Metal Coating Patents (Class 427/250)
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Patent number: 7598204Abstract: A reagent suitable for use as a catalyst comprises a first metal species substrate having a second reduced metal species coated thereon, the second reduced metal species being less electropositive than the first metal. Methods of manufacture are also provided.Type: GrantFiled: September 19, 2005Date of Patent: October 6, 2009Assignee: General Motors CorporationInventors: Andrew M. Mance, Tao Xie, Belabbes Merzougui
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Patent number: 7597934Abstract: A method for making a gas turbine engine turbine blade comprising an airfoil section a platform section, an under platform section, and a dovetail section, the exterior surface of the dovetail section comprising a shank exterior surface and a serrated exterior surface. The blade further includes a silicon-modified diffusion aluminide layer a surface of a turbine blade section selected from the group consisting of the exterior surface of the under platform section, the exterior surface of the dovetail section, and combinations thereof, the aluminide layer having a concentration of silicon at a surface of the aluminide layer in the range of about 1 weight percent to about 10 weight percent and a concentration of aluminum at the surface of the aluminide layer in the range of about 5 weight percent to about 25 weight percent.Type: GrantFiled: February 21, 2006Date of Patent: October 6, 2009Assignee: General Electric CompanyInventors: Bangalore A. Nagaraj, Mark D. Gorman
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Publication number: 20090246553Abstract: A reflective film is provided. The reflective film includes a substrate; a middle layer disposed on the substrate and mainly having a crystallized transition metal; and a metal layer disposed on the middle layer.Type: ApplicationFiled: November 14, 2008Publication date: October 1, 2009Applicant: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Po-Kai Chiu, Wen-Hao Cho, Hung-Ping Chen, Han-Chang Pan, Chien-Nan Hsiao
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Publication number: 20090238970Abstract: The present invention is an organoruthenium compound for use in production of a ruthenium or ruthenium compound thin film by chemical vapor deposition, including ruthenium and an arene group and norbornadiene both coordinated to the ruthenium and represented by the following formula. The present invention is an organoruthenium compound for use in chemical vapor deposition which does not require the coexistence of oxygen during the thin film formation, and moreover, is liquid at ordinary temperature, thereby having good handleability and recyclability. wherein the substituents, R1 to R6, of the arene group are each hydrogen or an alkyl group, and the total number of carbons of R1 to R6 (R1+R2+R3+R4+R5+R6) is 6 or less.Type: ApplicationFiled: September 27, 2007Publication date: September 24, 2009Inventors: Junichi Taniuchi, Masayuki Saito, Minoru Ishida
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Patent number: 7592051Abstract: This invention is directed to a method of preventing oxidation of copper alloys at high temperatures by deposition of a nano-structured, low-chromium copper-chromium protective coating to copper-alloy components. The coatings of the present invention are applied by an ion beam assisted, electron beam physical vapor deposition and consist of copper and chromium particles having a diameter of about 10 nm. This invention also encompasses the coated copper-alloy components produced by the disclosed deposition methods.Type: GrantFiled: February 9, 2005Date of Patent: September 22, 2009Assignee: Southwest Research InstituteInventors: Kuang-Tsan Kenneth Chiang, James H. Arps, Ronghua Wei
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Patent number: 7588804Abstract: Reactors having isolated gas connectors, systems that include such reactors, and methods for depositing materials onto micro-devices workpieces are disclosed herein. In one embodiment, a reactor for depositing material onto a micro-device workpiece includes a reaction chamber, a lid attachable to the reaction chamber, and a connector. The connector has a first portion coupled to the lid, a second portion coupled to the reaction chamber, a gas passageway extending through the first and second portions, and a seal. The seal can surround the gas passageway between the first and second portions. The first portion is detachably coupled to the second portion. In one aspect of this embodiment, the connector can also include a second gas passageway extending through the first and second portions and a second seal surrounding the second gas passageway between the first and second portions.Type: GrantFiled: August 19, 2004Date of Patent: September 15, 2009Assignee: Micron Technology, Inc.Inventor: Ross S. Dando
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Patent number: 7588799Abstract: A source gas is supplied into a chamber through a nozzle, and electromagnetic waves are thrown from a plasma antenna into the chamber. The resulting Cl2 gas plasma causes an etching reaction to a plurality of copper protrusions, which are arranged between a substrate and a ceiling member in a discontinuous state relative to the flowing direction of electricity in the plasma antenna, to form a precursor (CuxCly). The precursor (CuxCly) transported toward the substrate controlled to a lower temperature than the temperature of an etched member is converted into only Cu ions by a reduction reaction, and directed at the substrate to form a thin Cu film on the surface of the substrate. The speed of film formation is fast, the cost is markedly decreased, and the resulting thin Cu film is of high quality.Type: GrantFiled: December 29, 2005Date of Patent: September 15, 2009Assignee: Canon Anelva CorporationInventors: Ryuichi Matsuda, Naoki Yahata, Hitoshi Sakamoto
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Publication number: 20090226611Abstract: A method is provided for controlling copper agglomeration on a substrate and for forming void-free bulk copper metal filling of recessed features in integrated circuits. In one embodiment, the method includes providing a substrate having a topography including a top surface and at least one recessed feature comprising at least a sidewall surface and a bottom surface, depositing a barrier film on the substrate topography, and depositing a metal-containing wetting film on the barrier film. The method further includes physical vapor depositing copper metal on the metal-containing wetting film, where the substrate temperature is sufficiently high to form a smooth copper metal seed layer on the metal-containing wetting film. Void-free bulk copper metal may be plated in the at least one recessed feature.Type: ApplicationFiled: March 7, 2008Publication date: September 10, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Kenji SUZUKI, Atsushi GOMI, Miho JOMEN
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Publication number: 20090214888Abstract: Liquid aluminum is sprayed as a fine mist onto an alloyed iron article to produce a thin tenacious non-corrodible layer. In some embodiments, air is heated and delivered through insulated tubing to a container having solid aluminum therein. In some embodiments the air is heated by an electric induction coil. In some embodiments, the container is heated independently of the heated air. In some embodiments, the container is heated by an electric induction coil.Type: ApplicationFiled: May 7, 2009Publication date: August 27, 2009Inventor: Charles J. Upchurch
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Patent number: 7579042Abstract: Magnetic tunnel junctions and method for making the magnetic tunnel junctions are provided. The magnetic tunnel junctions are characterized by a tunnel barrier oxide layer sandwiched between two ferromagnetic layers. The methods used to fabricate the magnetic tunnel junctions are capable of completely and selectively oxidizing a tunnel junction precursor material using an oxidizing gas containing a mixture of gases to provide a tunnel junction oxide without oxidizing the adjacent ferromagnetic materials. In some embodiments the gas mixture is a mixture of CO and CO2 or a mixture of H2 and H2O.Type: GrantFiled: July 29, 2004Date of Patent: August 25, 2009Assignee: Wisconsin Alumni Research FoundationInventors: Y. Austin Chang, Jianhua J. Yang, Peter F. Ladwig
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Publication number: 20090208650Abstract: A Ti-based film forming method includes a step (step 1) of cleaning inside a chamber by introducing a cleaning gas containing fluorine into the chamber in a state where a wafer W is not provided on a susceptor; a step (step 2) of heating the susceptor in a state where the wafer W is not provided on the susceptor, injecting a processing gas containing Ti from a shower head into the chamber, and forming a pre-coated film at least on the surface of the shower head; and a step (step 3) of mounting the wafer W on the susceptor 2 in a state where the susceptor is heated, supplying a processing gas into the chamber 1 and forming a Ti-based film on the wafer W. The pre-coated film forming step is performed at a temperature lower than that in the film forming step.Type: ApplicationFiled: April 17, 2009Publication date: August 20, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Kensaku NARUSHIMA, Satoshi Wakabayashi, Takamitsu Takayama
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Publication number: 20090202863Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.Type: ApplicationFiled: February 11, 2008Publication date: August 13, 2009Applicant: Honeywell International Inc.Inventors: Don Mittendorf, Scott Sperl
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Publication number: 20090183573Abstract: A high-temperature pressure sensor element for power units includes a substrate, in which an interior space is developed, a deformable membrane, which separates the interior space from the exterior space in order to deform when the exterior pressure changes, and a strain measuring element, which is arranged on the membrane, for measuring the deformation of the membrane. The substrate, the membrane, and the strain measuring element are manufactured from the same high-temperature-stable material, such as an alloy. By way of example a nickel base alloy may be used. A component for a power unit, such as a turbine blade for an airplane or rocket engine, includes an integrated high-temperature pressure sensor element of this type.Type: ApplicationFiled: March 1, 2007Publication date: July 23, 2009Applicant: Astrium GmbHInventors: Soeren Fricke, Gerhard Mueller, Alois Friedberger, Eberhard Rose, Thomas Ziemann, Ulrich Schmid, Dimitri Telitschkin, Stefan Ziegenhagen
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Publication number: 20090176142Abstract: A metal composite for use in electrochemical devices is disclosed. The metal composite comprises a stainless steel interior component and a deposited nitrided metal exterior layer, wherein the nitrided exterior layer has lower electric contact resistance and greater corrosion resistance than the stainless steel interior component. A bipolar plate made of such metal composite and methods of producing the metal composite and bipolar plate are also disclosed.Type: ApplicationFiled: January 3, 2008Publication date: July 9, 2009Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: Mahmoud H. Abd Elhamid, Youssef M. Mikhail, Gayatri Vyas Dadheech, Feng Zhong, Richard H. Blunk, Daniel J. Lisi
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Publication number: 20090169910Abstract: The invention relates to a method of making a coated cutting tool comprising providing a substrate, and coating said substrate with a coating process wherein the coating process comprises at least one sequence comprising the steps of: depositing a non-metallic, functional layer or layer system, subjecting the surface of said non-metallic layer or layer system to an ion etching step, depositing at least one metallic interlayer, prior to the beginning of a new sequence. The method according to the invention makes it possible to achieve cutting tools with an increased tool life time. The invention also relates to a coated cutting tool made according to the method.Type: ApplicationFiled: December 16, 2008Publication date: July 2, 2009Applicant: SANDVIK INTELLECTUAL PROPERTY ABInventor: Toril MYRTVEIT
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Patent number: 7553468Abstract: Provided is a production method for producing a solid product by a reaction of gaseous raw materials with a plurality of components including a step of conducting the reaction using a reactor disposed in a vertical direction; a step of feeding the gaseous raw materials with a plurality of components from the upper part of the reactor; a step of, in the lower part of the reactor, forming a seal gas layer composed of a gas having a high density and fed continuously from the lower part of the reactor; a step of discharging an exhaust gas containing a by-product gas generated by the reaction and unreacted gaseous raw materials from somewhere in the upper part of the formed seal gas layer; and a step of accommodating a solid product in the seal gas layer of the lower part.Type: GrantFiled: March 7, 2008Date of Patent: June 30, 2009Assignee: Chisso CorporationInventors: Shuuichi Honda, Toru Tanaka, Satoshi Hayashida
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Patent number: 7550179Abstract: Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a temperature between about 60° C. and less than 150° C.; and forming a copper-containing film on at least a portion of the substrate surface. Also provided are copper-containing precursor compositions used therein.Type: GrantFiled: August 30, 2005Date of Patent: June 23, 2009Assignee: E.I du Pont de Nemours and CompanyInventors: Jeffrey Scott Thompson, Alexander Zak Bradley, Kyung-Ho Park
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Patent number: 7547464Abstract: This invention relates to organometallic precursor compounds represented by the formula (L)M(L?)2(NO) wherein M is a Group 6 metal, L is a substituted or unsubstituted anionic ligand and L? is the same or different and is a ? acceptor ligand, a process for producing the organometallic precursor compounds, and a method for producing a film, coating or powder from the organometallic precursor compounds.Type: GrantFiled: May 21, 2007Date of Patent: June 16, 2009Assignee: Praxair Technology, Inc.Inventor: Scott Houston Meiere
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Publication number: 20090148704Abstract: A vapor-phase process apparatus and a vapor-phase process method capable of satisfactorily maintaining quality of processes even when different types of processes are performed are obtained. A vapor-phase process apparatus includes a process chamber, gas supply ports serving as a plurality of gas introduction portions, and a gas supply portion (a gas supply member, a pipe, a flow rate control device, a pipe, and a buffer chamber). The process chamber allows flow of a reaction gas therein. The plurality of gas supply ports are formed in a wall surface (upper wall) of the process chamber along a direction of flow of the reaction gas. The gas supply portion can supply a gas into the process chamber at a different flow rate from each of one gas supply port and another gas supply port different from that one gas supply port among the plurality of gas supply ports.Type: ApplicationFiled: December 9, 2008Publication date: June 11, 2009Applicant: Sumitomo Electric Industries, Ltd.Inventors: Eiryo TAKASUKA, Toshio Ueda, Toshiyuki Kuramoto, Masaki Ueno
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Patent number: 7544393Abstract: The susceptor of a plasma treating device, or the electrostatic chuck of a substrate table, is formed by ceramic thermal spray method. A thermally sprayed ceramic layer is pore-sealed by methacrylic resin. Resin raw material mainly containing methyl methacrylate is applied to and impregnated into the thermally sprayed ceramic layer and then is cured to thereby fill pores between ceramic particles in the thermally sprayed ceramic layer with methacrylic resin. Methacrylic resin raw material solution, which does not produce pores at curing, can complete perfect pore sealing.Type: GrantFiled: January 12, 2006Date of Patent: June 9, 2009Assignee: Tokyo Electron LimitedInventors: Shinji Muto, Chihiro Taguchi, Nobuyuki Okayama
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Publication number: 20090142513Abstract: A treatment gas is supplied to form a Ti-based film on a predetermined number of wafers W while setting a temperature of a susceptor 2 in a chamber 1 to a predetermined temperature. After this, the interior of the chamber 1 containing no wafers W is cleaned by discharging Cl2 gas as a cleaning gas from a shower head 10 into the chamber 1. During this cleaning, the temperature of each of the susceptor 2, the shower head 10, and the wall portion of the chamber 1 is independently controlled so that the temperature of the susceptor 2 is not lower than the decomposition start temperature of Cl2 gas and the temperature of the shower head 10 and the wall portion of the chamber 1 is not higher than the decomposition start temperature.Type: ApplicationFiled: January 12, 2009Publication date: June 4, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Seishi MURAKAMI, Masaki Koizumi, Hiroaki Ashizawa, Masato Koizumi
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Patent number: 7534296Abstract: An electrically conductive diamond electrode and process for preparation thereof is described. The electrode comprises diamond particles coated with electrically conductive doped diamond preferably by chemical vapor deposition which are held together with a binder. The electrodes are useful for oxidation reduction in gas, such as hydrogen generation by electrolysis.Type: GrantFiled: March 17, 2006Date of Patent: May 19, 2009Assignee: Board of Trustees of Michigan State UniversityInventors: Greg Swain, Anne Fischer, Jason Bennett, Michael Lowe
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Publication number: 20090120800Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:Type: ApplicationFiled: February 7, 2006Publication date: May 14, 2009Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo
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Publication number: 20090122310Abstract: Provided is a method of making microarrays that includes providing a substrate with discrete first microfeatures that have a first profile, and depositing vapor-coated materials onto the first microfeatures to form second microfeatures having a second profile that is substantially different from the first profile. Also provided is a method of adding a replication material to the vapor-coated microfeatures to form a mold. Microarrays made by this method can be used as substrates for surface-enhanced Raman spectroscopy (SERS).Type: ApplicationFiled: October 7, 2008Publication date: May 14, 2009Inventors: Jun-Ying ZHANG, Terry L. Smith, Haiyan Zhang, Jerome C. Porque, Ding Wang, John C. Hulteen, Lisa A. Dick
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Publication number: 20090110852Abstract: An exemplary housing includes a main body, and a plurality of coatings formed on the main body. The coatings include a plating layer, an outer layer, and an adhesive layer. The plating layer is coated on the main body. The adhesive layer is sandwiched between the plating layer and the outer layer. Surface treating methods for making present housing are also provided.Type: ApplicationFiled: December 28, 2007Publication date: April 30, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHWAN-HWA CHIANG
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Patent number: 7524533Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the surface of the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, and mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: GrantFiled: April 9, 2004Date of Patent: April 28, 2009Assignee: Air Products and Chemicals, Inc.Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
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Publication number: 20090092844Abstract: A method and apparatus for lighting protection. In one advantageous embodiment a method forms a lighting protection system on a composite surface of an aircraft. A dielectric coating is formed on the composite surface in which the dielectric coating covers a metal feature exposed on the composite surface. A metal adhesion promoter is applied in a pattern on the dielectric coating and over additional areas of the composite surface, including a grounding feature to form a metal adhesion promoter layer. A metal coating is formed on the metal adhesion promoter layer to create a path from an area including the metal feature to the grounding feature.Type: ApplicationFiled: October 5, 2007Publication date: April 9, 2009Inventors: Michael H. E. Ware, Michael B. Nicholas, Quynhgiao N. Le
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Patent number: 7513921Abstract: An exhaust gas filter apparatus includes a particulate filter for collecting a particulate from an exhaust gas. The exhaust gas filter also includes a electromagnetic radiation resonator to heat a portion of the particulate to ignite the particulate and regenerate the particulate filter.Type: GrantFiled: October 24, 2005Date of Patent: April 7, 2009Assignee: HRL Laboratories, LLCInventors: Amanda C. Phelps, Kevin W. Kirby, Daniel Gregoire
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Patent number: 7513961Abstract: A family of extremely fine-grained alloys are used to make coatings or free-standing bodies having desirable properties for use as a heat-resistant and wear-resistant material. In an illustrative embodiment, the alloys are comprised of a multiplicity of alternate, microcrystalline or nanocrystalline films of tungsten metal and tungsten compound. The tungsten compound film may be comprised of a tungsten carbide or a tungsten boride. The tungsten films are the primary films. Their desirable characteristics, in addition to their very fine crystalline habit, per se, are the high strength, high hardness, high resilience, and high fracture energy which these fine crystallites foster. They may be manufactured by a chemical vapor deposition process in which reactive gas flows are rapidly switched to produce alternate films with abrupt hetero-junctions and thereby to produce the useful micro-crystalline habit. The unique synthesis method allows effective control of critical flaw size.Type: GrantFiled: December 6, 2004Date of Patent: April 7, 2009Inventors: Robert A. Holzl, Robert L. Shinavski
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Publication number: 20090087339Abstract: A method for depositing a thin ruthenium (Ru) film on a substrate in a reaction chamber, comprising: step (i) of supplying at least one type of gas of a ruthenium precursor being a ?-diketone-coordinated ruthenium complex and causing the gas to be adsorbed to the substrate in the reaction chamber; step (ii) of supplying a reducing gas into the reaction chamber and exciting the reducing gas, or supplying an excited reducing gas into the reaction chamber, in order to activate the ruthenium precursor adsorbed to the substrate; and step (iii) of repeating steps (i) and (ii) to form a thin ruthenium film on the substrate.Type: ApplicationFiled: September 3, 2008Publication date: April 2, 2009Applicant: ASM JAPAN K.K.Inventor: Hiroshi Shinriki
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Publication number: 20090082198Abstract: A methanol oxidation catalyst is provided, which includes nanoparticles having a composition represented by the following formula (1): PtxRuyMozTu ??(1) In the formula (1), the T-element is at least one selected from the group consisting of W and V, x is 20 to 80 at. %, y is 10 to 60 at. %, z is 1 to 30 at. % and u is 1 to 30 at. %. The area of the peak derived from oxygen bond of T-element is 80% or less of the area of the peak derived from metal bond of T-element in a spectrum measured by an X-ray photoelectron spectral method.Type: ApplicationFiled: September 28, 2007Publication date: March 26, 2009Inventors: Wu Mei, Taishi Fukazawa, Itsuko Mizutani, Tsuyoshi Kobayashi, Yoshihiko Nakano, Mina Farag, Yi-Qun Li, Shinji Aoki
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Publication number: 20090081827Abstract: An atomic-layer-deposition process for forming a patterned thin film comprising providing a substrate, applying a deposition inhibitor material to the substrate, wherein the deposition inhibitor material is an organic compound or polymer; and patterning the deposition inhibitor material either after step (b) or simultaneously with applying the deposition inhibitor material to provide selected areas of the substrate effectively not having the deposition inhibitor material. An inorganic thin film material is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.Type: ApplicationFiled: September 26, 2007Publication date: March 26, 2009Inventors: Cheng Yang, Lyn M. Irving, David H. Levy, Peter J. Cowdery-Corvan, Diane C. Freeman
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Publication number: 20090082133Abstract: A plating layer structure of a golf club head and a forming method thereof are disclosed. The forming method comprises: forming a medium layer on the surface of the golf club head; and electroplating a plating layer on the medium layer, wherein the material of the coating layer is electroplating-compatible with the material of the medium layer.Type: ApplicationFiled: September 20, 2007Publication date: March 26, 2009Inventor: Yung-Fu Tseng
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Publication number: 20090075101Abstract: A combustion turbine component (10) includes a combustion turbine component substrate (16) and an alloy coating (14) on the combustion turbine component substrate. The alloy coating (14) includes a first amount, by weight percent, of cobalt (Co) and a second amount, by weight percent, of nickel (Ni), the first amount being greater than the second amount. The alloy coating further includes chromium (Cr), aluminum (Al), at least one rare earth element, and an oxide of the at least one rare earth element.Type: ApplicationFiled: August 20, 2008Publication date: March 19, 2009Applicant: Siemens Power Generation, Inc.Inventors: Anand A. Kulkarni, Allister W. James, Douglas J. Arrell
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Publication number: 20090075112Abstract: A combustion turbine component (10) includes a combustion turbine component substrate (16) and an alloy coating (14) on the combustion turbine component substrate. The alloy coating (14) includes iron (Fe), chromium (Cr), aluminum (Al), at least one of titanium (Ti) and molybdenum (Mo), at least one rare earth element, and an oxide of the at least one rare earth element.Type: ApplicationFiled: August 20, 2008Publication date: March 19, 2009Applicant: SIEMENS POWER GENERATION, INC.Inventors: Anand A. Kulkarni, Allister W. James, Douglas J. Arrell
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Publication number: 20090074962Abstract: A method for the protection of an optical element of a lithographic apparatus is disclosed. A deposition gas comprising SnH4 is provided to the surface of the optical element to deposit a Sn cap layer on the surface of the optical element. In this way, a Sn cap layer is deliberately provided on the optical element, which may protect the optical element during lithographic processing from debris from a (Sn) plasma source. During or after lithographic processing, the (deteriorated) cap layer may be repaired by providing a hydrogen radical containing gas and/or a SnH4 containing gas. Additionally or alternatively, the (deteriorated) cap layer may be removed and a new cap layer provided by providing the deposition gas comprising SnH4.Type: ApplicationFiled: September 14, 2007Publication date: March 19, 2009Applicant: ASML NETHERLANDS B.V.Inventors: Maarten Marinus Johannes Wilhelmus Van Herpen, Wouter Anthon Soer
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Publication number: 20090075115Abstract: A thermal barrier coating system includes a substrate, a first transition metal layer on the substrate, a bond coat on the first transition metal layer, an optional second transition metal layer on the bond coat, and an optional ceramic topcoat on the second transition metal layer. In embodiments, the first transition metal layer and the second transition metal layer include platinum to resist reaction between the bond coat and the substrate and to slow oxidation of the bond coat.Type: ApplicationFiled: April 30, 2007Publication date: March 19, 2009Inventors: Brian S. Tryon, Michael J. Maloney
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Publication number: 20090068425Abstract: A decorated resin molded article that can secure a high durability and can represent a sufficiently realistic metal texture in appearance is provided as follows. A metal thin film is directly formed on a design surface of a substrate by either a physical vapor deposition method or a chemical vapor deposition method to provide a metallic decoration. Additionally, a topcoat layer is formed with a thickness of 10 to 40 ?m on the metal thin film. The topcoat layer comprises a transparent coating film having an adhesive property to both of the substrate and the metal thin film.Type: ApplicationFiled: September 2, 2008Publication date: March 12, 2009Applicant: Kojima Press Industry Co., Ltd.Inventors: Takane Suzuki, Hirotoshi MATSUI, Kaoru ITO, Masumi NOGUCHI
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Publication number: 20090068358Abstract: A method of making a plastic code wheel/code strip by: depositing a chrome-aluminum film on a plastic substrate having a transmittance greater than 90%, a transmittance greater than 90%, a heat resistance to at least 120° C. and a thickness smaller than 0.5 mm; forming a photoresist layer on the chrome-aluminum film; covering a patterned film strip on the photoresist layer; radiating the patterned film strip with a collimated light source to expose the optical grating pattern into the photoresist layer; removing the patterned film strip and the non-exposed photoresist from the chrome-aluminum film; etching the chrome-aluminum film; removing the photoimaged photoresist so as to obtain a semi-finished product having an optical grating pattern; and then stamping the semi-finished product into a finished product according to a predetermined shape.Type: ApplicationFiled: March 20, 2008Publication date: March 12, 2009Inventor: Yun-Long Lai
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Publication number: 20090068357Abstract: Films of magnesium mixed with titanium are produced by non-equilibrium alloying processes such as electron beam evaporation of magnesium and titanium ingots in a very low pressure chamber. Such magnesium-titanium films form as single phase solid solutions. Titanium is inherently resistant to corrosion and its admixture with magnesium in solid solution provides a new composition that is less subject to intra-film galvanic corrosion. The magnesium-titanium films also provide relatively hard and strong coatings.Type: ApplicationFiled: September 7, 2007Publication date: March 12, 2009Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: Yang T. Cheng, Mark W. Verbrugge, Michael P. Balogh, Daniel E. Rodak, Michael Lukitsch
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Publication number: 20090061086Abstract: A coating process and system suitable for use on components subjected to high temperatures. The coating system includes an overlay coating of predominantly B2 phase rhodium aluminide (RhAl) intermetallic compound containing about 25 to about 90 atomic percent rhodium, about 10 to about 60 atomic percent aluminum, optionally up to a combined total of about 25 atomic percent of one or more platinum group metals chosen from the group consisting of platinum, palladium, ruthenium, and iridium, and up to about 20 atomic percent of the base metal and alloying constituents of the substrate. The RhAl intermetallic coating may serve as an environmental coating, a diffusion barrier layer for an overlying environmental coating, or both, with or without an outer ceramic coating.Type: ApplicationFiled: April 7, 2008Publication date: March 5, 2009Applicant: General Electric CompanyInventors: Liang Jiang, Michael Francis Xavier Gigliotti, JR., Mark Daniel Gorman, Ramgopal Darolia
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Patent number: 7498059Abstract: The invention relates to a method and apparatus for growing a thin film onto a substrate, in which method a substrate placed in a reaction space (21) is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. According to the method, said reactants are fed in the form of vapor-phase pulses repeatedly and alternately, each reactant separately from its own source, into said reaction space (21), and said vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. According to the invention, the gas volume of said reaction space is evacuated by means of a vacuum pump essentially totally between two successive vapor-phase reactant pulses.Type: GrantFiled: December 3, 2007Date of Patent: March 3, 2009Assignee: ASM America, Inc.Inventors: Tuomo Suntola, Sven Lindfors
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Publication number: 20090046362Abstract: Apparatus and methods for a nano-patterning process to fabricate nanostructures. A roller type mold is used to continuously imprint nanostructures onto a flexible web or a rigid substrate. The process includes a coating and an imprinting module, which rotate the web synchronously. Liquid resist materials are used for imprinting and the patterns are set by thermal or UV curing. The process is used to produce bilayer metal wire-grid polarizers, organic solar cells, and organic light emitting diodes.Type: ApplicationFiled: April 9, 2008Publication date: February 19, 2009Inventors: Lingjie Jay Guo, Se Hyun Ahn
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Patent number: 7491421Abstract: A graphite base is made by: mixing nanometered graphite powder with a bonding agent to form a graphite mixture and then grinding the graphite mixture and processing the graphite mixture into a graphite mass with a high pressure by means of hot press, cold press and vibration, and then dipping the graphite mass in a liquid phase asphalt, and then baking the graphite mass to a dry state graphite block. The dry state graphite block is further coated with a layer of metal coating and bonded with metal radiation fins to form a heat sink.Type: GrantFiled: April 13, 2005Date of Patent: February 17, 2009Inventors: Kai-Yu Lin, Yi-Ning Chung
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Publication number: 20090042054Abstract: Nb—Si based alloy articles comprising a Nb—Si based alloy upon which is disposed an environmentally-resistant coating are described. They include a coating comprising at least one phase selected from the group consisting of M(Al,Si)3, M5(Al,Si)3, and M3Si5Al2, wherein M is one or more of Nb, Ti, Hf, Cr. Such coating can improve the environmental (e.g., in oxidation-promoting environments) resistance of a Nb—Si based alloy and alloy articles. Methods for preparing these articles are described as well.Type: ApplicationFiled: August 8, 2007Publication date: February 12, 2009Inventors: Bernard Patrick Bewlay, Ramgopal Darolia, Voramon Supatarawanich Dheeradhada, Richard DiDomizio, Michael Francis Xavier Gigliotti, Joseph David Rigney, Pazhayannur Ramanathan Subramanian
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Publication number: 20090041936Abstract: A coated, low-emissivity aluminum film is manufactured entirely in vacuum by depositing an aluminum layer over a substrate and then immediately coating the metal layer with a very thin protective polymeric layer. The thickness of this coating is selected to minimize absorption in the 3-15 micron wavelength. In vacuum, the metal layer is coated substantially in the absence of moisture, thereby preventing the formation of hydrated oxides that promote corrosion. The aluminum layer is preferably also passivated by in-line exposure to a plasma gas containing an oxygen-bearing component. A leveling polymeric layer may also be deposited between relatively rough substrates and the aluminum layer in order to improve the reflectivity of the resulting structures.Type: ApplicationFiled: October 13, 2008Publication date: February 12, 2009Applicant: Sigma Laboratories of Arizona, LLC.Inventors: Angelo Yializis, James DiBattista, Gordon Goodyear
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Patent number: 7488512Abstract: In a solid precursor evaporation system configured for use in a thin film deposition system, such as thermal chemical vapor deposition (TCVD), a method for preparing one or more trays of solid precursor is described. The solid precursor may be formed on a coating substrate, such as a tray, using one or more of dipping techniques, spin-on techniques, and sintering techniques.Type: GrantFiled: December 9, 2004Date of Patent: February 10, 2009Assignee: Tokyo Electron LimitedInventors: Kenji Suzuki, Emmanuel P. Guidotti, Gerrit J. Leusink, Masamichi Hara, Daisuke Kuroiwa, Sandra G. Malhotra, Fenton McFeely, Robert R. Young, Jr.
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Patent number: 7488435Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.Type: GrantFiled: August 7, 2006Date of Patent: February 10, 2009Assignee: E. I. du Pont de Nemours and CompanyInventor: Kyung-Ho Park
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Publication number: 20090032950Abstract: An adhesion between a Cu diffusion barrier film and a Cu wiring in a semiconductor device is improved and reliability of the semiconductor device is improved. A film forming method for forming a Cu film on a substrate to be processed is provided with a first process of forming an adhesion film on the Cu diffusion barrier film formed on the substrate to be processed, and a second process of forming a Cu film on the adhesion film. The adhesion film includes Pd.Type: ApplicationFiled: October 3, 2005Publication date: February 5, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Yasuhiko Kojima, Naoki Yoshii
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Patent number: 7485340Abstract: The present invention relates generally to depositing elemental thin films. In particular, the invention concerns a method of growing elemental metal thin films by Atomic Layer Deposition (ALD) using a boron compound as a reducing agent. In a preferred embodiment the method comprises introducing vapor phase pulses of at least one metal source compound and at least one boron source compound into a reaction space that contains a substrate on which the metal thin film is to be deposited. Preferably the boron compound is capable of reducing the adsorbed portion of the metal source compound into its elemental electrical state.Type: GrantFiled: December 5, 2006Date of Patent: February 3, 2009Assignee: ASM International N.V.Inventors: Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio, Pekka Juha Soininen