Abstract: Processes for (1) depositing main group metals on inorganic and metallic substrates, (2) depositing transition metals on organic, inorganic and metallic substrates, and (3) depositing combinations of main group metals and transition metals on organic, inorganic and metallic substrates. The resulting products have useful electrical, optical and/or decorative properties.

Abstract: A process for the metallization of a plastic by electroless deposition, wherein the plastic surface is contacted with a solution useful for the treatment of oxidant residue following contact of the surface with an oxidizing solution such as a hexavalent chromium or permanganate solution. In one embodiment, the solution comprises a reducing agent, a pH adjuster and a surface active agent in a concentration sufficient to reduce the surface tension of the solution preferably to 50 dynes per square centimeter or less at the operating temperature of the solution. In a second embodiment, the solution consists essentially of the surface active agent in a concentration sufficient to achieve the above surface tension range.

Abstract: A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an alkaline accelerator bath containing an agent which oxidizes the tin.

Abstract: A method for plating conductive plastics. The area to be plated is abrasively blasted as necessary to produce suitable mechanical bonding sites. The area is cleaned with a hot alkaline cleaning solution that will not appreciably attack the plastic. The area is sensitized to provide a base for firm adhesion of the metal onto the plastic. Sensitizing a graphite-reinforced epoxy composite preferably includes flowing a dilute solution of hydrochloric acid over the area, flowing a palladium chloride catalyst, rinsing the area, flowing a stannous accelerator, and rinsing the area again. Striking is then carried out by flowing an electroless plating solution over the area to provide a preliminary deposit of metal. The electroless solution may be either copper or nickel. The flowing of each solution is done at a very low velocity to ensure effective and even action on the entire area. Following striking, a plating buildup is provided as required.

Abstract: A process for the metallization of a plastic by electroless deposition, wherein the plastic surface is contacted with a solution useful for the treatment of oxidant residue following contact of the surface with an oxidizing solution such as a hexavalent chromium or permanganate solution. The solution comprises a reducing agent, a pH adjuster and a surface active agent in a concentration sufficient to reduce the surface tension of the solution preferably to 50 dynes per square centimeter or less at the operating temperature of the solution.

Abstract: Plastic substrata are metallized, preferably by direct electrolytic metallization, by (i) providing a plastic shaped article comprising intimate admixture of a polymeric resin and a plurality of small metallic filler particles of a non-conductive oxide of a non-noble metal uniformly dispersed therethrough, at least one of the face surfaces of said shaped article having exposed thereon such high density of said metallic filler particles as to provide in step (ii) metallization growth nuclei adapted for direct electrolytic metallization; (ii) next subjecting said at least one face surface of said plastic shaped article to the action of a reducing agent to essentially quantitatively convert the non-conductive metal oxide filler particles to conductive free metal, metallization growth nuclei; and (iii) thence electrochemically and/or electrolytically metallizing the at least one reduced face surface of said plastic shaped article with a free metal deposit.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A process for metal plating plastic or elastomeric materials which produces a coating of high conductivity which does not reduce over time is disclosed in this application to provide electro-magnetic interference shielding for said materials. This process uses either a particular special plating bath containing stabilizer additions with any surface preparation technique, or a certain specific surface preparation technique along with the use of a standard plating bath or the special stabilized plating bath to obtain metal coatings with the desired properties.

Abstract: The stability of alkaline electroless plating baths and the rate at which such baths are capable of depositing a metal film on a nonconductor substrate are both enhanced by the incorporation of a water soluble saccharide derivative into the bath composition. The saccharide derivatives include monosaccharides, oligosaccharides, polysaccharides, and saccharide reaction products such as gluconic and glucoheptonic acids and salts thereof.

Abstract: Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl andR.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.

Abstract: A gentle and inexpensive process for activating surfaces for electroless metallization comprises wetting the surfaces with an activating solution containing a silver-I compound which is sparingly soluble in water (for example AgCl) and which has been converted into a soluble form with the aid of complexing agents (for example NH.sub.3), splitting the soluble complex compound back into the sparingly soluble compound and reducing the silver-I compound remaining on the surface.

Abstract: A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.

Abstract: A process for metal plating plastic or elastomeric materials which produces a coating of high conductivity which does not reduce over time is disclosed in this application to provide electro-magnetic interference shielding for said materials. This process uses either a particular special plating bath containing stabilizer additions with any surface preparation technique, or a certain specific surface preparation technique along with the use of a standard plating bath or the special stabilized plating bath to obtain metal coatings with the desired properties.

Abstract: Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl.The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.

Abstract: A mild activation process for the electroless metallization of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl.sub.2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl.sub.3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial.

Abstract: A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.

Abstract: A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting the substrate so as to remove or prevent an active catalytic layer from remaining on the surface of the mask thereby preventing electroless plating on the mask.

Abstract: A method and apparatus for extending the useful life of an acqueous acid chloride solution that serves as a protective bath for an activator dip bath such as used in electroless copper plating. Means are provided for recirculating the acidic chloride solution over metallic tin to precipitate copper ions from the solution. The precipitated copper is filtered from the solution to extend its useful life.

Abstract: A printed circuit board is made of poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.

Abstract: This invention relates to a process for conditioning the surfaces of natural and synthetic plastic materials for electroless plating of a metal coating thereon by exposing such materials to an atmosphere comprising ozone, contacting said exposed materials with a conditioning solvent, such as an aqueous solution of sodium, potassium or lithium hydroxide, and thereafter rinsing said contacted materials with an aqueous solution of one or more surfactants.

Abstract: New polymeric substrates for the electroless deposition of metal thereon. The substrates of the invention result from the polymerization of liquid mixtures comprising a liquid precursor of a polymer that is relatively susceptible to oxidative attack and a liquid precursor of a polymer that resists oxidation.

Abstract: A simple and highly effective process for preparing the surface and plating a plastic or elastomer material is disclosed by the present invention.A uniform, highly adherent metal layer is deposited by the claimed process. The surface of the materials to be plated is prepared by exposure to a gas etch atmosphere and activation of the etched surface by providing a metal colloid thereon. Another aspect relates to the use of a one-step or two-step conditioner treatment in the process for improved results.After the surface preparation and activation, a desired metal coating can be electroless metal plated in a conventional manner.

Abstract: A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

Abstract: This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.

Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Abstract: A powdered composition for use in dry sensitization for electroless metal deposition. The composition contains a hydrophobic thermoplastic material having deposited on its surface a surfactant and a sensitizing tin compound.

Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: A method for selectively plating metal, such as copper, onto poly(phenylene sulfide) substrates is disclosed. In this method, a crystalline region and an amorphous region are created in a substrate. One method for creating these regions is to selectively crystallize a region in an amorphous poly(phenylene sulfide) substrate by heating it above its glass transition temperature. The surface of the substrate is then activated with an electroless plating catalyst such as palladium metal. After activation, a nitrosyl salt is introduced into the amorphous region of the substrate. The substrate is then immersed in an electroless plating solution containing the metal ions whereby metal selectively plates onto the crystalline region of the substrate.

Abstract: In a known hot melt screen printing machine the printing ink is heated by an electrical current which is conducted through a stainless steel mesh of a screen plate. In the known machine, the printing accuracy is not good, mainly because of variation of tension and thermal expansion of the mesh.The mesh according to the present invention consists of insulating material fibers and an electroless plating layer formed on the fibers. The plating layer preferably consists of a nickel phosphorous alloy. A squeezing means for forcing the printing ink to pass through a printing pattern and/or a printing base for mounting an article to be printed are provided with a heating means. One of the advantages of the present invention is a high printing accuracy.

Abstract: A method and apparatus for extending the useful life of an aqueous acid chloride solution that serves as a protective bath for an activator dip bath such as used in electroless copper plating. Means are provided for recirculating the acidic chloride solution over metallic tin to precipitate copper ions from the solution. The precipitated copper is filtered from the solution to extend its useful life.

Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate.

Abstract: Apparatus and method for determining the initiation, progression and quality electroless plating of blind or through hole walls in circuit panels. A test coupon for monitoring plating is provided having a sensitized initiation conductivity zone and sensitized through-hole walls arranged in a series resistance circuit with both conductivity zone and series circuit being measured periodically as to resistivity to determine the start or "take" of electroless plating and its progress during continued immersion.

Abstract: This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet-curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This composition is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.

Abstract: Adhesive is applied to a substrate for a printed circuit board in a pattern corresponding to that of the printed circuit. If the adhesive is of the type which contains a solvent, the substrate and adhesive are heated after application of the latter in order to drive off the solvent. Subsequently, a thin foil of a material which is capable of bonding to a chemically deposited metal is pressed onto the adhesive. The adhesive is then permitted to set which causes those portions of the foil in contact with the adhesive to adhere tightly to the latter. Once the adhesive has set, the foil is peeled from the adhesive. The portions of the foil which contact the adhesive remain bound to the adhesive thereby forming a base which is capable of receiving a chemically deposited metal. The thus-coated substrate is immersed in a bath where an electrically conductive metal for forming the printed circuit is chemically deposited in a pattern corresponding to that of the adhesive and, consequently, of the printed circuit.

Abstract: A process for fabricating miniature hollow gold spheres comprising the steps of gold plating copper plated miniature balls having centers employing compressible material, piercing small holes in the balls, extracting the compressible materials from the balls along with the cutouts formed by piercing step, and heat treating said hollow gold spheres.

Abstract: Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

Abstract: A surface of a plastic article is metallized without substantial pinholes, holidays and the like by initially coating the surface with an aqueous colloidal dispersion of an organic polymer, particularly a barrier polymer such as polyvinylidene chloride, treating the organic polymer coating to make it metallizable and subsequently overcoating the treated organic polymer coating with a metal to form a thin metal layer adherent to the organic polymer layer. The resulting metallized plastic article which can optionally be treated with an additional amount of an aqueous colloidal dispersion of an organic polymer or metal is essentially impermeable to atmospheric gases and other vapors.

Abstract: When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.

Abstract: The manufacture of printed circuit boards on a substrate material with a thermosetting adhesive layer. The adhesive layer is roughened by spraying with a suspension of hard particles. Thereafter the surface is provided with a layer of uniformly distributed particles of a light-sensitive, semiconductive metal oxide by spraying with a suspension of said oxide particles, which oxide after exposure to light is capable of releasing copper and/or a metal which is nobler than copper from a solution of the relevant metal salt the layer is exposed to light and is sprayed prior to and/or after the exposure with a solution of the afore-said metal salt, so that metal nuclei are formed in the exposed areas. Both operations are effected by spraying and that in such a way that the semiconductive oxide and the metal salt, respectively are substantially dry when they reach the surface. After exposure, the nuclei are intensified by means of an electroless copper plating bath.

Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

Abstract: A process for treating a polymeric plastic substrate to render it receptive to electroless plating in a process of the type including the steps of etching the substrate and activating the etched substrate. The present improvement includes the step of accelerating the activated substrate with an improved aqueous accelerating solution containing an aqueous soluble compatible oxidizing agent present in an amount effective to increase the activity of the accelerating solution. The improved accelerating solution inhibits the plating of stop-off coatings and plating racks and is of versatile use.

Abstract: Activation of thermoplastics, such as polyphenylene sulfide, polysulfone, and polyether sulfone thermoplastics by subjection thereof to bromine is disclosed. The activation process is carried out at relatively low temperatures, such as below 200.degree. F. and illustratively, may be carried out at room temperatures. The bromine, in the illustrated embodiment, is provided in an aqueous solution with or without acids or halide salts. The halide salts, when utilized, provide control of the activity of the bromine. The process advantageously adapted for activating the thermoplastic material where it is intended that it serve as a substrate for use in accepting copper plating, as in printed circuit board manufacture.

Abstract: Disclosed is an improved process for preparing metal plated thermoplastic compositions by electroless metal deposition and subsequent electrolytic plating. This process comprises the sequence of etching a filled thermoplastic resin substrate with dilute acid solution, treating with a sensitizer such as a tin salt, activating with a noble metal salt solution, electroless metal deposition using an electroless copper or nickel plating solution, and electrolytic plating with a metal selected from the group consisting of copper, nickel, chromium, or combinations thereof. The improvement is in the use of a wollastonite filler having an average particle size of less than about 3.5 microns, wherein 95 numerical percent of the particles are smaller than 10 microns in the longest dimension. The resulting electroplated articles exhibit a mirror-like finish and a peel strength of at least about 3 lbs./in.

Abstract: A process and method for the formation of novel colloidal catalytic electroless plating composition which incorporates corrosion inhibitor(s) for the stabilization and retardation against oxidation.

Abstract: A method for selective electroless deposition of a metal (Cu, Ni, Au, Ag) onto a polyester substrate, such as poly(ethylene terephthalate) is described. A combination of ultraviolet exposure of wavelengths <220 nm and a pre-treatment step is used to obtain selective electroless deposition. The polyester layer is first irradiated with uv light of wavelengths <220 nm and is then subjected to a pre-plating pre-treatment with a basic solution. After this, the desired metal is deposited by conventional electroless deposition. Substantial deposition will occur only in those areas which were both exposed to the uv light and subjected to the pre-plating treatment.

Abstract: A nickel plaque which may be coated with a suitable metal or compound to make an electrode for a fuel cell or battery is fabricated by directing nickel sensitizer, catalyst and plating solutions through a porous plastic substrate in the order named and at prescribed temperatures and flow rates. A boride compound dissolved in the plating solution decreases the electrical resistance of the plaque. Certain substrates may require treatment in an alkali solution to dissolve filler materials thereby increasing porosity to a required 65%.

Abstract: An electrical resistor family based on oxides of tungsten and/or molybdenum is prepared by combining a polymeric binder with such oxides in an appropriate amount to realize the desired bulk properties. The resistance of the composite can be varied by varying the metal content of the oxides and/or by appropriate combination of the various oxides. Inert fillers are not required and the bulk properties are more stable.

Abstract: This invention relates to a process for conditioning the surfaces of natural and synthetic plastic materials for electroless plating of a metal coating thereon by exposing such materials to an atmosphere comprising an effective amount of ozone and thereafter contacting said exposed materials with an effective amount of a conditioning solvent, such as an aqueous solution of sodium, potassium or lithium hydroxide.

Abstract: The surfaces of polymer articles are conditioned for metallizing by treatment with an etching solution composed of a mixture of sulfuric acid and a carboxylic acid, such as formic or acetic acid.