Metal Coating (e.g., Electroless Deposition, Etc.) Patents (Class 427/304)
  • Patent number: 7160583
    Abstract: A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: January 9, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Khanh P. Nguyen
  • Patent number: 7147896
    Abstract: An electroless nickel plating method for the preparation of zirconia ceramic material. The surface of the zirconia ceramic material is first cleaned of contaminants. This is followed by an etching step where the surface of the material is etched by an acid. Then, activating the surface of the material is achieved by first applying a tin sensitizer, and then a palladium activator. Following the palladium activator step, applying an electroless nickel to the surface of the post activated material. After the electroless nickel bath, the zirconial ceramic material can then be further electroless or electrolytically plated with a variety of finishes. Applying the method of the present invention provides a suitable, commercially practicable method for the preparation of zirconia ceramic material for electroless nickel plating, so that the electroless nickel chemistry is distributed evenly on the material's surface.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 12, 2006
    Inventor: Mark D. Rine
  • Patent number: 7101795
    Abstract: A method and system to form a refractory metal layer on a substrate features nucleating a substrate using sequential deposition techniques in which the substrate is serially exposed to first and second reactive gases followed by forming a layer, employing vapor deposition, to subject the nucleation layer to a bulk deposition of a compound contained in one of the first and second reactive gases.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: September 5, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Ming Xi, Ashok Sinha, Moris Kori, Alfred W. Mak, Xinliang Lu, Ken Kaung Lai, Karl A. Littau
  • Patent number: 7087268
    Abstract: A method (10 or 20) for plating a component of a golf club head (42) is disclosed herein. The component of the golf club head that is plated is preferably composed of a metal material selected from the group consisting of magnesium alloys, aluminum alloys, magnesium and aluminum. The plating (300) preferably comprises a first plating layer (302) a second plating layer (303) and a chrome or chromate layer (304). The method (10 of 20) preferably comprises exposing the component to alkaline and acidic solutions. The method (10 and 20) also preferably includes heat treating the plated component.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: August 8, 2006
    Assignee: Callaway Golf Company
    Inventors: Wayne H. Byrne, Herbert Reyes
  • Patent number: 7087267
    Abstract: A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: Tricia Lynn Breen, Sarah Jane Vella, Ali Afzali-Ardakani, Mahmoud Mostafa Khojasteh
  • Patent number: 7081304
    Abstract: The present invention aims to provide a surface-conductive resin suitable for wiring boards, and the like, a process for forming the resin efficiently, and a wiring board using the surface-conductive resin. The surface-conductive resin according to the present invention is formed by selectively generating reactive groups capable of substitution under alkaline conditions on the resin surface, bringing the reactive groups into contact with an alkaline solution so that part of the reactive groups are substituted by alkali metal ions, bringing the substituted parts by the alkali metal ions into contact with ions of a conductive material so that the alkali metal ions are substituted by ions of the conductive material, and reducing the ions of the conductive material so that the conductive material deposits on the resin surface.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: July 25, 2006
    Assignee: Fujitsu Limited
    Inventor: Kanae Nakagawa
  • Patent number: 7067172
    Abstract: Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: June 27, 2006
    Assignee: AVX Corporation
    Inventors: Andrew P. Ritter, John L. Galvagni, Jason MacNeal, Robert Heistand, II, Sriram Dattaguru
  • Patent number: 7063762
    Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: June 20, 2006
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Elizabeth Foster, Gregory Kevern, Anita Sargent
  • Patent number: 7056448
    Abstract: A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: June 6, 2006
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Keigo Obata, Masakazu Yoshimoto, Shingo Kitamura, Seiichiro Nakao, Osamu Masuyama, Hidenori Tsuji
  • Patent number: 7045461
    Abstract: Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretreatment agent obtained by reacting or mixing in advance a noble metal compound (catalyst) with a silane-coupling agent having functional groups capable of capturing metals. According to this method, metal plating can be securely applied to powders, resin cloths, semiconductor wafers, and other specular bodies. Moreover, the problem of the insufficient coverage of the seed layer on the inside walls of vias and trenches during the formation of fine wiring can be addressed by applying this method to semiconductor wafers. The silane-coupling agent may be a compound containing azole groups, preferably an imidazole.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: May 16, 2006
    Assignee: Nikkon Materials Co., Ltd.
    Inventors: Toru Imori, Masashi Kumagai, Junnosuke Sekiguchi
  • Patent number: 7026012
    Abstract: A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: April 11, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: William T. Chen, Peter M. Moran
  • Patent number: 7011862
    Abstract: An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of the wiring conductor with an electroless plated metal layer, wherein the electroless plated metal layer contains an element of Group 1B and is free from lead.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: March 14, 2006
    Assignee: Kyocera Corporation
    Inventors: Yoshihiro Hosoi, Yasuo Fukuda
  • Patent number: 7001641
    Abstract: Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surfactant that is compatible with a surfactant used when forming the remainder of the circuit feature on the seed layer. Yet another embodiment combines both techniques.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: February 21, 2006
    Assignee: Intel Corporation
    Inventors: Valery M. Dubin, Christopher D. Thomas, Vinay B. Chikarmane
  • Patent number: 6996425
    Abstract: There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multilayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on the lower metal layer with metal plating, and wherein the lower metal layer is made of a first metal which is ductile and the upper metal layer is made of a second metal which is brittle compared with that of the first metal.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: February 7, 2006
    Assignee: NEC Corporation
    Inventor: Yohsuke Watanabe
  • Patent number: 6960370
    Abstract: Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxes. Medical devices can be assembled by soldering together plated materials. Oxidizable materials can be plated with radiopaque materials to yield medical devices that are more visible to fluoroscopy.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: November 1, 2005
    Assignee: SciMed Life Systems, Inc.
    Inventors: Vittorino Monni, Verivada Chandrasekaran, Outhay Voraphet
  • Patent number: 6956076
    Abstract: An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) at least one plasticizer selected from the group consisting of compounds represented by the following formula (1): R1O—R2mOOC—(CH2nCOOR3—OmR4??(1) wherein R1 and R4are the same or different alkyl groups having 1 to 30 carbon atoms or alkenyl groups, R2 and R3 are the same or different alkylene groups having 1 to 30 carbon atoms or alkenylene groups, m is an integer of 0 to 5, and n is an integer of 1 to 10, and compounds represented by the following formula (2): wherein R5 is an alkyl group having 1 to 30 carbon atoms or alkenyl group. A transfer film and a plasma display panel production process using the composition are also described.
    Type: Grant
    Filed: November 19, 2001
    Date of Patent: October 18, 2005
    Assignee: JSR Corporation
    Inventors: Takanori Yamashita, Kenji Okamoto, Jiro Takahashi, Tadahiko Udagawa
  • Patent number: 6949269
    Abstract: A method is taught for fabricating patterned silicon dioxide layers on process areas disposed perpendicularly or at an inclination to a substrate surface. Firstly, a starter layer having leaving groups is produced by non-conformal deposition of a reactive component. Tris(tert-butoxy)silanol is subsequently added. The addition of the tris(tert-butoxy)silanol leads to the formation of a silicon dioxide layer selectively only on the starter layer.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: September 27, 2005
    Assignee: Infineon Technologies AG
    Inventors: Harald Seidl, Martin Gutsche
  • Patent number: 6926922
    Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: August 9, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Mei Kiu Leung, Willetta Lai, Pit Kai Peter Cheng, Cecilia Po Sze Wong
  • Patent number: 6911230
    Abstract: Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.
    Type: Grant
    Filed: November 23, 2002
    Date of Patent: June 28, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Miriana Kanzler
  • Patent number: 6905726
    Abstract: The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: June 14, 2005
    Assignee: Infineon Technologies AG
    Inventors: Klaus Lowack, Günter Schmid, Recai Sezi
  • Patent number: 6905622
    Abstract: Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: June 14, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris R. McGuirk, Srinivas Gandikota, Girish Dixit
  • Patent number: 6902761
    Abstract: The invention relates to a method for the interior metal-coating of glass tubes, with the metal-coated surface being a cylindrical shell. In accordance with the invention such a method comprises the following process steps: the glass tube is sealed off at either end; the glass tube is brought to a horizontal position: a sensitizer solution is introduced into the interior space of the glass tube in such a quantity that the interior space is only partly filled; the sensitizer solution is removed from the interior space after a certain dwell period; a mirror-coating solution is introduced into the interior space of the glass tube, with the entire interior surface of the glass tube being wetted by the mirror-coating solution; the used-up mirror-coating solution is removed from the interior space of the glass tube.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: June 7, 2005
    Assignee: Schott AG
    Inventors: Stephan Tratzky, Heinz Dotzler, Matthias Müller, Joachim Pfeifer, Michael Siller, Leonid Schulz, Gottfried Haas
  • Patent number: 6899829
    Abstract: A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: May 31, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, Wade Sonnenberg, Patrick J. Houle
  • Patent number: 6899816
    Abstract: Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: May 31, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris R. McGuirk, Srinivas Gandikota, Girish Dixit
  • Patent number: 6893681
    Abstract: A process to manufacture a surface-conductive resin in a short time at a low cost without damaging the main chain of a polymer is provided. The process for manufacturing surface-conductive resin comprises partially substituting a reactive group in at least one of a resin precursor and a semi-cured resin having at least one reactive group partially substitutable under alkaline condition by an alkali metal ion solution, exchanging the substituted alkali metal ion with the ion of a conductive material in the ionic solution, reducing the ion of the conductive material to deposit the conductive layer, then curing the resin, to get surface-conductive polymer/resin.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 17, 2005
    Assignee: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Kanae Nakagawa, Masataka Mizukoshi
  • Patent number: 6884628
    Abstract: Multifunctional, polyionic copolymers with molecular architectures and properties optimized for specific applications are synthesized on/or applied to substrate surfaces for analytical and sensing purposes. The coatings are particularly useful for suppression of non-specific interaction, adsorption or attachment of molecular or ionic components present in an analyte solution. Chemical, biochemical or biological groups that are able to recognize, interact with and bind specifically to target molecules in the material containing the analyte to be detected can be coupled to, integrated into, or absorbed to the multifunctional copolymers. These multifunctional copolymer coatings are compatible with a variety of different established methods to detect, sense and quantify the target molecule in an analyte.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: April 26, 2005
    Assignees: Eidgenossische Technische Hochschule Zurich, Universitat Zurich
    Inventors: Jeffrey A. Hubbell, Marcus Textor, Donald L. Elbert, Stephanie Finken, Rolf Hofer, Nicholas D. Spencer, Laurence Ruiz-Taylor
  • Patent number: 6881437
    Abstract: Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some embodiments, the fluids may fill the enclosed area. In addition or alternatively, a second enclosed area may be formed about the topography. As such, the provided system may be adapted to form different enclosed areas about a substrate holder. In some cases, the method may include agitating a solution to minimize the accumulation of bubbles upon a wafer during an electroless deposition process. As such, the system provided herein may include a means for agitating a solution in some embodiments. Such a means for agitation may be distinct from the inlet/s used to supply the solution to the chamber.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: April 19, 2005
    Assignee: Blue29 LLC
    Inventors: Igor C. Ivanov, Weiguo Zhang
  • Patent number: 6875475
    Abstract: This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: April 5, 2005
    Assignee: William Marsh Rice University
    Inventors: Cristin E. Moran, Corey J. Radloff, Naomi J. Halas
  • Patent number: 6875501
    Abstract: Method for the production of a laminate and bent product produced from such a laminate. The laminate is made up of at least two outer sheets of metal material with a layer of fibre-reinforced resin between them. During production the fibre layer is applied dry and the layer of resin material is applied around the fibre material only at a later stage. This can take place either by injection or by rendering fluid a layer of resin material that is applied adjoining the layer of fibre material in the laminate. In this way it is ensured that complete filling of the adjacent sheets of metal material with fibre-reinforced resin takes place even in bends.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: April 5, 2005
    Assignee: Stork Fokker AESP B.V.
    Inventors: Maarten Labordus, Michael Johannes Leonardus Van Tooren
  • Patent number: 6875260
    Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: April 5, 2005
    Assignee: Enthone Inc.
    Inventor: Han Verbunt
  • Patent number: 6863936
    Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilised catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: March 8, 2005
    Assignee: Agency for Science, Technology and Research
    Inventors: William T. Chen, Peter M. Moran, Harvey M. Phillips
  • Patent number: 6861097
    Abstract: The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: March 1, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin T. Goosey, John E. Graves, Joachim Buch, Mark A. Poole, Deborah Hirst, Rebecca Holland
  • Patent number: 6849291
    Abstract: A gas sensing element has a solid electrolytic body, a reference gas side electrode provided on a surface of the solid electrolytic body so as to be exposed to a reference gas, and a measured gas side electrode provided on another surface of the solid electrolytic body so as to be exposed to a measured gas. A crystal face strength ratio of the measured gas side electrode according to X-ray diffraction is 0.7?{I(200)/I(111)} or 0.6?{I(220)/I(111)}.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: February 1, 2005
    Assignee: Denso Corporation
    Inventors: Gang E, Kiyomi Kobayashi, Yasumichi Hotta, Namitsugu Fujii
  • Patent number: 6824666
    Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Chris R. McGuirk, Deenesh Padhi, Muhammad Atif Malik, Sivakami Ramanathan, Girish A. Dixit, Robin Cheung
  • Publication number: 20040234695
    Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.
    Type: Application
    Filed: June 22, 2004
    Publication date: November 25, 2004
    Inventors: Norman P. Trahan, Brian Keough, Gary Aruda, Tobias M. Lederberg
  • Publication number: 20040219298
    Abstract: The present invention provides a substrate processing method and a substrate processing apparatus which has reproducibility over a surface of a substrate such as a semiconductor wafer and between substrates and can manufacture semiconductor devices or the like with a high yield. According to the present invention, a substrate processing method of forming a protective film selectively on bottom surfaces and side surfaces or exposed surfaces of embedded interconnects formed in a surface of a substrate is characterized by performing a pre-plating process on the substrate, carrying out electroless plating on the surface of the substrate after the pre-plating process to form the protective film selectively on the bottom surfaces and the side surfaces or the exposed surfaces of the interconnects, and bringing the substrate into a dry state after the electroless plating.
    Type: Application
    Filed: February 3, 2004
    Publication date: November 4, 2004
    Inventors: Akira Fukunaga, Haruko Ono, Hiroaki Inoue, Shohei Shima
  • Publication number: 20040219374
    Abstract: A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating.
    Type: Application
    Filed: February 4, 2004
    Publication date: November 4, 2004
    Inventors: Hideo Honma, Atsushi Kawahara, Akira Teranishi
  • Patent number: 6805601
    Abstract: A method for producing a high-luminance and high-image-quality plasma display panel (PDP) reduced in panel yellowing, and the PDP obtained by the method. The method for forming electrodes in the PDP includes a base layer formation step for forming a base layer containing metal oxides on a glass substrate, a precipitation promoting step for depositing palladium on regions of the base layer where a metal layer will be formed, and a step for forming the metal layer on the regions. The metal oxides contained in the base layer is preferably made of one or more metal oxides selected out of nickel oxide, cobalt oxide, iron oxide, zinc oxide, indium oxide, copper oxide, titanium oxide, praseodymium oxide, and silicon oxide.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: October 19, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaki Aoki, Mitsuhiro Ohtani, Junichi Hibino
  • Patent number: 6805911
    Abstract: The present invention provides a method for improving interfacial chemical reactions of a solid workpiece contacted with a liquid solution, said method comprising pre-heating the workpiece prior to immersion thereof in said liquid solution. The pre-heating may be carried out up to a temperature that is practicable without impairing the workpiece.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: October 19, 2004
    Assignee: J.G. Systems, Inc.
    Inventor: John Grunwald
  • Patent number: 6800187
    Abstract: An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: October 5, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Steven T. Mayer, R. Marshall Stowell, Evan E. Patton, Jeff A. Hawkins
  • Patent number: 6797312
    Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: September 28, 2004
    Assignee: Mattson Technology, Inc.
    Inventors: Bob Kong, Nanhai Li
  • Patent number: 6798963
    Abstract: An improved method for providing high-quality optical fiber metallization with the required length at the required location. The method enables metallized optical fibers to be soldered and connected to mechanical components while reducing the level of stress in the metal coatings and providing strong adhesion, good conductivity and connectivity. The advantage of the method is a combination of vacuum evaporation and electroless deposition for the optical fiber metallization. A strong adhesion of the metal layer is achieved by the use of an evaporated thin metal layer, comprising an adhesion layer and a seed layer. The stress reduction is achieved due to electroless deposition, which is adequately thick for subsequent soldering/welding or other applications. The method comprises preparation for evaporation, preparation of optical fibers, evaporation of the thin metal adhesion and seed layer on the optical fiber, electroless deposition of an adequately thick metal layer, and acceptance testing.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: September 28, 2004
    Assignee: Bluebird Optical Mems Ltd.
    Inventors: Yael Nemirovsky, Elena Sidorov, Victor Sidorov
  • Patent number: 6780467
    Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: August 24, 2004
    Assignee: Nikko Materials Co., Ltd.
    Inventor: Toru Imori
  • Patent number: 6776826
    Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: August 17, 2004
    Assignee: GBN Technologies, Inc.
    Inventors: Norman P. Trahan, Brian Keough, Gary Aruda, by Tobias M. Lederberg
  • Patent number: 6776828
    Abstract: Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: August 17, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Miriana Kanzler, Michael P. Toben
  • Patent number: 6773760
    Abstract: A method for metallizing a surface of substrates is disclosed. Particularly, nonhomogeneous heating deposition occurs by setting the surface and the heater in an electroless plating reactor at different temperatures. Moreover, an adjustable gap is defined between the substrate being metalized and heating source board. The deposit can securely adhere to the surface of the substrate for gap creates and activates metallic nanoparticles, which possess higher activity and bonding strength to the surface. Accordingly, metallization of the surface of the substrate can be easily achieved without using precious metals and carcinogenic materials.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: August 10, 2004
    Inventors: Yuh Sung, Ming-Der Ger, Yu-Hsien Chou, Bing-Joe Hwang
  • Patent number: 6774049
    Abstract: A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with the at least one reducing agent simultaneously deposits metal and a dopant thereof. The oxidation barrier may be used to form conductive structures of semiconductor device structures, such as a capacitor electrode, or may be formed adjacent conductive or semiconductive structures of semiconductor device structures to prevent oxidation thereof. The oxidation barrier is particularly useful for preventing oxidation during the formation and annealing of a dielectric structure from a high dielectric constant material, such as Ta2O5 or BST.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: August 10, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Rita J. Klein
  • Patent number: 6770369
    Abstract: A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 &mgr;m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: August 3, 2004
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Masaaki Oyamada, Shinji Abe
  • Publication number: 20040146647
    Abstract: A method of preparing a substrate material such that it is capable of sponsoring a catalytic reaction over a pre-determined area of its surface comprising coating some or all of the substrate material with a catalytic material which is capable, once the coated substrate is introduced into a suitable catalytic reaction environment, of sponsoring a catalytic reaction over the coated areas of the substrate wherein the catalytic material is printed onto the substrate by a pattern transfer mechanism.
    Type: Application
    Filed: December 3, 2003
    Publication date: July 29, 2004
    Inventors: Gregory Peter Wade Fixter, Daniel Robert Johnson, William Norman Damerell, Stephen George Appleton
  • Patent number: 6767445
    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: July 27, 2004
    Inventors: Peter Kukanskis, Frank Durso, David Sawoska