Abstract: A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.

Abstract: The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

Abstract: Circuit boards having excellent electrical and mechanical properties are obtained when special mixtures of polyarylene sulfides and polycarbonates, polyaryl ethers, polyamides, polyesters or rubber elastomers are used as base plates for the wet-chemical deposition of the circuits and the boards are treated with an oxidizing agent before activation.

Abstract: A method for making printed circuit boards wherein the resistance of catalyzed nonconductive surfaces to solutions used in the processing stages, e.g., KOH used to remove an etch resist covering through-holes and the desired circuit lines, is enhanced by treating the catalyzed surface with an accelerator to activate the catalyst, treating the accelerated surface with a reducing agent, followed by baking.

Abstract: An activation solution for the activating of electrically nonconductive plastic surfaces of the purpose of a subsequent chemical metallization is prepared from an acid, a palladium(II) salt and a tin(II) salt, the palladium being present predominately in complexly dissolved form. The solution is prepared at room temperature, the molar ratio of the palladium employed and of the tin employed being about 1:1 to 1:2. The solution is mature and catalytically effective after about 10 minutes. There are no further stabilizing agents, auxiliary materials or the like present.

Abstract: The invention relates to compositions containinga) at least one organic polymer andb) a dibenzalacetone palladium complex of formula I ##STR1## which is homogeneously dissolved in said polymer but is not copolymerisable therewith, in which formula IR.sup.1 is hydrogen, C.sub.1 -C.sub.18 alkyl, C.sub.1 -C.sub.18 alkoxy or unsubstituted or substituted phenyl,R.sup.2 has one of the meanings of R.sup.1 or is also an amino, nitro or cyano group, an --O--C.sub.m H.sub.2mn OR.sup.4 or --O--CH.sub.2 --CH.OR.sup.4 --CH.sub.2.OR.sup.5 radical or a halogen atom or a glycidyl ether radical,R.sup.3 is hydrogen or C.sub.1 -C.sub.4 alkyl or the two groups R.sup.3 together form a C.sub.2 -C.sub.4 polymethylene chain,R.sup.4 and R.sup.5 have one of the meanings of R.sup.1,q is a value from 1 to 3.5,m is a value from 2 to 6 andn is a value from 0 to 20, with the proviso that the composition does not contain a polymer with an olefinic double bond.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: Method for the electroless metallizing of fibrous materials, consisting of coating such fibrous materials, before subjecting them to a chemical metallizing treatment, with a uniform film of a polymer which is capable of adhering to the fibrous material, is resistant to the chemical metallizing treatment, and is suitable for receiving metal coatings.

Abstract: Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.

Abstract: A method is disclosed for metallizing polymers comprising generating anionic sites on the structures, contacting same with the cation of the metal and then reducing the metal cation to metal at the anionic sites or treating the metal cations to form a semiconductor. The metallized polymers are useful as electrical conductors or semiconductors.

Abstract: The invention concerns a process disclosed for the pre-treatment of synthetic materials (plastics), particularly polyetherimide, polycarbonate and poly(ester-co-carbonate), for the adhesive chemical metallization, involving treating the synthetic material with a quaternary base dissolved in an organic solvent.

Abstract: A pretreatment composition comprising a combination of an adhesion promoter and corrosion inhibitor which is applied to the surface of a substrate and a process for pretreating the surface of a substrate before the deposition of thin metallic films to prepare mirrored substrates.

Abstract: The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.

Abstract: Polymeric, unquaternized or quaternized condensates which contain piperazine rings bonded via chain members are used as conditioners for the pretreatment of nonmetallic surfaces of moldings before their activation for subsequent chemical metallization. This procedure gives particularly uniform and well adhering metal coatings.

Abstract: Provided herein is a process for surface treatment of moldings of liquid-crystalline polyester resin which comprises roughening with an alkaline aqueous solution the surface of moldings of melt-processable polyester capable of forming an anisotropic molten phase. The roughened moldings are activated by contacting with an aqueous solution of an ampholytic surface active agent such as an aminocarboxylate. The process is intended to provide the moldings with surface characteristics suitable for surface decoration such as printing, painting, metallizing, and plating and also for bonding with an adhesive.

Abstract: Electroless plating compositions are described which produce a boron containing nickel coating. The compositions comprise a water soluble nickel salt, a chelating agent, an alkali metal hydroxide, a boron containing reducing agent, and ethylenethiourea. The composition is particularly useful for providing such coatings on gas turbine engine parts and results in improved wear resistance.

Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the elemnt(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.

Abstract: Disclosed is a process for preparing a selectively metallized article, and to the article prepared by this process. The process comprises:1. swelling a polymeric article with dimethylformamide for a length of time of 1 to 5 minutes;2. treating the polymeric article with an aqueous solution of a strong base;3. alternately repeating steps 1 and 2 any number of times;4. etching said polymeric article;5. subjecting polymeric article to electroless copper plating, to obtain said selectively metallized article.

Abstract: Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.

Abstract: The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 .mu.m in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.

Abstract: A polyimide surface is pretreated in preparation for an adhesion promotion treatment and subsequent metallization on the surface, wherein the pretreatment comprises the steps of:(A) contacting the polyimide surface with an aqueous solution of nitric acid having a concentration of about 35 to about 70% by weight or an aqueous solution of hydrochloric acid having a concentration of about 10 to about 38% by weight;(B) rinsing the acid-treated polyimide surface with water so as to substantially remove the acid from the surface of the polyimide;(C) contacting the rinsed polyimide surface with a mild etching agent, resulting in the formation of a residual film on the polyimide surface;(D) contacting the etched polyimide surface with a basic solution, and(E) removing the residual film formed on the surface of the polyimide after contact with the mild etching agent in step (C).

Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The conditioning can be in the holes and/or on the surfaces of the substrate.

Abstract: A novel electroless plating bath composition and method for the use thereof, are described for depositing a layer of nickel on anodized aluminum substrates for facilitating direct attachment of electronic chips thereto; the bath composition being a neutralized solution of nickel sulfate, sodium citrate, lactic acid and dimethylbomine in deionized water.

Abstract: A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

Abstract: Cross-linked polymer microspheres are carefully separated into fractions of equal size and density by first using sieves and then using hydraulic separation in a cone. Each fraction is separately plated with copper. The copper plated microspheres are again separated into fractions of equal size and density. Each fraction is then given an additional metal plating. The thus plated microspheres have uniformly thick plating and have a maximized surface area for the amount of metal plated making them particularly useful as catalysts or in electrical products or processes. Microspheres having a plating of palladium exhibit a marked improvement in the adsorption of hydrogen both quantitatively and in rapidity.

Abstract: A local electroless plating process for plastics comprising the steps of: coating the nonplating surface portion of a shaped plastic product with a pasty masking composition comprising a polymer and at least one compound selected from the group consisting of a sulfur compound, nitrogen compound and silicon compound; roughening the surface portion of the plastics product to be plated and applying a catalyst to the rough-surfaced portion; electrolessly plating the plastics product; and removing the polymer coating from the nonplating surface portion of the plastics product.

Abstract: Certain quaternary salts of di- and/or tri-(alkanol)-amines, which salts are soluble in the aqueous bath employed, are used as conditioners for pretreating nonmetallic surfaces of moldings prior to their activation for subsequent chemical metallization.Outstandingly uniform and strongly adhering metal coatings are obtained in this manner.

Abstract: A process is provided for improving the surface properties of polyimide articles which contain significant amounts of transimide. The surface of the polyimide containing the transimide is first treated with a base to convert the surface layer of both the polyimides and the transimides to polyamic salt. Thereafter the surface layer of the converted polyamic salt is treated with an acid to convert the layer to a polyamic acid. This is followed by a cure preferably in infrared radiation at a sufficiently rapid rate to prevent the formation of any significant amounts of transimide and provide only polyimide. Following this treatment metallization is applied to the improved surface layer.

Abstract: A process is disclosed for the adhesive metallization of synthetic materials, by means of pre-treatment of the synthetic materials and subsequent activation, as well as chemical and, if necessary, galvanic metal deposition, characterized by pre-treating the synthetic materials initially with an alkaline solution of an oxidation agent and then with a metal salt solution.

Abstract: A process is described for the chemical metallization of textile fibers or textile fibrous structures by treating the textile fibrous structure with an activating solution, removing excess activating agent, and without any further intermediate treatment, bringing the fiber into contact with a chemical metallizing solution.

Abstract: Disclosed is a method of rendering polymeric materials hydrophilic by treating the material sequentially with different solvents. The method is especially useful in the preparation of polymeric substrates for etching.

Abstract: To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

Abstract: A method for providing a circuit pattern on an insulated substrate that has improved adherence thereto. By providing an electroless conductive layer of a predetermined thickness on the substrate and thereafter exposing the substrate to an ablative laser beam, the resultant conductive lines are stronger than those provided by previously known techniques.

Abstract: A laser, such as an excimer laser, is employed to ablate electroless plating activator material from polymer and other substrates. The treated substrates are then immersed in electroless plating baths for plating of conductive material over remaining activator material. The method is particularly effective for depositing conductive patterns on non-flat substrates and on substrates needing plated-through connections. High resolution patterns are created on any compatible polymer substrate with any compatible electroless plating activator material.

Abstract: A method for removing residual precious metal catalyst from a plastic, metal-plated surface is disclosed. The method involves the oxidation of the precious metal without degrading the plated metal or the plastic, followed by washing away the oxidized precious metal. This invention further includes methods for the plating of metal directly on the surface of a plastic substrate.

Abstract: An aqueous composition is provided for treating a laminate in the manufacture of a printed circuit board, the composition comprising a wetting agent, which has a positively charged quaternary nitrogen atom, and a reducing agent which is compatible with the wetting agent. Preferably the reducing agent is hydroxylamine or one or more of its salts, but oxalic acid or one or more oxalates may, alternatively or as well, be used. The compatibility of the wetting and reducing agents enables the number of process steps to be reduced.

Abstract: A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.

Abstract: The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.

Abstract: The invention relates to a process for the chemical metallization of sheetlike textile substrates, in particular, of non-woven or needle felt webs, in which the substrates are activated and subsequently electrolessly metallized in a reductant-containing metallization solution in a horizontal attitude or at an angle of up to 20.degree. with the horizontal. The hydrogen which appears as a by-product in the course of the metallization can, as a result, escape particularly simply and rapidly from the substrate, so that uniform metallization of the fibers of the substrate can take place across the entire thickness of the substrate.

Abstract: At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.

Abstract: Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization.The metal deposits produced are notable for good bond strength.

Abstract: An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Abstract: An electroless plating method which comprises applying to a substrate a polymer composition comprising 100 parts by weight of a polymer and an organic metal complex in an amount of from 0.001 to 50 parts by weight as metal, pyrolytically decomposing the organic metal complex at a temperature of from 50.degree. to 500.degree. C. to form plating catalyst metal nuclei on the substrate, removing the dried polymer coating, and conducting electroless plating of the substrate.

Abstract: Shielding means for electromagnetic radiation, particularly that of radio frequency, comprises a enclosure fabricated from non-conductive material and having on at least one of the interior or exterior walls a layer of copper metal. The latter has been applied by coating the surface of the wall with a suspension of particles of cuprous oxide (or like non-conductive metal derivatives capable of being reduced to conductive free metal) in a curable resinous material, at least partially curing the coating, reducing to free metal the cuprous oxide or like particles in the surface of the coating and then electrolessly plating the coating with copper.

Abstract: A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.

Abstract: Metallic surfaces are imparted to non-conductor substrates by an electroless plating process comprising contacting the substrate with colloidal composition comprising colloids of catalytic metals capable of electroless plating initiation and activator(s) capable of modifying and extending the useful life-time for the colloidal composition from further deterioration.

Abstract: This invention relates to a process for conditioning the surfaces of polyester and polyamide materials for electroless plating of a metal coating thereon by exposing such materials to a composition comprising a solvent system containing water, and one or more substantially water-soluble organic solvents and an effective amount of solvated hydroxide ions.

Abstract: A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.

Abstract: The present invention is intended to provide a carrier to be used as a two-component developer, wherein a nuclide particle surface has a magnetic plated layer composed of an iron oxide. The carrier according to the present invention is to be used in the electrophotographic method, electrostatic recording method, and electrostatic printing method, and also provides an excellent developer which is lightweight and has a long service life.