Abstract: There is provided an array of alkyl substituted silsesquioxane thin film precursors having a structure wherein alkyl groups are bonded to the silicon atoms of a silsesquioxane cage. The alkyl groups may be the same as, or different than the other alkyl groups. In a first aspect, the present invention provides a composition comprising a vaporized material having the formula [R—SiO1.5]x[H—SiO1.5]y, wherein x+y=n, n is an integer between 2 and 30, x is an integer between 1 and n and y is a whole number between 0 and n. R is a C1 to C100 alkyl group. Also provided are films made from these precursors and objects comprising these films.

Abstract: A developer is supplied onto a substrate and thereafter a rinse discharge nozzle is moved toward an operating direction. The rinse discharge nozzle is so moved on the substrate as to continuously supply pure water onto the substrate from a slit discharge port of the rinse discharge nozzle while sucking and recovering the pure water from the surface of the substrate through a slit suction port, and a series of development is performed in a stationary state of the substrate.

Abstract: The present invention relates to porous layers, to a method for the production thereof and to the use of those layers in micro-electronics, in sensors, in catalytic reactions, in separation methods and in optical layers. The layers according to the invention are produced by application of a suspension of porous particles to a substrate by means of spin-coating.

Abstract: Low dielectric constant porous materials with improved elastic modulus and material hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material with a fluorine-free plasma gas to produce a fluorine-free plasma cured porous dielectric material. Fluorine-free plasma curing of the porous dielectric material yields a material with improved modulus and material hardness, and with comparable dielectric constant. The improvement in elastic modulus is typically greater than or about 50%, and more typically greater than or about 100%. The improvement in material hardness is typically greater than or about 50%. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.

Abstract: The present invention provides a method and apparatus for achieving ornamental dispersion of particles in a molded article thereby increasing the ornamental desirability of the article. The method for achieving ornamental dispersion of small planar particles in a resin molded articles comprises the steps of preparing a basic plate with any patterns engraved therein, pouring moldable fluid resin mixed with small planer particles into the patterns engraved in the plate, shaking the plate in circular vibration, hardening the resin and grinding the surface of the plate. When the patterns are is filled with a fluid resin material to which planar particles have been added, the action of the apparatus serves to ornamentally disperse the particles within the fluid resin while maintaining a pearl-like dispersion of each particle until the resin has set.

Abstract: A wafer is held on the upper side of a chuck. The chuck is connected to a spin motor, a motor-pedestal seat and an air cylinder shaft. The spin motor functions to rotate the chuck while the air cylinder shaft functions to elevate the chuck. When a resist is dropped on the wafer, the air is supplied to the air cylinder concurrently with the rotation of the spin motor, thus causing the chuck to move upward while rotating. The upward movement causes a downward inertial force to act on the resist, which in turn causes the resist to be pressed against the wafer while being dispersed over the surface of the wafer.

Abstract: A method and apparatus is provided for preparing an optical information medium comprising a disk-shaped substrate having a center hole, an information recording layer thereon, and a resin-based light-transmitting layer thereon by which recording/reading laser beam is transmitted. The apparatus includes a rotating table (2) for holding and rotating the substrate (100) having the information recording layer borne thereon, a plug means (3) including a disk member (31) for closing the center hole (101) and an integral support shaft (32), and a nozzle (4) for feeding a coating fluid containing the resin to the outer periphery of the support shaft (32), wherein the coating fluid is flowed from the support shaft to the disk member, then over the substrate, thereby forming the light-transmitting layer having a minimized thickness variation.

Abstract: An apparatus for and method of rinsing one side of a two-sided substrate and removing unwanted material from the substrate's edge and/or backside. One embodiment of the method is directed toward rinsing and cleaning a substrate having a front side upon which integrated circuits are to be formed and a backside. This embodiment includes dropping the substrate front side down onto a pool of rinsing liquid in a manner such that the front side of the substrate is in contact with the solution while the substrate is held in suspension by the surface tension of the solution liquid thereby preventing the backside of the substrate from sinking under an upper surface of the pool. Next, while the substrate is in suspension in said rinsing liquid, the substrate is secured by its edge with a first set of fingers and in some embodiments the substrate is subsequently spun. In another embodiment, a method of forming a copper layer on a front side of a substrate is disclosed.

Abstract: A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).

Abstract: The present invention generally relates to a method of modifying the surface of substrates such as contact lenses and other biomedical articles by at least partially coating the surfaces of such substrates with a polymeric tie layer having reactive sites. Various other moieties may then be chemically attached to the article surface by reaction of the other moieties with the reactive sites through classical chemical attachment mechanisms.

Abstract: In processing a substrate, adsorption members provided on a table play an important role in whether “indirectly influenced marks” are left on the rear surface of the substrate. Groups of adsorption members are selected in a predetermined order for use in the adsorption operation. Adsorption at a first group of members is terminated before an “indirectly influenced mark” is left on the substrate, and another adsorption operation is initiated at a second group of members. In this manner, the substrate is held on the table by migrating adsorption sites on the rear surface of the substrate.

Abstract: A machine for processing a flat workpiece or wafer has a head, which spins the wafer between upper and lower weirs in a base. The head is spaced apart from the base by an air gap. A vacuum source attached to an exhaust opening in the base draw air through the air gap, to reduce or eliminate movement of process chemicals into the head. Corrosion of head components by process chemicals is reduced. The disadvantages of having a mechanical seal between the base and the head are also eliminated.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A spin-coating method according to the present invention includes a uniforming step of rotating a substrate at a predetermined main rotation speed for a predetermined main rotation time so as to primarily make a resist film thickness uniform, and a subsequent drying step of rotating the substrate at a predetermined drying rotation speed for a predetermined drying rotation time so as to primarily dry the uniform resist film. In the present invention, a contour map, for example, of film thickness uniformity within an effective region (critical area) shown in FIG. 3A is determined (generated), and resist-coating is performed by selecting a condition within the optimum region in this contour map in which the film thickness uniformity (within an effective region) can be the maximum, or within the region in which the film thickness uniformity (within an effective region) can be high enough for a desirably specified.

Abstract: A device for coating a developing liquid included in an developing device of the present invention includes a coating member rotatable with the developing liquid deposited thereon in a preselected amount. An intermediate member has a surface contacting the surface of the coating member and is movable at the same speed and in the same direction as the surface of the coating member. Also, the surface of the intermediate member contacts the surface of a developing roller to be coated with the developing liquid and is movable in the opposite direction to the surface of the developing roller.

Abstract: A film having a large thin layer, preferably of a nano-micrometer thickness, of at least one perovskite magnanite. A coating for blocking EMIs, in particular the directed energy pulses, said coating comprising at least one nanostructured perovskite manganite in an environmentally friendly carrier. A method of protecting a surface by applying coating having at least one perovskite manganite in an environmentally friendly carrier. A barrier coating having at least one perovskite manganite in an environmentally friendly carrier.

Abstract: A method and apparatus for simultaneously coating and measuring a part. The apparatus includes a part support, a sprayer and a part measurer positioned adjacent to the part support and a display device positioned adjacent to the part support. The sprayer applies a coating to a section of the part while the part measurer continuously measures a dimension of the section of the part being coated. In one embodiment, an initial amount of coating and a final amount of coating are applied to the section of the part based on the dimension measurements and desired dimension of the part. In another embodiment, the amount of coating applied to the part is based on the desired coating thickness. As a result, the apparatus and method of the present invention significantly reduces the margin of error related to the application of coatings to parts.

Abstract: Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

Abstract: The frequency uniformity of a film bulk acoustic resonator may be improved by controlling the thickness across a wafer of one or more layers of the film bulk acoustic resonator. One or more layers of the film bulk acoustic resonator may be deposited in a way that irregularities in the deposition process from one die to another may be controlled.

Abstract: A method of fabricating a micro-electromechanical systems device that is positioned on a wafer substrate that incorporates drive circuitry includes the step of depositing a first sacrificial layer of an organic material on the wafer substrate. The first sacrificial layer is etched to define a required pattern. A layer of a conductive material is deposited on the first sacrificial layer. The layer of conductive material is etched to define a required structure and at least one subsequent sacrificial layer of organic material is deposited on the layer of conductive material. The at least one subsequent sacrificial layer is etched to define a further required pattern. A structural layer of a dielectric material is deposited on the subsequent sacrificial layer. The structural layer is etched to define a further required structure. The sacrificial layers are removed to release micro-electromechanical structures defined by the layer of conductive material and the structural layer.

Abstract: Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold.

Abstract: Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: In a method and apparatus for forming a plurality of films on the surface of a substrate, at least two liquid samples are deposited by a deposition device onto the substrate surface. The substrate is moved so that the liquid samples on the substrate are subjected to a non-contact spreading force sufficient to cause the samples to spread over the surface to form a respective film thereon. At least a portion of each film is discrete from one or more other films formed on each substrate surface. In another embodiment, liquid samples of different compositions are deposited on an array of substrates. The liquid samples on at least two of the substrates are subjected to non-contact spreading forces during overlapping durations of time whereby the spreading forces are sufficient to cause the samples to spread over respective surfaces of the substrates to form films thereon.

Abstract: Disclosed is a semiconductor device manufacturing apparatus provided with a rotational gas injector for supplying source gases at an upper portion of a reaction chamber. According to the invention, source gases are injected from the upside of the wafers through the rotational type gas injector, and non-reacted gases are exhausted into the downside space of the wafers, so that lowering in the thickness uniformity of a thin film due to the horizontal flow of source gases provided in the conventional art decrease remarkably. Accordingly, although multiple wafers are loaded in a single reaction chamber, a thin film having very high thickness uniformity can be deposited with respect to all the wafers, thereby capable of enhancing the productivity.

Abstract: A non-sintered element body having a predetermined shape is fabricated from powdery raw material of a solid electrolytic body. The non-sintered element body is temporarily sintered to obtain a partially-sintered element body as a semi-finished product of the solid electrolytic body. An outer surface of the partially-sintered element body is dipped into a slurry. The slurry contains surface roughing powder including large and small grains which are mutually differentiated in grain size. Then, the partially-sintered element body with a rough slurry film coated thereon is completely sintered into the solid electrolytic body.

Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

Abstract: A method of forming a perovskite thin film includes preparing a perovskite precursor solution; preparing a silicon substrate for deposition of a perovskite thin film, including forming a bottom electrode on the substrate; securing the substrate in a spin-coating apparatus and spinning the substrate at a predetermined spin rate; injecting a perovskite precursor solution into the spin-coating apparatus thereby coating the substrate with the perovskite precursor solution to form a coated substrate; baking the coated substrate at temperatures which increase incrementally from about 90° C. to 300° C.; and annealing the coated substrate at a temperature of between about 500° C. to 800° C. for between about five minutes to fifteen minutes.

Abstract: This invention discloses a novel design to obtain a good coating uniformity and to reduce the volume of viscous materials when coating by spraying the viscous material on the wafer during the first time period at a first predetermined pressures; spraying the viscous material on the wafer at a second predetermined pressure in response to the end of the first time period, the second predetermined pressure being lower than the first predetermined pressure; and spraying the viscous material on the wafer during a second time period at a time-varying pressure, the time-varying pressure being increased from the second predetermined pressure to a third predetermined pressure during the second time period.

Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.

Abstract: There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5 q&ggr; (mm) given with respect to a surface tension &ggr; (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5 (m·sec/N).

Abstract: A method and apparatus for forming a generally uniform liquid layer on a surface of an upper surface microelectronic substrate. The apparatus can include a support that engages less than the entire lower surface of the microelectronic substrate and rotates the microelectronic substrate at a selected rate. A barrier can extend over the upper surface of the microelectronic substrate and can rotate at about the same rate as the substrate to separate a rotating air mass adjacent to the upper surface and within the barrier from a stationary air mass external to the barrier. The rotating air mass can reduce the likelihood for liquid/air interface disturbances that create non-uniformities in the liquid layer. Accordingly, the method and apparatus can increase the range of thicknesses to which the liquid layer can be formed and can reduce the topographical non-uniformities of the liquid layer.

Abstract: A coating solution for used in a scan coating method contains a low vapor pressure solvent having a vapor pressure lower than 1 Torr (133.322 Pa) at room temperature.

Abstract: A substrate spinning step is executed for spinning a substrate in a plane parallel to a principal plane thereof at a first spinning speed of 100 rpm to 500 rpm. Then, a first applying step is executed for supplying a treating solution to a surface of the substrate by moving a nozzle from a position opposed to an edge of the substrate in a spin toward a position opposed to a spin center of the substrate while delivering the treating solution from the nozzle. Next, a second applying step is executed for supplying the treating solution to the surface of the substrate by stopping the nozzle at the position opposed to the spin center of the substrate in the spin while delivering the treating solution from the nozzle. Finally, a film thickness adjusting step is executed for stopping delivery of the treating solution from the nozzle, and spinning the substrate in the plane parallel to the principal plane thereof at a second spinning speed faster than the first spinning speed.

Abstract: A spin chuck on which a wafer is mounted is divided into a plurality of regions concentrically in a radial direction, and different temperatures are set for each of the regions so that the temperature gradually increases from the outer periphery to the center. The wafer is placed on this spin chuck, and a processing solution is applied to the wafer and spread over the wafer by centrifugal force, whereby the vaporization of a solvent of the processing solution which is spread on the outer periphery of the wafer is suppressed, and hence the timing of drying of the processing solution within the surface of the wafer can be made uniform. Consequently, a coating film with a uniform thickness within the wafer surface can be obtained.

Abstract: A method for spin coating a polymeric material film upon a wafer rotatably mounted within a spin coater; the wafer having a surface, including the following steps. A first step of rotating the wafer on an axis perpendicular to the wafer surface while applying a predetermined amount of polymeric material while rotating the wafer at a rotational speed of from about 300 to 1200 rpm for from about 2.5 to 5 seconds to spread the polymeric material on the whole surface of the wafer. A second step of increasing the rotational speed of the wafer to about 5500 rpm for about 2.5 seconds. A third step of decreasing the rotational speed of the wafer to about 300 to 1200 rpm for about 2.5 seconds. A fourth step of increasing the rotational speed of the wafer to about 5500 rpm for about 20 seconds to form the polymeric material film having a predetermined thickness over the whole surface of the wafer.

Abstract: A device for coating a film with more than two kinds of thickness, including a turntable, a mask and a coating source. The turntable spins regularly. The shape of the mask depends on the thickness of the film and the mask is set close to the substrate. The coating source is set opposite to the turntable, and the mask is set between the coating source and the turntable. The invention also discloses a method for coating a film with more than two kinds of thickness. The method including setting a substrate on a turntable that spins regularly, setting a mask close to the substrate and coating a film on the substrate by a coating source.

Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: The invention provides a device for holding a substrate during deposition processes that includes a rotation member rotatable about a first, central axis, and a plurality of substrate holders positioned on the rotation member, the substrate holders being rotatable about second axes. In another aspect, the invention provides a method of applying a substantially uniform coating on a substrate including the steps of providing a device of the invention; mounting a substrate onto the substrate mounts; providing at least one substrate coating station in spaced relation to the substrate mounts; rotating the rotation member about a central axis to position one or more of the substrate mounts at the substrate coating station; supplying the coating through the nozzle; moving the nozzle of the coating station in a direction parallel to the substrate at a predetermined rate to apply a uniform coating on the substrate; and rotating the substrate mounts about the second axes during the coating process.

Abstract: To provide a device and a method for forming a film by discharging a liquid material with a liquid discharge head or the like, such as an ink jet head, and which can reduce the unevenness resulting from variation of the amount of the discharged liquid material. To provide a device and a method for forming a film by discharging a liquid material and which can increase process efficiency while suppressing the increase of costs, even if the liquid material is discharged onto various objects.

Abstract: A process for preparing low-dielectric-constant silica film is developed. The dielectric constant of said film are lower than 2.5. Said process comprises a) preparing spin coating solution, said solution being composed of silica precursor, deionized water, alcohol, single proton acid, and polyoxyethylene (20) sorbitan compounds also known as Tween group compounds as templates; the weight ratio of polyoxyethylene (20) sorbitan compounds over TEOS being more than 0.41; b) spin-coating the said solution into a film; c) removing most water and alcohol in said film and making the film react with silicon wafer in soft-bake process; d) removing said polyoxyethylene (20) sorbitan compound of said film in calcination process; and e) Modifying said film to hydrophobic by dehydroxylating said film.

Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

Abstract: A physical vapor deposition coating system to produce orthogonal lift-off coatings. The system incorporates multiple domes that rotate about the source centerline and about another axis of rotation in order to assure an even coating and to utilize a large percentage of a material evaporated from the source.

Abstract: A coating process method in which a coating liquid is discharged onto the surface of a target substrate to be processed while rotating the target substrate so as to expand the coating liquid radially outward on the target substrate and, thus, to form a coated film comprises the step of detecting that the actual discharging of a coating liquid from a coating liquid discharging nozzle is started, and the step of controlling based on a signal of the detection at least one of the driving timing of a pump for allowing the coating liquid to be discharged from the coating liquid discharging nozzle, the operation timing of a valve mounted to a pipe for supplying the coating liquid into the coating liquid discharging nozzle, and the rotation starting or stopping timing of the target substrate.

Abstract: This invention provides a method for producing a CD-R optical recording medium. A first stack at a first stage is created by forming on a substrate a recording layer containing an organic dyestuff and a metal layer. At least after a formation of the metal layer; the first stack is transported from the first stage along a transport path towards a second stage through an atmosphere having a relative humidity. The relative humidity is maintained at 40% or less. To control the relative humidity, a shielding plate may be provided around the transport path. An air conditioner may locally control the relative humidity of an area encircled by this shielding plate.

Abstract: A method for fabricating a structure on a substrate with a low contrast photoresist having a height greater than 15 microns is provided. A uniformly thick film of photoresist is achieved on a substrate by spinning the substrate at two different speeds, then at least partially, but not fully drying the layer of photoresist at ambient temperature. The layer of photoresist is then dried and hardened by applying heat to the bottom surface of the substrate via a hot plate. The substrate is maintained level at all times during the spinning and drying steps in order to prevent wedging of the photoresist which remains in a plastic state until fully hardened by the hot plate. A surface relief pattern is then created in the photoresist via a scanning beam of electromagnetic radiation, which is preferably a laser beam. The resulting exposed surface relief patterns are then developed to produce the desired structure, which has a height of 15 microns or greater.

Abstract: A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: An optical disc and its manufacturing method in which humps may be prohibited from being formed on an outer rim area of the disc to assure optimum surface properties of a light transmitting layer of the disc to contribute to further increase in recording capacity. On a substrate 2 of an optical disc 1 are sequentially formed a recording portion 6 and a light transmitting layer 5. The light falls on the light transmitting layer 5 to record and/or reproduce information signals for a signal recording area 6a of the substrate 2. The radial distance D from the outermost rim of the substrate 2 to the signal recording area 6a is selected to be larger than the radial width L of a hump 5a formed on the outer rim of the light transmitting layer 5. The hump 5a has a height h from the surface of the light transmitting layer 5 not larger than 70 &mgr;m.

Abstract: A method for spin coating high viscosity materials. Two dispense steps are used. The first dispense step dispenses a small amount (102) of high viscosity material at the center of the wafer (100). A high-speed wafer rotation spreads the material to form a thin layer (104) to prime the surface of the wafer (100) and lower the surface tension without regard to uniformity. A second dispense step occurs at lower RPM and coats (108) the wafer (100) more uniformly.