Abstract: A combustion turbine component (10) includes a combustion turbine component substrate (16) and an alloy coating (14) on the combustion turbine component substrate. The alloy coating (14) includes a first amount, by weight percent, of nickel (Ni) and a second amount, by weight percent, of cobalt (Co), the first amount being greater than the second amount. The alloy coating also includes chromium (Cr), aluminum (Al), and yttrium (Y). The alloy coating further includes at least one of titanium (Ti), tantalum (Ta), tungsten (W), and rhenium (Re). Moreover, the alloy coating includes at least one rare earth element, and an oxide of at least one of the yttrium the at least one rare earth element.

Abstract: A metallic component, in particular a rolling bearing, engine or transmission component, having a component body and at least one functional surface thereof that interacts with another element. Only the functional surface (7) is formed from an amorphous metal (6).

Abstract: A method of forming a primary coat, which consists of a V- or Ti-containing film, formed on the surface of a subject on which holes or the like have been formed, according to the CVD technique, while using, for instance, a tetravalent amide-type vanadium-containing organometal compound as a raw gas and using, for instance, tertiary butyl hydrazine as a reducing gas, and a copper-containing film is then formed on the primary coat, according to the CVD technique, to thus fill the holes or the like with the copper-containing film and to thus form copper distributing wire, which is excellent in the hole-filling properties and excellent in the adhesion to a primary coat, this process can be applied to the field of copper distributing wires used in the semiconductor industries.

Abstract: A multi-step method for depositing ruthenium thin films having high conductivity and superior adherence to the substrate is described. The method includes the deposition of a ruthenium nucleation layer followed by the deposition of a highly conductive ruthenium upper layer. Both layers are deposited using chemical vapor deposition (CVD) employing low deposition rates.

Abstract: The present invention is a film deposition method of a metal film comprising the steps of: placing an object to be processed having a recess formed in a surface thereof, on a stage in a processing vessel; evacuating the processing vessel to create a vacuum therein; ionizing a metal target in the evacuated processing vessel to generate metal particles including metal ions, by means of a plasma formed by making the plasma from an inert gas; and by applying a bias electric power to the object to be processed placed on the stage to draw the plasma and the metal particles into the object to be processed, scraping a bottom part of the recess to form a scraped recess, and depositing a metal film on an entire surface of the object to be processed including surfaces in the recess and in the scraped recess.

Abstract: Techniques for making nanowires with a desired diameter are provided. The nanowires can be grown from catalytic nanoparticles, wherein the nanowires can have substantially same diameter as the catalytic nanoparticles. Since the size or the diameter of the catalytic nanoparticles can be controlled in production of the nanoparticles, the diameter of the nanowires can be subsequently controlled as well. The catalytic nanoparticles are melted and provided with a gaseous precursor of the nanowires. When supersaturation of the catalytic nanoparticles with the gaseous precursor is reached, the gaseous precursor starts to solidify and form nanowires. The nanowires are separate from each other and not bind with each other to form a plurality of nanowires having the substantially uniform diameter.

Abstract: A surface treating method for making a housing have a metallic glass main body comprising: coating a primer on the metallic glass main body to form a bottom layer; forming a plating layer on the bottom layer; coating an adhesive on the plating layer to form an adhesive layer; and coating a lacquer on the adhesive layer to form an outer layer.

Abstract: A coating apparatus for coating interior surfaces of internal passages of a workpiece, such as a turbine engine component is provided. The coating apparatus comprises a vessel defining an internal space, a plate dividing the internal space into a first chamber and a second chamber, a divider supporting the plate, and the plate having at least one cut-out for receiving a portion of the workpiece having the internal passages to be coated.

Abstract: A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to form an aluminum-infused overlay coating having an increased aluminum level in at least an outer surface thereof. The diffusion step is carried out so that the increased aluminum level is sufficient to render the aluminum-infused overlay coating removable by selective stripping. The outer surface of the aluminum-infused overlay coating is then contacted with an aqueous composition to remove the aluminum-infused overlay coating from the substrate. The aqueous composition includes at least one acid having the formula HxAF6, and/or precursors thereof, wherein A is Si, Ge, Ti, Zr, Al, and/or Ga, and x is from 1 to 6.

Abstract: In the method for producing a layer system on a dielectric substrate in which a metal layer is applied onto the substrate by a coating step (110) and a further layer with a predetermined layer thickness is subsequently applied by a further coating step (140), the metal layer having a sheet resistance >10 Mohm and an average reflectance >50%, the further layer would have a sheet resistance <1 Mohm if it had been applied onto the substrate with the same layer thickness by the further coating step (140), and the layer system consisting of the metal layer and the further layer has a sheet resistance >10 Mohm, where the invention furthermore relates to a layer system on a dielectric substrate in which a metal layer is applied onto the substrate by a coating step (110) and a further layer with a predetermined layer thickness is subsequently applied by a further coating step (140), the metal layer having a sheet resistance >10 Mohm and an average reflectance >50%, where the further layer, if it had

Abstract: The invention relates to barrier products and a method for the manufacture thereof. The product comprises a fibrous substrate, a coating layer on at least one surface of the fibrous substrate, and a barrier applied on the coating layer, comprising a thin film with a thickness of less than about 1 micrometer and capable of providing barrier properties to the fibrous product. According to the invention, the coating layer comprises biopolymer, which have been found to be suitable for atomic layer deposition of thin barrier films comprising e.g. metal oxide. Improved oxygen, water vapour and aroma barrier properties can be achieved by the invention for papers and paperboards for packaging purposes.

Abstract: Methods of forming metal-containing layers are provided where heteroleptic organometallic compounds containing at least one formamidinate ligand are conveyed in a gaseous form to a reactor; and films comprising a metal are deposited on a substrate. These heteroleptic organometallic compounds have improved properties over conventional vapor deposition precursors. Such compounds are suitable for use as vapor deposition precursors including direct liquid injection. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds or their solutions in organic solvents.

Abstract: A process for passivating a vapor-deposited aluminum layer on a substrate, including providing a substrate comprising vapor deposited aluminum on a surface thereof; treating the surface of the substrate with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated surface with water. A process for passivating a vapor-deposited aluminum layer on a substrate, including vapor depositing a layer of aluminum on a substrate; treating the substrate with the vapor deposited aluminum with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated substrate with water.

Abstract: A personal ornament having an ornament base article made of a metal or the like; an underlayer, preferably nickel-free, formed on the base article; and a coloring layer constituted of an abrasion-resistant layer of 0.2-1.5 ?m thick formed by dry-plating on the surface of the underlayer and an outermost layer of 0.002-0.1 ?m thick formed by dry-plating on the surface of the abrasion-resistant layer. The coloring layer is a white hard coating film of a stainless-steel color which provides superior quality, high resistance to deterioration of appearance by scratching, and a high-quality image like a stainless steel film.

Abstract: A method of forming a phase change layer using a Ge compound and a method of manufacturing a phase change memory device using the same are provided. The method of manufacturing a phase change memory device included supplying a first precursor on a lower layer on which the phase change layer is to be formed, wherein the first precursor is a bivalent precursor including germanium (Ge) and having a cyclic structure. The first precursor may be a cyclic germylenes Ge-based compound or a macrocyclic germylenes Ge-based, having a Ge—N bond. The phase change layer may be formed using a MOCVD method, cyclic-CVD method or an ALD method. The composition of the phase change layer may be controlled by a deposition pressure in a range of 0.001 torr-10 torr, a deposition temperature in a range of 150° C. to 350° C. and/or a flow rate of a reaction gas in the range of 0-1 slm.

Abstract: A multi-step method for depositing ruthenium thin films having high conductivity and superior adherence to the substrate is described. The method includes the deposition of a ruthenium nucleation layer followed by the deposition of a highly conductive ruthenium upper layer. Both layers are deposited using chemical vapor deposition (CVD) employing low deposition rates.

Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.

Abstract: The present invention is directed to compositions of matter, systems, and methods to manufacture nanowires. In an embodiment, a method to produce a catalytic-coated nanowire growth substrate for nanowire growth is disclosed which comprises: (a) depositing a buffer layer on a substrate; (b) treating the buffer layer with boiled water or steam to enhance interactions between the buffer layer and catalyst particles; and (c) depositing catalytic particles on a surface of the buffer layer. Methods to develop and use this catalytic-coated nanowire growth substrate are disclosed.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.59 to about 83.59, a value of a* in a range from about ?0.55 to about 0.45 and a value of b* in a range from about ?0.60 to about 0.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A laminate film including a first polylactic acid layer; a second metal-receiving layer including PVOH, EVOH, or a blend thereof on a side of the first polylactic acid layer; and a metal layer deposited on a side of the metal-receiving layer opposite the polylactic acid layer. The metal-receiving layer may be coextruded with the polylactic acid first layer or may be a coating applied to one side of the polylactic acid first layer. This laminate film exhibits excellent gas and moisture barrier properties, appearance, and metal adhesion. It may also include a heat sealable or winding improving layer on the side opposite the metal receiving-layer of the first polylactic acid layer.

Abstract: Systems and methods for providing localized heat treatment of metal components are provided. In this regard, a representative method includes: identifying a portion of a metal component to which localized heat treatment is to be performed; shielding an area in a vicinity of the portion of the metal component; and directing electromagnetic energy in the infrared (IR) spectrum toward the portion of the metal component such that the portion is heated to a desired temperature and such that the area in the vicinity of the portion that is subjected to shielding does not heat to the temperature desired for the heat treatment.

Abstract: Provided is a method of manufacturing silica nanowires. The method includes: providing an object to be processed into a reaction chamber; supplying a precursor having a heteroleptic structure, which has a chemical forma SiA2B2 (A and B are different functional groups), into the reaction chamber; supplying an oxygen-containing gas that preferentially reacts with any one of the functional groups A and B of the precursor; and growing an intermediate on a surface of the object to be processed due to a reaction between the precursor and the oxygen-containing gas.

Abstract: Coatings suitable for use as protective oxide-forming coatings on Nb-based substrates exposed to high temperatures and oxidative environments. The coatings contain chromium and/or molybdenum, preferably contains silicon, and optionally contains niobium, titanium, hafnium, iron, rhenium, tantalum, and/or tungsten, which in combination form multiple intermetallic phases, which in combination form one or more intermetallic phases that promote the formation of a slow-growing oxide scale. Depending on the particular coating composition, the intermetallic phases may be: a silicon-modified Cr2Nb Laves phase and optionally a chromium solid solution phase, a CrNbSi intermetallic phase, and/or an M3Si intermetallic phase where M is niobium, titanium, and/or chromium; or M5Si3, MSi2 and/or M3Si2 where M is molybdenum, niobium, titanium, chromium, hafnium, iron, rhenium, tantalum, and/or tungsten.

Abstract: A thermo-mechanically stable, heat sealable mono-axially oriented polymer substrate film includes polymers based on low density polyethylene. The thermo-mechanically stable, heat sealable mono-axially oriented polymer substrate film can consist essentially of the polymers based on low density polyethylene. The disclosure also describes a vapour deposition coated substrate film, especially such a film which is metallised, a packaging laminate comprising the vapour deposition coated polymer substrate film, and a packaging container produced from such a packaging laminate. Also disclosed is a method for the production of the thermo-mechanically stable, heat sealable polymer substrate film and a method of vapour deposition coating the film.

Abstract: An implant and method for applying an osteoconductive coating on a non-conductive surface of an implant. The method includes depositing an electroconductive interlayer on at least a portion of a non-conductive implant surface. A secondary process is applied to the interlayer and an osteoconductive coating is thereby formed on the implant. In various embodiments, the electroconductive interlayer is deposited as a non-structural film and comprises a dense, non-porous metal such as titanium, titanium alloys, cobalt, cobalt alloys, chromium, chromium alloys, tantalum, tantalum alloys, iron alloys, stainless steel, and mixtures thereof. The osteoconductive coating may include a metal, a porous metal, or calcium phosphate. The osteoconductive coating may include additional agents, such as bone product, growth factor, bioactive agent, antibiotic, or combinations thereof.

Abstract: This invention relates to organometallic precursor compounds represented by the formula (Cp(R?)x)yM(H)z-y, a process for producing the organometallic precursor compounds, and a method for depositing a metal and/or metal carbide layer, e.g., Ta metal and/or TaC layer, on a substrate by the thermal or plasma enhanced disassociation of the organometallic precursor compounds, e.g., by CVD or ALD techniques. The metal and/or metal carbide layer is useful as a liner or barrier layer for conducting metals and high dielectric constant materials in integrated circuit manufacturing.

Abstract: A tool or wear part has a coating formed over a substrate. The coating includes at least one sequence of a ductile nano-layer located between two hard layers, though the coating may have several such sequences created by alternating ductile nano-layers with hard layers, with adjacent sequences sharing a hard layer. The various hard layers may differ in composition from one another, as can the ductile nano-layers. An optional adhesion layer may be provided between the substrate and the sequence, and an optional top layer may be provided over the outermost hard layer. The various layers may be deposited by physical vapor deposition in a single chamber.

Abstract: The present invention is directed to systems and methods for nanowire growth and harvesting. In an embodiment, methods for nanowire growth and doping are provided, including methods for epitaxial oriented nanowire growth using a combination of silicon precursors, as well as us of patterned substrates to grow oriented nanowires. In a further aspect of the invention, methods to improve nanowire quality through the use of sacrifical growth layers are provided. In another aspect of the invention, methods for transferring nanowires from one substrate to another substrate are provided.

Abstract: A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is has in its backbone, side chains, or both backbone and side chains, multiple secondary or tertiary amide groups that are represented by the following acetamide structure: >N—C(?O)—. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.

Abstract: A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is soluble in an aqueous solution comprising at least 50 weight % water and has an acid content of less than 2.5 meq/g of polymer. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.

Abstract: A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%.

Abstract: A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic poly(vinyl alcohol) having a degree of hydrolysis of less than 95%. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.

Abstract: The present invention relates to process for the production of plane-parallel platelets, comprising the steps of: a) vapor-deposition of a separating agent onto a carrier to produce a separating agent 5 layer, b) vapor-deposition of at least one product layer onto the separating agent layer, and c) dissolution of the separating agent layer in a solvent and production of a suspension in which the at least one product layer is present in the form of plane-parallel platelets, wherein the separating agent is selected from the group consisting of anthracene, anthraquinone, acetamidophenol, acetylsalicylic acid, camphoric anhydride, benzimidazole, benzene-1,2,4-tricarboxylic acid, biphenyl-2,2-dicarboxylic acid, bis(4-hydroxyphenyl)sulfone, dihydroxyanthraquinone, hydantoin, 3-hydroxybenzoic acid, 8-hydroxyquinoline-5-sulfonic acid monohydrate, 4-hydroxycoumarin, 7-hydroxycoumarin, 3-hydroxynaphthalene-2-carboxylic acid, isophthalic acid, 4,4-methylene-bis-3-hydroxynaphthalene-2-carboxylic acid, naphthalene-1,8-dic

Abstract: A coated substrate and a method of forming a diffusion barrier coating system between a substrate and a MCrAl coating, including a diffusion barrier coating deposited onto at least a portion of a substrate surface, wherein the diffusion barrier coating comprises a nitride, oxide or carbide of one or more transition metals and/or metalloids and a MCrAl coating, wherein M includes a transition metal or a metalloid, deposited on at least a portion of the diffusion barrier coating, wherein the diffusion barrier coating restricts the inward diffusion of aluminum of the MCrAl coating into the substrate.

Abstract: A device housing comprises a transparent substrate, a paint coating, and a metallic coating. The paint coating is formed on portions of one surface of the transparent substrate. The metallic coating is formed on other portions of the surface of the transparent substrate having the paint coating. A method for making the device housing is also described there.

Abstract: A Fabry-Perot filter is applied as a thin coating on a film, for example, a packaging film, and permits interesting color effects. The coating has a layered construction in which both reflecting layers of the filter may be made of aluminum and the intermediate layer between the reflecting layers may be made of aluminum oxide.

Abstract: A laminate film including a first core polylactic acid layer, a coating receiving-layer of polylactic acid, and coated on one side of the coating receiving-layer with PVOH, EVOH, a blend of crosslinked EVOH/PVOH, vinyl alcohol-vinylamine (PVAm) copolymer, anionic carboxylated styrene-butadiene copolymer (SBR) emulsion, or blends thereof. This coating may be applied after the machine-direction orientation step and dried and oriented in a transverse direction orientation oven if in-line coating is desired; or applied to the film in an off-line coating method and dried in an air flotation oven. The dried coating layer can be metallized. This laminate film exhibits excellent gas and moisture barrier properties, appearance, and metal adhesion. It may also optionally include a heat sealable or winding improving layer on the side opposite the coating receiving-layer of the core layer.

Abstract: A metallized barrier material comprising a base material, a first protective coating, a metallized layer, and a second protective coating. The base material has a first surface and a second surface. The base material is a dimensionally stable porous substrate. The first protective coating is applied to the first surface of the base material. The metallized layer is vapor deposited on the protective first surface of the base material to a desired optical density. The second protective coating applied to the metallized layer.

Abstract: The present disclosure relates to a method for the synthesis of at least one metallic nanotube (10). The method includes the steps of: growing at least one nanowhisker (6) on a substrate (2), the nanowhisker (6; 12) consisting of or having a coating of a first metal (12); coating said first metal (12) with a second metal (14) to form a coated nanowhiskers (8); and heat treating the at least one coated nanowhisker (8), to produce a metallic nanotube (10). Moreover, the present teaching relates to metallic nanotubes (10) grown by the method of the present teaching.

Abstract: There is provided a method of making a heat treated (HT) coated article to be used in shower door applications, window applications, or any other suitable applications where transparent coated articles are desired. The method may include heat treating a glass substrate coated with at least a layer of or including diamond-like carbon (DLC) or other type of carbon, with an oxygen barrier layer provided thereon directly or indirectly. Optionally, a release layer of a material such as zinc oxide or the like may be provided between the oxygen barrier layer and the DLC. In certain example embodiments, the oxygen content of at least part of the protective film when deposited may be determined based on whether the coated surface is to be bent in a convex manner, to be bent in a concave manner, or to remain flat. Following heat treatment, which may include bending the coated surface into a convex or concave shape, and quenching, the protective film may be removed by washing or the like.

Abstract: Objects of the present invention are to provide a novel niobium or tantalum complex having good vapor pressure and becoming a raw material for producing a niobium- or tantalum-containing thin film by a method such as CVD method, ALD method or the like, a method for producing the same, a metal-containing thin film using the same, and a method for producing the same. The present invention relates to producing an imide complex represented by the general formula (1) by, for example, the reaction between M1(NR1)X3(L)r (2) and an alkali metal alkoxide (3): (wherein M1 represents niobium atom or tantalum atom, R1 represents an alkyl group having from 1 to 12 carbon atoms, R2 represents an alkyl group having from 2 to 13 carbon atoms, X represents halogen atom, r is 1 when L is 1,2-dimethoxyethane ligand, r is 2 when L is pyridine ligand, and M2 represents an alkali metal), and producing a niobium- or tantalum-containing thin film by using the imide complex (1) as a raw material.

Abstract: Methods for forming a film on a substrate in a semiconductor manufacturing process. A reaction chamber a substrate in the chamber are provided. A ruthenium based precursor, which includes ruthenium tetroxide dissolved in a mixture of at least two non-flammable fluorinated solvents, is provided and a ruthenium containing film is produced on the substrate.

Abstract: A method for producing a high-temperature protective layer containing metal on a metallic high-temperature material is disclosed. The metal is deposited on the high-temperature material via the gaseous phase to form the high-temperature protective layer. The high-temperature material is held at a diffusion temperature for a specific length of time so that at least a portion of the deposited metal is diffused into the high temperature material to form a diffusion zone and where the high-temperature material is not in contact with solids or liquids in the region of the surface to be coated, but merely has a solid/gas interface. Also disclosed is a component made of a high-temperature material with a hot-gas anti-corrosive layer containing chromium. There is a coating layer containing chromium applied to the surface of the high-temperature material, a diffusion layer in the high-temperature material, and a build-up zone between the coating layer and the diffusion layer.

Abstract: A modified atomic plasma deposition (APD) procedure is used to produce amorphous, nonconformal thin metal film coatings on a variety of substrates. The films are porous, mesh-like lattices with imperfections such as pinholes and pores, which are useful as scaffolds for cell attachment, controlled release of bioactive agents and protective coatings.

Abstract: Under one aspect, a method of making a superconductor wire includes providing an oxide superconductor layer overlaying a substrate; forming a substantially continuous barrier layer over the oxide superconductor layer, the barrier layer including metal; depositing a layer of metal particles over the barrier layer, said depositing including applying a liquid including metal particles over the barrier layer; and sintering the layer of metal particles to form a substantially continuous metal layer over the barrier layer. In one or more embodiments, the oxide superconductor layer is oxygen-deficient, and the method may include oxidizing the oxygen-deficient oxide superconductor layer. At least a portion of the sintering and the oxidizing may occur simultaneously, for example by performing them at an oxygen partial pressure and a temperature sufficient to both sinter the metal particles and to oxidize the oxygen-deficient oxide superconductor layer.

Abstract: Disclosed is a method for making a non-metallic, fiber-reinforced barrel tube having particular application for use in a barrel system to be attached to a paintball marker in order to direct paintballs propelled by the marker towards a target. A mandrel is first dipped in a releasing agent. The mandrel is then coated with a thin layer of metal (e.g., nickel or chrome) by means of a nano vapor deposition process. Next, a fiber-reinforced resinous sheet is wrapped over the thin metal layer to establish a tube therearound. A heat-sensitive plastic tape is wound around the tubular resinous sheet. The mandrel is heated in an oven to cause the thin metal layer to bond to the tubular resinous sheet. At the same time, the heat-sensitive tape shrinks to squeeze any air bubbles from the resinous sheet.

Abstract: This invention relates to an object having a corrosion resistant surface that is also sufficiently ductile to let the surface, or the whole object, be mechanically modified without creating cracks or other weaknesses undermining or damaging the corrosion resistance. The surface layer preferably contains at least 80% of a refractory metal, such as tantalum, and an alloy layer is created between a core element and the surface layer having the needed ductility and adhering abilities.

Abstract: A CVD method for forming a metal film on a substrate by using a metal carbonyl gas includes a preparing step for setting a vacuum chamber at a vacuum pressure and heating the substrate in the vacuum chamber to a first temperature where the metal carbonyl gas is decomposed. Also included are a supplying step for supplying the metal carbonyl gas into the vacuum chamber while exhausting the vacuum chamber with a first vacuum pumping speed and a removing step for removing a decomposed gas of the metal carbonyl gas by stopping supplying of the metal carbonyl gas and quickly exhausting the vacuum chamber with a second vacuum pumping speed sufficiently higher than the first vacuum pumping speed. The supplying step and the removing step can be repeatedly as desired.

Abstract: Noble metal films can be deposited by atomic layer deposition (ALD)-type processes. In preferred embodiments, Ir, Pd, and Pt are deposited by alternately and sequentially contacting a substrate with vapor phase pulses of a noble metal precursor, an oxygen source, and a hydrogen source. The oxygen source is preferably a reactive oxygen species. Preferably the deposition temperature is less than about 200° C. Preferably, pulses of the hydrogen source are less than 10 seconds.

Abstract: A method of forming a structure useful in all forms of deposited metals, elemental metals, metal alloys, metal compounds, metal systems, including refractory metals such as tungsten and tantalum is provided. The structure generally comprises a substrate, a first layer formed atop the substrate, and a second layer formed atop the first layer. The first layer comprises a metal, which can be chromium, gold, platinum, aluminum, nickel, or copper. The second layer comprises a metal, elemental metal, metal alloy, metal compound, or metal system comprising a refractory metal such as tungsten or tantalum. The substrate can be a silicon, quartz or glass, metal, metal oxide or nitride.