Nickel, Copper, Cobalt, Or Chromium Coating Patents (Class 427/305)
  • Patent number: 10253414
    Abstract: A processing system and method for depositing a film on a substrate by liquid phase ALD is disclosed in various embodiments. The method includes providing the substrate in a process chamber, spinning on the substrate a first reactant in a first liquid to form a self-limiting layer of the first reactant on the substrate, spinning on the substrate a second reactant in a second liquid, where the second reactant reacts with the self-limiting layer of the first reactant on the substrate to form a film on the substrate, and repeating the spinning steps at least once until the film has a desired thickness. Other embodiments of the invention further include rinsing the substrate to remove excess first and second reactants from the substrate, and heat-treating the substrate during and/or following the film deposition.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 9, 2019
    Assignee: Tokyo Electron Limited
    Inventor: Robert D. Clark
  • Patent number: 10224208
    Abstract: An electroless plating process is performed on an Al layer, which is made of aluminum or an aluminum alloy, with an electroless plating liquid which is alkaline and contains a complexing agent. A plating method includes preparing a substrate 10 having a surface (for example, bottom surface of TSV 12) at which an Al layer 22 made of aluminum or an aluminum alloy is exposed; forming a zincate film 30 on a surface of the Al layer by performing a zincate treatment on the substrate; and forming a first electroless plating layer (for example, Co barrier layer 14a) on the surface of the Al layer with an electroless plating liquid (for example, Co-based plating liquid) which is alkaline and contains a complexing agent.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: March 5, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Nobutaka Mizutani, Mitsuaki Iwashita, Takashi Tanaka
  • Patent number: 10124323
    Abstract: A nano-nickel catalyst and a hydrogenation device of carbon oxides are provided. The hydrogenation device is configured to reduce the carbon oxides to form low carbon hydrocarbons. The nano-nickel catalyst has a metallic nickel body and a plurality of microstructures connecting with at least one surface of the metallic nickel body. The microstructures are sharp, and have a length-diameter ratio ranging from 2 to 5.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: November 13, 2018
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Po-Wei Lan, Cheng-Wei Huang, Yu-Wen Hou, Chen-Chien Wang, Chuh-Yung Chen
  • Patent number: 9885347
    Abstract: Carbon dioxide compressors having one or more coatings with wear surfaces having electroless surface coatings are provided. Alternatively, propane compressors are contemplated having wear surface coatings. The coating is electrolessly applied and may comprise nickel and wear resistant particles, such as boron nitride. The electroless surface coatings for use with compressor machines improve corrosion and wear resistance, as well as anti-friction properties for compressors processing CO2 or C3H8 containing refrigerants. In certain aspects, a scroll machine has an Oldham coupling and/or lower bearing comprising aluminum and has an electroless surface coating comprising nickel boron nitride particles disposed on one or more wear surfaces. In other aspects, a reciprocating compressor has a wear surface, such as on a connecting rod and/or piston coated with an electrolessly applied nickel and boron nitride particle layer. Methods for making the electroless surface coatings are also provided.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: February 6, 2018
    Assignee: Emerson Climate Technologies, Inc.
    Inventors: Carl Joseph Lachey, Eric Anthony Maurer
  • Patent number: 9770887
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4??, Ca0.25Cu0.75TiO3??, and TiO2??, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: September 26, 2017
    Assignee: BYD COMPANY LIMITED
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Patent number: 9752232
    Abstract: Tubulars are immersed in electroless nickel coating solution to coat the tubulars. Prior to the coating step the tubulars are blasted with a clean medium and washed and rinsed in alkaline solution. The tubulars are arranged in a bunk for washing, rinsing and coating. LLDPE stretch wrap applied to outer portions of the tubulars prevents coating of the outer portions. The tubulars are electrically separated from the bunk and the coating solution tank, and the tank is provided with anodic protection to prevent coating of the tank. The bunk is provided with a header assembly to provide solution flow through the tubulars via nozzles on the header assembly in addition to flow caused by the vortex effect created by velocity of fluid exiting the nozzles. The bunk is arranged in the solution tank so that the tubulars are at an angle to horizontal to efficiently remove hydrogen gas. Solution flow to the header assembly is filtered to remove particulates.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: September 5, 2017
    Inventors: Dan Porodo, Stewart Thompson
  • Patent number: 9372284
    Abstract: Mirrors with no copper layer according to the present invention comprise a glass substrate, a silver coating layer provided at a surface of the glass substrate and at least two paint layers covering the silver coating layer, the outermost paint layer comprising a polyurethane resin based paint. They are characterized in that the paint layers are free of alkyd resin and in that the first paint layer closest to the silver coating layer has a thickness of at least 10 ?m.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: June 21, 2016
    Assignee: AGC GLASS EUROPE
    Inventors: Lionel Ventelon, Bruno Cosijns
  • Patent number: 9175406
    Abstract: There is provided a metallic glass component with its surface layer having both durability of a film and chromatic color properties, and a method for forming the surface layer. Surface active treatment is performed wherein the surface of the metallic glass component is reacted with a mixed aqueous solution of nitric acid and hydrofluoric acid to remove an oxide film and to provide an anchor bond shape on the surface of a metallic glass component, and electroplating or electroless plating is then performed, to form a plating film on the surface of the metallic glass component. It is thereby possible to form a surface layer of a metallic glass which has both durability and a chromatic color.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: November 3, 2015
    Assignees: TOKOKU UNIVERSITY, NGK INSULATORS, LTD.
    Inventors: Xin Min Wang, Naokuni Muramatsu, Junsuke Kiuchi, Hiroshi Suzuki, Tatsue Arakawa, Hisamichi Kimura, Akihisa Inoue, Eiichi Makabe
  • Publication number: 20150111050
    Abstract: The present invention relates to a process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subjecting the resulting surface to an oxidizing treatment; contacting the resulting substrate with a solution containing an ion of a metal from groups IB and VIII of the Periodic Table; obtaining a substrate comprising ions of a metal that are chemically attached to the nonmetallic material constituting the substrate on at least one of its surfaces; subjecting the ions to a reducing treatment to obtain a substrate comprising atoms of a metal that are chemically attached to the nonmetallic material constituting the substrate on a part of at least one of its surfaces; and contacting the resulting surface with a solution containing ions of a metal.
    Type: Application
    Filed: December 24, 2014
    Publication date: April 23, 2015
    Inventors: SEBASTIEN ROUSSEL, FRIDA GILBERT
  • Patent number: 8986789
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: March 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
  • Patent number: 8980531
    Abstract: A transparent component comprises a substrate (1) having an interface surface, with a pattern of electrically conductive copper (2) disposed on the interface surface with of the substrate, wherein the copper has a copper sulfide surface coating (3). It is found that copper with a suitably thin coating layer of copper sulfide has reduced visibility compared with uncoated copper, so that the metal pattern is less distracting to a viewer. The component finds application as part of a touch-sensitive display, with the substrate overlying or forming part of the display, with images on the display being visible to a user through the transparent component.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Conductive Inkjet Technology Limited
    Inventor: Philip Gareth Bentley
  • Patent number: 8962086
    Abstract: A process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subjecting the resulting surface to an oxidizing treatment; contacting the resulting substrate with a solution containing an ion of a metal from groups IB and VIII of the Periodic Table; obtaining a substrate comprising ions of a metal that are chemically attached to the nonmetallic material constituting the substrate on at least one of its surfaces; subjecting the ions to a reducing treatment to obtain a substrate comprising atoms of a metal that are chemically attached to the nonmetallic material constituting the substrate on a part of at least one of its surfaces; and contacting the resulting surface with a solution containing ions of a metal.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: February 24, 2015
    Assignee: Pegastech
    Inventors: Sebastien Roussel, Frida Gilbert
  • Publication number: 20150030774
    Abstract: A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 29, 2015
    Applicant: Tokyo Electron Limited
    Inventors: Takashi Tanaka, Yuichiro Inatomi, Nobutaka Mizutani, Yusuke Saito, Mitsuaki Iwashita
  • Patent number: 8911608
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: December 16, 2014
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Patent number: 8846151
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: September 30, 2014
    Assignee: BYD Company Limited
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Publication number: 20140272144
    Abstract: Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Feng LIU, Maria Anna RZEZNIK
  • Patent number: 8828482
    Abstract: A disk for a hard disk drive is provided. The disk comprises a substrate comprising aluminum, and a coating layer disposed over the substrate. The coating layer comprises an alloy of Ni, X1 and X2, wherein X1 comprises one or more elements selected from the group consisting of Ag, Au, B, Cr, Cu, Ga, In, Mn, Mo, Nb, Pb, Sb, Se, Sn, Te, W, Zn and Zr, and wherein X2 comprises either B or P, and wherein X1 and X2 do not comprise the same elements.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: September 9, 2014
    Assignee: WD Media, LLC
    Inventors: Alan J. Ruffini, Lindsey A. Hamilton, Dorothea Buechel-Rimmel, Jean M. Laplante, Ambrose Schaffer, Frederick K. Lowes
  • Patent number: 8808791
    Abstract: A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: August 19, 2014
    Assignee: Lam Research Corporation
    Inventors: Igor C. Ivanov, Weiguo Zhang, Artur Kolics
  • Patent number: 8784931
    Abstract: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer and an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, a SiO2 surface of the insulating interlayer portion on which the diffusion layer is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. A capping layer may be formed on the wiring layer by electroless plating. Consequently, a diffusion prevention layer having good adhesive properties can be formed through a simple wet process, and, the wiring layer can directly be formed on this diffusion prevention layer by a wet process. The capping layer can also be directly formed on the wiring layer by electroless plating.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: July 22, 2014
    Assignees: Waseda University, Renesas Electronics Corporation
    Inventors: Kazuyoshi Ueno, Tetsuya Osaka, Nao Takano
  • Publication number: 20140134338
    Abstract: A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.
    Type: Application
    Filed: January 20, 2014
    Publication date: May 15, 2014
    Applicant: MacDermid Acumen, Inc.
    Inventors: Roshan V. Chapaneri, Anthony Wall, Trevor Pearson, Roderick D. Herdman
  • Publication number: 20140113158
    Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
    Type: Application
    Filed: April 17, 2012
    Publication date: April 24, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Frank Brüning, Birgit Beck, Bexy Dosse, Johannes Etzkorn
  • Patent number: 8679591
    Abstract: An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu
  • Patent number: 8648601
    Abstract: The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: February 11, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Constanze Donner, Guenther Bauer, Therese Stern, Kay Wurdinger, Lutz Brandt, Frank Bruening
  • Publication number: 20140030532
    Abstract: Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.
    Type: Application
    Filed: October 30, 2012
    Publication date: January 30, 2014
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ji Young BYUN, Sang Hoon KIM, Ju Yeon HWANG, Heon Phil HA
  • Patent number: 8623460
    Abstract: The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: January 7, 2014
    Assignee: Valspar Sourcing, Inc.
    Inventor: Harry J. Bahls
  • Patent number: 8586133
    Abstract: A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: November 19, 2013
    Assignee: Lam Research Corporation
    Inventors: Igor C. Ivanov, Weiguo Zhang, Artur Kolics
  • Patent number: 8574680
    Abstract: A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure:
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Tricia Breen Carmichael, Sarah Jane Vella, Ali Afzali-Ardakani, Mahmoud Mostafa Khojasteh
  • Patent number: 8575021
    Abstract: Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove an effect of variations in the material layer as a result of substrate processing. The methods include normalizing the surface characteristics of the material layer by selectively depositing the MML on the material layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 5, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Thomas R. Boussie, Tony P. Chiang, Anh Duong, Zachary Fresco, Nitin Kumar, Chi-I Lang, Sandra G. Malhotra, Jinhong Tong
  • Patent number: 8524629
    Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: September 3, 2013
    Assignee: Energia Technologies, Inc.
    Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
  • Publication number: 20130216713
    Abstract: Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
    Type: Application
    Filed: August 17, 2012
    Publication date: August 22, 2013
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Feng LIU, Maria Anna Rzeznik
  • Publication number: 20130209689
    Abstract: A method of preparing a plastic article to accept plating thereon is proposed. At least a portion of the plastic article is rendered plateable by sulfonation. The method includes the steps of: (a) exposing the plastic article to an atmosphere containing a sulfonating agent to sulfonate at least a portion of the plastic article; (b) conditioning the sulfonated article with an alkaline conditioner; (c) activating the plastic article with an ionic palladium activator; and (d) contacting the plastic article with an accelerator to react with adsorbed palladium increase the catalytic activity of at least the portion of the plastic article.
    Type: Application
    Filed: February 15, 2012
    Publication date: August 15, 2013
    Inventors: Mark Wojtaszek, Robert Hamilton, John Wallace, Bradlee Radke
  • Patent number: 8507381
    Abstract: The invention relates to a method for fabricating silicon and/or germanium nanowires on a substrate, comprising a step of bringing a precursor comprising silicon and/or a precursor comprising germanium into contact with a compound comprising copper oxide present on the said substrate, by means of which growth of nanowires takes place.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: August 13, 2013
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Vincent Renard, Vincent Jousseaume, Michael Jublot
  • Patent number: 8507400
    Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: August 13, 2013
    Assignee: Energia Technologies, Inc.
    Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
  • Publication number: 20130152786
    Abstract: A process of producing transition metal-based membranes or other layers on a porous support is provided. The layers are suitable for hydrogen separation, oxygen separation, or protective or decorative purpose sand are produced by pretreating the porous support by coating with a solution of a transition metal salt, drying the seeded support, reducing the transition metal salt to transition metal metal, and electroless plating with a complex of a transition metal (palladium, silver or other)and optionally other metals. The membranes can be tubular with a transition metal layer of 1-10 ?m on its outside.
    Type: Application
    Filed: August 26, 2011
    Publication date: June 20, 2013
    Inventors: Lucretia Agnes Correia, Johannis Pieter Overbeek, Yvonne Christine Van Delft
  • Publication number: 20130040164
    Abstract: In a method for coating a copper-containing aluminum alloy, the alloy is treated with a solution of at least one polyamino carboxylic acid ligand. A trivalent chromium coating is thereafter applied.
    Type: Application
    Filed: August 10, 2011
    Publication date: February 14, 2013
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Promila P. Bhaatia, Gary M. Lomasney, Uvauhn S. Mason
  • Patent number: 8354014
    Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: January 15, 2013
    Assignee: Ebara-Udylite Co., Ltd.
    Inventors: Makoto Kohtoku, Mika Hamada
  • Patent number: 8323739
    Abstract: A method for forming a metal pattern on a substrate via printing and electroless plating is disclosed, which includes printing a pattern on the substrate with an ink composition, drying the printed pattern, and contacting the dried pattern with an electroless plating solution. The ink composition either contains components (i), (ii) and (iii), components (i) and (iv), or components (i) and (v), which are dissolved or dispersed in a solvent, wherein (i) is a binder; (ii) is a sulfate terminated polymer of an ethylenically unsaturated monomer; (iii) is a catalytic metal precursor; (iv) is a polymer of an ethylenically unsaturated monomer deposited with particles of catalytic metal; and (v) is a copolymer of an ethylenically unsaturated monomer and a hydrophilic monomer deposited with particles of catalytic metal. The binder (i) is a water swellable resin. The catalytic metal may be Au, Ag, Pd, Pt or Ru.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: December 4, 2012
    Assignee: National Defense University
    Inventors: Yuh Sung, Ming-Der Ger, Chang-Ping Chang, Chun-Chieh Tseng, Wen-Ding Chen
  • Patent number: 8318254
    Abstract: A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: November 27, 2012
    Assignee: National Defense University
    Inventors: Yuh Sung, Ming-Der Ger, Chang-Ping Chang, Chun-Chieh Tseng, Wen-Ding Chen
  • Patent number: 8318241
    Abstract: A method of manufacture of an electrode for a fuel cell, the method comprising at least the steps of: (a) providing an electrode substrate; (b) contacting at least a part of the electrode substrate with an electroless plating solution comprising a reducing agent, a metal precursor and a suspension of particulate material; and (c) electrolessly plating the metal from the metal precursor onto the contacted part of the electrode substrate, thereby co-depositing the particulate material on the contacted part of the electrode substrate to provide the electrode.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: November 27, 2012
    Assignee: The Court of Edinburgh Napier University
    Inventors: William John Waugh, Alan MacDonald Davidson
  • Patent number: 8309164
    Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 13, 2012
    Assignee: Tokuyama Corporation
    Inventors: Tetsuo Imai, Osamu Yatabe, Masakatsu Maeda
  • Patent number: 8231928
    Abstract: A method for producing a layer on a molded article. The method includes providing a formable film. Galvanically catalytically active nuclei are anchored to at least one region of the formable film provided for the layer. The formable film is shaped so as to form the molded article. A galvanic deposition is performed on a surface of the molded article so as to bond the nuclei to form the layer.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: July 31, 2012
    Assignee: Forschungszentrum Karlsruhe GmbH
    Inventors: Nina Dambrowsky, Stefan Giselbrecht, Roman Truckenmueller
  • Publication number: 20120177821
    Abstract: Catalytic nanoparticles are coated with a layer of an amphoteric surfactant to stabilize the nanoparticles for electroless metal plating.
    Type: Application
    Filed: July 18, 2011
    Publication date: July 12, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Peter R. LEVEY
  • Patent number: 8202576
    Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 19, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Masaaki Inoue, Tetsunori Matsumoto
  • Publication number: 20120058362
    Abstract: Various embodiments provide a method for depositing metal on a substrate. The method may include carrying out a first immersion plating process, thereby forming a first metal portion on the substrate; providing an immersion plating activating substance on the first metal portion; and carrying out a second immersion plating process using the immersion plating activating substance, thereby forming a second metal portion on the first metal portion.
    Type: Application
    Filed: September 8, 2010
    Publication date: March 8, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Zistler, Stephan Bradl
  • Patent number: 8124226
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: February 28, 2012
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Patent number: 8052858
    Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 8, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Motoki Hiraoka, Takeshi Bessho, Sigeru Sibata
  • Publication number: 20110256413
    Abstract: A process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subjecting the resulting surface to an oxidizing treatment; contacting the resulting substrate with a solution containing an ion of a metal from groups IB and VIII of the Periodic Table; obtaining a substrate comprising ions of a metal that are chemically attached to the nonmetallic material constituting the substrate on at least one of its surfaces; subjecting the ions to a reducing treatment to obtain a substrate comprising atoms of a metal that are chemically attached to the nonmetallic material constituting the substrate on a part of at least one of its surfaces; and contacting the resulting surface with a solution containing ions of a metal.
    Type: Application
    Filed: April 19, 2011
    Publication date: October 20, 2011
    Applicant: PEGASTECH
    Inventors: Sebastien ROUSSEL, Frida GILBERT
  • Patent number: 8039045
    Abstract: An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 ?m or more. Before forming a plating film by a step of electroless plating S6, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment S2 to increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S3, a step of palladium catalyst treatment S4, and a step of palladium bonding treatment S5.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: October 18, 2011
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Youichi Tei, Akira Iso, Kazuhito Higuchi, Hajime Kurihara, Hiroyuki Uwazumi
  • Patent number: 8007862
    Abstract: Provided are a method of preparing a nanowire grid polarizer, and a nanowire grid polarizer prepared using the same. The method includes: mixing a surfactant and a silica precursor to prepare a mesoporous film composition; coating the mesoporous film composition on a substrate; aging the coated product to form a silica template composite; removing the surfactant inside the silica template composite to prepare a mesoporous material having channels; and filling the channels of the mesoporous material with metal. The method is suitable for the formation of a nanowire having a stable structure, mass production, and large-area production.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: August 30, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Su-mi Lee, Dong-mok Whang, Moon-gyu Lee, Yoon-sun Choi, Sun-hwak Woo
  • Patent number: 8003165
    Abstract: Nanoparticles are coated using thick-film techniques with a catalyst to promote the growth of carbon nanotubes thereon. In one example, alumina nanoparticles are coated with a copper catalyst. Such nanoparticles can be selectively deposited onto a substrate to create a field emission cathode, which can then be utilized within field emission devices.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 23, 2011
    Assignee: Applied Nanotech Holdings, Inc.
    Inventors: Dongsheng Mao, Yunjun Li, Richard Fink, Valerie Ginsberg, Mohshi Yang, Leif Thuesen