Abstract: An article comprising: (1) an interpolymer which comprises crosslinked (meth)acrylate, crosslinked styrene-acrylonitrile, and uncrosslinked styrene-acrylonitrile components; and (2) an adherent metallic coating on said interpolymer. The article is useful as a plated component in motor vehicles, for example, as trim, grille work, wheel covers, and the like, or as plated appliance parts or plumbing components.

Abstract: The invention relates to improving the heat transfer properties in boiling liquids of tubes and other surfaces by applying a very porous reticulated organic foam layer in contact with the tube surface, and then plating a thin metal coating on the foam substrate. Preferably, the tube is copper and the plating consists of a first electrolessly applied layer of copper and a second electroplated layer. The foam is preferably in the form of a thin tape which is spirally wound about the tube. Pyrolization of the foam after plating improves the heat transfer performance of the tube.

Abstract: A method of metallizing materials by coating a substrate material with a hydrophilic composite material; electrolessly metal plating the hydrophilic composite material with a metal to render the surface conductive; followed by electroplating a metal onto the conductive surface. The method can, for example, be utilized to produce metallized foams, embossing plates for reproduction of grains and textures, and decorative coatings for substrate materials.

Abstract: A substrate is plated by a process which includes the steps of catalyzing a substrate by coating its surface with a silver-pyridine complex dissolved in an organic solvent, converting the complex to silver oxide by immersion in a basic solution, and reducing the silver oxide to metallic silver and then electroless plating. When the substrate is copper, the silver oxide is spontaneously converted to a reflective and continuous layer of metallic silver upon immersion in the basic solution. The process as disclosed is used in the manufacture of insulated conductors and cord from nylon filaments.

Abstract: A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 10.sup.3 to 10.sup.4. This enhancement is sufficient to make masking unnecessary.

Abstract: In the electroless plating of dielectric or non-conductive substrates by first priming the surface of the substrate with aqueous solutions containing stannous and copper ions, followed by developing the substrate with a reducing agent capable of reducing the valence state of the copper ions, the substrate is contacted with a linking agent for the stannous ion either prior to or concurrently with the priming step permitting the use of lower amounts of stannous and copper ions while achieving improved plating and improved primer usefulness.

Abstract: Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.

Abstract: Non-metallic surfaces are prepared to receive an electroless metal deposit of copper, gold or nickel using a two-step adsorption procedure to sensitize the surface. The surface is first immersed in a bath containing copper in solution or suspension to adsorb the copper on the surface, followed by contact with a nickel or cobalt bath at a pH above 4 to encourage adsorption of the second metal. The adsorbed metals are then reduced with a borohydride reducing agent, with the nickel or cobalt serving to catalyze the reduction of the copper. The surface can be rinsed between the two adsorption steps without decreasing the effectiveness of the treatment.

Abstract: The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.

Abstract: A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.

Abstract: A method for the formation of amorphous dispersions derived by the admixing of a stabilized colloidal dispersion of a higher degree of crystallinity with a modifier. The modified dispersions exhibit a shift towards lower particle size distribution. The resulting amorphous dispersions are useful in a wide variety of chemical processes ranging from catalysis and pigments to display devices.

Abstract: Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: A method of making a printed circuit board from a laminate structure comprising an insulative laminate base, a layer of semi-cured adhesive material, a layer of electroless copper and an electroplating resist covering the surfaces in the negative of the image of the desired conductor configuration which comprises immersing said resist covered structure in an acid cleaning solution for cleaning said structure; immersing said laminate structure in an acidic copper electroplating solution and coupling an electrical source to said structure for electroplating acid copper onto the exposed portions of said electroless copper and retaining said structure in said solution for an interval sufficient to produce a plating of electroplated copper of a thickness in the range of 0.0005 to 0.

Abstract: A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

Abstract: A process for treating a polymeric plastic substrate to render it receptive to electroless plating including the steps of etching the substate, rinsing and activating the etched substrate with an acidic tin-palladium complex, rinsing and thereafter accelerating the activated substrate employing an improved aqueous accelerating solution containing an aqueous soluble compatible substituted alkyl amine. The improved accelerating solution is stable, easy to control, tolerant to metallic impurities present in the solution, inhibits rack plating and is of versatile use.

Abstract: The invention relates to a metallized textile material having a surface resistance as measured at 23.degree. C./50% relative humidity in accordance with DIN 54 345 of at most 1.times.10.sup.3 ohm. The invention also relates to a process for the production of such metallized textile material by currentless metal deposition, preferably at room temperature, thereon wherein the activation of the material is effected in a colloidal palladium solution, preferably at room temperature.

Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

Abstract: Since their surfaces are inactive, polyolefin resins are difficult to plate. A plating method utilizing sensitizing-activation of the surface has been used for plating polyolefin resins. Many attempts have been made to improve the plating properties of the surfaces of polyolefin resins, for example, a mechanical method, a method employing a solvent, a method of coating other types of resins on the surface, etc. As methods modifying the plastics themselves, there are several; a method of introducing polar radicals by graft polymerization, etc., a method of introducing atactic polypropylene or block copolymer of polypropylene and polyethylene, a method of mixing rubber or a copolymer of ethylene and vinyl acetate, a method of mixing in an inorganic filler, etc.

Abstract: A method for depositing a metal on a surface is disclosed. The method comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic real image is treated with a stabilizer comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.

Abstract: In manufacturing a record matrix from a lacquer master having a sound groove in a surface thereof, a basic reduction solution containing borohydride compound and an acidic metal salt solution containing nickel salt, ammonium salt and lactic acid are sprayed against the surface of the master having the sound groove for effecting the electroless plating thereon of a nickel surface metal layer having thereon a projection strip coincident with the sound groove, a reinforcing layer is formed over the surface metal layer and its reinforcing layer are peeled off from the lacquer master along the boundary therebetween to provide the record matrix.

Abstract: Sensitizing solutions for rendering surfaces receptive to the deposition of adherent electroless metal comprising a precious metal and a stoichiometric excess of a Group IV metal which is capable of two valence states are stabilized against precious metal separation by adding a Lewis Base, e.g., hydroquinone or hydroxylamine. Processes for rendering surfaces receptive to the deposition of an electroless metal are also provided in which there are employed the stabilized sensitizing solutions.

Abstract: A tin-palladium catalyst useful for electroless deposition of metals, such as copper or nickel, onto a nonconductive substrate, said catalyst containing a much lower concentration of halide ions than similar compositions presently known, or being completely free of halide ions. The tin-palladium catalyst can be prepared from nonhalide salts using a hydroxy substituted organic acid to stabilize the system.

Abstract: A method of depositing a metal on a surface is disclosed. The method comprises coating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal. The coated surface is selectively treated to reduce the metal salt to metallic nuclei to form a catalytic pattern thereon capable of directly catalyzing the deposition of a metal on the nuclei from an electroless metal deposition solution. The selectively treated surface is then exposed to a stripping solution comprising an organic acid selected from (a) a carboxylic acid having a structural formula of ##STR1## where R is a member selected from the hydrogen radical, H, and an alkyl group having 1 to 3 carbon atoms, (b) citric acid and (c) a mixture of any of the foregoing acids, to essentially remove portions of the coated surface which have not been selectively treated.

Abstract: A process for the preparation of non-conductors prior to electroless metal plating with a catalyst composition. The catalyst formulation comprises the product resulting from the admixture of an acid, a nucleophilic reactant, stannous ions, an hydrolyzable stannic compound, and precious metal ions. The stannous ions are in a molar excess relative to either the stannic compound or the precious metal ions.

Abstract: A method for electroless plating relatively inert plastics, e.g., polyvinylidene fluoride, with metal, such as gold, copper or nickel has been developed. The process requires that the plastic be treated with a solvent such as n,n-dimethylformamide or dimethylsulfoxide. The plastic is then sensitized with silver followed by treatment with a suitable activator for the electroless plated solution. Continuous adherent thin films of the desired metal coating are produced.

Abstract: A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment prior to electroless (chemical) plating.

Abstract: An adherent bright metallic coating which may be any metal or alloy capable of being deposited electrolessly, is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising suitable pretreatment of said surface, deposition of a primary electroless copper to produce an underlayer, then depositing a bright secondary electroless coating of the desired metal (the overlayer) with complete elimination of any subsequent electroplating process [usually required to achieve this brightness]. The required overlayer may also be limited to selected surface areas of a coated part by mechanically removing portions of the primary electroless copper prior to immersion of the part in the secondary electroless bath to produce the desired overlayer metal.

Abstract: A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.

Abstract: Electroless plating processes wherein a substrate is contacted with a catalytic composition, contacted with a reducing solution containing a deactivator and then contacted with an electroless plating solution.

Abstract: Method for pretreating a plastic substrate prior to metallization thereof by electroless metal deposition by applying a brush discharge thereto, the current density of which is higher than 0.5 mA/cm.sup.2, the tension of which being less than the breakdown tension of the substrate and the total charge of energy applied being no higher than 20mC/cm.sup.2 ; the treatment comprising plural short spaced exposures of said substrate to said discharge. Various masking means are employed to provide selectively treated and untreated portions on the substrate.

Abstract: An adherent, bright metallic nickel coating is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising, after suitable pretreatment of said surface, the deposition of a primary electroless nickel possessing special properties followed by a secondary electroless nickel of bright appearance with complete elimination of any subsequent electroplating process usually required to achieve this brightness. The nickel coating may be limited to selected surface areas of a coated part by mechanically removing portions of the primary coat prior to immersion of the part in a secondary electroless nickel bath.

Abstract: Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.

Abstract: Improvements are disclosed in the method of electroless deposition of a metal on a nonconductive surface wherein the surface is sequentially contacted with a tin salt solution, a palladium salt solution, and an electroless plating bath containing said metal. The improvement relates to preparing the surface to produce an unbroken layer of water adhering thereto upon dipping said surface in deionized water. The improvement further contemplates removing the surface from the electroless plating bath after formation of the visible amount of metal, inspecting the surface for imperfections, removing the metal, and recleaning the surface to remove imperfections. Finally, the activation steps are repeated followed by contacting the surface with an electroless plating bath to plate the desired quantity of metal thereon in a manner wherein uniformity and adhesion are improved.

Abstract: A method of sensitizing surfaces which at least include areas of copper for subsequent electroless plating wherein the surface to be sensitized is processed with a sensitizing bath which includes precious metal ions, stannous ions in stoichiometric surplus, a haloid acid, and a complex forming compound for copper ions.

Abstract: A printed circuit board made by providing on an insulating substrate an adhesive coating comprising a butadiene-based rubber and a phenolic resin finely dispersed therein, etching the surface layer of said coating with an oxidizing agent to expose the microcapsules having phenolic resin shells, which have been formed during the setting of said adhesive coating, and forming a chemically deposited metal layer on said adhesive coating.

Abstract: Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:(I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate,(II) removing the initiator from the surface of said resist, and(III) dipping the insulating substrate in an electroless metal plating solution, thereby forming an electroless metal plating on a positive pattern of circuit, wherein a thermosetting resin containing a rutile type solid solution of metal oxides of titanium, nickel and antimony is employed as the masking material in said step (I), and the initiator is removed from the surface of the resist through contact with a hydrochloric acid solution of ammonium persulfate in said step (II).

Abstract: A process and composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the colloidal product resulting from the admixture of a principal catalytic agent and a catalytic promoting agent. The principle catalytic agent is selected from the metals of Period 4 of Groups 1B and VIII of the Periodic Table of the Elements while the catalytic promoting agent is selected from the metals of Period 4, 5, 6 and Groups IVB, VB, VIB and VIIB of the Periodic Table of the Elements, and further the catalytic promoter agent is admixed subsequent to the colloid nucleation process.

Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

Abstract: A method of selectively nickeling a layer of polymerized polyester resin is described. Patterns of electrically conducting nickel are produced on the resin surface by etching the surface of the resin prior to covering the etched surface with a patterned layer of unetched resin which exposes the etched resin in the regions in which metallization is to occur. A palladium plating solution followed by an immersion boron-nickel bath provide the metalization on the etched regions of the resin.

Abstract: The thermoplastic polymer employed in this invention is a rubber modified unsaturated carboxylic acid or anhydride containing polymer which is prepared by polymerizing the monomers in the presence of the rubber in a finely divided form. The surface to be metallized is first aminated with aqueous hydroxylamine or hydrazine, then treated with a noble metal salt solution and thereafter treated with a reducing agent, as needed, to produce a metallized surface having a resistance of 100 ohms/sq. or less. The metallized surface can then be further plated by conventional means.

Abstract: An electroless plating process for copper in an acidic bath whereby copper by a chemical reduction process is continuously being plated to a desired thickness on a suitable substrate; this process is especially applicable to plating of copper and substrates which are susceptible to alkaline solutions such as polyimides, polyparabanic acids, etc.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

Abstract: A method for depositing a metal on a surface is disclosed. The method comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic real image is treated with a stabilizer comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.

Abstract: A method for the formation of novel colloidal catalytic electroless plating compositions comprises admixing a highly stable non active (weakly active) colloidal dispersion with a reactivity modifier. The admixture so formed is used in electroless plating processes wherein a substrate is contacted with the novel colloidal catalytic composition, rinsed, contacted with a reducing or activating solution (which may be optional) and then contacted with an electroless plating solution.

Abstract: A process for pretreating polyvinyl chloride plastics to form adherent non-grainy conformal metal coatings by electroless deposition comprising immersing the polyvinyl chloride plastic in a solution comprising at least about 10 grams of alkali metal hydroxide dissolved in a solution consisting of about 5% to about 30% by volume of a water-soluble mono-, di-, or polyhydric alcohol and about 70% to about 95% by volume of water. The immersion time is variable from about 5 minutes in ultrasonically agitated, mildly heated solutions to about 6 to about 8 hours in non-agitated, unheated solutions. After pretreatment, the polyvinyl chloride plastic is treated by standard electroless plating procedures known in the art.

Abstract: Mixtures of water with water soluble and/or miscible halogenated compounds are used to pre-etch polysulfone and other polymers such as polyesters and polycarbonates to induce or improve adhesion of metals deposited by electroless plating processes.

Abstract: Electroless nickel coating of epoxy resin foundry patterns and core boxes can be carried out without a palladium chloride/stannous chloride activation of the surface, if the pattern or core box contains a high density of metal particles which act as "keying" sites, and if the metal-filled resin surface is properly prepared. The preparation steps include a very light abrading with a fine (minus 60 U.S. mesh and preferably even finer) grit and a very brief acid pickling step. The electroless-plated article has a continuous coating of nickel bonded essentially directly to the resin through the metallic "keying" sites.

Abstract: Deposition of metal onto a polyimide film by an electroless method is disclosed. The subject method finds particular application in generating metal patterns on polyimide substrates, such as films. The subject method employs a photographic like technique for generating on a polyimide substrate, a pattern capable of attracting thereon a precious metal-salt which is useable as a catalyst in an electroless plating process. The methods disclosed are useable in an electroless plating process to produce a metallic pattern, such as an electric circuit pattern for mounting integrated circuit chips, etc.