Metal Coating Patents (Class 427/250)
  • Patent number: 7598204
    Abstract: A reagent suitable for use as a catalyst comprises a first metal species substrate having a second reduced metal species coated thereon, the second reduced metal species being less electropositive than the first metal. Methods of manufacture are also provided.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: October 6, 2009
    Assignee: General Motors Corporation
    Inventors: Andrew M. Mance, Tao Xie, Belabbes Merzougui
  • Patent number: 7597934
    Abstract: A method for making a gas turbine engine turbine blade comprising an airfoil section a platform section, an under platform section, and a dovetail section, the exterior surface of the dovetail section comprising a shank exterior surface and a serrated exterior surface. The blade further includes a silicon-modified diffusion aluminide layer a surface of a turbine blade section selected from the group consisting of the exterior surface of the under platform section, the exterior surface of the dovetail section, and combinations thereof, the aluminide layer having a concentration of silicon at a surface of the aluminide layer in the range of about 1 weight percent to about 10 weight percent and a concentration of aluminum at the surface of the aluminide layer in the range of about 5 weight percent to about 25 weight percent.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: October 6, 2009
    Assignee: General Electric Company
    Inventors: Bangalore A. Nagaraj, Mark D. Gorman
  • Publication number: 20090246553
    Abstract: A reflective film is provided. The reflective film includes a substrate; a middle layer disposed on the substrate and mainly having a crystallized transition metal; and a metal layer disposed on the middle layer.
    Type: Application
    Filed: November 14, 2008
    Publication date: October 1, 2009
    Applicant: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Po-Kai Chiu, Wen-Hao Cho, Hung-Ping Chen, Han-Chang Pan, Chien-Nan Hsiao
  • Publication number: 20090238970
    Abstract: The present invention is an organoruthenium compound for use in production of a ruthenium or ruthenium compound thin film by chemical vapor deposition, including ruthenium and an arene group and norbornadiene both coordinated to the ruthenium and represented by the following formula. The present invention is an organoruthenium compound for use in chemical vapor deposition which does not require the coexistence of oxygen during the thin film formation, and moreover, is liquid at ordinary temperature, thereby having good handleability and recyclability. wherein the substituents, R1 to R6, of the arene group are each hydrogen or an alkyl group, and the total number of carbons of R1 to R6 (R1+R2+R3+R4+R5+R6) is 6 or less.
    Type: Application
    Filed: September 27, 2007
    Publication date: September 24, 2009
    Inventors: Junichi Taniuchi, Masayuki Saito, Minoru Ishida
  • Patent number: 7592051
    Abstract: This invention is directed to a method of preventing oxidation of copper alloys at high temperatures by deposition of a nano-structured, low-chromium copper-chromium protective coating to copper-alloy components. The coatings of the present invention are applied by an ion beam assisted, electron beam physical vapor deposition and consist of copper and chromium particles having a diameter of about 10 nm. This invention also encompasses the coated copper-alloy components produced by the disclosed deposition methods.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: September 22, 2009
    Assignee: Southwest Research Institute
    Inventors: Kuang-Tsan Kenneth Chiang, James H. Arps, Ronghua Wei
  • Patent number: 7588804
    Abstract: Reactors having isolated gas connectors, systems that include such reactors, and methods for depositing materials onto micro-devices workpieces are disclosed herein. In one embodiment, a reactor for depositing material onto a micro-device workpiece includes a reaction chamber, a lid attachable to the reaction chamber, and a connector. The connector has a first portion coupled to the lid, a second portion coupled to the reaction chamber, a gas passageway extending through the first and second portions, and a seal. The seal can surround the gas passageway between the first and second portions. The first portion is detachably coupled to the second portion. In one aspect of this embodiment, the connector can also include a second gas passageway extending through the first and second portions and a second seal surrounding the second gas passageway between the first and second portions.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: September 15, 2009
    Assignee: Micron Technology, Inc.
    Inventor: Ross S. Dando
  • Patent number: 7588799
    Abstract: A source gas is supplied into a chamber through a nozzle, and electromagnetic waves are thrown from a plasma antenna into the chamber. The resulting Cl2 gas plasma causes an etching reaction to a plurality of copper protrusions, which are arranged between a substrate and a ceiling member in a discontinuous state relative to the flowing direction of electricity in the plasma antenna, to form a precursor (CuxCly). The precursor (CuxCly) transported toward the substrate controlled to a lower temperature than the temperature of an etched member is converted into only Cu ions by a reduction reaction, and directed at the substrate to form a thin Cu film on the surface of the substrate. The speed of film formation is fast, the cost is markedly decreased, and the resulting thin Cu film is of high quality.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: September 15, 2009
    Assignee: Canon Anelva Corporation
    Inventors: Ryuichi Matsuda, Naoki Yahata, Hitoshi Sakamoto
  • Publication number: 20090226611
    Abstract: A method is provided for controlling copper agglomeration on a substrate and for forming void-free bulk copper metal filling of recessed features in integrated circuits. In one embodiment, the method includes providing a substrate having a topography including a top surface and at least one recessed feature comprising at least a sidewall surface and a bottom surface, depositing a barrier film on the substrate topography, and depositing a metal-containing wetting film on the barrier film. The method further includes physical vapor depositing copper metal on the metal-containing wetting film, where the substrate temperature is sufficiently high to form a smooth copper metal seed layer on the metal-containing wetting film. Void-free bulk copper metal may be plated in the at least one recessed feature.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 10, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenji SUZUKI, Atsushi GOMI, Miho JOMEN
  • Publication number: 20090214888
    Abstract: Liquid aluminum is sprayed as a fine mist onto an alloyed iron article to produce a thin tenacious non-corrodible layer. In some embodiments, air is heated and delivered through insulated tubing to a container having solid aluminum therein. In some embodiments the air is heated by an electric induction coil. In some embodiments, the container is heated independently of the heated air. In some embodiments, the container is heated by an electric induction coil.
    Type: Application
    Filed: May 7, 2009
    Publication date: August 27, 2009
    Inventor: Charles J. Upchurch
  • Patent number: 7579042
    Abstract: Magnetic tunnel junctions and method for making the magnetic tunnel junctions are provided. The magnetic tunnel junctions are characterized by a tunnel barrier oxide layer sandwiched between two ferromagnetic layers. The methods used to fabricate the magnetic tunnel junctions are capable of completely and selectively oxidizing a tunnel junction precursor material using an oxidizing gas containing a mixture of gases to provide a tunnel junction oxide without oxidizing the adjacent ferromagnetic materials. In some embodiments the gas mixture is a mixture of CO and CO2 or a mixture of H2 and H2O.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: August 25, 2009
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Y. Austin Chang, Jianhua J. Yang, Peter F. Ladwig
  • Publication number: 20090208650
    Abstract: A Ti-based film forming method includes a step (step 1) of cleaning inside a chamber by introducing a cleaning gas containing fluorine into the chamber in a state where a wafer W is not provided on a susceptor; a step (step 2) of heating the susceptor in a state where the wafer W is not provided on the susceptor, injecting a processing gas containing Ti from a shower head into the chamber, and forming a pre-coated film at least on the surface of the shower head; and a step (step 3) of mounting the wafer W on the susceptor 2 in a state where the susceptor is heated, supplying a processing gas into the chamber 1 and forming a Ti-based film on the wafer W. The pre-coated film forming step is performed at a temperature lower than that in the film forming step.
    Type: Application
    Filed: April 17, 2009
    Publication date: August 20, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kensaku NARUSHIMA, Satoshi Wakabayashi, Takamitsu Takayama
  • Publication number: 20090202863
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Application
    Filed: February 11, 2008
    Publication date: August 13, 2009
    Applicant: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Publication number: 20090183573
    Abstract: A high-temperature pressure sensor element for power units includes a substrate, in which an interior space is developed, a deformable membrane, which separates the interior space from the exterior space in order to deform when the exterior pressure changes, and a strain measuring element, which is arranged on the membrane, for measuring the deformation of the membrane. The substrate, the membrane, and the strain measuring element are manufactured from the same high-temperature-stable material, such as an alloy. By way of example a nickel base alloy may be used. A component for a power unit, such as a turbine blade for an airplane or rocket engine, includes an integrated high-temperature pressure sensor element of this type.
    Type: Application
    Filed: March 1, 2007
    Publication date: July 23, 2009
    Applicant: Astrium GmbH
    Inventors: Soeren Fricke, Gerhard Mueller, Alois Friedberger, Eberhard Rose, Thomas Ziemann, Ulrich Schmid, Dimitri Telitschkin, Stefan Ziegenhagen
  • Publication number: 20090176142
    Abstract: A metal composite for use in electrochemical devices is disclosed. The metal composite comprises a stainless steel interior component and a deposited nitrided metal exterior layer, wherein the nitrided exterior layer has lower electric contact resistance and greater corrosion resistance than the stainless steel interior component. A bipolar plate made of such metal composite and methods of producing the metal composite and bipolar plate are also disclosed.
    Type: Application
    Filed: January 3, 2008
    Publication date: July 9, 2009
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Mahmoud H. Abd Elhamid, Youssef M. Mikhail, Gayatri Vyas Dadheech, Feng Zhong, Richard H. Blunk, Daniel J. Lisi
  • Publication number: 20090169910
    Abstract: The invention relates to a method of making a coated cutting tool comprising providing a substrate, and coating said substrate with a coating process wherein the coating process comprises at least one sequence comprising the steps of: depositing a non-metallic, functional layer or layer system, subjecting the surface of said non-metallic layer or layer system to an ion etching step, depositing at least one metallic interlayer, prior to the beginning of a new sequence. The method according to the invention makes it possible to achieve cutting tools with an increased tool life time. The invention also relates to a coated cutting tool made according to the method.
    Type: Application
    Filed: December 16, 2008
    Publication date: July 2, 2009
    Applicant: SANDVIK INTELLECTUAL PROPERTY AB
    Inventor: Toril MYRTVEIT
  • Patent number: 7553468
    Abstract: Provided is a production method for producing a solid product by a reaction of gaseous raw materials with a plurality of components including a step of conducting the reaction using a reactor disposed in a vertical direction; a step of feeding the gaseous raw materials with a plurality of components from the upper part of the reactor; a step of, in the lower part of the reactor, forming a seal gas layer composed of a gas having a high density and fed continuously from the lower part of the reactor; a step of discharging an exhaust gas containing a by-product gas generated by the reaction and unreacted gaseous raw materials from somewhere in the upper part of the formed seal gas layer; and a step of accommodating a solid product in the seal gas layer of the lower part.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: June 30, 2009
    Assignee: Chisso Corporation
    Inventors: Shuuichi Honda, Toru Tanaka, Satoshi Hayashida
  • Patent number: 7550179
    Abstract: Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a temperature between about 60° C. and less than 150° C.; and forming a copper-containing film on at least a portion of the substrate surface. Also provided are copper-containing precursor compositions used therein.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: June 23, 2009
    Assignee: E.I du Pont de Nemours and Company
    Inventors: Jeffrey Scott Thompson, Alexander Zak Bradley, Kyung-Ho Park
  • Patent number: 7547464
    Abstract: This invention relates to organometallic precursor compounds represented by the formula (L)M(L?)2(NO) wherein M is a Group 6 metal, L is a substituted or unsubstituted anionic ligand and L? is the same or different and is a ? acceptor ligand, a process for producing the organometallic precursor compounds, and a method for producing a film, coating or powder from the organometallic precursor compounds.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: June 16, 2009
    Assignee: Praxair Technology, Inc.
    Inventor: Scott Houston Meiere
  • Publication number: 20090148704
    Abstract: A vapor-phase process apparatus and a vapor-phase process method capable of satisfactorily maintaining quality of processes even when different types of processes are performed are obtained. A vapor-phase process apparatus includes a process chamber, gas supply ports serving as a plurality of gas introduction portions, and a gas supply portion (a gas supply member, a pipe, a flow rate control device, a pipe, and a buffer chamber). The process chamber allows flow of a reaction gas therein. The plurality of gas supply ports are formed in a wall surface (upper wall) of the process chamber along a direction of flow of the reaction gas. The gas supply portion can supply a gas into the process chamber at a different flow rate from each of one gas supply port and another gas supply port different from that one gas supply port among the plurality of gas supply ports.
    Type: Application
    Filed: December 9, 2008
    Publication date: June 11, 2009
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Eiryo TAKASUKA, Toshio Ueda, Toshiyuki Kuramoto, Masaki Ueno
  • Patent number: 7544393
    Abstract: The susceptor of a plasma treating device, or the electrostatic chuck of a substrate table, is formed by ceramic thermal spray method. A thermally sprayed ceramic layer is pore-sealed by methacrylic resin. Resin raw material mainly containing methyl methacrylate is applied to and impregnated into the thermally sprayed ceramic layer and then is cured to thereby fill pores between ceramic particles in the thermally sprayed ceramic layer with methacrylic resin. Methacrylic resin raw material solution, which does not produce pores at curing, can complete perfect pore sealing.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: June 9, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Shinji Muto, Chihiro Taguchi, Nobuyuki Okayama
  • Publication number: 20090142513
    Abstract: A treatment gas is supplied to form a Ti-based film on a predetermined number of wafers W while setting a temperature of a susceptor 2 in a chamber 1 to a predetermined temperature. After this, the interior of the chamber 1 containing no wafers W is cleaned by discharging Cl2 gas as a cleaning gas from a shower head 10 into the chamber 1. During this cleaning, the temperature of each of the susceptor 2, the shower head 10, and the wall portion of the chamber 1 is independently controlled so that the temperature of the susceptor 2 is not lower than the decomposition start temperature of Cl2 gas and the temperature of the shower head 10 and the wall portion of the chamber 1 is not higher than the decomposition start temperature.
    Type: Application
    Filed: January 12, 2009
    Publication date: June 4, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Seishi MURAKAMI, Masaki Koizumi, Hiroaki Ashizawa, Masato Koizumi
  • Patent number: 7534296
    Abstract: An electrically conductive diamond electrode and process for preparation thereof is described. The electrode comprises diamond particles coated with electrically conductive doped diamond preferably by chemical vapor deposition which are held together with a binder. The electrodes are useful for oxidation reduction in gas, such as hydrogen generation by electrolysis.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: May 19, 2009
    Assignee: Board of Trustees of Michigan State University
    Inventors: Greg Swain, Anne Fischer, Jason Bennett, Michael Lowe
  • Publication number: 20090120800
    Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:
    Type: Application
    Filed: February 7, 2006
    Publication date: May 14, 2009
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo
  • Publication number: 20090122310
    Abstract: Provided is a method of making microarrays that includes providing a substrate with discrete first microfeatures that have a first profile, and depositing vapor-coated materials onto the first microfeatures to form second microfeatures having a second profile that is substantially different from the first profile. Also provided is a method of adding a replication material to the vapor-coated microfeatures to form a mold. Microarrays made by this method can be used as substrates for surface-enhanced Raman spectroscopy (SERS).
    Type: Application
    Filed: October 7, 2008
    Publication date: May 14, 2009
    Inventors: Jun-Ying ZHANG, Terry L. Smith, Haiyan Zhang, Jerome C. Porque, Ding Wang, John C. Hulteen, Lisa A. Dick
  • Publication number: 20090110852
    Abstract: An exemplary housing includes a main body, and a plurality of coatings formed on the main body. The coatings include a plating layer, an outer layer, and an adhesive layer. The plating layer is coated on the main body. The adhesive layer is sandwiched between the plating layer and the outer layer. Surface treating methods for making present housing are also provided.
    Type: Application
    Filed: December 28, 2007
    Publication date: April 30, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHWAN-HWA CHIANG
  • Patent number: 7524533
    Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the surface of the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, and mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: April 28, 2009
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
  • Publication number: 20090092844
    Abstract: A method and apparatus for lighting protection. In one advantageous embodiment a method forms a lighting protection system on a composite surface of an aircraft. A dielectric coating is formed on the composite surface in which the dielectric coating covers a metal feature exposed on the composite surface. A metal adhesion promoter is applied in a pattern on the dielectric coating and over additional areas of the composite surface, including a grounding feature to form a metal adhesion promoter layer. A metal coating is formed on the metal adhesion promoter layer to create a path from an area including the metal feature to the grounding feature.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 9, 2009
    Inventors: Michael H. E. Ware, Michael B. Nicholas, Quynhgiao N. Le
  • Patent number: 7513921
    Abstract: An exhaust gas filter apparatus includes a particulate filter for collecting a particulate from an exhaust gas. The exhaust gas filter also includes a electromagnetic radiation resonator to heat a portion of the particulate to ignite the particulate and regenerate the particulate filter.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: April 7, 2009
    Assignee: HRL Laboratories, LLC
    Inventors: Amanda C. Phelps, Kevin W. Kirby, Daniel Gregoire
  • Patent number: 7513961
    Abstract: A family of extremely fine-grained alloys are used to make coatings or free-standing bodies having desirable properties for use as a heat-resistant and wear-resistant material. In an illustrative embodiment, the alloys are comprised of a multiplicity of alternate, microcrystalline or nanocrystalline films of tungsten metal and tungsten compound. The tungsten compound film may be comprised of a tungsten carbide or a tungsten boride. The tungsten films are the primary films. Their desirable characteristics, in addition to their very fine crystalline habit, per se, are the high strength, high hardness, high resilience, and high fracture energy which these fine crystallites foster. They may be manufactured by a chemical vapor deposition process in which reactive gas flows are rapidly switched to produce alternate films with abrupt hetero-junctions and thereby to produce the useful micro-crystalline habit. The unique synthesis method allows effective control of critical flaw size.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: April 7, 2009
    Inventors: Robert A. Holzl, Robert L. Shinavski
  • Publication number: 20090087339
    Abstract: A method for depositing a thin ruthenium (Ru) film on a substrate in a reaction chamber, comprising: step (i) of supplying at least one type of gas of a ruthenium precursor being a ?-diketone-coordinated ruthenium complex and causing the gas to be adsorbed to the substrate in the reaction chamber; step (ii) of supplying a reducing gas into the reaction chamber and exciting the reducing gas, or supplying an excited reducing gas into the reaction chamber, in order to activate the ruthenium precursor adsorbed to the substrate; and step (iii) of repeating steps (i) and (ii) to form a thin ruthenium film on the substrate.
    Type: Application
    Filed: September 3, 2008
    Publication date: April 2, 2009
    Applicant: ASM JAPAN K.K.
    Inventor: Hiroshi Shinriki
  • Publication number: 20090082198
    Abstract: A methanol oxidation catalyst is provided, which includes nanoparticles having a composition represented by the following formula (1): PtxRuyMozTu ??(1) In the formula (1), the T-element is at least one selected from the group consisting of W and V, x is 20 to 80 at. %, y is 10 to 60 at. %, z is 1 to 30 at. % and u is 1 to 30 at. %. The area of the peak derived from oxygen bond of T-element is 80% or less of the area of the peak derived from metal bond of T-element in a spectrum measured by an X-ray photoelectron spectral method.
    Type: Application
    Filed: September 28, 2007
    Publication date: March 26, 2009
    Inventors: Wu Mei, Taishi Fukazawa, Itsuko Mizutani, Tsuyoshi Kobayashi, Yoshihiko Nakano, Mina Farag, Yi-Qun Li, Shinji Aoki
  • Publication number: 20090081827
    Abstract: An atomic-layer-deposition process for forming a patterned thin film comprising providing a substrate, applying a deposition inhibitor material to the substrate, wherein the deposition inhibitor material is an organic compound or polymer; and patterning the deposition inhibitor material either after step (b) or simultaneously with applying the deposition inhibitor material to provide selected areas of the substrate effectively not having the deposition inhibitor material. An inorganic thin film material is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.
    Type: Application
    Filed: September 26, 2007
    Publication date: March 26, 2009
    Inventors: Cheng Yang, Lyn M. Irving, David H. Levy, Peter J. Cowdery-Corvan, Diane C. Freeman
  • Publication number: 20090082133
    Abstract: A plating layer structure of a golf club head and a forming method thereof are disclosed. The forming method comprises: forming a medium layer on the surface of the golf club head; and electroplating a plating layer on the medium layer, wherein the material of the coating layer is electroplating-compatible with the material of the medium layer.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 26, 2009
    Inventor: Yung-Fu Tseng
  • Publication number: 20090075101
    Abstract: A combustion turbine component (10) includes a combustion turbine component substrate (16) and an alloy coating (14) on the combustion turbine component substrate. The alloy coating (14) includes a first amount, by weight percent, of cobalt (Co) and a second amount, by weight percent, of nickel (Ni), the first amount being greater than the second amount. The alloy coating further includes chromium (Cr), aluminum (Al), at least one rare earth element, and an oxide of the at least one rare earth element.
    Type: Application
    Filed: August 20, 2008
    Publication date: March 19, 2009
    Applicant: Siemens Power Generation, Inc.
    Inventors: Anand A. Kulkarni, Allister W. James, Douglas J. Arrell
  • Publication number: 20090075112
    Abstract: A combustion turbine component (10) includes a combustion turbine component substrate (16) and an alloy coating (14) on the combustion turbine component substrate. The alloy coating (14) includes iron (Fe), chromium (Cr), aluminum (Al), at least one of titanium (Ti) and molybdenum (Mo), at least one rare earth element, and an oxide of the at least one rare earth element.
    Type: Application
    Filed: August 20, 2008
    Publication date: March 19, 2009
    Applicant: SIEMENS POWER GENERATION, INC.
    Inventors: Anand A. Kulkarni, Allister W. James, Douglas J. Arrell
  • Publication number: 20090074962
    Abstract: A method for the protection of an optical element of a lithographic apparatus is disclosed. A deposition gas comprising SnH4 is provided to the surface of the optical element to deposit a Sn cap layer on the surface of the optical element. In this way, a Sn cap layer is deliberately provided on the optical element, which may protect the optical element during lithographic processing from debris from a (Sn) plasma source. During or after lithographic processing, the (deteriorated) cap layer may be repaired by providing a hydrogen radical containing gas and/or a SnH4 containing gas. Additionally or alternatively, the (deteriorated) cap layer may be removed and a new cap layer provided by providing the deposition gas comprising SnH4.
    Type: Application
    Filed: September 14, 2007
    Publication date: March 19, 2009
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Maarten Marinus Johannes Wilhelmus Van Herpen, Wouter Anthon Soer
  • Publication number: 20090075115
    Abstract: A thermal barrier coating system includes a substrate, a first transition metal layer on the substrate, a bond coat on the first transition metal layer, an optional second transition metal layer on the bond coat, and an optional ceramic topcoat on the second transition metal layer. In embodiments, the first transition metal layer and the second transition metal layer include platinum to resist reaction between the bond coat and the substrate and to slow oxidation of the bond coat.
    Type: Application
    Filed: April 30, 2007
    Publication date: March 19, 2009
    Inventors: Brian S. Tryon, Michael J. Maloney
  • Publication number: 20090068425
    Abstract: A decorated resin molded article that can secure a high durability and can represent a sufficiently realistic metal texture in appearance is provided as follows. A metal thin film is directly formed on a design surface of a substrate by either a physical vapor deposition method or a chemical vapor deposition method to provide a metallic decoration. Additionally, a topcoat layer is formed with a thickness of 10 to 40 ?m on the metal thin film. The topcoat layer comprises a transparent coating film having an adhesive property to both of the substrate and the metal thin film.
    Type: Application
    Filed: September 2, 2008
    Publication date: March 12, 2009
    Applicant: Kojima Press Industry Co., Ltd.
    Inventors: Takane Suzuki, Hirotoshi MATSUI, Kaoru ITO, Masumi NOGUCHI
  • Publication number: 20090068358
    Abstract: A method of making a plastic code wheel/code strip by: depositing a chrome-aluminum film on a plastic substrate having a transmittance greater than 90%, a transmittance greater than 90%, a heat resistance to at least 120° C. and a thickness smaller than 0.5 mm; forming a photoresist layer on the chrome-aluminum film; covering a patterned film strip on the photoresist layer; radiating the patterned film strip with a collimated light source to expose the optical grating pattern into the photoresist layer; removing the patterned film strip and the non-exposed photoresist from the chrome-aluminum film; etching the chrome-aluminum film; removing the photoimaged photoresist so as to obtain a semi-finished product having an optical grating pattern; and then stamping the semi-finished product into a finished product according to a predetermined shape.
    Type: Application
    Filed: March 20, 2008
    Publication date: March 12, 2009
    Inventor: Yun-Long Lai
  • Publication number: 20090068357
    Abstract: Films of magnesium mixed with titanium are produced by non-equilibrium alloying processes such as electron beam evaporation of magnesium and titanium ingots in a very low pressure chamber. Such magnesium-titanium films form as single phase solid solutions. Titanium is inherently resistant to corrosion and its admixture with magnesium in solid solution provides a new composition that is less subject to intra-film galvanic corrosion. The magnesium-titanium films also provide relatively hard and strong coatings.
    Type: Application
    Filed: September 7, 2007
    Publication date: March 12, 2009
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Yang T. Cheng, Mark W. Verbrugge, Michael P. Balogh, Daniel E. Rodak, Michael Lukitsch
  • Publication number: 20090061086
    Abstract: A coating process and system suitable for use on components subjected to high temperatures. The coating system includes an overlay coating of predominantly B2 phase rhodium aluminide (RhAl) intermetallic compound containing about 25 to about 90 atomic percent rhodium, about 10 to about 60 atomic percent aluminum, optionally up to a combined total of about 25 atomic percent of one or more platinum group metals chosen from the group consisting of platinum, palladium, ruthenium, and iridium, and up to about 20 atomic percent of the base metal and alloying constituents of the substrate. The RhAl intermetallic coating may serve as an environmental coating, a diffusion barrier layer for an overlying environmental coating, or both, with or without an outer ceramic coating.
    Type: Application
    Filed: April 7, 2008
    Publication date: March 5, 2009
    Applicant: General Electric Company
    Inventors: Liang Jiang, Michael Francis Xavier Gigliotti, JR., Mark Daniel Gorman, Ramgopal Darolia
  • Patent number: 7498059
    Abstract: The invention relates to a method and apparatus for growing a thin film onto a substrate, in which method a substrate placed in a reaction space (21) is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. According to the method, said reactants are fed in the form of vapor-phase pulses repeatedly and alternately, each reactant separately from its own source, into said reaction space (21), and said vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. According to the invention, the gas volume of said reaction space is evacuated by means of a vacuum pump essentially totally between two successive vapor-phase reactant pulses.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: March 3, 2009
    Assignee: ASM America, Inc.
    Inventors: Tuomo Suntola, Sven Lindfors
  • Publication number: 20090046362
    Abstract: Apparatus and methods for a nano-patterning process to fabricate nanostructures. A roller type mold is used to continuously imprint nanostructures onto a flexible web or a rigid substrate. The process includes a coating and an imprinting module, which rotate the web synchronously. Liquid resist materials are used for imprinting and the patterns are set by thermal or UV curing. The process is used to produce bilayer metal wire-grid polarizers, organic solar cells, and organic light emitting diodes.
    Type: Application
    Filed: April 9, 2008
    Publication date: February 19, 2009
    Inventors: Lingjie Jay Guo, Se Hyun Ahn
  • Patent number: 7491421
    Abstract: A graphite base is made by: mixing nanometered graphite powder with a bonding agent to form a graphite mixture and then grinding the graphite mixture and processing the graphite mixture into a graphite mass with a high pressure by means of hot press, cold press and vibration, and then dipping the graphite mass in a liquid phase asphalt, and then baking the graphite mass to a dry state graphite block. The dry state graphite block is further coated with a layer of metal coating and bonded with metal radiation fins to form a heat sink.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: February 17, 2009
    Inventors: Kai-Yu Lin, Yi-Ning Chung
  • Publication number: 20090042054
    Abstract: Nb—Si based alloy articles comprising a Nb—Si based alloy upon which is disposed an environmentally-resistant coating are described. They include a coating comprising at least one phase selected from the group consisting of M(Al,Si)3, M5(Al,Si)3, and M3Si5Al2, wherein M is one or more of Nb, Ti, Hf, Cr. Such coating can improve the environmental (e.g., in oxidation-promoting environments) resistance of a Nb—Si based alloy and alloy articles. Methods for preparing these articles are described as well.
    Type: Application
    Filed: August 8, 2007
    Publication date: February 12, 2009
    Inventors: Bernard Patrick Bewlay, Ramgopal Darolia, Voramon Supatarawanich Dheeradhada, Richard DiDomizio, Michael Francis Xavier Gigliotti, Joseph David Rigney, Pazhayannur Ramanathan Subramanian
  • Publication number: 20090041936
    Abstract: A coated, low-emissivity aluminum film is manufactured entirely in vacuum by depositing an aluminum layer over a substrate and then immediately coating the metal layer with a very thin protective polymeric layer. The thickness of this coating is selected to minimize absorption in the 3-15 micron wavelength. In vacuum, the metal layer is coated substantially in the absence of moisture, thereby preventing the formation of hydrated oxides that promote corrosion. The aluminum layer is preferably also passivated by in-line exposure to a plasma gas containing an oxygen-bearing component. A leveling polymeric layer may also be deposited between relatively rough substrates and the aluminum layer in order to improve the reflectivity of the resulting structures.
    Type: Application
    Filed: October 13, 2008
    Publication date: February 12, 2009
    Applicant: Sigma Laboratories of Arizona, LLC.
    Inventors: Angelo Yializis, James DiBattista, Gordon Goodyear
  • Patent number: 7488512
    Abstract: In a solid precursor evaporation system configured for use in a thin film deposition system, such as thermal chemical vapor deposition (TCVD), a method for preparing one or more trays of solid precursor is described. The solid precursor may be formed on a coating substrate, such as a tray, using one or more of dipping techniques, spin-on techniques, and sintering techniques.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: February 10, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Kenji Suzuki, Emmanuel P. Guidotti, Gerrit J. Leusink, Masamichi Hara, Daisuke Kuroiwa, Sandra G. Malhotra, Fenton McFeely, Robert R. Young, Jr.
  • Patent number: 7488435
    Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: February 10, 2009
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Kyung-Ho Park
  • Publication number: 20090032950
    Abstract: An adhesion between a Cu diffusion barrier film and a Cu wiring in a semiconductor device is improved and reliability of the semiconductor device is improved. A film forming method for forming a Cu film on a substrate to be processed is provided with a first process of forming an adhesion film on the Cu diffusion barrier film formed on the substrate to be processed, and a second process of forming a Cu film on the adhesion film. The adhesion film includes Pd.
    Type: Application
    Filed: October 3, 2005
    Publication date: February 5, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yasuhiko Kojima, Naoki Yoshii
  • Patent number: 7485340
    Abstract: The present invention relates generally to depositing elemental thin films. In particular, the invention concerns a method of growing elemental metal thin films by Atomic Layer Deposition (ALD) using a boron compound as a reducing agent. In a preferred embodiment the method comprises introducing vapor phase pulses of at least one metal source compound and at least one boron source compound into a reaction space that contains a substrate on which the metal thin film is to be deposited. Preferably the boron compound is capable of reducing the adsorbed portion of the metal source compound into its elemental electrical state.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: February 3, 2009
    Assignee: ASM International N.V.
    Inventors: Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio, Pekka Juha Soininen