate 11a with the protective layer 12a formed thereon other than an outer edge portion of the protective layer 12a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.

Abstract: A liquid form adhesive system is provided for spin-coating on wafers and mounting to rigid carrier substrates to support thinning and backside processing. The liquid adhesive comprises about 30–35% of a rosin, between 5–10% of a thermoplastic urethane, a nonionic surfactant present between 1–3%, and a trace of an ultraviolet fluorescing dye. The entire system is dissolved in 50–65%, by weight, of a dual solvent mixture composed of dimethylacetamide and propylene glycol monomethyl ether. When the mixture is made to a specific viscosity, filtered, applied by a spin-coating method to the wafer frontside surface, and cured, the result is a uniform and smooth surface of defined thickness. When the coated wafer is mounted to a rigid substrate, it may be mechanically thinned to thicknesses down to and beyond 25 um, depending upon the wafer composition, diameter, and process.

Abstract: The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.

Abstract: A method and apparatus for removing excess coating material from a honeycomb body of a catalytic converter. The coated honeycomb body is mounted on an eccentric tappet and is rotated around a first rotational axis with a first rotational frequency such that the distance from the center of gravity of the honeycomb body to the first rotational axis is at least 1.5 times the length of the honeycomb body. The honeycomb body is further rotated around a second rotational axis even out the coating material and provide a more uniform coating surface.

Abstract: A method of making nematic liquid crystal devices where low energy zenith anchoring of the liquid crystal is obtained over confinement plates. A polymer or copolymer is deposited based on PVC onto a substrate. The polymer deposit is stabilized. An azimuth orientation is defined for the deposit to induce controlled azimuth anchoring of the liquid crystal.

Abstract: A method of fabricating a patterned polymer film with nanometer scale includes filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a desired polymer film; allowing the embossed stamp placed on the polymer film to stand at temperatures higher than a glass transfer temperature of the polymer film for a predetermined time; and releasing the embossed stamp from the polymer film. Alternatively, the patterned polymer film is obtained by filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a coating layer of a polymer precursor formed on a substrate; curing the coating layer; and releasing the embossed stamp from the cured coating layer.

Abstract: A method and system of coating a polymer solution on a substrate such as a semiconductor wafer. The method includes providing a substrate. Dispensing a polymer solution onto the surface of the substrate using a pump. The pump is connected in-line with a buffer tank and a polymer solution source such that the pump draws the polymer solution from the polymer solution source and the buffer tank in a continuous fluid path to dispense the polymer solution. The polymer solution source is connected to a pressure source capable of causing a transfer of the polymer solution from the polymer solution source into the buffer tank. The buffer tank to maintain a relatively constant level of polymer solution.

Abstract: This invention includes a method of producing a thin, oriented layer of polymer material. The material is preferably produced by the method of introducing a shearing flow to a free surface in a predominantly monomeric solution of the self-assembling polymer sub-units, and inducing polymerization or growth of the monomer while in this shearing flow. The system for forming the oriented layer of material provides relative movement between a delivery system and the substrate on or over which the material is deposited. The rate of flow of the material from the delivery system and the relative velocity between the deposition surface and the material as it is delivered to the surface are controlled to properly orient the material at the desired thickness. These rates can be adjusted to vary the properties of the film in a controlled manner. Preferred embodiments include either angular or linear relative movement between the delivery system and the substrate.

Abstract: Invisible logos may be made by forming a hydrophilic coating and a hydrophobic coating on a substrate surface, so that a portion of the hydrophilic coating and a portion of the hydrophobic coating are exposed. The invisible logos are undetectable to the human eye, but may be temporarily viewed in response to stimuli.

Abstract: A method of manufacturing an optical disc includes easily removing a bump formed on a circumference of the optical disc during forming a transparent layer by using a spin-coating method to form the optical disk having a high-density recording capacity. The method includes preparing a substrate having a diameter larger than that of a desired disc, applying an ultraviolet hardening resin to the substrate and forming a transparent layer having a predetermined thickness by a spin-coating method, illuminating an ultraviolet ray on the transparent layer and a bump formed on a circumference of the transparent layer to be hardened, and cutting out the bump by using a puncher. According to the method, the bump which inevitably occurs when the transparent layer is formed, can be easily cut out by a puncher.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: An apparatus for forming a film on a wafer comprising, a first coating apparatus coating a foaming insulation film material on the wafer, a second coating apparatus coating a non-porous insulation film material on the wafer, a low oxygen heating temperature regulating process apparatus performing a heating process on the wafer on which the foaming insulation film material is coated, a low oxygen high temperature heating process apparatus performing the heating process on the water on which the non-foaming insulation film material is coated, a transfer mechanism transferring the wafer to these apparatuses, and a selecting means selecting a path to which the wafer is transferred corresponding to the film formed on the wafer.

Abstract: A substrate which has been subjected to heat processing in any of hot plate units is transferred to a normal cooling unit by a transfer device and subjected to cooling processing to some extent, and then transferred to a high accuracy cooling unit and subjected to cooling processing with high accuracy, and thereafter transferred to any of coating units or a developing units. Thereby, the substrate can be subjected to the cooling processing with high accuracy and thereafter to coating processing with no increase in apparatus cost and with no decrease in throughput.

Abstract: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

Abstract: Encapsulating a component structure includes applying a fluid, light-sensitive first reactive resin layer to a surface of a component substrate containing the component structure, exposing and developing the first reactive resin layer so as to form a frame structure that encloses the component structure, covering the frame structure with an auxiliary foil, applying a second reactive resin layer to a surface of the auxiliary foil so as to form ceiling structures on the surface of the auxiliary foil, at least one of the ceiling structures making a seal with the frame structure, and removing the auxiliary foil in areas between ceiling structures.

Abstract: The present invention is a coating unit for applying a coating solution on a substrate, comprising: a container enclosing the substrate; a casing for accommodating the container therein; a supply device for supplying a predetermined gas into the casing; a first exhaust pipe for exhausting an atmosphere inside the container; a second exhaust pipe for exhausting an atmosphere inside the casing; a first adjusting device which is disposed in the first exhaust pipe, for adjusting a flow rate of an atmosphere passing through the first exhaust pipe; and a second adjusting device which is disposed in the second exhaust pipe, for adjusting a flow rate of an atmosphere passing through the second exhaust pipe. According to the present invention, the second exhaust pipe is usable for adjusting the exhaust flow rate to maintain a pressure inside the casing at a positive pressure.

Abstract: When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: The present invention relates to a method for heat processing a substrate. After a coating film is formed on the substrate, the substrate is baked at a predetermined high temperature. The baking step is performed by first increasing the substrate temperature from a predetermined low temperature to a predetermined intermediate temperature that is lower than a predetermined reaction temperature at which the coating film reacts. Next, a second baking step maintains the substrate at the predetermined intermediate temperature for a predetermined period of time, and is followed by a third step of increasing the temperature of the substrate to the predetermined high temperature that is higher than the predetermined reaction temperature. This results in uniform temperature within the surface of the substrate when the temperature of the substrate reaches the reaction temperature. Consequently, a chemical reaction due to heat processing of the coating film within the surface of the substrate is performed uniformly.

Abstract: Relative movement occurs between the in-process substrate and the dropping section. While the substrate is rotated, the dropping section is relatively moved from an approximate center of the substrate toward an outer periphery thereof. While the dropping section relatively moves from the approximate center of the in-process substrate toward the outer periphery, the rotational frequency w for the substrate is decreased so that the solution film should not move due to the centrifugal force applied to a dropped solution film. Concurrently, feed rate v for the liquid from the dropping section is increased to form a solution film on the in-process substrate.

Abstract: The invention concerns a method for producing porous ceramic layers on metallic, ceramic, enameled or glass substrates using crystalline nanoparticles of particle sizes of between 3 nm and 100 nm via a wet-chemical process and functionalising of this porous ceramic layer through introducing a second component into the pores of the porous ceramic layer which serves as carrier layer. The porous ceramic layers can be filled with hydrophobizing, hydrophilizing, dirt-repellent and corrosion-inhibiting substances which remain in the substrate or are supplied later on demand, or with bactericidal substances, aromatics, perfumes or inhalation substances which are delivered to the room air in precise doses.

Abstract: The frequency uniformity of a film bulk acoustic resonator may be improved by controlling the thickness across a wafer of one or more layers of the film bulk acoustic resonator. One or more layers of the film bulk acoustic resonator may be deposited in a way that irregularities in the deposition process from one die to another may be controlled.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A method of forming a fluorescent screen where a pigment film and a fluorescent film are deposited on a surface of a light transmissive substrate, is presented. The method includes coating a pigment dispersion liquid on the surface of the light transmissive substrate to form a coated film and forming the pigment film by drying the coated film. The drying of the coated film is performed under conditions that a temperature of the corner portions of the light transmissive substrate is controlled to 36° C. to 50° C.

Abstract: Embodiments of the present invention provide a developing method, which can efficiently prevent the developing solution from remaining on the backside surface of the wafer, so as to avoid the influence of the contamination on the subsequent processes. In one embodiment, a developing method comprises providing a wafer in a reaction space, wherein the wafer has an exposed photoresist thereon; coating a developing solution on a surface of the wafer; rotating the wafer; rinsing a normal surface and a backside surface of the wafer; and stopping rinsing the normal surface of the wafer while keeping rinsing the backside surface of the wafer for a specific time period.

Abstract: A method of coating a coating liquid on a base material having a curved surface portion, includes processes of: a coating process of coating a coating liquid on a base material; and a rotating process of rotating the base material coated with the coating liquid.

Abstract: A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.

Abstract: There is provided a photogravure plate making method capable of performing a quite superior photogravure plate making operation while it has a requisite and sufficient developing latitude under non-heating condition after forming a coating film and while applying a positive O-type thermal resist.

Abstract: A substrate processing method comprises stopping the transfer of a head substrate of a succeeding lot for a period which is an integral multiple of a cycle time after a last substrate of a preceding lot is transferred from a cassette section to a processing section by a transfer mechanism, executing dummy dispense of a predetermined time by a solution processing unit during the substrate transfer stop period, and transferring the head substrate of the succeeding lot to the processing section by the transfer mechanism after the dummy dispense.

Abstract: A manufacturing process in which a plurality of fluid jetting apparatuses are formed includes forming and sequentially adhering a heat driving part, a membrane and a nozzle part, respectively. The fluid jetting apparatuses are completed as a wafer unit by forming the nozzle part by forming a nozzle plate on a substrate of a wafer by a spinning process; forming jetting fluid barriers on the nozzle plate by the spinning process; forming jetting fluid chambers in the jetting fluid barriers; forming nozzles in the nozzle plate; and separating the substrate from the nozzle plate after the nozzle part and the membrane are adhered to each other. The forming jetting fluid chambers is accomplished by a process of wet etching, and the forming nozzles is accomplished by a treating apparatus of a laser beam or by a process of reactive ion etching.

Abstract: A developing apparatus which enables the time necessary for a development reaction to be shortened and permits uniform development includes a chuck device with a support portion whose top surface is a horizontal surface and a spinner disposed in the middle of this support portion. The support portion and the spinner are provided within an antiscattering cup. A groove which vacuum adsorbs a substrate W to be treated is formed on the top surface of the spinner, a pipe which forms a circulation path is disposed within the groove formed on the top surface of the support portion, and a cleaning nozzle which cleans a developing solution which has flown behind the rear surface of the substrate W is disposed in a position which is nearest to the inside diameter of the top surface of the support portion. On the other hand, in a nozzle device, a spray nozzle is attached to a horizontally reciprocating arm via a columnar support.

Abstract: A method for coating low viscosity materials onto a wafer to form a uniform film. After a wafer is rotated at a first rotation speed, coating solution is dispensed onto the wafer. The wafer is decelerated to a second rotation speed at a first deceleration rate to spread the coating solution. Next, the wafer is slowly decelerated to a third rotation speed at a second deceleration rate considerably lower than the first deceleration rate, so the coating solution reflows to the center of the wafer. The wafer is then quickly accelerated to a fourth rotation speed at a third acceleration rate larger than the first deceleration rate to spread the coating solution again.

Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.

Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

Abstract: The present invention provides a process for fabricating ultrathin monolayers or ultrathin multilayer films, the process comprising the steps of: introducing positive or negative charge or a material capable of hydrogen-bonding to a substrate and placing the substrate on a spinner(pretreating step); introducing a material (A) bindable with the material deposited on the substrate, and spinning the substrate at 500 rpm to 30000 rpm for 4 to 200 seconds(first coating step); dropping washing solvent onto the substrate after completion of the first coating and spinning the substrate at 500 rpm to 30000 rpm for 4 to 200 sec to remove weakly-bound material (A) and form a thin film (A)(first washing step); introducing another material (B) bindable with the material (A) coated on the substrate and further coating it in the same condition as of the first coating(second coating step), dropping washing solvent onto the substrate after completion of the second coating and spinning the substrate at 500 rpm to 30000 rpm for

Abstract: A process tool, preferably a spin coater, includes a set of at least three arms and an adjustable rinse nozzle. The arms lift a substrate, e.g. a semiconductor wafer, from a chuck inside the process chamber after having performed the corresponding manufacturing step, e.g. coating. The contact area between the arms and the substrate is as small as possible. The rinse nozzle dispenses a solvent liquid onto the backside of the substrate, thereby removing contaminating particles located at the area of contact between the vacuum channels of the chuck and the substrate. The set of arms rotates for a homogeneous cleaning. A gas flowing out of vacuum ports of the chuck prevents the vacuum ports from being obstructed with particles. While the substrate is being lifted, the chuck can also be cleaned by dispensing the solvent liquid onto the chuck.

Abstract: A substrate processing apparatus for supplying a treatment liquid onto the surface of a substrate to treat the same. This apparatus is provided with: a spin chuck for holding and rotating a substrate; a nozzle for supplying a treatment liquid to the substrate held by the spin chuck; a circulating passage arranged such that the treatment liquid supplied to the substrate from the nozzle and used for substrate treatment is circulated to the nozzle and reutilized for substrate treatment; a metal contamination amount measuring device for measuring the metal contamination amount in the treatment liquid passing through the circulating passage; and a judgment processing unit for judging whether or not the value measured by the metal contamination amount measuring device has exceeded a predetermined set value.

Abstract: A specific amount of a processing solution is supplied on a wafer by spraying the processing solution from a first end (tip) of a nozzle. The solution surface of the processing solution remaining in the nozzle is sucked back to a second end side of the nozzle by aspirating the remaining processing solution to the second end side. The first end of the nozzle is then soaked into a fluid. The processing solution remaining in the nozzle is aspirated to the second end side to aspirate a specific amount of the fluid into the first end of the nozzle for further sucking back the solution surface of the processing solution to the second end side, thus the solution surface of the processing solution being not touching the fluid.

Abstract: The wafer coated with the resist is deliberately placed in the vapor before being transferred to an aligner that exposes the resist on the wafer, the vapor, for example, the moisture, uniformly adheres onto the resist on the wafer. As a result, the substrate can uniformly be exposed in the following exposing process, and the uniformity of the line width and the like can be improved.

Abstract: A method of preparing a multi-layer, crack resistant sol-gel glass derived coating on a substrate by removing the outer periphery of each layer before curing the layer and depositing any succeeding layer.

Abstract: A method for forming a film using a rotating cup application apparatus in which a rotatable inner cup is provided within an outer cup, the upper openings of the inner cup and the outer cup are closed with corresponding lids, and the lid for the inner cup is integrally rotated together with the inner cup, the method comprising the steps of setting a material to be treated, on which wiring layers have been formed, in the rotating cup application apparatus, applying SOG onto the surface of the material to be treated, thereafter closing the upper openings of the inner cup and the outer cup with the lids, rotating the inner cup in this state to thereby uniformly diffusing the SOG, repeating the SOG application and diffusing steps, and thereafter baking the material to be treated in a heat treatment apparatus.

Abstract: A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism (810). One end of a rinsing liquid supply nozzle (840) is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism (850) to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle (840), the rotation axis of the rinsing liquid supply nozzle (840) moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle (840) is reduced.