Metal Coating (e.g., Electroless Deposition, Etc.) Patents (Class 427/304)
  • Patent number: 8052858
    Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 8, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Motoki Hiraoka, Takeshi Bessho, Sigeru Sibata
  • Publication number: 20110256317
    Abstract: A storage container is provided, which includes carbon dioxide containing a functional material and a container body in which carbon dioxide has been hermetically contained. Accordingly, a method for molding a resin, a method for forming a plating film, and the storage container for carbon dioxide, which are excellent in the mass productively at low cost, are provided without using any special high pressure apparatus for producing a supercritical fluid.
    Type: Application
    Filed: June 15, 2011
    Publication date: October 20, 2011
    Applicant: Hitachi Maxell, Ltd.
    Inventors: Takaki Nasu, Atsushi Yusa, Yoshiyuki Nomura, Masato Fukumori
  • Patent number: 8039045
    Abstract: An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 ?m or more. Before forming a plating film by a step of electroless plating S6, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment S2 to increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S3, a step of palladium catalyst treatment S4, and a step of palladium bonding treatment S5.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: October 18, 2011
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Youichi Tei, Akira Iso, Kazuhito Higuchi, Hajime Kurihara, Hiroyuki Uwazumi
  • Patent number: 8007862
    Abstract: Provided are a method of preparing a nanowire grid polarizer, and a nanowire grid polarizer prepared using the same. The method includes: mixing a surfactant and a silica precursor to prepare a mesoporous film composition; coating the mesoporous film composition on a substrate; aging the coated product to form a silica template composite; removing the surfactant inside the silica template composite to prepare a mesoporous material having channels; and filling the channels of the mesoporous material with metal. The method is suitable for the formation of a nanowire having a stable structure, mass production, and large-area production.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: August 30, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Su-mi Lee, Dong-mok Whang, Moon-gyu Lee, Yoon-sun Choi, Sun-hwak Woo
  • Patent number: 8003038
    Abstract: There is disclosed a process for producing a resin molded article by using a resin into which fine metal particles are so introduced as to be hardly dissolved at the melting temperature of the resin and as to obtain high solubility in a high-pressure carbon dioxide. This process comprises the steps of forming a high-pressure fluid by dissolving, in a high-pressure carbon dioxide, a fluorine-containing metal complex and a fluorine-based solution capable of dissolving the same metal complex; introducing the high-pressure fluid into a heated and molten resin; and molding the resin having the high-pressure fluid introduced thereinto, to shape the molded article.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: August 23, 2011
    Assignee: Hitachi Maxell, Ltd.
    Inventors: Tetsuya Ano, Atsushi Yusa, Satoshi Yamamoto, Toshiyuki Ogano
  • Patent number: 8003165
    Abstract: Nanoparticles are coated using thick-film techniques with a catalyst to promote the growth of carbon nanotubes thereon. In one example, alumina nanoparticles are coated with a copper catalyst. Such nanoparticles can be selectively deposited onto a substrate to create a field emission cathode, which can then be utilized within field emission devices.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 23, 2011
    Assignee: Applied Nanotech Holdings, Inc.
    Inventors: Dongsheng Mao, Yunjun Li, Richard Fink, Valerie Ginsberg, Mohshi Yang, Leif Thuesen
  • Patent number: 7998247
    Abstract: A gas separation membrane and a method of manufacturing such gas separation membrane that comprises a porous substrate treated with a layer of metal-coated inorganic oxide particles and with the layer of such metal-coated inorganic oxide particles being coated with an overlayer of a gas-selective material.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: August 16, 2011
    Assignee: Shell Oil Company
    Inventors: John Charles Saukaitis, Alan Anthony Del Paggio
  • Publication number: 20110189401
    Abstract: The present invention relates to a method for improving the corrosion-protecting pre-treatment of metal surfaces and using rinse water in a manner to conserve resources in such a corrosion-protecting pre-treatment, comprising a conversion treatment step using an aqueous composition comprising at least 50 ppm of the elements B, Si, Ti, Zr and/or Hf in the form of water-soluble compounds at a pH value of 3 to 5.5, wherein a minimum fraction of 10 ppm of the elements B, Si, Ti, Zr and/or Hf in the form of water-soluble compounds is present in the last pre-rinse step and a portion of the aqueous composition of the conversion treatment step is contained in the first post-rinse step. The resource-conserving use of the rinse water is accomplished according to the invention by way of a cascaded return of rinse water from the last rinse step to the first rinse step.
    Type: Application
    Filed: January 31, 2011
    Publication date: August 4, 2011
    Applicant: Henkel AG & Co. KGaA
    Inventors: Franz-Adolf Czika, Sophie Cornen, Jens Kroemer, Michael Frank, Nicole Teubert, Jan-Willem Brouwer
  • Patent number: 7989029
    Abstract: A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: August 2, 2011
    Assignee: SRI International
    Inventors: Jaspreet Singh Dhau, Sunity K. Sharma
  • Patent number: 7976892
    Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 12, 2011
    Assignee: Robert Bosch GmbH
    Inventors: Walter Beck, Eric Ochs, Walter Roethlingshoefer, Bernhard Bachor, Dietmar Schaible, Albert-Andreas Hoebel, Klaus-Peter Dambock, Juergen Schwaiger, Detlef Nitsche
  • Publication number: 20110159191
    Abstract: Provided is a sensitizing solution for electroless plating which can easily dissolve an Sn compound therein without the use of acid, and thus can be used for a long period of time without impairing the uniformity of a metal plating coating. The sensitizing solution for electroless plating is a sensitizing solution for electroless plating including: an Sn compound; and a solvent, wherein the solvent contains 10 vol. % or more of a water-soluble alcohol. In addition, provided is an electroless plating method including: a pretreatment process of immersing a body to be plated into a pretreatment solution; and a plating process of immersing the body to be plated after being subjected to the pretreatment process into a plating solution, wherein the sensitizing solution for electroless plating according to the invention is used as the pretreatment solution.
    Type: Application
    Filed: August 26, 2009
    Publication date: June 30, 2011
    Applicants: SHOWA DENKO K.K., Kanto Gakuin School Corporation
    Inventors: Ichiro Koiwa, Akira Hashimoto, Masahiko Usuda
  • Patent number: 7959977
    Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: June 14, 2011
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
  • Publication number: 20110111175
    Abstract: A method for increasing the durability of glass (1) by a coating, according to the present invention comprises the step of coating glass (1) with a coating comprising at least one layer (4, 5, 6) whose thickness is below 5 nanometres, wherein the coating comprises a compound of at least one element. A glass product comprising a coating, according to the present invention is fabricated by coating glass (1) with a coating comprising at least one layer (4, 5, 6) whose thickness is below 5 nanometres. A glass product comprising a coating, according to the present invention comprises surface scratches (2) with a width at the level of the glass (1) surface of below 50 nanometres, the coating residing essentially conformally on the inside of the surface scratches (2) to increase the durability of the glass (1).
    Type: Application
    Filed: December 1, 2008
    Publication date: May 12, 2011
    Applicant: Beneq Oy
    Inventors: Markku Rajala, Matti Putkonen
  • Patent number: 7919138
    Abstract: Methods of attaching a ligand to a surface are described that include contacting a surface with a substrate containing an amphiphilic comb polymer. The substrate is configured to provide a pattern of the amphiphilic comb polymer on a selected region of the surface. The substrate can be separated from the surface leaving the amphiphilic comb polymer on the selected region of the surface, thus providing a selected region of the surface having amphiphilic comb polymer on it. A ligand can then be deposited on the surface such that the selected region of the surface having the amphiphilic comb polymer is substantially free of the ligand.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: April 5, 2011
    Assignee: Duke University
    Inventors: Ashutosh Chilkoti, Zhongping Yang, Jinho Hyun
  • Publication number: 20110064954
    Abstract: For the purpose of providing a method capable of conveniently enhancing adhesion between a metal film and an insulating resin upon forming the metal film on a flat surface of the insulating resin, the invention provides a method for conditioning an insulating resin, comprising hydrophilizing an insulating resin, treating the insulating resin with a solution containing a polymer having a primary amine, a secondary amine or both of them on a side chain thereof, and a method for metallizing an insulating resin utilizing the conditioning method.
    Type: Application
    Filed: May 22, 2008
    Publication date: March 17, 2011
    Applicant: EBARA-UDYLITE CO., LTD.
    Inventor: Satoru Shimizu
  • Patent number: 7897198
    Abstract: Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer (in the range of a few hundred angstroms). The components are typically a reducing agent and a metal source.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: March 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Heung L. Park, Eric G. Webb, Jonathan D. Reid, Timothy Patrick Cleary
  • Patent number: 7892605
    Abstract: A high-strength quenched formed body containing a layer on the surface of an after-quenching formed-body steel material in which layer Zn is a major component and which layer contains 30% by mass or less of Fe, and which layer is present in an amount of 30 g/m2 or more. A quenched formed body is produced by quenching a zinc-plated steel material which includes a zinc-plated layer containing each of Al and Si having alloying-retarding function and readily-oxidizing function independently or compositely, in an amount of 0.15% by mass or more, after heating it to 800° C. or more and 950° C. or less in an oxidizing atmosphere containing 0.1% by volume or more of oxygen.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: February 22, 2011
    Assignees: Aisin Takaoka Co., Ltd., Nippon Steel Corporation
    Inventors: Shinichi Suzuki, Toshimasa Tomokiyo, Shuuji Souma, Katsuji Nakashima, Masashi Ozawa, Kiyohito Kondou
  • Publication number: 20110020550
    Abstract: The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.
    Type: Application
    Filed: March 12, 2009
    Publication date: January 27, 2011
    Inventors: Hironori Ota, Atsushi Yusa, Satoshi Yamamoto
  • Patent number: 7871670
    Abstract: A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a substrate patterned-nanostructure surface, disposing a metal layer on the substrate patterned-nanostructure surface to form a metallic patterned-nanostructure surface region, forming a self-assembled monolayer on the metallic patterned-nanostructure surface region, exposing the self-assembled monolayer to an electroless plating solution comprising a deposit metal, and depositing electrolessly the deposit metal selectively on the surface regions having a metallic nanostructured surface. Articles formed from this method are also disclosed.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: January 18, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Khanh P. Nguyen, Matthew H. Frey, Haiyan Zhang, Jun-Ying Zhang
  • Publication number: 20110009656
    Abstract: The invention discloses a method of modifying the surface of a metallic hydride-forming material, through functionalization treating the surface of the metallic hydride-forming material with aminosilane to deposit self-assembled monolayers onto the surface. Thereafter at least one Platinum Group Metal is deposited onto the treated surface of the metallic hydride-forming material to allow chemical bonding to occur between the Platinum Group Metal(s) and the self-assembled monolayers.
    Type: Application
    Filed: November 21, 2008
    Publication date: January 13, 2011
    Inventors: Mario Williams, Mykhaylo V. Lototsky, Alexander N. Nechaev, Vladimir M. Linkov
  • Patent number: 7867564
    Abstract: The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and ?-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: January 11, 2011
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Toru Imori, Atsushi Yabe
  • Patent number: 7862860
    Abstract: A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: January 4, 2011
    Assignee: International Business Machines Corporation
    Inventors: Tricia Breen Carmichael, Sarah Jane Vella, Ali Afzali-Ardakani, Mahmoud Mostafa Khojasteh
  • Publication number: 20100323174
    Abstract: There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof.
    Type: Application
    Filed: October 16, 2007
    Publication date: December 23, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Hideo Nagasaki, Takeyoshi Kano
  • Publication number: 20100320635
    Abstract: To provide a method for producing a polymer member having a plated film with excellent adhesion by subjecting a polymer member in which a catalyst component is dispersed by using pressurized carbon dioxide to electroless plating under ordinary pressure. A polymer member in which a catalyst component is dispersed is formed by using a pressurized fluid in which a catalyst component containing a metal which serves as a plating catalyst is dissolved in pressurized carbon dioxide; the polymer member in which the catalyst component is dispersed is immersed in an alcohol treatment liquid under ordinary pressure; and the polymer member, which has been subjected to the pretreatment with the alcohol treatment liquid, is immersed in an electroless plating solution containing an alcohol under ordinary pressure to form a plated film.
    Type: Application
    Filed: June 16, 2010
    Publication date: December 23, 2010
    Applicant: Hitachi Maxell, Ltd
    Inventors: Hironori OTA, Atsushi Yusa, Tetsuya Ano
  • Publication number: 20100310773
    Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1.
    Type: Application
    Filed: August 20, 2010
    Publication date: December 9, 2010
    Inventors: Hiroshi Yoshida, Haruo Akahoshi, Akihiro Miyauchi, Masahiko Ogino
  • Patent number: 7838065
    Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: November 23, 2010
    Assignee: National Tsing Hua University
    Inventors: Tzu-Chien Wei, Chi-Chao Wan, Yeng-Yun Wang, Hui-Hsiu Tang
  • Patent number: 7829153
    Abstract: The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: November 9, 2010
    Assignee: Science Applications International Corporation
    Inventors: Paul E. Schoen, Ronald R. Price, Joel M. Schnur, Daniel Zabetakis, Robert F. Brady, Jr., Ann Mera, Dana Leamann, Bor-Sen Chiou, Walter J. Dressick
  • Publication number: 20100272902
    Abstract: A plating method comprising: (a) applying a plating catalyst liquid containing a catalytic element and an organic solvent, to an object to be plated having, at least at a surface thereof, a functional group capable of forming an interaction with the catalytic element; and (b) performing plating on the object to be plated, to which the plating catalyst liquid has been applied.
    Type: Application
    Filed: December 19, 2008
    Publication date: October 28, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Hideo Nagasaki, Masataka Sato
  • Publication number: 20100221432
    Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
    Type: Application
    Filed: April 30, 2010
    Publication date: September 2, 2010
    Inventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
  • Publication number: 20100193364
    Abstract: In some embodiments, a workpiece-surface-influencing device preferentially contacts the top surface of the workpiece, to chemically modify the surface at desired field areas of the workpiece without affecting the surfaces of cavities or recesses in the field areas. The device includes a substance which is chemically reactive with material forming the workpiece surface. The substance can be in the form of a thin film or coating which contacts the surface of the workpiece to chemically modify that surface. The workpiece-surface-influencing device can be in the form of a solid state applicator such as a roller or a semi-permeable membrane. In some other embodiments, the cavities are filled with material that prevents surface modification of the cavity surfaces while allowing modification of the field areas, or which encourages surface modification of the cavity surfaces while preventing modification of the field areas. The modified surface facilitates selective deposition of materials on the workpiece.
    Type: Application
    Filed: April 9, 2010
    Publication date: August 5, 2010
    Applicant: IPGRIP, LLC
    Inventor: Vladislav Vasilev
  • Publication number: 20100189974
    Abstract: An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprising a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.
    Type: Application
    Filed: June 26, 2008
    Publication date: July 29, 2010
    Inventors: Shinya Ochi, Ryuichi Nakagami, Makoto Kohtoku, Mika Hamada
  • Patent number: 7758923
    Abstract: The present invention provides a method of producing a molded article, which can be perform the continuous processes and effectively impregnate a modifying material such as metal complexes in the thermoplastic resin for short period of time. The above object is achieved by providing the method of producing the thermoplastic resin molded article which includes impregnating the high-pressure fluid having a modifying material dissolved therein, in thermoplastic resin, and continuously molding the thermoplastic resin in which the modifying material has been impregnated, into the form of a film.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: July 20, 2010
    Assignee: Hitachi Maxell Ltd.
    Inventors: Atsushi Yusa, Yoshiyuki Nomura, Harumi Hieida
  • Patent number: 7754062
    Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: July 13, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masatsugu Nakanishi, Takeshi Bessho
  • Publication number: 20100173070
    Abstract: Porous and/or curved nanofiber bearing substrate materials are provided having enhanced surface area for a variety of applications including as electrical substrates, semipermeable membranes and barriers, structural lattices for tissue culturing and for composite materials, production of long unbranched nanofibers, and the like. A method of producing nanofibers is disclosed including providing a plurality of microparticles or nanoparticles such as carbon black particles having a catalyst material deposited thereon, and synthesizing a plurality of nanofibers from the catalyst material on the microparticles or nanoparticles. Compositions including carbon black particles having nanowires deposited thereon are further disclosed.
    Type: Application
    Filed: March 1, 2010
    Publication date: July 8, 2010
    Applicant: NANOSYS, INC.
    Inventor: Chunming Niu
  • Patent number: 7744675
    Abstract: A gas separation membrane and a method of manufacturing such gas separation membrane that comprises a porous substrate treated with a layer of metal-coated inorganic oxide particles and with the layer of such metal-coated inorganic oxide particles being coated with an overlayer of a gas-selective material.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: June 29, 2010
    Assignee: Shell Oil Company
    Inventors: John Charles Saukaitis, Alan Anthony Del Paggio
  • Publication number: 20100155255
    Abstract: The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.
    Type: Application
    Filed: May 16, 2008
    Publication date: June 24, 2010
    Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Toshimitsu Nagao, Yusuke Yoshikane, Junji Yoshikawa, Toru Morimoto, Toshiya Murata, Kazuya Satou
  • Publication number: 20100143431
    Abstract: The invention relates to the production and use of novel bioactive devices and metallic coatings for example for sterilizing, disinfecting, and decontaminating water or aqueous solutions. The known oligodynamic effect of silver for reducing the amount of germs is thereby improved and increased by combining silver with ruthenium and a vitamin or derivative thereof. The novel properties of these bioactive metal surfaces lead to faster and more efficient killing of microorganisms. Simultaneously, these novel bioactive metal surfaces prevent infestation by microorganisms and attachment or permanent deposition of problematic biomolecules such as for example DNA, RNA, or proteins. A self-cleaning surface is thus obtained, which very quickly and efficiently and over extended periods of time sterilizes water and aqueous solutions when they come in contact with said surface.
    Type: Application
    Filed: October 2, 2007
    Publication date: June 10, 2010
    Applicant: AGXX INTELLECTUAL PROPERTY HOLDING GMBH
    Inventors: Uwe Landau, Thomas Lisowsky, Karlheinz Esser, Klaus-Dieter Mehler
  • Patent number: 7691433
    Abstract: The invention relates to a method for a structured application of molecules on a strip conductor and to a molecular memory matrix. The inventive method makes it possible, for the first time, to economically and simply apply any number of molecular memory elements on the strip conductor in a structured and targeted way, thereby making available, also for the first time, a memory matrix at a molecular level.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: April 6, 2010
    Assignee: Forschungszentrum Julich GmbH
    Inventors: Stephan Kronholz, Silvia Karthäuser
  • Publication number: 20100075026
    Abstract: A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.
    Type: Application
    Filed: October 30, 2008
    Publication date: March 25, 2010
    Applicant: NATIONAL DEFENSE UNIVERSITY
    Inventors: Yuh Sung, Ming-Der Ger, Chang-Pin Chang, Chun-Chieh Tseng, Wen-Ding Chen
  • Publication number: 20100068391
    Abstract: The present invention provides methods of controlling properties of a thin film applied to a substrate whereby the properties of the thin film may be controlled by the surface morphology of the substrate. Methods of increasing a deposition rate of an electroless plating process applied to a substrate, controlling the grain size distribution and/or grain size of a thin film applied to a substrate and maintaining a uniform overpotential of an electroless plating process on a substrate are also provided.
    Type: Application
    Filed: May 13, 2009
    Publication date: March 18, 2010
    Inventors: Shamsuddin Ilias, Mohammad A. Islam
  • Publication number: 20100047458
    Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
    Type: Application
    Filed: November 2, 2006
    Publication date: February 25, 2010
    Applicant: EBARA-UDYLITE CO., LTD.
    Inventors: Makoto Kohtoku, Mika Hamada
  • Patent number: 7666471
    Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: February 23, 2010
    Inventors: Mark Wojtaszek, James Watkowski, Gary B. Larson, Peter Kukanskis
  • Patent number: 7666476
    Abstract: A method of producing a metallized polymeric foam that produces an anti-microbial material using an advanced method of metallizing polymeric foam with a metal, such as silver. The foam material may be polyurethane, polyester, polyether, or a combination thereof. The method provides a 3-dimensional surface coating of the metal. The metallized substrate is durable and highly adherent. Such metallized foam is a highly effective filter and/or an anti-microbial product. The mechanism of filtration is mainly due to Vander Der Wal attraction. The anti-microbial activity may be due, in part, to the release of select metal ions as a response to stimuli.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: February 23, 2010
    Assignee: Noble Fiber Technologies, LLC
    Inventors: N. Satish Chandra, Joel M. Furey, William F. McNally, Vinesh Naik
  • Publication number: 20100015338
    Abstract: A process for preparing a metal styrene polymer composite having nano metallic particles deposited thereon is disclosed, which includes a) undergoing free radical polymerization of styrene and an optional co-monomer in the presence of a persulfate initiator and a chain transfer agent; and b) contacting the resulting styrene oligomer or copolymer of styrene and the co-monomer from step a) with an aqueous solution containing a noble metal ion dissolved therein, so that the noble metal ion is reduced to element form particles and deposit on the styrene oligomer or copolymer of styrene and the co-monomer by sulfates on the oligomer or copolymer in the absence of a reducing agent.
    Type: Application
    Filed: August 2, 2006
    Publication date: January 21, 2010
    Applicant: CHUNG CHENG INSTITUTE OF TECHNOLOGY, NATIONAL DEFENSE UNIVERSITY
    Inventors: Jinn-Luh Ou, Chang-Ping Chang, Yuh Sung, Ming-Der Ger, Chun-Chieh Tseng, Wen-Ding Chen
  • Patent number: 7645370
    Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heav
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: January 12, 2010
    Assignee: Daicel Polymer Ltd.
    Inventors: Toshihiro Tai, Ippei Tonosaki
  • Patent number: 7641817
    Abstract: There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: January 5, 2010
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Hiroshi Matsushima, Kozo Ogi
  • Publication number: 20090315181
    Abstract: Methods and associated structures of forming a microelectronic structure are described. Those methods may comprise dissolving a metal precursor in a non-aqueous solvent in a bath; placing a substrate comprising an interconnect opening in the bath, wherein the metal precursor forms a monolayer within the interconnect opening; and placing the substrate in a coreactant mixture, wherein the coreactant reacts with the metal precursor to form a thin barrier monolayer.
    Type: Application
    Filed: June 24, 2008
    Publication date: December 24, 2009
    Inventor: Adrien R. Lavoie
  • Publication number: 20090304935
    Abstract: A method for reducing cure shrinkage of a thermoset resin includes forming a plurality of surface modified nanofibers. The surface modified nanofibers are formed by soaking nanofibers in an oxidizing acidic solvent. An oxidizing agent is added to the soaking nanofibers, thereby generating heat sufficient for at least one of in-situ oxidation and in-situ exfoliation of a subsurface of each of the nanofibers. Excess oxidizing agent and acidic solvent are removed from the nanofibers, which are then dried. The dried nanofibers have reduced surface hydrophobicity. The surface modified nanofibers are substantially uniformly dispersed into the thermoset resin. The surface modified nanofibers are adapted to reduce cure shrinkage of the thermoset resin during subsequent curing processes.
    Type: Application
    Filed: August 14, 2009
    Publication date: December 10, 2009
    Inventors: Gholam-Abbas Nazri, Chen-Shih Wang
  • Patent number: 7629015
    Abstract: An electrically conductive member (10) includes an elongate body (11) which has at least one electrically conductive region (20). The electrically conductive region (20) comprises a porous polymeric material coated with an electrically conductive material. A method of manufacturing the electrically conductive member (10) includes the steps of extruding an elongate body of polymeric material wherein at least one region of the elongate body is porous in nature; and coating said elongate body with an electrically conductive material such that the electrically conductive material substantially coats the pores of said at least one region.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: December 8, 2009
    Assignee: CathRx Ltd
    Inventors: Neil Lawrence Anderson, Evan Ka-Loke Chong
  • Publication number: 20090269599
    Abstract: Disclosed is a multilayer film for plating comprising, on a surface of a first substrate, a plating receptive layer which contains a polymer having a polymerizable group and a functional group, wherein the plating receptive layer satisfies at least one of the following (1)-(4): (1) the saturated water absorption ratio is from 0.01 to 10% by mass in an environment of a temperature of 25° C. and relative humidity of 50%; (2) the saturated water absorption ratio is from 0.05 to 20% by mass in an environment of a temperature of 25° C. and relative humidity of 95%; (3) the water absorption ratio is from 0. 1 to 30% by mass after immersion in boiling water at 100° C. for one hour; and (4) the surface contact angle of distilled water is from 50° to 150° after 5 ?l of the distilled water is dropped onto the plating receptive layer and allowed to stand for 15 seconds in an environment of a temperature of 25° C. and relative humidity of 50%.
    Type: Application
    Filed: April 22, 2009
    Publication date: October 29, 2009
    Applicant: FUJIFILM CORPORATION
    Inventor: Mitsuyuki Tsurumi