Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: A dielectric material is strengthened by bonding a metal component to the dielectric matrix. The metal component may be a metal oxide or metal oxide precursor. The metal component may be deposited on the substrate with the dielectric material, or sol-gel chemistry may be used and the liquid solution spin-coated on a substrate.

Abstract: A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting air or nitrogen gas blow onto a predetermined area of the material film.

Abstract: Disclosed is a process to rapidly spin-apply an AR coating system to a backside of a prescription lens. The AR coating system comprises a polyurethane primer layer, a siloxane thermally cured scratch resistant coating layer, a two-layer sol-gel AR coating, and a hydrophobic layer. The process comprising steps of spin-applying each of the layers provides a quick way to furnish a prescription lens that is AR coated on both sides.

Abstract: The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate.

Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

Abstract: A method for modification of glass-based microchannels, which uses liquid organic-based solution containing siloxane for the modification of microchannels on the glass substrate, such as quartz, boron glass, sodium glass, and the like, to form a solid film to isolate the glass surface of the microchannels from the environment. Therefore, the present invention can be applied for electrophoresis experiment, so that the operation causes no electrical-double-layer effects, and further eliminates the occurrence of electro-osmosis flow, thus the separation efficiency of electrophoresis chips is improved.

Abstract: A photoresist-free and ARC-free lip on the periphery of the upper surface of a semiconductor substrate adjacent the end edge of the substrate is formed by the steps of: forming an ARC layer on one surface of a semiconductor substrate; chemically treating the ARC layer to chemically terminate the ARC layer a first distance from the end edge of the substrate; forming a photoresist layer over the semiconductor substrate and over the ARC layer thereon; and exposing the peripheral portion of the photoresist layer to UV light followed by development of the exposed peripheral portion of the photoresist layer to photolithographically terminate the photoresist layer a second distance from the end edge of the substrate wherein the second distance is smaller than the first distance.

Abstract: A slit nozzle is positioned above a surface of a substrate placed in a rotary coater, and, while the slit nozzle is translated parallel to the surface of the substrate a coating solution is ejected from the slit nozzle toward the glass substrate under conditions such that the effects of surface tension of the solution are minimized or substantially cancelled out, to uniformly coat the coating solution on substantially the entire surface of the substrate with minimum wasting of the solution.

Abstract: Coated bodies and a process, apparatus and article of manufacture for coating bodies in a non-fluidized state, including tablets, by producing an upward spray of coating fluid by means of a two-fluid nozzle as defined herein and contacting said bodies with said spray of coating fluid in a non-fluidized state; wherein, before contacting the bodies with said spray, providing the bodies with a spinning movement by acentral impact of gas jets directed upward to intersect the centerline of said spray; guiding the spinning bodies by said gas jets towards a central position over the two-fluid nozzle, thereby increasing the number of suspended bodies contacting the spray; providing atomization gas to the two-fluid nozzle in an amount less than the one which after moderation by means of muffling gas would scatter the bodies in the spray zone; and pneumatically muffling the atomization gas just above the nozzle to reduce the body scattering effect thereof.

Abstract: An aqueous inorganic solution for sealing the porosity of metal components made of sintered compacted powered metal and castings formed from liquid metal, and a process for applying the solution onto the components. The solution consists primarily of a blend of inorganic metallic salt silicates with the metal ions being taken from Group 1A elements.

Abstract: A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.

Abstract: A substrate (W) is held in an approximately horizontal position by a substrate holder (10) and is rotated by a spinning motor (13). A rinsing liquid supply nozzle (140) is rotatably supported at its one end by a second nozzle movement mechanism (150) and is rotated to pass over the substrate (W). The rinsing liquid supply nozzle (140) is rotated to pass over the substrate (W) and at the same time to discharge a rinsing liquid from its discharge unit. At this time, the rinsing liquid supply nozzle (140) and the substrate (W) are rotated so that a virtual scanning direction (La) of the substrate (W) is substantially perpendicular to a direction of extension of the rinsing liquid supply nozzle (140). That is, since the rinsing liquid supply nozzle (140) is shifted in the virtual scanning direction (La), a non-supplying area of the substrate (W) where a rinsing liquid is not supplied can successively be made up and eliminated as the scanning by the nozzle (140) proceeds.

Abstract: A machine for applying sealant material to non-circular closures using a rotating chuck connected to a rotational motor and a fixedly mounted dispensing apparatus. The chuck is also moved in at least one linear direction in a plane normal to the rotational axis of the chuck. The rotational motor may be connected to the chuck using various mechanisms while minimizing the moving mass of the machine. Sealant applicators are also disclosed that are mounted on a turret and use independently controlled motors, or fully integrated servomotors to rotate the chuck.

Abstract: A method of preparing a multi-layer, crack resistant sol-gel glass derived coating on a substrate by removing the outer periphery of each layer before curing the layer and depositing any succeeding layer.

Abstract: A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.

Abstract: An article which is being processed with plasma is moved during plasma processing so that the motion of the article comprises at least a first rotational motion, a second rotational motion, and a third rotational motion which occur simultaneously. The apparatus that moves the article comprises a first arm rotatable around a first axis, a second arm rotatably attached to the first arm and rotating the article around a second axis, and a rotational mechanism for inducing a rotational motion of the article in addition to, and simultaneously with, the rotation of the first and second arms.

Abstract: A method for rotationally casting a coating onto a flexible substrate is provided wherein the coating comprises a polyurethane composition formed from (a) a substantially linear isocyanate-terminated polyurethane prepolymer; and, (b) a curative agent containing a diol having a molecular weight of less than 250 and, optionally, a secondary aliphatic diamine. Also provided is a flexible substrate possessing the coating.

Abstract: A resist coating unit includes a coater cup surrounding a wafer W held by a spin chuck and an air supply mechanism for blowing an air into the coater cup. The air supply mechanism includes a hollow frame having a first open portion formed in the vertical wall, an air blowing device for blowing an air into the hollow frame, and a filter chamber unit into which the air within the frame is introduced. The filter chamber unit includes a first air introducing chamber having a heater arranged therein, a second air introducing chamber, an air stream control mechanism, and a filter unit. The air flowing within the frame flows into the first air introducing chamber through the first open portion so as to be uniformly heated by the heater and, then, is introduced into the second air introducing chamber. Then, the air uniformly heated by the heater is blown into the coater cup through the air stream control mechanism and the filter unit.

Abstract: A multi-nozzle gas spray arm for a spin coating apparatus. In a typical embodiment, the invention comprises a primary spray arm and a secondary spray arm which is confluently connected to the primary spray arm. The primary spray arm ejects a narrow, relatively high-velocity nitrogen stream against a substrate while the secondary spray arm ejects a diffuse, relatively low-velocity nitrogen stream against the substrate as the gas spray arm is typically swept across the surface of the wafer. The diffuse nitrogen flow characteristic of the nitrogen ejected from the secondary spray arm is effective in eliminating water and chemical droplets which otherwise would tend to remain and form dry spots on the wafer surface.

Abstract: A method for coating a substrate includes rotating the substrate about an axis, and applying a polymeric reaction mixture to a surface of the rotating substrate by ejecting the polymeric reaction mixture through a die. The die has a branched system of channels for dividing an inlet stream of the polymeric reaction mixture into plural outlet streams. The outlet streams are spaced apart from each other such that the outlet streams flow together seamlessly after application to the substrate. The die and the rotating substrate are moved longitudinally relative to each other. And the material output rate of the mixture and the relative movement of the die are synchronized with the rotational speed of the substrate in such a way that successive convolutions of polymeric reaction mixture overlap and connect together seamlessly.

Abstract: An process of forming multilayer thin film heterostructures is disclosed and includes applying a solution including a first water-soluble polymer from the group of polyanionic species, polycationic species and uncharged polymer species onto a substrate to form a first coating layer on the substrate, drying the first coating layer on the substrate, applying a solution including a second water-soluble polymer from the group of polyanionic species, polycationic species and uncharged polymer species onto the substrate having the first coating layer to form a second coating layer on the first coating layer wherein the second water-soluble polymer is of a different material than the first water-soluble polymer, and drying the second coating layer on the first coating layer so as to form a bilayer structure on the substrate.

Abstract: The present invention has several plausible embodiments. In one embodiment an apparatus for coating a medical device is provided. This apparatus includes a coating chamber, a vibrating structure within the coating chamber the vibrating structure capable of suspending a medical device positioned in the coating chamber, and a coating source, the coating source positioned to introduce coating into the coating chamber. In another embodiment a method of coating a medical device is provided. This method includes moving a medical device into a predetermined coating area, vibrating a structure below the medical device, the vibration of the structure forcing the medical device away from the vibrating structure, and coating at least a portion of the medical device that has moved away from the vibrating structure.

Abstract: A workpiece coating apparatus (12) for applying a coating to each of a plurality of workpieces (11). A coating system (14) includes a coating chamber (18) that receives the workpieces (11) for coating. A curing system (16) includes a curing chamber (20) that receives workpieces (11) for curing. A conveyor system (22) rotates the workpieces (11) about horizontal axes (38) while serially transporting them first through the coating chamber (18) for coating and then through the curing chamber (20) for curing. The coating chamber (18) and curing chamber (20) are stacked to minimize floor space requirements.

Abstract: A method for coating low viscosity materials onto a wafer to form a uniform film. After a wafer is rotated at a first rotation speed, coating solution is drizzled onto the wafer. The wafer is decelerated to a second rotation speed at a first deceleration rate to spread the coating solution. Next, the wafer is slowly decelerated to a third rotation speed at a second deceleration rate considerably lower than the first deceleration rate, so the coating solution reflows to the center of the wafer. The wafer is then quickly accelerated to a fourth rotation speed at a third acceleration rate larger than the first deceleration rate to spread the coating solution again.

Abstract: An improved method for producing substrates coated with dielectric films for use in microelectronic applications wherein the films are processed by exposing the coated substrate surfaces to a flux of electron beam. Substrates cured via electron beam exposure possess superior dielectric properties, density, uniformity, thermal stability, and oxygen stability.

Abstract: The present invention is to provide a method of making a polymer compound material by coating an inorganic material on the surface of a polymer. The method provided by the present invention comprises the step of spraying a high volatile solvent to a chipped polymeric matrix to slightly dissolve the surface of the matrix, and the step of adding inorganic material powders to let the powders be coated on the surface of the matrix layer by layer so as to form the polymer compound material.

Abstract: A spin-coater for coating a liquid material on a wafer that is equipped with a self-cleaning coating cup and a method for self-cleaning a spin-coater are described. The spin-coater is constructed of a coating cup of circular shape, a wafer pedestal situated in the cup, a coating material dispensing nozzle over the pedestal, a motor means for rotating the pedestal, and a solvent dispensing means that is mounted juxtaposed to an upper rim of the sidewall of the cup for dispensing a cleaning solvent onto an interior surface of the sidewall to dissolve and rinse off any liquid coating material splattered thereon and to prevent the formation of solid contamination from the solidified coating material.

Abstract: The present invention relates to methods of incorporating additives into a thin film formed on a substrate comprising: forming an impregnatable thin film on at least one face of a substrate; depositing an impregnation composition comprising at least one additive incorporated in an appropriate diluent medium on said impregnatable thin film by spin coating; diffusing the impregnation composition within said impregnatable thin film and; treating the substrate coated with the impregnated thin film to at least partially remove the diluent medium from the impregnated thin film. The invention also relates to the application of such methods to the production of optical lenses, including in the coloring of such lenses.

Abstract: In a method and apparatus for jetting a liquid from a nozzle of a droplet jet head and applying it to a substrate, a jet amount of the liquid to any one of at least two divided regions of a coating region of the substrate is controlled to be greater than a jet amount to the other divided regions. A spin coater can be used to rotate the substrate. To divide the coating region of the substrate, the substrate can be divided into at least an inside circumferential region and an outside circumferential region positioned at predetermined distances from the center of rotation of the substrate. In this case, the jet amount to the outside region is greater than the jet amount to the inside region.

Abstract: A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface of a cylindrical substrate, and a layer of a heat-resistant resin is formed thereon. An accumulated body of the heat-resistant resin and the metallic thin film is peeled off from the substrate. The metallic thin film may be formed by electroplating, electroless plating or vapor deposition, or may also be formed by attaching a metallic foil having been prepared on an inner surface of the substrate. The heat-resistant resin layer is formed by injecting a polyamide acid solution in a rotational drum, and then formed by centrifugal forming by rotating the rotational drum on rollers under heating. After forming, imidization is conducted by heating and baking to form a film member of a thermosetting polyimide.

Abstract: The present invention relates to an apparatus for coating one or more workpieces such as components to be used in jet engines or industrial turbines. The apparatus comprises a device for simultaneously manipulating a workpiece about multiple axes while holding a center of the workpiece at a fixed position with respect to a source of coating material. The device for manipulating the workpiece preferably comprises a modular fixture while allows the workpiece to be simultaneously rotated about a first axis, rotated about a second axis at an angle to the first axis, and titled through a range of motion such as from +45 degrees to −45 degrees with respect to the first axis.

Abstract: The purging of photoresist from a supply device of semiconductor coating equipment is automatically executed in a controlled manner. The equipment employs a plurality of photoresist bottles for storing the same kind of photoresist. A plurality of supply pipes are respectively connected to the photoresist bottles, respectively. A valve system selectively opens and closes the supply pipes in response to control signals generated by a main controller. A dispense pump forces the photoresist in the open supply pipe through a nozzle. A purge start button issues a purge start command signal to the controller when the button is pressed. The controller then controls the valve system and the dispense pump so as to automatically purge the photoresist according to a sequence effected using a timer.

Abstract: Methods for forming data storage media and the media formed thereby are disclosed herein. In one embodiment, the method for forming a data storage media, comprises: injection molding a substrate comprising surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master; and disposing a data layer over at least one surface of said substrate; wherein said data storage media has an axial displacement peak of less than about 500&mgr; under shock or vibration excitation.

Abstract: A spin coating apparatus and method of manufacturing incorporating a perforated sheet located above the substrate in a manner to control solvent evaporation that tends to occur in the coating vessel when the chuck is rotated without introducing additional airflow complications. The distance between the substrate surface and the perforated sheet, and the number, distribution, and size of the perforations in the perforated sheet can be adjusted to optimize the uniformity of film thickness coating the substrate. The result is reduced substrate and room contamination and enhanced coating uniformity.

Abstract: A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.

Abstract: A ferrite layer formation process that may be performed at a lower temperature than conventional ferrite formation processes. The formation process may produce highly anisotropic structures. A ferrite layer is deposited on a substrate while the substrate is exposed to a magnetic field. An intermediate layer may be positioned between the substrate and the ferrite to promote bonding of the ferrite to the substrate. The process may be performed at temperatures less than 300° C. Ferrite film anisotropy may be achieved by embodiments of the invention in the range of about 1000 dyn-cm/cm3 to about 2×106 dyn-cm/cm3.

Abstract: After an additive containing a reducing agent is supplied to an object to be treated, a solution containing metal ions such as a copper sulfate solution is supplied to the object to be treated. Since the additive and the solution containing the metal ions are separated, the composition of a plating solution is easily regulated.

Abstract: Compositions comprising: (i) a coating solvent comprising a liquid carrier, and at least one fluorocarbon surface tension-reducing agent; and (ii) a coating moiety dissolved therein are described. Also described is a method of using the compositions to solution coat a surface.

Abstract: There is provided an apparatus for spin-coating a semiconductor substrate, including (a) a rotary table rotatable in opposite directions, (b) a nozzle dropping coating material onto a semiconductor substrate lying on the rotary table, (c) an electrode having a ring-shaped cross-section and disposed around the rotary table, and (d) a power source applying a voltage to the electrode, the voltage having an electric polarity opposite to an electric polarity of the coating material. Coating material dropped onto the semiconductor substrate is attracted to an electric field generated by the electrode around the semiconductor substrate. Hence, the coating material is not concentrated around a center of the semiconductor substrate, but is facilitated to uniformly spread over the semiconductor substrate, ensuring formation of a coating layer having a uniform thickness.

Abstract: A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stamping station is adapted to retain a large area substrate thereon. The stamp has a patterned bottom surface that is adapted for microcontact printing. The prep station is for applying a precursor to the patterned bottom surface of the stamp. In one embodiment, a method for processing large area substrates includes the steps of disposing a large area substrate on a platen, inking a stamp adapted for microcontact printing, and automatically contacting a bottom of the stamp to the large area substrate supported on a platen.

Abstract: Disclosed is a film-forming method, comprising dispensing from a dispenser nozzle a coating solution, which is prepared by adding a solid component to a solvent and controlled to be spread on the substrate in a predetermined range, onto a target substrate to be processed while relatively moving the dispenser nozzle and the target substrate so as to form a liquid film on the entire surface of the target substrate, and arranging a sucking nozzle above and apart from the target substrate such that the sucking nozzle is not in contact with the surface of the liquid film so as to permit the sucking nozzle to suck the solvent vapor right under the sucking nozzle while moving the sucking nozzle relative to the target substrate, thereby removing the solvent from the liquid film and, thus, forming a coated film.

Abstract: A method of applying a coating such as a varnish or a paint on a hollow article. The method includes the operation consisting in depositing a predetermined quantity of coating in the fluid state on the center of a surface of the article, and in spreading it by causing the article to revolve.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: A solid electrolytic body is dipped into a slurry stored in a dipping tank, while the slurry is forcibly circulated between the dipping tank and a viscosity adjusting tank by a circulating pump. A slurry film is formed on a predetermined portion of the solid electrolytic body through this dipping treatment. Then, the slurry film is changed into a porous layer through a sintering treatment.

Abstract: A method and apparatus for removing excess coating material from a honeycomb body of a catalytic converter. The coated honeycomb body is mounted on an eccentric tappet and is rotated around a first rotational axis with a first rotational frequency such that the distance from the center of gravity of the honeycomb body to the first rotational axis is at least 1.5 times the length of the honeycomb body. The honeycomb body is further rotated around a second rotational axis even out the coating material and provide a more uniform coating surface.

Abstract: The present invention relates to polymethylsilsesquioxane copolymers, and methods for preparing the copolymers and low-dielectric PMSSQ coating films. Polymethylsilsesquioxane copolymer of the present invention is synthesized by a copolymerization reaction using a methyltrialkokxysilane [A: CH3Si(OR)3] and &agr;,&ohgr;-bistrialkokxysilane compound [B: (RO)3Si—X—Y—Si(OR)3, wherein X and Y are identical or different hydrocarbon groups and are linked to each other by carbon] as a copolymerization monomer, and it contains Si—OH terminal group more than 10% in content, and has molecular weight ranging from 5,000 to 30,000. The coating film prepared from the low dielectric PMSSQ according to the present invention meets the two inevitable requirements for next generation semiconductor industry, i.e., mechanical strength (hardness 1.9 Gpa, Modulus 12 Gpa) and low dielectric property (<2.3).