Abstract: A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.

Abstract: A method of manufacturing a magnetic recording medium comprises steps of providing a non-magnetic substrate having at least one surface; forming a layer of a sol-gel on the surface, partially drying the sol-gel layer at room temperature to remove a portion of the solvent therein to form a partially dried sol-gel layer of hardness less than that of the substrate; mechanically texturing the surface of the partially dried sol-gel layer; and depositing a layer stack including at least one magnetic layer thereover. Embodiments of the invention include embossing a servo pattern in the as-deposited sol-gel layer prior to partial drying and mechanically texturing, followed by sintering at an elevated temperature to form a substantially fully dried layer having a density and hardness similar to that of glass, and formation of a thin film magnetic media layer stack thereon.

Abstract: Electro-optic structures are constructed by spin coating water based emulsions or solvent based sensor materials, preferably a solvent-based polymer dispersed liquid crystal (PDLC), onto a substrate under conditions of controlled solvent evaporation. In a particular process, the uniformity of the PDLC coating is achieved by 1) spin coating in a semi-sealed chamber, 2) “converting” a square substrate into round substrate by using a fixture; 3) providing a controllable distance between the substrate and a spin coater top cover; and 4) providing a controllable solvent evaporation rate.

Abstract: A method for spin coating a polymeric material film upon a wafer rotatably mounted within a spin coater; the wafer having a surface, including the following steps. A first step of rotating the wafer on an axis perpendicular to the wafer surface while applying a predetermined amount of polymeric material while rotating the wafer at a rotational speed of from about 300 to 1200 rpm for from about 2.5 to 5 seconds to spread the polymeric material on the whole surface of the wafer. A second step of increasing the rotational speed of the wafer to about 5500 rpm for about 2.5 seconds. A third step of decreasing the rotational speed of the wafer to about 300 to 1200 rpm for about 2.5 seconds. A fourth step of increasing the rotational speed of the wafer to about 5500 rpm for about 20 seconds to form the polymeric material film having a predetermined thickness over the whole surface of the wafer.

Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

Abstract: A method of formation of a coating film on the surface of a cylindrical base material such as a piston wherein a waste of the lubricant coating solution is prevented and a lubrication action is maintained. A cylindrical base material is rotably supported horizontally on a rotating support device and in rotation, a coating solution is supplied to a coating surface, and a coating film is coated on the surface of the cylindrical base material. A coating former equipped with a blade is inclined at an angle of 20° to 80° with respect to a tangential direction of rotation, the blade is separated from the coating surface by exactly a coating layer thickness, and further the cylindrical base material is rotated by ¼ of a turn or more.

Abstract: Method and device for providing a layer (6) of a coating material on the inner side (2) of a display window (1) for a color display tube. A drop (3) of a suspension of said coating material is deposited on the inner side of the display window, its axis of symmetry (4) being oriented vertically. Then the display window is rotated around said axis of symmetry, and at the same time, said axis is tilted to a horizontal position. The suspension is thereby distributed on the inner side of the display window. An excess of suspension is collected during the rotation in four collection cups (8) arranged at the comers (7) of the display window, whence it is drained off to a central collection cup (10). Finally, the part of the suspension which remains on the display window is dried by infrared radiation (9). As the suspension is drained from the four collection cups to the central collection cup during the rotation, there is no risk that the suspension may drip from the cups onto the display window.

Abstract: Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.

Abstract: A method for producing a graytone mask capable of satisfying a dimensional accuracy of a predetermined graytone pattern, on a graytone mask having, at least in a part, a predetermined graytone pattern. Suppressed to ±1% or less an on-plane distribution in thickness of a resist film to be applied onto a substrate in a graytone mask producing process.

Abstract: A developing process of the photo-resist coated on the wafer is performed, cleaning the developing solution by a cleaning solution then transferring the wafer to the electron beam radiation unit before the rinsing solution and the resist dries out. The radiation chamber is replaced with a helium gas to form a predetermined degree of vacuum or atmospheric pressure. An electron beam is radiated and the front face of the wafer is heated for a predetermined period of time. In this method, deformation and breaking of a pattern caused by drying after the development can be prevented.

Abstract: In an optical disk substrate film-formation apparatus which prepared an optical disk by forming a thin film on a substrate, the optical disk substrate is held by a holder section. A contact support surface is provided to the holder section which closely contacts at least a portion of the surface of the optical disk substrate rear to the surface where the think film is formed.

Abstract: Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring solvent. Suitable mechanical removal methods include applying adhesive tape to the substrate-adherent polymer and peeling the tape and substrate-adherent polymer away from the pattern, and abrading the substrate-adherent polymer from the pattern using impact media.

Abstract: Cobalt-nickel oxide films of nominal 100 nm thickness, and resistivity as low as 0.06 &OHgr;·cm have been deposited by spin-casting from both aqueous and organic precursor solutions followed by annealing at 450° C. in air. Films deposited on sapphire substrates exhibit a refractive index of about 1.7 and are relatively transparent in the wavelength region from 0.6 to 10.0 &mgr;m. They are also magnetic. The electrical and spectroscopic properties of the oxides have been studied as a function of x=Co/(Co+Ni) ratio. An increase in film resistivity was found upon substitution of other cations (e.g., Zn2+, Al3+) for Ni in the spinel structure. However, some improvement in the mechanical properties of the films resulted. On the other hand, addition of small amounts of Li decreased the resistivity. A combination of XRD, XPS, UV/vis and Raman spectroscopy indicated that NiCo2O4 is the primary conducting component and that the conductivity reaches a maximum at this stoichiometry.

Abstract: A method of fabricating a patterned polymer film with nanometer scale includes filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a desired polymer film; allowing the embossed stamp placed on the polymer film to stand at temperatures higher than a glass transfer temperature of the polymer film for a predetermined time; and releasing the embossed stamp from the polymer film. Alternatively, the patterned polymer film is obtained by filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a coating layer of a polymer precursor formed on a substrate; curing the coating layer; and releasing the embossed stamp from the cured coating layer.

Abstract: In a method for producing a stamper for an optical information recording medium, a master 6 with a concavo-convex pattern is produced by exposing and developing a master substrate 3 including a resist 2 of an inorganic material formed on a substrate 1. An organic layer 7 is formed by a spin coat method on the concavo-convex pattern of the master 6. A conductive film 8 is formed on the organic layer 7 and a metal layer 9 is formed on the conductive film 8 by a plating. During the plating, the layer 7 prevents the resist from reacting with a conductive film and the metal layer and decomposing electrically. The metal layer 9 alone or together with the conductive film 8 is peeled off from the master 6 and thereby a stamper 10a or 10b having a concavo-convex pattern complementary to that of the master 6 is obtained.

Abstract: The invention concerns a method for producing a highly-porous ceramic layer and for application of this layer onto metallic, ceramic, enameled and/or glass substrates using porous, ceramic particles, preferably aluminum oxide, titanium oxide and zircon oxide, and an inorganic binder system. The inorganic binder system contains at least one ceramic nanoparticle of a particle size of less than 100 nm, preferably less than 50 nm and particularly preferred less than 25 nm, the solvent being water. Layers produced in this fashion are suited as self-cleaning catalytically active layers e.g. in ovens, in combustion engines etc. or for general coating of substances to considerably increase their specific surface e.g. for catalytic substrates.

Abstract: A metallo-organic decomposition process for the preparation of intermetallic powders and films. A liquid mixture containing a first metal precursor and a second metal is heated to a temperature in a first temperature range so as to convert the first metal precursor to a first metal followed by heating to a temperature in a second temperature range so as to form an intermetallic compound by a solid state reaction between the first and second metals. The intermetallic compound can be used as a catalyst in cut filler and/or the filter of a cigarette.

Abstract: Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some embodiments, the fluids may fill the enclosed area. In addition or alternatively, a second enclosed area may be formed about the topography. As such, the provided system may be adapted to form different enclosed areas about a substrate holder. In some cases, the method may include agitating a solution to minimize the accumulation of bubbles upon a wafer during an electroless deposition process. As such, the system provided herein may include a means for agitating a solution in some embodiments. Such a means for agitation may be distinct from the inlet/s used to supply the solution to the chamber.

Abstract: A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. A differential voltage is applied to the developer plate and the wafer causing an electric field to be formed in the gap. Transportation of negatively charge photoresist material is facilitated by exposure to the electric field during the development process.

Abstract: A coating method for a coating liquid includes preparing a coating surface which has a plurality of regions that are to be coated with said coating liquid; providing a plurality of storage chambers under atmospheric pressure in which said coating liquid is stored in respective amounts that enable the coating surfaces of said corresponding regions being coated to be coated to substantially the same coating thickness; disposing said corresponding regions being coated on the undersides of said storage chambers; and applying said coating liquid on the coating surfaces of said regions being coated by pushing said coating liquid stored in said storage chambers by said atmospheric pressure.

Abstract: Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.

Abstract: After a first processing solution is spread over the front surface of a substrate and the temperature of the front surface of the substrate is regulated at a predetermined substrate temperature, a second processing solution is spread over the front surface of the substrate. The second processing solution can be spread while the front surface temperature of the substrate is maintained at the predetermined substrate temperature. Hence, a layer insulating film with good adhesion properties can be formed uniformly on the front surface of the substrate, and the quantity of the processing solution to be used can be reduced.

Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.

Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.

Abstract: A method of forming a perovskite thin film includes preparing a perovskite precursor solution; preparing a silicon substrate for deposition of a perovskite thin film, including forming a bottom electrode on the substrate; securing the substrate in a spin-coating apparatus and spinning the substrate at a predetermined spin rate; injecting a perovskite precursor solution into the spin-coating apparatus thereby coating the substrate with the perovskite precursor solution to form a coated substrate; baking the coated substrate at temperatures which increase incrementally from about 90° C. to 300° C.; and annealing the coated substrate at a temperature of between about 500° C. to 800° C. for between five minutes to fifteen minutes.

Abstract: A method for producing a fluorine-containing polyimide film excelling in heat resistance, resistance to chemicals, water repellency, dielectric properties, electrical properties, and optical properties and a spin coater suitable for the method are to be provided. A method for the production of a fluorine-containing polyimide film which comprises forming a coating film of a fluorine-containing polyimide precursor in an atmosphere having a relative humidity thereof adjusted to a level of not more than 50 RH % and then subjecting the fluorine-containing polyimide precursor to heat treatment thereby forming a fluorine-containing polyimide film is provided. By adjusting the relative humidity in accordance with this method, the fluorine-containing polyimide precursor can be prevented from being decomposed by the absorption of moisture and consequently prevent effectively the fluorine-containing polyimide film from forming piriform spots and scratches.

Abstract: A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.

Abstract: This invention provides a method of fabricating a tunable dielectric slurry, comprising, depositing a thick film tunable dielectric onto a substrate, subjecting the thick film to UV radiation exposure after it is coated onto the substrate, drying and baking the thick film and the substrate, applying a developer to the thick film and the substrate, the developer capable of washing away an unexposed area of the thick film and retaining an exposed area enabling a latent pattern to be brought out and thus creating a patterned film, and sintering the substrate.

Abstract: A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolation applications. According to the methods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified by infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followed by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.

Abstract: On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.

Abstract: A spin-on glass (SOG) composition and a method of forming a silicon oxide layer utilizing the SOG composition are disclosed. The method includes coating on a semiconductor substrate having a surface discontinuity, an SOG composition containing polysilazane having a compound of the formula —(SiH2NH)n— wherein n represents a positive integer, a weight average molecular weight within the range of about 3,300 to 3,700 to form a planar SOG layer. The SOG layer is converted to a silicon oxide layer with a planar surface by curing the SOG layer. Also disclosed is a semiconductor device made by the method.

Abstract: The present invention relates to methods and/or systems for applying treatment fluid to a plurality of fabric articles in a fabric treatment apparatus. The present invention is also directed to an apparatus capable of carrying out such methods and/or systems.

Abstract: A technique to promote the adhesion and uniform distribution of a spin coated film upon a ferroelectric material. At least one embodiment of the invention uses a ferroelectric material, such as PVDF/TrFE, to promote the adhesion of a spin-coated film onto a wafer.

Abstract: Aluminophosphate compounds and compositions as can be used for substrate or composite films and coating to provide or enhance, without limitation, planarization, anti-biofouling and/or anti-microbial properties.

Abstract: A method and structure that forms a multilayer nanoparticle thin film assembly begins by functionalizing a substrate with functional molecules. Next, the invention replaces a stabilizer on a bottom surface of the first nanoparticles with the functional molecules via surface ligand exchange to make a first nanoparticle layer on the substrate. The invention then replaces the stabilizer on a top surface of the first nanoparticle layer with functional molecules via surface ligand exchange. The invention replaces the stabilizer on a bottom surface of the second nanoparticles with the functional molecules via surface ligand exchange to make a second nanoparticle layer on the first nanoparticle layer. Lastly, the invention repeats the previous steps and forms additional nanoparticle layers.

Abstract: A resist film forming method including a resist coating step, comprising steps of rising by a capillary phenomenon a coating liquid stored below the coating surface of a substrate held facing-downward, bringing the rised coating liquid into contact with the coating surface via a nozzle, and scanning the nozzle along the coating surface of the substrate thereby coating the resist film on the coating surface of the substrate, wherein said method further including a step of drying the coated resist film by moving the substrate at a predetermined speed with the coating surface of the substrate facing downward.

Abstract: In a method for forming one or more features in a thick-film ink deposited on a substrate, a photoimagable material is used to define a negative of the one or more features on the substrate. A thick-film ink is then deposited on at least part of the substrate, abutting at least some of the photoimagable material. The thick-film ink is cured, and the photoimagable material is removed. One embodiment of the method is used to produce a channel plate. Another embodiment of the method is used to produce a switch.

Abstract: This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these particles have a dimension of less than approximately one micron. A suction force is applied in the vicinity of the surface after applying the fluid so as to remove from the surface the majority of those particles having the dimension of less than approximately one micron.

Abstract: Provided is a method for increasing an etching selectivity of photoresist material. The method initiates with providing a substrate with a developed photoresist layer. The developed photoresist layer on the substrate is formulated to contain a hardening agent. Next, the substrate is exposed to a gas, where the gas is formulated to interact with the hardening agent. A portion of the developed photoresist layer is then converted to a hardened layer where the hardened layer is created by an interaction of the hardening agent with the gas. Some notable advantages of the discussed methods of increasing the selectivity of a photoresist include improved etch profile control. Additionally, by combining fabrication steps such as the hardening of the photoresist in an etch chamber, downstream etching processes may be performed without having to transfer the wafer to an additional chamber, thereby improving wafer throughput while minimizing handling.

Abstract: A method of manufacturing a magnetic recording medium including a servo pattern, comprising steps of:

Abstract: A wedge-shaped nozzle for dispensing fluids onto a round surface is disclosed. The nozzle dispenses the fluid with a generally uniform volume of fluid per unit area of the round surface to achieve rapidly a uniform thickness of applied fluid on the round surface. The wedge-shaped nozzle has orifices of equal size disposed on its bottom through which the fluid is dispensed. The orifices are disposed along arcs, with increasing numbers of orifices on the arcs at greater and greater distances of the arcs from the apex of the wedge-shaped nozzle. The numbers of the orifices on each arc are proportional to the area of an annular region determined by the arcs.

Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: The present invention is a coating unit for applying a coating solution on a substrate, comprising: a container enclosing the substrate; a casing for accommodating the container therein; a supply device for supplying a predetermined gas into the casing; a first exhaust pipe for exhausting an atmosphere inside the container; a second exhaust pipe for exhausting an atmosphere inside the casing; a first adjusting device which is disposed in the first exhaust pipe, for adjusting a flow rate of an atmosphere passing through the first exhaust pipe; and a second adjusting device which is disposed in the second exhaust pipe, for adjusting a flow rate of an atmosphere passing through the second exhaust pipe. According to the present invention, the second exhaust pipe is usable for adjusting the exhaust flow rate to maintain a pressure inside the casing at a positive pressure.

Abstract: A uniform coating is provided using surface features. Multiple ridges or other shapes are fabricated near an area of interest to allow for uniform coating in between the ridges. Areas at either ends of the ridges are left open to allow for excess pooling of photoresist liquid and to aid in obtaining uniform coating. The photoresist liquid or other coating fluid is applied to the sample and spun dry. A soft-bake process is performed to evaporate remaining solvents. An element, such as a diffractive, refractive, or reflective grating structure, is then formed in the area of interest using the uniform photoresist coating.

Abstract: A method of applying a layer of a flowable material to a substrate. The substrate is received with a rotatable chuck, and an amount of the flowable material is dispensed on to the substrate. The substrate is spun on the rotatable chuck, thereby spreading the flowable material across the substrate and conveying a surplus amount of the flowable material away from the substrate. An exhaust stream is created with a vacuum source. At least a portion of the surplus amount of the flowable material conveyed away from the substrate is entrained into the exhaust stream, which exhaust stream is conveyed into an exhaust system. A pressure drop is created in the exhaust stream across a vane anemometer within the exhaust system. The blow back of the entrained portion of the surplus amount of the flowable material from a downstream position in the exhaust system to the substrate is thereby reduced.

Abstract: A chemical pump includes a pressure chamber, a partition member for dividing the pressure chamber into a cleaning pressure chamber and a discharging pressure chamber, a filter part disposed on the primary side of the discharging pressure chamber, and a single drive mechanism. A pair of openings with respective check valves mounted therein are provided in each of the cleaning and discharging pressure chambers, and are positioned so as to cause a resist solution to flow only in the +Z direction. The drive mechanism moves the partition member in the −X direction to cause the resist solution to be sucked into the cleaning pressure chamber and to cause the resist solution to be discharged from the discharging pressure chamber.

Abstract: An organic thin film device in which as a junction interface shape between an organic thin film and an adjacent layer, a sectional contour shape of a device interface having a Hausdorff dimension, as one fractal dimension, falling within the range 1.5≦D≦2.0 is formed by defining the Hausdorff dimension and its scale length.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A method for producing an optical recording medium including a step of coating a dye solution on a substrate by a spin coating method to form a dye recording layer, wherein the substrate is rotated at a rotation speed of 400 rpm or higher during a period from the beginning to the end of the supply of the dye solution.