Organic Base Patents (Class 427/306)
  • Patent number: 11065717
    Abstract: A laser beam applying unit of a laser processing apparatus includes a laser oscillator, a condenser adapted to focus the laser beam emitted from the laser oscillator and apply the laser beam to a workpiece, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece. The liquid jetting apparatus includes: a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam; a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall; an opening formed in the bottom plate, extending in a processing feeding direction, and permitting passage therethrough of the laser beam focused by the condenser; and a liquid supply section adapted to supply the liquid to the casing.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 20, 2021
    Assignee: DISCO CORPORATION
    Inventors: Yuji Hadano, Masatoshi Nayuki, Keiji Nomaru
  • Patent number: 10975474
    Abstract: A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: April 13, 2021
    Assignee: Atotech Deutschland GmbH
    Inventors: Christian Wendeln, Lutz Stamp, Bexy Dosse, Kay Wurdinger, Gerson Krilles, Tang Cam Lai Nguyen
  • Patent number: 10960570
    Abstract: An additive formulation for lignocellulosic composites comprising a) a first aqueous emulsion comprising i) a component selected from the group consisting of petroleum wax, a triglyceride, and combinations thereof; and ii) a first anionic emulsifier; and b) a second aqueous emulsion comprising: i) a reaction product of I) a derivative of a polyol selected from the group consisting of saccharides, sugar alcohols, sugar acids, gluconic acids, and gluconic acid lactones; and II) a polyisocyanate; and ii) an emulsifier selected from the group consisting of a second anionic emulsifier, a non-ionic emulsifier, and mixtures thereof, is disclosed.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: March 30, 2021
    Assignee: HEXION INC.
    Inventor: Donald G. Jenkins
  • Patent number: 10940560
    Abstract: A liquid supply mechanism is disposed on an upper portion of a holding unit of a laser processing apparatus. The liquid supply mechanism includes: a liquid chamber having a transparent plate positioned such that a gap is formed between the transparent plate and the top surface of a workpiece held on a holding table; a linear-motion mechanism configured to linearly move the transparent plate over the liquid chamber; a liquid supply nozzle configured to supply a liquid from one side of the liquid chamber to the gap; and a liquid discharge nozzle configured to discharge the liquid from another side of the liquid chamber. A laser beam irradiating unit includes a laser oscillator configured to irradiate the workpiece through the transparent plate and the liquid supplied to the gap.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: March 9, 2021
    Assignee: DISCO CORPORATION
    Inventors: Keiji Nomaru, Yuji Hadano, Masatoshi Nayuki
  • Patent number: 10249904
    Abstract: The present invention provides an electrochemical cell including: an electrode body; an exterior packaging body in which a plurality of substrates including a first substrate formed from a ceramic material are stacked in the first direction, and a cavity in which the electrode body is accommodated is formed; a first electrode connection wiring that is formed in the exterior packaging body and connects a first electrode layer and an external substrate to each other; and a second electrode connection wiring that is forming in the exterior packaging body and connects a second electrode layer and the external substrate to each other. At least the first electrode connection wiring is formed in the first substrate, and an attachment portion, to which a fastening member configured to mount at least the first electrode connection wiring to the external substrate is attached, is formed in the first substrate.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: April 2, 2019
    Assignees: SEIKO INSTRUMENTS INC., OHARA INC.
    Inventors: Shunji Watanabe, Tsuneaki Tamachi, Yoshimi Kanno, Kazumi Tanaka, Kazuhito Ogasa, Ryohei Sato
  • Patent number: 10208224
    Abstract: The present disclosure is directed to a composition including a polyvinyl butyral represented by the following formula: wherein A, B and C represent a proportion of corresponding repeat units expressed as a weight percent, wherein each repeat unit is randomly distributed along a polymer chain and wherein the sum of A, B and C is about 100 weight percent; a poly(melamine-co-formaldehyde) based polymer and an anhydride. Devices coated with the composition and cured films formed from the composition comprising conductive features are also provided.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: February 19, 2019
    Assignee: XEROX CORPORATION
    Inventors: Guiqin Song, Nan-Xing Hu, Ping Liu, Biby Esther Abraham, Cuong Vong
  • Patent number: 9090966
    Abstract: Process for coating plastics with metals, wherein the plastics are pretreated with a composition comprising at least one salt having a melting point of less than 100° C. at 1 bar (hereinafter referred to as ionic liquid).
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: July 28, 2015
    Assignee: BASF SE
    Inventors: Itamar Michael Malkowsky, Aurelie Alemany
  • Patent number: 9005854
    Abstract: A conductive pattern is formed using a reactive polymer comprising pendant tertiary alkyl ester groups, a compound that provides an acid upon exposure to radiation, and a crosslinking agent. A polymeric layer is patternwise exposed to form first exposed regions with a polymer comprising carboxylic acid groups that are contacted with electroless seed metal ions, and then contacted with a halide to form corresponding electroless seed metal halide. Another exposure converts electroless seed metal halide to electroless seed metal nuclei and forms second exposed regions. A reducing agent is used to develop the electroless seed metal nuclei in the second exposed regions, or to develop the electroless seed metal halide in the first exposed regions. Fixing is used to remove any remaining electroless seed metal halide. The electroless seed metal nuclei are then electrolessly plated in various exposed regions.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: April 14, 2015
    Assignee: Eastman Kodak Company
    Inventors: Mark Edward Irving, Thomas B. Brust
  • Patent number: 8980531
    Abstract: A transparent component comprises a substrate (1) having an interface surface, with a pattern of electrically conductive copper (2) disposed on the interface surface with of the substrate, wherein the copper has a copper sulfide surface coating (3). It is found that copper with a suitably thin coating layer of copper sulfide has reduced visibility compared with uncoated copper, so that the metal pattern is less distracting to a viewer. The component finds application as part of a touch-sensitive display, with the substrate overlying or forming part of the display, with images on the display being visible to a user through the transparent component.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Conductive Inkjet Technology Limited
    Inventor: Philip Gareth Bentley
  • Patent number: 8974860
    Abstract: The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: March 10, 2015
    Inventors: Robert Hamilton, Mark Wojtaszek
  • Publication number: 20150050422
    Abstract: The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.
    Type: Application
    Filed: March 21, 2013
    Publication date: February 19, 2015
    Inventors: Dirk Tews, Fabian Michalik, Belén Gil Ibánez, Lutz Brandt, Meng Che Hsieh, Zhiming Liu
  • Patent number: 8936890
    Abstract: A pattern is formed in a polymeric layer comprising (a) a reactive polymer comprising -A- recurring units comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a ?max of 150 nm to 450 nm, and (c) a crosslinking agent that is capable of reacting in the presence of the acid to provide crosslinking in the (a) reactive polymer. The polymeric layer is patternwise exposed to the radiation to provide a polymeric layer comprising exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with a reducing agent to incorporate reducing agent, and then contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei. The electroless seed metal nuclei are then electrolessly plated with a metal to form a conductive metal pattern.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: January 20, 2015
    Assignee: Eastman Kodak Company
    Inventors: Mark Edward Irving, Thomas B. Brust
  • Patent number: 8911608
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: December 16, 2014
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Patent number: 8846151
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: September 30, 2014
    Assignee: BYD Company Limited
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Patent number: 8648601
    Abstract: The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: February 11, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Constanze Donner, Guenther Bauer, Therese Stern, Kay Wurdinger, Lutz Brandt, Frank Bruening
  • Patent number: 8628831
    Abstract: The present invention relates to the field of selective metallization, and in particular to preparing a polymer article for selective metallization by submerging the article in a first liquid, and while submerged irradiate the article by a laser beam the area of the article on which the metal is to be deposited. An activation step, prior to the selective metallization, comprises submerging the article in an activation liquid for depositing seed particles in the selected area. The irradiation of the selected area is proportionate so as to cause a temporary melting of the polymer in the surface of the selected area of the polymer article. The invention is advantageous in that the preparation may be performed with a relatively high scan rate across the polymer article, and in that a quite limited use of toxic chemicals.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: January 14, 2014
    Assignees: Danmarks Tekniskie Universitet, IPU
    Inventors: Peter Torben Tang, Jakob Skov Nielsen, Peter Caroe Nielsen, Hans Nørgaard Hansen, Yang Zhang
  • Patent number: 8575021
    Abstract: Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove an effect of variations in the material layer as a result of substrate processing. The methods include normalizing the surface characteristics of the material layer by selectively depositing the MML on the material layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 5, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Thomas R. Boussie, Tony P. Chiang, Anh Duong, Zachary Fresco, Nitin Kumar, Chi-I Lang, Sandra G. Malhotra, Jinhong Tong
  • Patent number: 8574680
    Abstract: A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure:
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Tricia Breen Carmichael, Sarah Jane Vella, Ali Afzali-Ardakani, Mahmoud Mostafa Khojasteh
  • Patent number: 8491772
    Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: July 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
  • Publication number: 20130084395
    Abstract: A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.
    Type: Application
    Filed: September 29, 2011
    Publication date: April 4, 2013
    Inventors: Roshan V. Chapaneri, Anthony Wall, Trevor Pearson, Roderick D. Herdman
  • Patent number: 8354014
    Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: January 15, 2013
    Assignee: Ebara-Udylite Co., Ltd.
    Inventors: Makoto Kohtoku, Mika Hamada
  • Patent number: 8323739
    Abstract: A method for forming a metal pattern on a substrate via printing and electroless plating is disclosed, which includes printing a pattern on the substrate with an ink composition, drying the printed pattern, and contacting the dried pattern with an electroless plating solution. The ink composition either contains components (i), (ii) and (iii), components (i) and (iv), or components (i) and (v), which are dissolved or dispersed in a solvent, wherein (i) is a binder; (ii) is a sulfate terminated polymer of an ethylenically unsaturated monomer; (iii) is a catalytic metal precursor; (iv) is a polymer of an ethylenically unsaturated monomer deposited with particles of catalytic metal; and (v) is a copolymer of an ethylenically unsaturated monomer and a hydrophilic monomer deposited with particles of catalytic metal. The binder (i) is a water swellable resin. The catalytic metal may be Au, Ag, Pd, Pt or Ru.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: December 4, 2012
    Assignee: National Defense University
    Inventors: Yuh Sung, Ming-Der Ger, Chang-Ping Chang, Chun-Chieh Tseng, Wen-Ding Chen
  • Patent number: 8202576
    Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 19, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Masaaki Inoue, Tetsunori Matsumoto
  • Publication number: 20120021218
    Abstract: In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 26, 2012
    Applicant: SYSCOM ADVANCED MATERIALS, INC.
    Inventors: Jar-Wha Lee, Ching Chang
  • Publication number: 20110281135
    Abstract: The present invention discloses a method for metallizing a plastic surface. The method may comprise the steps of: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, the present invention discloses a method for preparing a plastic article and a plastic article as manufactured by the method as described.
    Type: Application
    Filed: April 22, 2010
    Publication date: November 17, 2011
    Applicant: BYD COMPANY LIMITED
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Patent number: 8052858
    Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 8, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Motoki Hiraoka, Takeshi Bessho, Sigeru Sibata
  • Patent number: 8003038
    Abstract: There is disclosed a process for producing a resin molded article by using a resin into which fine metal particles are so introduced as to be hardly dissolved at the melting temperature of the resin and as to obtain high solubility in a high-pressure carbon dioxide. This process comprises the steps of forming a high-pressure fluid by dissolving, in a high-pressure carbon dioxide, a fluorine-containing metal complex and a fluorine-based solution capable of dissolving the same metal complex; introducing the high-pressure fluid into a heated and molten resin; and molding the resin having the high-pressure fluid introduced thereinto, to shape the molded article.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: August 23, 2011
    Assignee: Hitachi Maxell, Ltd.
    Inventors: Tetsuya Ano, Atsushi Yusa, Satoshi Yamamoto, Toshiyuki Ogano
  • Patent number: 7989029
    Abstract: A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: August 2, 2011
    Assignee: SRI International
    Inventors: Jaspreet Singh Dhau, Sunity K. Sharma
  • Patent number: 7968804
    Abstract: An article includes a polymeric film having a major surface, a discontinuous layer of a catalytic material on the major surface, and a metal pattern on the catalytic material. The discontinuous layer of catalytic material has an average thickness of less than 200 angstroms. Methods of forming these articles are also disclosed.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: June 28, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Tracie J. Berniard, Roxanne A. Boehmer
  • Patent number: 7959977
    Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: June 14, 2011
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
  • Publication number: 20110020550
    Abstract: The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.
    Type: Application
    Filed: March 12, 2009
    Publication date: January 27, 2011
    Inventors: Hironori Ota, Atsushi Yusa, Satoshi Yamamoto
  • Patent number: 7871670
    Abstract: A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a substrate patterned-nanostructure surface, disposing a metal layer on the substrate patterned-nanostructure surface to form a metallic patterned-nanostructure surface region, forming a self-assembled monolayer on the metallic patterned-nanostructure surface region, exposing the self-assembled monolayer to an electroless plating solution comprising a deposit metal, and depositing electrolessly the deposit metal selectively on the surface regions having a metallic nanostructured surface. Articles formed from this method are also disclosed.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: January 18, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Khanh P. Nguyen, Matthew H. Frey, Haiyan Zhang, Jun-Ying Zhang
  • Patent number: 7867564
    Abstract: The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and ?-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: January 11, 2011
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Toru Imori, Atsushi Yabe
  • Patent number: 7754062
    Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: July 13, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masatsugu Nakanishi, Takeshi Bessho
  • Patent number: 7651813
    Abstract: A capacitor includes a base having a hollow or open portion in an upper surface for containing a battery element or an electric double layer capacitor element and an electrolytic solution in an inside thereof, a metallized layer formed to a periphery of the base defining the hollow or open portion in the upper surface and a frame member made of metal brazed to the metallized layer so as to surround the hollow or open portion. An inner lateral surface of the frame member is inclined outward, and a corrosion resistant layer is deposited so as to continuously cover the inclined surface and a portion of the surface of the metallized layer situated inward thereof.
    Type: Grant
    Filed: November 25, 2005
    Date of Patent: January 26, 2010
    Assignee: Kyocera Corporation
    Inventors: Kiyotaka Yokoi, Yoshihiro Ushio, Manabu Miyaishi, Masakazu Yasui
  • Patent number: 7645370
    Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heav
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: January 12, 2010
    Assignee: Daicel Polymer Ltd.
    Inventors: Toshihiro Tai, Ippei Tonosaki
  • Patent number: 7578888
    Abstract: The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: August 25, 2009
    Assignee: Enthone Inc.
    Inventor: Mark Peter Schildmann
  • Publication number: 20090155468
    Abstract: Electrolessly depositing a cobalt-based alloy on a metal surface of a substrate in a process which involves monitoring for Co3+ ion concentration in a sample of the electroless cobalt deposition composition during said contacting; and replacing or regenerating the electroless cobalt deposition composition when the concentration of Co3+ ions exceeds a predetermined concentration of Co3+ ions.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Paul Figura, Qingyun Chen, Charles Valverde, Richard Hurtubise
  • Patent number: 7367118
    Abstract: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: May 6, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Kevin Cheng, Ming-Huan Yang, Wan-Wen Chiu, Jane Chang
  • Patent number: 7288287
    Abstract: The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: October 30, 2007
    Assignee: Omron Corporation
    Inventors: Hirokazu Tanaka, Satoshi Hirono
  • Patent number: 7205098
    Abstract: A method for manufacturing a high-transmittance optical filter for image display devices, which may include the steps of coating a photocatalytic compound on a transparent substrate to form a photocatalytic film, selectively exposing the photocatalytic film to light and growing a metal crystal thereon by plating to form a metal pattern, and selectively etching and removing the photocatalytic compound remaining on the transparent substrate using a buffered oxide etchant (BOE). According to the method, a high-transmittance, high-resolution and low-resistivity optical filter can be manufactured in a simple manner at low costs.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: April 17, 2007
    Assignee: Samsung Corning Co., Ltd.
    Inventors: Sung Hen Cho, Euk Che Hwang, Jin Young Kim, Chang Ho Noh, Ki Yong Song, Ho Chul Lee
  • Patent number: 7033648
    Abstract: A method to selectively metallize polyimide with an all-electroless process.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: April 25, 2006
    Assignee: International Business Machines Corporations
    Inventors: Fuad E. Doany, Jeffrey R. Marino, Carlos J. Sambucetti, Ravi F. Saraf
  • Patent number: 7028399
    Abstract: The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessly depositing a conductor starting layer for producing metal wiring interconnects and substitute contact sites with short-circuit contacts for interconnecting the individual metal wiring interconnects and the corresponding electrical contact sites; reinforcing the conductor starting layer by a common electrodepositing process; and separating the short-circuit contacts for separating the electrical contact sites or the contact sites of the wiring from one another.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: April 18, 2006
    Assignee: Infineon Technologies AG
    Inventors: Klaus Lowack, Guenter Schmid, Recai Sezi, Ute Zschieschang
  • Patent number: 7026012
    Abstract: A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: April 11, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: William T. Chen, Peter M. Moran
  • Patent number: 6875260
    Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: April 5, 2005
    Assignee: Enthone Inc.
    Inventor: Han Verbunt
  • Patent number: 6863936
    Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilised catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: March 8, 2005
    Assignee: Agency for Science, Technology and Research
    Inventors: William T. Chen, Peter M. Moran, Harvey M. Phillips
  • Patent number: 6861097
    Abstract: The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: March 1, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin T. Goosey, John E. Graves, Joachim Buch, Mark A. Poole, Deborah Hirst, Rebecca Holland
  • Patent number: 6802985
    Abstract: There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film is subjected to exposure and development processes, by which a ground resin film patterned into a wiring pattern is obtained. Then, on the patterned ground resin film, a low-resistance metal film made of Cu is formed by electroless plating.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: October 12, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshimasa Chikama, Yoshihiro Izumi
  • Publication number: 20040197478
    Abstract: The invention provides a process for producing a plated plastic article, which requires no chemical etching and can ensure high quality of plating without addition of a large amount of any inorganic filler in order to form a physically rough surface for an effective plating adhesion. After molding thermoplastic materials having a shear strength of 50 MPa or more, the surfaces of the molded articles are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz (average roughness of ten points) is 10 &mgr;m or more, and subsequently addition of catalyst, activation treatment, and electroless plating are carried out.
    Type: Application
    Filed: January 22, 2004
    Publication date: October 7, 2004
    Inventor: Tatsuaki Takagi
  • Patent number: 6776826
    Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: August 17, 2004
    Assignee: GBN Technologies, Inc.
    Inventors: Norman P. Trahan, Brian Keough, Gary Aruda, by Tobias M. Lederberg